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Enhancement Mode Power Mos.FET RoHS Compliant Product Channe
Top Searches for this datasheetSSG4575 Enhancement Mode Power Mos.FET RoHS Compliant Product Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) SOP-8 Description 0.40 0.90 0.19 0.25 SSG4575 provide designer with best combination fast switching, ruggedized device design, on-resistance cost-effectiveness. SOP-8 package universally preferred commercial industrial surface mount application suited voltage applications such DC/DC converters. 0.35 0.49 1.27Typ. 0.375 6.20 5.80 0.25 3.80 4.00 4.80 5.00 0.10~0.25 1.35 1.75 Features Simple Drive Requirement Lower On-resistance Dimensions millimeters Fast Switching Performance Date Code 4575SS Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current Symbol ID@TA=25 ID@TA=70 PD@TA=25 Ratings N-Channel 0.016 P-Channel -4.2 -3.3 Unit Total Power Dissipation Linear Derating Factor Operating Junction Storage Temperature Range Tstg -55~+150 Thermal Data Parameter Thermal Resistance Junction-ambient Symbol Rthj-a Ratings 62.5 Unit http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jun-2002 Rev. Page SSG4575 Enhancement Mode Power Mos.FET Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) Electrical Characteristics Channel( Tj=25 Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25oC) Drain-Source Leakage Current (Tj=70 Static Drain-Source On-Resistance Unless otherwise specified) Typ. Symbol BVDSS BVDS/ Min. Max. Unit Test Condition VGS=0V, ID=250uA Reference ID=1mA VDS=VGS, ID=250uA VGS=± VDS=60V,VGS=0 VDS=48V,VGS=0 VGS=10V, ID=5A VGS=4.5V, ID=3A 0.04 VGS(th) IGSS IDSS ±100 RDS(ON) Td(ON) Td(Off) Ciss Coss Crss Total Gate Charge 1670 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance ID=5A VDS=48V VGS=4.5V VDD=30V ID=1A VGS=10V RG=3.3 RD=30 2670 VGS=0V VDS=25V f=1.0MHz VDS=10V, ID=4A Source-Drain Diode Parameter Forward Voltage Reverse Recovery Time Reverse Recovery Charge Symbol Min. Typ. Max. Unit Test Condition IS=1.7A, VGS=0V. VGS=0V dl/dt=100A/uS Notes: 1.Pulse width limited Max. junction temperature. 2.Pulse width300us, dutycycle2%. 3.Surface mounted copper board; when mounted Min. copper pad. http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jun-2002 Rev. Page SSG4575 Enhancement Mode Power Mos.FET Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) Electrical Characteristics P-Channel( Tj=25 Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 Drain-Source Leakage Current (Tj=70 Static Drain-Source On-Resistance2 Unless otherwise specified) Typ. Symbo BVDSS BVDS/ Min. Max. Unit Test Condition VGS=0V, ID=-250uA Reference ID=-1mA VDS=VGS, ID=-250uA VGS=± VDS=-60V,VGS=0 VDS=-48V,VGS=0 VGS=-10V, ID=-4A VGS=-4.5V, ID=-3A -0.04 VGS(th) IGSS IDSS -1.0 -3.0 RDS(ON) Td(ON) Td(Off) Ciss Coss Crss Total Gate Charge 1780 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance ID=-4A VDS=-48V VGS=-4.5V VDS=-30V ID=-1A VGS=-10V RG=3.3 RD=30 2850 VGS=0V VDS=-25V f=1.0MHz VDS=-10V, ID=-4A Source-Drain Diode Parameter Forward Voltage Reverse Recovery Time Reverse Recovery Charge Symbol Min. Typ. Max. -1.2 Unit Test Condition IS=-1.7A, VGS=0V. Is=-4A, VGS=0V dl/dt=100A/uS Notes: 1.Pulse width limited Max. junction temperature. 2.Pulse width300us, dutycycle2%. 3.Surface mounted copper board; when mounted Min. copper pad. http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jun-2002 Rev. Page SSG4575 Enhancement Mode Power Mos.FET Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) Characteristics Curve N-Channel Typical Output Characteristics Typical Output Characteristics On-Resistance v.s. Gate Voltage Normalized On-Resistance v.s. Junction Temperature Forward Characteristics Reverse Diode http://www.SeCoSGmbH.com/ Gate Threshold Voltage v.s. Junction Temperature changing specification will informed individual 01-Jun-2002 Rev. Page SSG4575 Enhancement Mode Power Mos.FET Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) N-Channel Gate Charge Characteristics Typical Capacitance Characteristics Maximum Safe Operating Area Effective Transient Thermal Impedance Switching Time Waveform http://www.SeCoSGmbH.com/ Gate Charge Waveform changing specification will informed individual 01-Jun-2002 Rev. Page SSG4575 Enhancement Mode Power Mos.FET Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) P-Channel Typical Output Characteristics Typical Output Characteristics On-Resistance v.s. Gate Voltage Normalized On-Resistance v.s. Junction Temperature http://www.SeCoSGmbH.com/ Forward Characteristics Reverse Diode Gate Threshold Voltage v.s. Junction Temperature changing specification will informed individual 01-Jun-2002 Rev. Page SSG4575 Enhancement Mode Power Mos.FET Channel 60V,R DS(ON) Channel -4.2A, 60V,R DS(ON) P-Channel Gate Charge Characteristics Typical Capacitance Characteristics Maximum Safe Operating Area Effective Transient Thermal Impedance Switching Time Waveform Gate Charge Waveform http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jun-2002 Rev. 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