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Document Number: MC9RS08LA8 Rev. 1, 10 / 2008

MC9RS08LA8

Freescale Semiconductor Data Sheet: Technical Data
Document Number: MC9RS08LA8 Rev. 1, 10 / 2008
MC9RS08LA8
48 QFN Case 1314 7 mm2
48 LQFP Case 932 7 mm2
MC9RS08LA8
Table of Contents
Revision History
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Revision 1 Date 10 / 9 / 2008 Initial public released. Description of Changes
Related Documentation
Find the most current versions of all documents at: http://www.freescale.com
Reference Manual
(MC9RS08LA8RM) Contains extensive product information including modes of operation, memory, resets and interrupts, register definition, port pins, CPU, and all module information.
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 2 Freescale Semiconductor
MCU Block Diagram
VREFH VREFL VDDAD VSSAD
MCU Block Diagram
6-CH 10-BIT ANALOG-TO-DIGITAL CONVERTER(ADC) 4-BIT KEYBORAD RS08 CORE INTERRUPT(KBI) SERIAL PERIPHERAL INTERFACE (SPI) ANALOG COMPARATOR (ACMP) RS08 SYSTEM CONTROL RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT COP WAKEUP VPP RTI 2-CH TIMER / PWM LVD MODULE (TPM) RESET XTAL EXTAL SS SPSCK MISO MOSI ACMP+ ACMP- ACMPO PTA0 / SS / KBIP0 / ADP0 / LCD27 PTA1 / SPSCK / KBIP1 / ADP1 / LCD26 KBIP0:7
The block diagram, Figure 1, shows the structure of the MC9RS08LA8 MCU.
ADP5:0
PORT A
PTA2 / MISO / KBIP2 / ADP2 / RxD / LCD25 PTA3 / MOSI / KBIP3 / ADP3 / TxD / LCD24 PTA4 / KBIP4 / ADP4 / LCD23 PTA5 / KBIP5 / ADP5 / LCD22 PTA6 / KBIP6 / ACMP+ PTA7 / KBIP7 / ACMP-
PORT B
PTB0 / EXTAL PTB1 / XTAL PTB2 / RESET / VPP PTC0 / RxD
TPMCH0 TPMCH1 TCLK
PORT C
PTC1 / TxD PTC2 / TPMCH0 PTC3 / TPMCH1 PTC6 / ACMPO / BKGD / MS
USER FLASH 8192 BYTES USER RAM 256 BYTES 20 MHz INTERNAL CLOCK SOURCE (ICS) LOW-POWER OSCILLATOR TCLK SERIAL COMMUNICATION INTERFACE (SCI)
TxD RxD
PTC7 / TCLK / LCD28 PTD0 / LCD0 PTD1 / LCD1
PORT D
31.25 kHz to 38.4 kHz
1 MHz to 16 MHz (XOSC) VDD VSS VOLTAGE REGULATOR
8-bit Modulo Timer (MTIM)
PTD2 / LCD2 PTD3 / LCD3 PTD4 / LCD4 PTD5 / LCD5 PTD6 / LCD6 PTD7 / LCD7 PTE0 / LCD8
LCD0:7 VLL1 VLL2 VLL3 VCAP1 VCAP2 LCD28 LIQUID CRYSTAL DISPLAY DRIVER (LCD) LCD16:21 LCD22:27 LCD8:15
PTE1 / LCD9
PORT E
PTE2 / LCD10 PTE3 / LCD11 PTE4 / LCD12 PTE5 / LCD13 PTE6 / LCD14 PTE7 / LCD15 LCD16:21
NOTES: 1. PTB2 / RESET / VPP is an input only pin when used as port pin 2. PTC6 / ACMPO / BKGD / MS is an output only pin
Figure 1. MC9RS08LA8 Series Block Diagram
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 3
Pin Assignments
Table 1. Pin Availability by Package Pin-Count
This section shows the pin assignments in the packages available for the MC9RS08LA8 series.
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 4 Freescale Semiconductor
Pin Assignments
Table 1. Pin Availability by Package Pin-Count (continued)
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 5
Pin Assignments
PTE2 / LCD10
PTE3 / LCD11
PTE4 / LCD12
PTE5 / LCD13
PTE6 / LCD14
PTE7 / LCD15
PTE0 / LCD8
PTE1 / LCD9
LCD16
LCD17
LCD18
PTD7 / LCD7 PTD6 / LCD6 PTD5 / LCD5 PTD4 / LCD4 PTD3 / LCD3 PTD2 / LCD2 PTD1 / LCD1 PTD0 / LCD0 VCAP1 VCAP2 VLL1 VLL2
LCD19
PTB0 / EXTAL PTC0 / RxD PTA7 / KBIP7 / ACMP- PTA6 / KBIP6 / ACMP+ PTB1 / XTAL PTB2 / RESET / VPP VSSAD / VREFL VDDAD / VREFH PTC1 / TxD VLL3 VDD VSS
LCD20 LCD21 PTA5 / KBIP5 / ADP5 / LCD22 PTA4 / KBIP4 / ADP4 / LCD23 PTA3 / MOSI / KBIP3 / ADP3 / TxD / LCD24 PTA2 / MISO / KBIP2 / ADP2 / RxD / LCD25 PTA1 / SPSCK / KBIP1 / ADP1 / LCD26 PTA0 / SS / KBIP0 / ADP0 / LCD27 PTC7 / TCLK / LCD28 PTC6 / ACMPO / BKGD / MS PTC3 / TPMCH1 PTC2 / TPMCH0
Figure 2. MC9RS08LA8 Series in 48-Pin QFN / LQFP Package
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 6 Freescale Semiconductor
Electrical Characteristics
Parameter Classification
This chapter contains electrical and timing specifications.
The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate:
Table 2. Parameter Classifications
P C Those parameters are guaranteed during production testing on each individual device. Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category. Those parameters are derived mainly from simulations.
NOTE The classification is shown in the column labeled "C" in the parameter tables where appropriate.
Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the limits specified in Table 3 may affect device reliability or cause permanent damage to the device. For functional operating conditions, refer to the remaining tables in this chapter. This device contains circuitry protecting against damage due to high static voltage or electrical fields however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD) or the programmable pull-up resistor associated with the pin is enabled.
Table 3. Absolute Maximum Ratings
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 7
Electrical Characteristics
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I / O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the MCU design. In order to take PI / O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I / O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
Table 4. Thermal Characteristics
Rating Operating temperature range (packaged) Maximum junction temperature Thermal resistance Single layer board 48-pin LQFP 48-pin QFN JA Four layer board 48-pin LQFP 48-pin QFN 49 28 71 84 °C / W TA TJMAX Symbol TL to TH -40 to 85 105 Value °C °C Unit
The average chip-junction temperature (TJ) in °C can be obtained from:
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 8 Freescale Semiconductor
Electrical Characteristics
(if PI / O is neglected) is:
Solving Equation 1 and Equation 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from Equation A-3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations 1 and 2 iteratively for any value of TA.
ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM). A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification.
Table 5. ESD and Latch-up Test Conditions Model
Human Body
Description
Series resistance Storage capacitance Number of pulses per pin Series resistance
Symbol
Value
Machine
Storage capacitance Number of pulses per pin Minimum input voltage limit
Latch-up Maximum input voltage limit
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 9
Electrical Characteristics
Table 6. ESD and Latch-Up Protection Characteristics No.
Rating1
Symbol
VHBM VMM VCDM ILAT ILAT
DC Characteristics
This section includes information about power supply requirements, I / O pin characteristics, and power supply current in various operating modes.
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 10 Freescale Semiconductor
Electrical Characteristics
Symbol
Typical
VOL IOLT
400 300 200 100 0 3mA 6mA 9mA 12mA 15mA
-40C 25C 85C
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 11
Electrical Characteristics
1800 1600 1400 1200 mV 1000 800 600 400 200 0 3mA 6mA 9mA 12mA 15mA -40C 25C 85C
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 3mA 6mA 9mA 12mA 15mA V
-40C 25C 85C
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 12 Freescale Semiconductor
Electrical Characteristics
1.4 1.2 1 0.8 V 0.6 0.4 0.2 0 3mA 6mA 9mA 12mA 15mA -40C 25C 85C
VIH vs VDD
1.5 1 0.5 0 2.8V 3.0V 3.3V 4.5V 5.0V 5.5V
-40C 25C 85C
Figure 7. Typical VDD vs. VIH
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 13
Electrical Characteristics
VIL vs VDD
-40C 25C 85C
0 2.8V 3.0V 3.3V 4.5V 5.0V 5.5V
Figure 8. Typical VDD vs. VIL
Supply Current Characteristics
Table 8. Supply Current Characteristics
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 14 Freescale Semiconductor
Electrical Characteristics
Table 8. Supply Current Characteristics (continued)
Symbol - -
Typical1 2.4 1.9 70 65
External (XOSC) and Internal (ICS) Oscillator Characteristics
Reference Figure 9 for crystal or resonator circuit.
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 15
Electrical Characteristics
Typical1 - - -
Max 38.4 10 10
Unit kHz MHz MHz
See Note 2
t CSTL t CSTH
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 16 Freescale Semiconductor
Electrical Characteristics
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fBUS. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage for a given interval.
XOSC EXTAL XTAL RS
Crystal or Resonator C2
Figure 9. Typical Crystal or Resonator Circuit
AC Characteristics
This section describes ac timing characteristics for each peripheral system.
Control Timing
Table 10. Control Timing
Parameter Symbol fBus tRTI textrst tKBIPW tKBIPWS tRise, tFall Min 0 700 150 1.5 tcyc 100 - - Typical - 1000 - - - 11 35 Max 10 1300 - - - - - Unit MHz s ns ns ns ns
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 17
Electrical Characteristics
textrst RESET
Figure 10. Reset Timing
tKBIPWS tKBIPW KBI Pin (rising or high level)
KBI Pin (falling or low level) tKBIPW tKBIPWS
Figure 11. KBI Pulse Width
TPM / MTIM Module Timing
Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current bus rate clock.
Table 11. TPM / MTIM Input Timing
Function External clock frequency External clock period External clock high time External clock low time Input capture pulse width Symbol fTCLK tTCLK tclkh tclkl fICPW
tTCLK tclkh
Min 0 4 1.5 1.5 1.5
Unit MHz tCYC tCYC tCYC tCYC
TCLK tclkl
Figure 12. Timer External Clock
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 18 Freescale Semiconductor
Electrical Characteristics
tICPW TPMCHn
TPMCHn tICPW
Figure 13. Timer Input Capture Pulse
Analog Comparator (ACMP) Electrical
Table 12. Analog Comparator Electrical Specifications
Characteristic Symbol VDD IDDAC VAIN VAIO VH RAS IALKG tAINIT VBG Min 2.7 - VSS - 0.3 - 3.0 - - - 1.208 Typical - 20 - 20 9.0 - - - 1.208 Max 5.5 35 VDD 40 15.0 10 1.0 1.0 1.208 Unit V A V mV mV k A s V
Supply voltage Supply current (active) Analog input voltage Analog input offset voltage1 Analog Comparator hysteresis1 Analog source impedance Analog input leakage current Analog Comparator initialization delay Analog Comparator bandgap reference voltage
These data are characterized but not production tested. Measurements are made with the device entered STOP mode.
Internal Clock Source Characteristics
Table 13. Internal Clock Source Specifications
twakeup
Data in typical column was characterized at 3.0 V and 5.0 V, 25 °C or is typical recommended value. This value has been trimmed to 39.0625 kHz when out of factory 3 This value has been trimmed to 20 MHz when out of factory
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 19
Electrical Characteristics
This parameter is characterized and not tested on each device. This specification applies to any time the FLL reference source or reference divider is changed, trim value changed or changing from FLL disabled (FBILP) to FLL enabled (FEI, FBI).
ADC Characteristics
Table 14. 5 Volt 10-bit ADC Operating Conditions
Characteristic Conditions Absolute Symbol VDDAD VDDAD VSSAD VREFH VREFL VADIN CADIN RADIN Min 2.7 -100 -100 2.7 VSSAD VREFL - - - - - 0.4 fADCK 0.4 Typical1 - 0 0 VDDAD VSSAD - 4.5 3 - - - - - Max 5.5 100 100 VDDAD VSSAD VREFH 5.5 5 5 10 10 8.0 MHz 4.0 Unit V mV mV V V V pF k
Supply voltage Ground voltage Ref voltage high Ref voltage low Input voltage Input capacitance Input resistance
Analog source resistance external to MCU
ADC conversion clock frequency
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 20 Freescale Semiconductor
Electrical Characteristics
SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZAS RAS VADIN VAS Pad leakage due to input protection
ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT RADIN
ADC SAR ENGINE
RADIN INPUT PIN
RADIN
INPUT PIN
RADIN CADIN
INPUT PIN
IDDAD
VDDAD 5.5 V
IDDAD
IDDAD fADACK
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 21
Electrical Characteristics
Sample time
10-bit mode 8-bit mode 10-bit mode
10-bit mode 8-bit mode
AC Characteristics
This section describes AC timing characteristics for each peripheral system.
Control Timing
Table 16. Control Timing
Characteristic Symbol fBus tRTI Min DC 700 Typical - 1000 Max 10 1300 Unit MHz s
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 22 Freescale Semiconductor
Electrical Characteristics
Table 16. Control Timing (continued)
Symbol textrst tKBIPW tKBIPWS tRise, tFall
Min 150 1.5 tcyc 100 - -
Typical
Unit ns ns ns ns
textrst RESET
Figure 15. Reset Timing
tKBIPWS tKBIPW KBI Pin (rising or high level)
KBI Pin (falling or low level) tKBIPW tKBIPWS
Figure 16. KBI Pulse Width
Flash Specifications
This section provides details about program / erase times and program-erase endurance for the flash memory. For detailed information about program / erase operations, see the reference manual.
Table 17. Flash Characteristics
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 23
Electrical Characteristics
Table 17. Flash Characteristics (continued)
Min 20 500 - - 10 5 5 100 20 20 200 1 1000 15
Unit s ms ms hours s s s s ns ns ns s cycles years
Typicals are measured at 25 °C. thv is the cumulative high voltage programming time to the same row before next erase. Same address can not be programmed more than twice before next erase. 3 Fast V PP rise time may potentially trigger the ESD protection structure, which may result in over current flowing into the pad and cause permanent damage to the pad. External filtering for the VPP power source is recommended. An example VPP filter is shown in Figure 17.
Figure 17. Example VPP Filtering
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 24 Freescale Semiconductor
Ordering Information
tprog WRITE DATA1 tpgs
Data Next Data
PGM tnvs HVEN trs VPP2 tnvh trcv
tvps thv
Next Data applies if programming multiple bytes in a single row, refer to MC9RS08LA8 Series Reference Manual. 2 V DD must be at a valid operating voltage before voltage is applied or removed from the VPP pin.
Figure 18. Flash Program Timing
tme trcv MASS tnvs HVEN trs VPP1
tnvh1
VDD must be at a valid operating voltage before voltage is applied or removed from the VPP pin.
Figure 19. Flash Mass Erase Timing
Ordering Information
This section contains ordering numbers for MC9RS08LA8 devices. See below for an example of the device numbering system.
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 Freescale Semiconductor 25
Mechanical Drawings
Table 18. Device Numbering System
Memory Device Number FLASH MC9RS08LA8 8 KB RAM 256 bytes Type 48-Pin QFN 48-Pin LQFP Designator FT LF Document No. 98ARH99048A 98ASH00962A Package
Mechanical Drawings
This following pages contain mechanical specifications for MC9RS08LA8 series package options. · 48-pin QFN (quad flat non-leader) · 48-pin LQFP (low-profile quad flat-pack)
MC9RS08LA8 Series MCU Data Sheet, Rev. 1 26 Freescale Semiconductor
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Document Number: MC9RS08LA8 Rev. 1 10 / 2008