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Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V
Top Searches for this datasheetSSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET RoHS Compliant Product SOP-8 Description 0.40 0.90 0.19 0.25 SSG4505 provide designer with best combination fast switching, ruggedized device design, on-resistance cost-effectiveness. SOP-8 package universally preferred commercial industrial surface mount application suited voltage applications such DC/DC converters. 0.35 0.49 1.27Typ. 6.20 5.80 0.25 0.375 3.80 4.00 4.80 5.00 0.10~0.25 Features Simple Drive Requirement Lower On-Resistance 1.35 1.75 Dimensions millimeters Fast Switching Performance Date Code 4505SS Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current Symbol ID@TA=25 ID@TA=70 PD@TA=25 Ratings 0.016 Unit -8.4 -6.7 otal Power Dissipation Linear Derating Factor Operating Junction Storage Temperature Range Tstg -55~+150 Thermal Data Parameter Thermal Resistance Junction-ambient Symbol Max. Rthj-a Ratings 62.5 Unit http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jan-2008 Rev. Page SSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET Electrical Characteristics Channel( Tj=25 Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25oC) Unless otherwise specified) Typ. Symbol BVDSS BVDS/ VGS(th) IGSS IDSS Min. Max. Unit V/oC Test Condition VGS=0V, ID=250uA Reference ID=1mA VDS=VGS, ID=250uA VGS=± VDS=30V,VGS=0 VDS=24V,VGS=0 VGS=10V, ID=6A 0.02 ±100 Drain-Source Leakage Current (Tj=70 Static Drain-Source On-Resistance RDS(ON) Td(ON) Td(Off) Ciss Coss Crss VGS=4.5V, ID=4A Total Gate Charge Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time2 Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance 1770 ID=9A VDS=24V VGS=4.5V VDD=15V ID=1 VGS=10V RG=3.3 RD=15 2830 VGS=0V VDS=25V f=1.0MHz VDS=10V, ID=9A Source-Drain Diode Parameter Forward Voltage Symbol Min. Typ. Max. Unit Test Condition IS=1.7A ,VGS=0V IS=9A,V GS=0V dl/dt=100A/us Reverse Recovery Time Reverse Recovery Charge Notes: 1.Pulse width limited Max. junction temperature. 2.Pulse width300us, dutycycle2%. 3.Surface mounted inch2 copper board;135 °C/W when mounted min. copper pad. http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jan-2008 Rev. Page SSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET Electrical Characteristics P-Channel( Tj=25 Unless otherwise specified) Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 Symbol BVDSS BVDS/ VGS(th) IGSS IDSS Min. Typ. Max. Unit Test Condition VGS=0V, ID=-250uA Reference 25oC, ID=-1mA VDS=VGS, ID=-250uA VGS=± VDS=-30V,VGS=0 VDS=-24V,VGS=0 VGS=-10V, ID=-8A -0.02 -1.0 -3.0 ±100 Drain-Source Leakage Current (Tj=70oC) Static Drain-Source On-Resistance RDS(ON) Td(ON) Td(Off) Ciss Coss Crss VGS=-4.5V, ID=-4A Total Gate Charge Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance 1580 ID=-8A VDS=-24V VGS=-4.5V VDS=-15V ID=-1A VGS=-10V RG=3.3 RD=15 2530 VGS=0V VDS=-25V f=1.0MHz VDS=-10V, ID=-8A Source-Drain Diode Parameter Forward Voltage Symbol Min. Typ. Max. -1.2 Unit Test Condition IS=-1.7A, VGS=0V IS=-8A,VGS=0V dl/dt=100A/us Reverse Recovery Time Reverse Recovery Charge Notes: 1.Pulse width limited Max. junction temperature. 2.Pulse width300us, dutycycle2%. 3.Surface mounted inch2 copper board;135 °C/W when mounted min. copper pad. http://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jan-2008 Rev. Page SSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET Characteristics Curve N-Channel Typical Output Characteristics Typical Output Characteristics On-Resistance v.s. Gate Voltage Normalized On-Resistance v.s. Junction Temperature http://www.SeCoSGmbH.com/ Forward Characteristics Reverse Diode Gate Threshold Voltage v.s. Junction Temperature changing specification will informed individual 01-Jan-2008 Rev. Page SSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET N-Channel Gate Charge Characteristics Typical Capacitance Characteristics Maximum Safe Operating Area Effective Transient Thermal Impedance Switching Time Waveform http://www.SeCoSGmbH.com/ Gate Charge Waveform changing specification will informed individual 01-Jan-2008 Rev. Page SSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET P-Channel Description Typically large storage capacitor connected from this ground insure that input 1.3V open= output enable. tage does below minimum dropout voltage during load higher than Vout order device Typical Output Characteristics Typical Output Characteristics On-Resistance v.s. Gate Voltage Normalized On-Resistance v.s. Junction Temperature Forward Characteristics Reverse Diode http://www.SeCoSGmbH.com/ Gate Threshold Voltage v.s. Junction Temperature changing specification will informed individual 01-Jan-2008 Rev. Page SSG4505 Elektronische Bauelemente Channel 10A, 30V,RDS(ON) Channel -8.4A, -30V,RDS(ON) Enhancement Mode Power Mos.FET P-Channel Gate Charge Characteristics Typical Capacitance Characteristics Maximum Safe Operating Area Effective Transient Thermal Impedance Switching Time Waveform Gate Charge Waveform tp://www.SeCoSGmbH.com/ changing specification will informed individual 01-Jan-2008 Rev. 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