features high-density wiring fine line pattern available Miniaturizati

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features high-density wiring fine line pattern available Miniaturizati

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multilayer substrates
features high-density wiring fine line pattern available Miniaturization possible burying Strip-line uses dielectric-loss ceramics loss conductors, substrates excel high frequency characteristic thermal expansion coefficient close silicon's, substrates suitable bare chip mounting preparing thermal vias under bare chips, substrates excellent heat dissipation substrates outstanding heat resistance humidity resistance ceramics used construction
Chip Cavity
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Part Type Ref. Number
Buried conductor pattern
Inductor Thermal
Capacitor
definition With high functioning advance down-sizing electronic equipment, wiring substrates also required highly functioned. technologies respond high functioning substrates LTCC (Low Temperature Co-fired Ceramics), which ceramic multilayer technology that enables alumina fired "low temperature" 900°C lower adding glass materials alumina while fired "high temperature" about 1500°C. LTCC's important characteristic that melting point materials like etc. used buried conductors temperature firing.
environmental applications Characteristics Substrate Material
Parameter Bending Strength Thermal Expansion Coefficient Thermal Conductivity Insulation Resistance Dielectric Constant Dielectric Loss Resistivity Buried Conductor Density Surface Roughness Withstanding Voltage Layer Thickness Substrate Flatness >1013 <0.003 <0.4 100, Standard <0.03 Characteristics
modules
11/23/08
Specifications given herein changed time without prior notice. Please confirm technical specifications before order and/or use.
Speer Electronics, Inc. Bolivar Drive Bradford, 16701 814-362-5536 Fax: 814-362-8883 www.koaspeer.com
multilayer substrates environmental applications (continued) Characteristics Substrate Material
Symbol Line Width Line Line Spacing Diameter Diameter Spacing Line Spacing Part Edge Conductor Spacing Part Edge Spacing Cavity Width Cavity Depth Wall Thickness Cavity Shelf Width Cavity Parameter Design Value 0.06mm Min. 0.06mm Min. 0.1mm, 0.15mm, 0.2mm diameter +0.05mm Min. 0.2mm Min. 0.15mm Min. 0.2mm Min. 0.3mm Min. 0.6mm Min. 0.1mm Min. 0.5mm Min. 0.5mm Min. Cavity Surface layer Inner layer
modules
Specifications given herein changed time without prior notice. Please confirm technical specifications before order and/or use. 1/08/09
Speer Electronics, Inc. Bolivar Drive Bradford, 16701 814-362-5536 Fax: 814-362-8883 www.koaspeer.com

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