PROTECTION PRODUCTS MicroClampDescription Clamp series arrays des

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PROTECTION PRODUCTS MicroClampDescription Clamp series arrays des

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Profile Clamp8-Line protection
PROTECTION PRODUCTS MicroClampDescription
Clamp series arrays designed protect sensitive electronics from damage latch-up ESD. designed replace multilayer varistors (MLVs) portable applications such cell phones, notebook computers, other portable electronics. features large cross-sectional area junctions conducting high transient currents. diodes offer desirable characteristics board level protection including fast response time, operating clamping voltage, device degradation. ClampTM0508T 8-pin, RoHS/WEEE compliant, SLP1713P8T package. measures with nominal height only 0.4mm. leads spaced pitch 0.4mm finished with leadfree NiPdAu. Each device features eight diodes with operating voltage volts maximum loading capacitance only 10pF. They used meet immunity requirements 61000-4-2, Level (±15kV air, ±8kV contact discharge). combination small size high surge capability makes them ideal portable applications such cellular phones, digital cameras, notebook computers.
uClamp0508T
Features
Transient protection data lines 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) 61000-4-4 (EFT) 5/50ns) Cable Discharge Event (CDE) Ultra-small package Protects eight data lines clamping voltage Working voltage: capacitance (10pF) Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1713P8T package RoHS/WEEE Compliant Nominal Dimensions: Lead Finish: NiPdAu Molding compound flammability rating: 94V-0 Marking Marking code Packaging Tape Reel
Applications
Cellular Handsets Accessories Notebooks Handhelds Micro Ports HS-MMC Ports Portable Instrumentation Digital Cameras Peripherals
Dimensions
1.70
Schematic
1.30
0.40
0.40
Nominal Dimensions (mm) (SLP1713P8T Bottom View)
Revision 01/07/2008 www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Absolute Maximum Rating
ating Peak Pulse Power 8/20s) Maximum Peak Pulse Current 8/20s) 61000-4-2 (Air) 61000-4-2 (Contact) erating Temp erature Storage Temp erature Symbol VESD TSTG Value +125 +150 Units Watts Amps
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage Clamp Voltage Junction acitance Junction acitance Symbol VRWM VRWM T=25°C 10mA 8/20s 1MHz 3.3V, 1MHz 0.25 12.5 Conditions Minimum Typical Maximum Units
2008 Semtech Corp.
www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power Pulse Time
Power Derating Curve
Rated Power
Peak Pulse Power (kW)
0.01 Pulse Duration (us)
Ambient Temperature
Clamping Voltage Peak Pulse Current
Clamping Voltage Forward Voltage
Forward Voltage Forward Current
Waveform Parameters:
Waveform Parameters:
Peak Pulse Current
Forward Current
Junction Capacitance Reverse Voltage
Clamping (8kV Contact 61000-4-2)
CJ(VR) CJ(VR=0) Reverse Voltage
Note: Data taken with attenuator 2008 Semtech Corp. www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Typical Characteristics
Insertion Loss
-3.0037dB 572.149 -5.0581 800.00
Analog Crosstalk
-5.8299 900.00
-23.207 1.80000 -13.452 2.50000
START.
STOP 3000 000000
START. STOP 3000 000000
2008 Semtech Corp.
www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Applications Information
Device Connection Options This device designed protect eight data lines. device unidirectional used lines where signal polarity above ground. Ground Connection Recommendation Parasitic inductance present board layout will affect filtering performance device. Ground loop inductance reduced using multiple vias make connection ground plane. Figure shows recommended device layout. ground vias have diameter 0.008 inches (0.20 while external vias have diameter 0.010 inches (0.250mm). internal vias spacedapproximately evenly from center pad. designer choose more vias with smaller diameter (such 0.005 inches 0.125mm) since changing diameter will result little change inductance. Circuit Board Layout Recommendations Suppression ESD. Good circuit board layout critical suppression induced transients. following guidelines recommended: Place near input terminals connectors restrict transient coupling. Minimize path length between protected line. Minimize conductive loops including power ground loops. transient return path ground should kept short possible. Never critical signals near board edges. ground planes whenever possible. Figure Recommended Layout using Ground Vias Figure Circuit Diagram (Eight Each)
2008 Semtech Corp.
www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Applications Information Spice Model
uClamp0508T Spice Model
uClamp0508T Spice Parameters Parameter Unit Volt Volt Farad 2.05e-15 0.80 0.75 1.0E-3 9e-12 2.541E-9 0.25 1.11
2008 Semtech Corp.
www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Outline Drawing SLP1713P8T
INDICATOR (LASER MARK)
SEATING PLANE
.015 .016 .017 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 .008 .010 .012 .003 .004
DIMENSIONS INCHES MILLIMETERS
0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.78 1.20 1.30 1.40 1.25 1.30 1.38 0.20 0.30 0.40 0.40 0.20 0.25 0.30 0.08 0.10
NOTES:
CONTROLLING DIMENSIONS MILLIMETERS (ANGLES DEGREES). COPLANARITY APPLIES EXPOSED WELL TERMINALS.
Land Pattern SLP1713P8T
DIMENSIONS INCHES (.050) .027 .012 .055 .016 .008 .023 .073 MILLIMETERS (1.27) 0.69 0.30 1.40 0.40 0.20 0.58 1.85
NOTES: CONTROLLING DIMENSIONS MILLIMETERS (ANGLES DEGREES). THIS LAND PATTERN REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES MET. THERMAL VIAS LAND PATTERN EXPOSED SHALL CONNECTED SYSTEM GROUND PLANE. FAILURE COMPROMISE THERMAL AND/OR FUNCTIONAL PERFORMANCE DEVICE.
2008 Semtech Corp.
www.semtech.com
uClamp0508T
PROTECTION PRODUCTS Marking Code Ordering Information
Part Number uClamp 0508T.TCT Working Voltage Reel 3,000 Reel Size Inch
INDICATOR
0508T
YYWW
Notes: This lead-free, RoHS/WEEE compliant product MicroClamp, uClamp Clamp marks Semtech Corporation
Note: YYWW Date Code
Tape Reel Specification
Location
User Direction feed
Device Orientation Tape
1.51 +/-0.10
Tape Width
1.91 +/-0.10
0.66 +/-0.10
(MAX)
(Max)
(0.59 +.005 .000)
1.750±.10 (.069±.004)
4.0±0.1 (.157±.004)
4.0±0.1 (.157±.004)
T(MAX)
(.312±.012)
(.165)
±0.05 (.031)
3.5±0.05 (.138±.002)
(.094)
2.0±0.05mm (.079±.002)
(.016)
Contact Information
Semtech Corporation Protection Products Division Flynn Rd., Camarillo, 93012 Phone: (805)498-2111 (805)498-3804
www.semtech.com
2008 Semtech Corp.

PROTECTION PRODUCTS MicroClampDescription Clamp series arrays des

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