21-26.5GHz Down converter GaAs Monolithic Microwave package

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21-26.5GHz Down converter GaAs Monolithic Microwave package

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CHR3693-QDG
21-26.5GHz Down converter
GaAs Monolithic Microwave package
Description
CHR3693-QDG multifunction part, which integrates balanced cold mixer, time multiplier, LNA. designed wide range applications, typically commercial communication systems. circuit manufactured with pHEMT process, 0.25µm gate length, holes through substrate bridges. supplied lead-free package.
R3693 YYWW
Conversion gain (Inf. Sup. Mode)
Main Features
Broadband performance 21-26.5GHz 14dB gain -5dBm IIP3 18dBc Image rejection 24LQFN4x4 Level
F_FI=2GHz F_FI=3GHz
(supradyne) (infradyne)
Main Characteristics
Tamb +25° Symbol Parameter frequency range frequency range frequency range Conversion gain 26.5 Unit
Protections: Electrostatic discharge sensitive device observe handling precautions!
Ref. DSCHR3693-QDG8274
1/16
Specifications subject change without notice
United Monolithic Semiconductors S.A.S.
Route BP46 91401 Orsay Cedex France Tel.: Fax:
CHR3693-QDG
Electrical Characteristics
21-26.5GHz Down Converter
Tamb=25° Vdx=Vdl Typical -0.9V Vgm= -0.7V Symbol
IIP3 LO/RF 2LO/RF frequency range frequency range frequency range Conversion gain Noise Figure Input power Image Suppression Input return loss return loss 24GHz) return loss 26.5GHz) Isolation Isolation Bias current (Idl Idx)
Parameter
26.5
Unit
-9.5
With external hybrid coupler Typically, Idl= 90mA, Idx=70mA These values representative onboard measurements defined drawing page (paragraph "Evaluation mother board:").
Absolute Maximum Ratings
Tamb +25° Symbol
Tstg
Parameter
Maximum drain bias voltage Maximum drain bias current Gate bias voltage Maximum input power Maximum input power Maximum channel temperature Operating temperature range Storage temperature range
Values
-2.0 +0.4 +125
Unit
Operation this device above anyone these paramaters cause permanent damage.
Ref. DSCHR3693-QDG8274
2/12
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Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
21-26.5GHz Down Converter
Device thermal performances
CHR3693-QDG
figures given this section obtained assuming that device cooled down only conduction through package thermal convection mode considered). temperature monitored package back-side interface (Tcase) shown below. system maximum temperature must adjusted order guarantee that Tcase remains below maximum value specified next table. system must designed comply with this requirement. derating must applied dissipated power Tcase temperature maintained below than maximum temperature specified (see curve Pdiss. Max) order guarantee nominal device life time (MTTF).
DEVICE THERMAL SPECIFICATION CHR3693-QDG Recommanded max. junction temperature max) Junction temperature absolute maximum rating Max. continuous dissipated power Tcase= 0.34 Pdiss derating above Tcase Junction-Case thermal resistance (Rth J-C) <114 °C/W Min. package back side operating temperature Max. package back side operating temperature Min. storage temperature Max. storage temperature
Derating junction temperature constant calculated worst case where hotter junction MMIC considered. Tcase=Package back side temperature measured under die-attach-pad (see drawing below).
0.35 0.25 0.15 Pdiss. Max. 0.05 Tcase Pdiss. Max.
Tcase
Example back-side view, temperature reference point (Tcase) location.
Ref.: DSCHR3693-QDG8274
3/12
Specifications subject change without notice
Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
CHR3693-QDG
Typical Measured Performances
21-26.5GHz Down Converter
Tamb. Vdx=Vdl Typical -0.9V -0.7V
These values representative onboard measurements defined drawing page (paragraph "Evaluation mother board:") connector access planes).
Conversion Gain (infradyne mode) Freq_IF=2GHz, PLO=2dBm
-40°
+25°
+80°
Conversion Gain (supradyne mode) Freq_IF=2GHz, PLO=2dBm
-40°
+25°
+80°
Ref. DSCHR3693-QDG8274
4/12
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Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
21-26.5GHz Down Converter
CHR3693-QDG
Image Frequency rejection (inf. sup. Mode) -40, +25, +80°
-40° +25° +80°
(supradyne) (infradyne)
Noise figure channel -40, +25, +80°
(supradyne) (infradyne)
Measurements connectors' plan +80° +25°
-40°
(GHz)
Ref.: DSCHR3693-QDG8274
5/12
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Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
CHR3693-QDG
21-26.5GHz Down Converter
Compression (inf. sup. Mode) F_RF=21GHz F_IF=3GHz PLO=2dBm
-40°C
+25°
+80°
(supradyne) (infradyne)
Compression (inf. sup. Mode) F_RF=26GHz F_IF=2GHz PLO=2dBm
-40° +25°
+80°
(supradyne) (infradyne)
Ref. DSCHR3693-QDG8274
6/12
Specifications subject change without notice
Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
21-26.5GHz Down Converter
Input versus power
IIP3 (dBm)
CHR3693-QDG
P_RF 2tones (dBm)
21GHz -40° 21GHz 21GHz 23.6GHz -40° 23.6GHz 23.6GHz 26.5GHz -40° 26.5GHz 26.5GHz
Isolations LORF 2LORF PLO=2, 6dBm Freq_IF=2GHz Isolation LO-RF
Isolation 2LO-RF
Ref.: DSCHR3693-QDG8274
7/12
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Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
CHR3693-QDG
21-26.5GHz Down Converter
Return Loss PLO=0dBm
Return Loss PRF=-30dBm
Ref. DSCHR3693-QDG8274
8/12
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Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
21-26.5GHz Down Converter
Package outline
CHR3693-QDG
R3693
Matt tin, Lead Free Units From standard
(Green) JEDEC MO-220 (VGGD)
123456789101112-
131415161718192021222324-
I-IF Q-IF
package outline drawing included this data-sheet given indication. Refere application note AN0017 available http://www.ums-gaas.com exact package dimensions.
strongly recommended ground pins marked "GND" through board.
Ref.: DSCHR3693-QDG8274 9/12 Specifications subject change without notice
Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
CHR3693-QDG
Definition reference planes
21-26.5GHz Down Converter
reference planes used measurements given above symmetrical from symmetrical axis package (see drawing beside). input output reference planes located 3.18mm offset (input wise output wise respectively) from this axis. Then, given parameters incorporate land pattern evaluation motherboard recommended page
Recommanded package footprint
Refer application note AN0017 available http://www.ums-gaas.com package foot print recommandations.
mounting procedure
leadless package been designed high volume surface mount assembly process. dimensions footprint required (motherboard) given drawings above. mounting process standard techniques involving solder paste suitable reflow process used. further details, application note AN0017.
Ref. DSCHR3693-QDG8274
10/12
Specifications subject change without notice
Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
21-26.5GHz Down Converter
Evaluation mother board:
CHR3693-QDG
Compatible with proposed footprint. Based typically Ro4003 8mils equivalent. Using microstrip coplanar transition access package. Recommended implementation this product module board. Decoupling capacitors 10nF ±10% recommended accesses. (See application note AN0017 details).
10nF capacitor 0603 Hybric coupler Anaren 11306-3
connections include decoupling capacitor package, therefore mandatory provide good external decoupling board, close possible package. leadless package been designed high volume surface mount assembly process. typical footprint proposed (motherboard) previous drawing. mounting process standard techniques involving solder paste suitable reflow process used. further details, application note AN0017.
Ref. DSCHR3693QDG7264 Sept
11/12
Specifications subject change without notice
Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:
CHR3693-QDG
21-26.5GHz Down Converter
Ordering Information
RoHS compliant package: CHR3693-QDG/XY Stick: Tape reel:
Information furnished believed accurate reliable. However United Monolithic Semiconductors S.A.S. assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights United Monolithic Semiconductors S.A.S. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. United Monolithic Semiconductors S.A.S. products authorised critical components life support devices systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref. DSCHR3693-QDG8274
12/12
Specifications subject change without notice
Route 128, BP46 91401 ORSAY Cedex FRANCE Tel.: Fax:

21-26.5GHz Down converter GaAs Monolithic Microwave package

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