vishay semiconductors vse-db2802-0610 notes: navigate: click
|
|
|
Top Searches for this datasheet
infrared data communication
vishay semiconductors
vse-db2802-0610
notes: navigate: click vishay logo datasheet contents page that section. click vishay logo contents page main table contents page. click products within table contents directly datasheet. scroll page up/page down functions. adobe acrobat page function browser bar. search text catalog adobe acrobat search function.
Discrete Semiconductors Passive Components
World's Largest Manufacturers
Infrared data communIcatIon
VISHAY SEmICONDuCTORS Encoders/Decoders
DATA
semIconductors
rectIfIers
Schottky (single, dual) Standard, Fast, ultra-Fast Recovery (single, dual) Bridge Superectifier® Sinterglass Avalanche Diodes
transIstors
Bipolar Transistors Dual Gate mOSFETs mOSmICs®
oPtoeLectronIcs
Emitters Detectors, Receiver modules Optocouplers Solid-State Relays Optical Sensors LEDs 7-Segment Displays Infrared Data Transceiver modules Custom Products
smaLL-sIGnaL dIodes
Schottky Switching (single, dual) Tuner/Capacitance (single, dual) Bandswitching
Zener suPPressor dIodes
Zener (single, dual) (TransZorb®, Automotive, ESD, Arrays)
Power Analog Switches DC/DC Converters Transceivers Optoelectronics
PRODuCT LISTINGS
mosfets
Power mOSFETs JFETs
PassIve comPonents
resIstIve Products
Foil Resistors Film Resistors metal Film Resistors Thin Film Resistors Thick Film Resistors metal Oxide Film Resistors Carbon Film Resistors Wirewound Resistors Power metal Strip® Resistors Chip Fuses Variable Resistors Cermet Variable Resistors Wirewound Variable Resistors Conductive Plastic Variable Resistors Networks/Arrays Non-linear Resistors Thermistors Thermistors Varistors
caPacItors
Tantalum Capacitors molded Chip Tantalum Capacitors Coated Chip Tantalum Capacitors Solid Through-Hole Tantalum Capacitors Tantalum Capacitors Ceramic Capacitors multilayer Chip Capacitors Disc Capacitors Film Capacitors Power Capacitors Heavy-Current Capacitors Aluminum Capacitors Silicon Capacitors
straIn GaGe transducers stress anaLysIs systems
PhotoStress® Strain Gages Load Cells Force Transducers Instruments Weighing Systems
maGnetIcs
Inductors Transformers
Transceivers Databook
Vishay Semiconductor GmbH P.O.B. 3535, D-74025 Heilbronn Germany Telephone: (0)7131 2831 number: (0)7131 2423 www.vishay.com
NOTICE Specifications products displayed herein subject change without notice. Vishay Intertechnology, Inc., anyone behalf, assumes responsibility liability errors inaccuracies. Information contained herein intended provide product description only. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Vishay's terms conditions sale such products, Vishay assumes liability whatsoever, disclaims express implied warranty, relating sale and/or Vishay products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright, other intellectual property right. products shown herein designed medical, life-saving, life-sustaining applications. Customers using selling these products such applications their risk agree fully indemnify Vishay damages resulting from such improper sale.
OZONE DEPLETING SUBSTANCES POLICY STATEMENT policy Vishay Semiconductor GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances (ODSs). Montreal Protocol (1987) London Amendments (1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. Vishay Semiconductor GmbH been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency (EPA) Council Decision 88/540/EEC 91/690/EEC Annex (transitional substances) respectively. Vishay Semiconductor GmbH certify that semiconductors manufactured with ozone depleting substances contain such substances.
Table Contents
Vishay Semiconductors
Alphanumeric Index Selection Guide General Information
Infrared Data Communication According IrDA® Standard, Part Physical Layer. Infrared Data Communication According IrDA® Standard, Part Protocol. Symbols Terminology Data Sheet Structure Taping, Labeling, Storage, Packing Marking. Environmental Health Safety Policy Surface Mount Assembly Instructions Window Size Housings Sources Accessories Testing Ambient Light Electromagnetic Interference Safety Diode Emitters Remote Control with IrDA® Transceivers Interface Circuits Reference Layouts Circuit Diagrams. Quality Reliability
TFBS4650 TFBS4652 TFBS4710 TFBS4711 TFDU4100 TFDU4101 TFDU4202 TFDU4203 TFDU4300
TFBS5700 TFBS5711 TFDU5307
TFBS6711 TFBS6712 TFDU6102 TFDU6103 TFDU6300 TFDU6301 TFBS6614
with Receiver
TFDU7100
VFIR
TFDU8108
Emitter/Detector Pair
TFDU2201
Endec
TOIM4232
www.vishay.com
Alphanumeric Index
Vishay Semiconductors
TFBS4650. TFBS4652. TFBS4710. TFBS4711. TFBS5700. TFBS5711. TFBS6614. TFBS6711. TFBS6712. TFDU2201 TFDU4100 TFDU4101 TFDU4202 TFDU4203 TFDU4300 TFDU5307 TFDU6102 TFDU6103 TFDU6300 TFDU6301 TFDU7100 TFDU8108. TOIM4232.
www.vishay.com
Selection Guide
Vishay Semiconductors
Size Operating Link Distance Voltage Idle Supply Current (mA) Shutdown Current
Type
Pins
Pitch (mm)
Voltage Echo
Data Rate: kbit/s 115.2 kbit/s TFBS4650 TFBS4652 TFBS4710 TFBS4711 TFDU4100 TFDU4101 TFDU4202 TFDU4203 TFDU4300 0.08 0.08 0.07 0.08 0.06 0.06 0.08 0.01 0.01 0.01 0.01 0.01 0.02 0.01 0.95 0.95 1.55 0.95 0.95
Data Rate: kbit/s 1.152 Mbit/s TFBS5700 TFBS5711 TFDU5307 0.55 0.55 0.55 0.01 0.01 0.95 0.95 0.95
Data Rate: kbit/s Mbit/s TFBS6614 TFBS6711 TFBS6712 TFDU6102 TFDU6103 TFDU6300 TFDU6301 0.01 0.01 0.01 0.01 0.01 0.95 0.95 0.95 0.95 0.95
Data Rate: kbit/s Mbit/s Carrier Remote Control Receiver TFDU7100 active)
Data Rate: kbit/s VFIR Mbit/s TFDU8108 0.01
Emitter/Decoder pair data rate TFDU2201 n.a. n.a. n.a. n.a.
Encoder/Decoder TOIM4232 10.3 10.4 n.a. n.a.
Document Number 81368 Rev. 1.0, 04-Jul-06
www.vishay.com
Vishay Semiconductors
www.vishay.com
Contents
Infrared Data Communication According IrDA® Standard, Part Physical Layer Infrared Data Communication According IrDA® Standard, Part Protocol
General Information
Symbols Terminology. Data Sheet Structure Taping, Labeling, Storage, Packing Marking Environmental Health Safety Information. Surface Mount Assembly Instructions Window Size Housings Sources Accessories Testing Ambient Light Electromagnetic Interference. Safety Diode Emitters. Remote Control with IrDA® Transceivers Interface Circuits. Reference Layouts Circuit Diagrams Quality Reliabilty
IRDC, Part Physical Layer
Vishay Semiconductors
Infrared Data Communication According IrDA® Standard Part Physical Layer
What IrDA?
IrDA abbreviation Infrared Data Association, non-profit organization setting standards serial computer connections. following original excerpt from IrDA site (http://www.irda.org). includes Serial Infrared (SIR) Link specification, Link Access Protocol (IrLAP) specification, Link Management Protocol (IrLMP) specification. IrDA released extensions standard including Mbit/s October 1995. IrDA Standard Specification been expanded include high speed extensions 1.152 Mbit/s Mbit/s. This extension will require add-in card retrofit existing with high speed synchronous communications controller equivalent. 1995, several market leaders announced released products with features based IrDA standards. These products include components, adapters, printers, PCs, PDAs, notebook computers, access, software applications. November 1995, Microsoft Corporation announced added support IrDA connectivity Microsoft Windows operating system, enabling low-cost wireless connectivity between Windows based peripheral devices. IrDA's interoperable infrared serial data link features power consumption with data speeds Mbit/s, allowing cordless 'walk-up-to' data transfer simple, compelling way. Applications both consumer commercial markets with universal data connection relevant docking input units, printers, telephones, desktop/ laptop PCs, network nodes, ATMs, handheld mobile peers (PDA meets PDA). Yesterday's systems with capabilities such Newton, Omnibook, Wizard Zoomer easily compatible with each other other complementary devices. IrDA response which many segments industry have committed themselves realizing opportunity general standard providing data links which noninterfering interoperable.
Executive Summary
IrDA established 1993 support hardware software standards which create infrared communications links. Association's charter create interoperable, low-cost, low-power, halfduplex, serial data interconnection standard that supports walk-up, point-to-point user model that adaptable wide range applications devices. IrDA standards support broad range computing, communications, consumer devices. International scope, IrDA non-profit corporation headquartered Walnut Creek, California, Board Directors which represents voting membership worldwide. leading high technology standards association, IrDA committed developing promoting infrared standards hardware, software, systems, components, peripherals, communications, consumer markets.
Industry Overview
Infrared (IR) communications based technology which similar remote control devices such entertainment remote controls used most homes today. offers convenient, inexpensive reliable connect computer peripheral devices without cables. IrDA connectivity being incorporated into most notebook bring most cost-effective easy support available wireless technologies. There European other international regulatory constraints. Manufacturers ship IrDA-enabled products globally without constraints, IrDA functional devices used international travellers wherever they are, interference problems minimal. Standards communications have been developed IrDA. September 1993, IrDA determined basis IrDA Data Link Standards. June 1994, IrDA published IrDA standards which
www.vishay.com
IrDA Standard
current IrDA physical layer standard version includes changes add-ons VFIR with Mbit/s. Version replaced version which obsolete former versions from 1.2. Referring these versions currently describe only historical steps IrDA development.
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Physical Layer
Vishay Semiconductors IrDA Transmission Works
transmission IrDA-compatible mode (sometimes called serial uses, simplest case, RS232 port, built-in standard compatible PCs. With simple interface, shortening length maximum 3/16 original length power-saving requirements, infrared emitting diode driven transmit optical signal receiver. This type transmission covers data range 115.2 kbit/s which maximum data rate supported standard UARTs (see figure minimum demand transmission speed IrDA only 9600 bit/s. transmissions must started this frequency enable compatibility. Higher speeds matter negotiation ports after establishing links. Higher speeds require special interfaces which operate 1.152 Mbit/s similar pulse-shortening process RS232-related mode, with pulse reduction original pulse length. fastest data rate supported IrDA Mbit/s (often called FIR), operating with 125-ns pulses 4-PPM (PPM Pulse-Position Modulation) mode. typical interfaces various modes shown figure following chapter "IrDA Standard Physical Layer", definitions IrDA standard given. Optical output power receiver sensitivity level where point-and-shoot activity sufficient point-to-point communication, prevents pollution ambient straying needless power. Transmission over distance least ensured. detector front receives transmitted signal, re-shapes signal feeds port. system works half-duplex mode that allows only transmission direction active given time. frequencies 115.2 kbit/s, minimum output intensity defined with mW/sr. higher speeds, higher output intensity W/sr minimum used. sensitivity thresholds mW/m2 mW/m2 respectively. wavelength chosen standard between additional IrDA standard generated 1997 (voted Feb. 1998) Control applications, socalled IrControl standard. This standard using IEC1603-1 carrier frequency allocation with carrier 1500 kHz. transmission capacity kbit/s. This system still some compatibility problems with SIR/FIR
Document number: 82513 Rev. 1.4, 20-Sep-06
IrDA Standard. disadvantages that detector circuitry different from other, baseband system. Therefore, integrating both into application expensive. Using IrControl SIR/FIR application would imply that hardware channels must built-in. Very Fast (VFIR, min. Mbit/s transfer rate over more than established 1999.
What need enable IrDA Transmission?
simplest optical interfacing mode shown figure pulse shaping recovery, Vishay Semiconductors device TOIM4232 recommended. front including transmitter receiver should realized example integrated transceiver module TFDU4100 other devices 4000 series. TFDU4100 also directly connected Super I/Os. transimpedance amplifier used receiver input amplification. output signal comparator input, whose reference level adjusted efficiently suppress noise interferences from ambient. Additionally, digital pulse-shaping circuit must inserted shortening pulse emitted (i.e., 3/16 length kbit/s) pulse recovery detected signal comply with IrDA standard. Only active bits transmitted. high-speed mode, TFDU6102 other devices from 6000 series recommended operated with NSC's SMC's IrDA-compatible Super circuits. Circuit proposals various modes found application section. block diagram shown Figure
www.vishay.com
IRDC, Part Physical Layer
Vishay Semiconductors
output Pulse shaping Transmitter
UART16550/ RS232
TOIM4232 Pulse recovery
17255
4000 series transceiver
Receiver input
Figure Block diagram overall link
115.2 kbit/s 1.152 Mbit/s 0.576 Mbit/s Mbit/s
17256
Output driver IRED
output Active output interface Active input interface output
transceiver module
Detector receiver
Figure Block diagram link signaling rates Mbit/s
IrDA standard documentation found IrDA site http://www.irda.org. documents which public downloaded shown next page. physical layer responsible definition hardware transceivers data transmission. physical layer therefore discussed following chapters which define properties front devices manufactured Vishay Semiconductors.
www.vishay.com
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Physical Layer
Vishay Semiconductors Standards available public access download www.irda.org
Standards, specifications guidelines available under addresses following documents describe IrDA Standards: IrDA Data Specification containing IrDA Serial Infrared Physical Layer Link Specification IrPHY IrDA Serial Infrared Link Access Protocol (IrLAP) IrDA Serial Infrared Link Management Protocol (IrLMP) IrDA Tiny IrDA Point Shoot Profile Test Specification Other available documents IrDA Financial Messaging (IrFMTM) Point Specification IrDA Financial Messaging (IrFMTM)Test Specification IrDA IrLAPFast Connect Application Note IrDA Adapter Application Profile Test Specification IrDA Control Specification IrDA Infrared Communications Protocol (IrCOMM 1.0) IrDA Infrared Tiny Transport Protocol (IrTinyTP 1.1) IrDA Infrared Access Extensions Link Management Protocol (IrLAN 1.0) IrDA Object Exchange Protocol (OBEXTM) Ver.1.3 IrDA Object Exchange Protocol (OBEXTM) Test Specification Ver.1.0.1 IrDA Minimal IrDA Protocol Implementation (IrLite) IrDA Plug Play Extensions IrLMP IrDA Infrared Mobile Communications (IrMC) IrDA Infrared Transfer Picture Specifications (IrTranP) IrDA Dongle Interface specifications IrDA Infared Wrist Watches specification (IrWW) Serial Port Profile, IrModem Profile Test Specs Serial Interface Transceivers IrDA Point Shoot IrDA Point Shoot Application Profile IrDA Point Shoot Test Specification
Document number: 82513 Rev. 1.4, 20-Sep-06
www.vishay.com
IRDC, Part Physical Layer
Vishay Semiconductors
IrDA-Standard Physical Layer
Specification
mode, data represented optical pulses between 3/16 length RS232 data pulse mode. Pulse-length reduction also applied higher frequency modes. limits standards shown tables optical radiant intensity detector sensitivity adjusted guarantee point-to-point transmission cone over distance least radiant intensity sensitivity front increased ensure transmission over (see figure Data from optical interface standard documented tables Signaling Rate Pulse Duration: IrDA serial infrared interface must operate kbit/s. Additional allowable rates listed below optional. Signaling rate pulse duration specifications shown table signaling rates including 115.2 kbit/s minimum pulse duration same (the specification allows both 3/16 duration pulse minimum pulse duration 115.2 kbit/s signal (1.63 minus 0.22 tolerance). maximum pulse duration 3/16 duration, plus greater tolerance duration, 0.60 0.576 Mbit/s 1.152 Mbit/s, maximum minimum pulse durations nominal duration plus (tolerance) minus (tolerance) duration. Mbit/s, maximum minimum single pulse durations nominal symbol duration plus minus tolerance symbol duration. Mbit/s, maximum minimum double pulse durations symbol plus minus tolerance symbol duration. Double pulses occur whenever adjacent chips require pulse. link must meet specification over link length range meet optical pulse constraints.
Power Power Link Distance Lower Limit, meters Minimum Link Distance Upper Limit, meters Table Link Distance Specifications Standard Power Standard Standard
Media Interface Specification
Overall Links There different sets transmitter/ receiver specifications. first, referred Standard, link which operates from least meter. second, referred Power Option, shorter operating range, only defined 115.2 kbit/s. There three possible links (see Table below): Power Option Power Option, Standard Power Option; Standard Standard. distance measured between optical reference surfaces.The Error Ratio (BER) shall greater than 10-8. link shall operate meet specification over range.
www.vishay.com
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Physical Layer
Vishay Semiconductors
UART Start
Frame Stop
Data Bits
UART
Frame
Frame Start Data
Stop
Frame
17257
Pulse Width 3/16 Time
Signaling Rate kbit/s kbit/s 19.2 kbit/s 38.4 kbit/s 57.6 kbit/s 115.2 kbit/s 0.576 Mbit/s 1.152 Mbit/s Mbit/s Single pulse Double pulse Mbit/s Return Zero Inverted
Modulation RZI*) RZI*) RZI*) RZI*) RZI*) RZI*)
Rate Tolerance Rate 0.87 0.87 0.87 0.87 0.87 0.87 0.01 0.01 0.01
Pulse Duration Minimum 1.41 1.41 1.41 1.41 1.41 1.41 295.2 147.6 115.0 240.0 38.3
Pulse Duration Nominal 78.13 19.53 9.77 4.88 3.26 1.63 434.0 217.0 125.0 250.0 41.7
Pulse Duration Maximal 88.55 22.13 11.07 5.96 4.34 2.23 520.8 260.4 135.0 260.0 45.0
RZI*) (1.13)
Table Signaling rate pulse-duration specification
Document number: 82513 Rev. 1.4, 20-Sep-06
www.vishay.com
IRDC, Part Physical Layer
Vishay Semiconductors
115.2 kbit/s 0.576 Mbit/s 1.15 Mbit/s
17258
cell
Mbit/s
complete Symbol chip
17259
chip
chip
chip
Data Pair (DBD)
4PPM Data Symbol (DD) 1000 0100 0010 0001
www.vishay.com
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Physical Layer
Vishay Semiconductors (1,13) Modulation Code 16-Mbit/s VFIR Standard
modulation code following salient features: Code Rate: Maximal Duty Cycle: Average Duty Cycle: Minimal Duty Cycle: 1/12 Run-Length Constraints: Longest '10' yyy'000'101'010'101'000'yyy Chip Rate Data Rate Mbit/s: Mchips/s System Clock Data Rate Mbit/s: (where HHH(1,13) code Length Limited (RLL) code that provides both power efficiency bandwidth efficiency high data rate. signaling rate code Mchips/s allowing rise fall time time further improved having average duty cycle random data. lower duty cycle achieved scrambling incoming data stream. length constraints ensure inactive chip after each active chip, i.e. only single-chip-width pulses occur. This feature allows source receiver exhibit long tail property. take full advantage feature HHH(1, strong signal conditions, clock data recovery circuitry should designed ignore level chip following active chip assume these chips inactive. HHH(1, denominates that maximum number chips without signal That limits lower cutoff frequency system optimizes threshold trigger stability receiver designs. modulation code enhanced with simple framesynchronized scrambler/descrambler mechanisms defined described IrDA IrPhy standard. While such scheme does eliminate worst-case duty cycle signal patterns specific cases, probabilities their occurrence reduced significantly average. This leads better "eye" opening reduced jitter recovered signal stream typical payload data.
Document number: 82513 Rev. 1.4, 20-Sep-06
www.vishay.com
IRDC, Part Physical Layer
Vishay Semiconductors Active Output Interface
active output interface (IRLED) emits infrared signal. parameters this interface, defined IrDA physical layer specification shown table complete specification available from IrDA.
Specification Peak wavelength, Maximum intensity angular range, mW/sr Data Rates Type Both Power 115.2 kbit/s below Minimum intensity angular range, mW/sr Above 115.2 kbit/s 115.2 kbit/s below 115.2 kbit/s Mbit/s Mbit/s Pulse duration Optical overshoot, Edge Jitter, nominal pulse duration Edge Jitter nominal chip duration 115.2 kbit/s below Mbit/s 16.0 Mbit/s Table Active output specification *)For given transmitter implementation, 60825-1 Class limit less than this. section above Appendix Both Both Both Both Both Both Power Power Half angle, degrees Signaling rate (also called clock accuracy) Rise time fall time Both Both Minimum 0.85 table table Maximum 0.90 500*) 500*) table table
Edge Jitter, relative reference clock, nominal duration 0.576 1.152 Mbit/s
Tolerance Field Angular Emission
optical radiant intensity limited maximum mW/sr angle enable independent operation more than system room. figure tolerance field infrared
17260
transmitter's emission shown. typical field characteristic transmitter also shown this figure.
Radiant intensity (mW/sr)
IrDA tolerance field
Typical characteristic
(V)FIR
Angle emission
Figure Tolerance field angular emission
www.vishay.com
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Physical Layer
Vishay Semiconductors Active Input Interface
When infrared optical signal impinges active input interface (PIN photodiode), signal detected, conditioned receiver circuitry, transmitted receive decoder.
Specification Maximum irradiance angular range, mW/m2 Minimum irradiance angular range, mW/m2 Above 115.2 kbit/s Data Rates 115.2 kbit/s below Type Both Power Power Half angle, degrees Receiver latency allowance, 16.0 Mbit/s Table Active input specification kbit/s below Both Power Both Minimum 22.5 10.0 Maximum 0.10
Active Input Specification
following five specifications form which measured concurrently: Maximum irradiance angular range, mW/m2 Minimum irradiance angular range, mW/m2 Half-angle, degrees Error Ratio, (BER) Receiver Latency Allowance, These measurements require optical power source means measure angles BERs. Since optical power source must provide specified characteristics Active Output, calibration control this source same equipment that required measure intensity timing characteristics. measurements require some method determine errors received decoded signal. latency test requires exercise node's transmitter condition receiver. Definitions reference point etc., same Active Output Interface optical power measurements except that test head optical power source with in-band characteristics (peak wavelength, rise fall times, pulse duration, signaling rate jitter) Active Output Interface. optical power source must also able provide maximum power levels listed Active Output Specifications. expected that minimum levels attained appropriately spacing optical source from reference point. Figure illustrates region over which Optical High State defined. receiver operated throughout this region measurements made verify maximum minimum requirements. ambient conditions (page apply during tests; measurements done with worst case signal patterns. Unless otherwise known, test signal pattern should include maximum length sequences "1"s light) test noise ambient, maximum length sequences "0"s (light) test latency other overload conditions. Latency tested Minimum Irradiance angular Range conditions. receiver conditioned exercise associated transmitter. rates including 1.152 Mbit/s, conditioning signal should include maximum length sequences "0"s (light) permitted this equipment. Mbit/s operation, various data strings should used; latency pattern dependent. receiver operated with minimum irradiance levels measurements made after specified latency period this equipment verify irradiance, half angle, latency requirements. minimum allowable intensity value indicated "minimum" figure since actual specified value dependent upon data rate, FIR.
Document number: 82513 Rev. 1.4, 20-Sep-06
www.vishay.com
IRDC, Part Physical Layer
Vishay Semiconductors Power Standard Full Range Operation
message that Power device must special design often propagated, incorrect. Full standard devices operated easily with reduced IRED drive current fulfill power specification. However, devices specially designed Power applications with profile package able cover full standard because limited efficiency little drive current capability.
Irradiance Incidence) (W/m (Vertical axis drawn scale) kW/m
Undefined Region Optical High State Undefined Region
minimum
17261
Angle (Degrees)
Figure Optical High State Acceptable Range
www.vishay.com
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Physical Layer
Vishay Semiconductors Transmission Distance
From figure transmission distance function sensitivity (necessary irradiance detector) read. example: Sensitivity given minimum irradiance detector mW/m2, combined with intensity mW/sr, results transmission distance combination detector with minimum irradiance mW/m2 emitter with mW/sr transmit over almost five meters. Vishay Semiconductor transceivers work well with standard remote control receivers therefore operated remote control transmitters. physical layer properties devices defined under ambient conditions listed appendix which been reprinted following chapters.
10-1 10-2 0.01
17262
mW/sr mW/sr mW/sr mW/sr IrDA Standard specified sensitivity IrDA Standard specified sensitivity Remote Control, guaranteed sensitivity Remote Control, typical sensitivity
Irradiance (mW/m
Distance
Figure IrDA Remote Control maximum transmission distance. Remote Control receivers operating with IrDA transmitters sensitivity mW/m2 assumed.
Document number: 82513 Rev. 1.4, 20-Sep-06
www.vishay.com
IRDC, Part Physical Layer
Vishay Semiconductors
Appendix Test Methods
Note Normative unless otherwise noted. rest Appendix Appendix Informative, Normative {i.e. does contain requirements, information only}. Examples measurement test circuits calibration provided IrDA Serial Infrared Physical Layer Measurement Guidelines.
A.1. Background Light Electromagnetic Field
There four ambient interference conditions which receiver operate correctly. conditions applied separately: Electromagnetic field: maximum (Refer 61000-4-3. test level details) (For devices that intend connect with operate vicinity mobile phone pager, field with frequency ranges from including amplitude modulation with sine wave recommended. Refer 61000-4-3 test level details. condition recommendation; normative condition.) Sunlight: kilolux maximum optical port This simulated with source having peak wavelength within range spectral width less than biased provide W/cm2 (with modulation) optical port. light source faces optical port. This simulates sunlight within IrDA spectral range. effect longer wavelength radiation covered incandescent condition. Incandescent Lighting: 1000 maximum. This produced with general service, tungsten filament, gas-filled, inside-frosted lamps Watt Watt range generate 1000 over horizontal surface which equipment under test rests. light sources above test area. source expected have filament temperature 2700 3050 degrees Kelvin range spectral peak 1050 range. Fluorescent Lighting: 1000 maximum This simulated with source having peak wavelength within range spectral width less than biased modulated provide optical square wave signal W/cm2 minimum W/cm2 peak amplitude with rise fall times less than equal over horizontal surface which equipment under test rests. light sources above test area. frequency optical signal swept over frequency range from kHz. variety fluorescent lamps range emissions, this condition expected cover circumstances. will provide common basis IrDA operation.
www.vishay.com
Document number: 82513 Rev. 1.4, 20-Sep-06
IRDC, Part Protocol
Vishay Semiconductors
Infrared Data Communication According IrDA® Standard Part Protocol IrDA Protocol Stack
IrDA protocol stack provides hardware software architecture guidelines designing IrDA compliant system. Figure shows different layers stack. minimum, compliance IrPHYS, IrLAP, IrLMP required. Optional sections protocol include Higher Speed Extensions (1.15 Mbit/s), IrCOMM, TinyTP PnP. (commanding) station more secondary (responding) stations, whose roles IrLAP responsibility managing. primary station responsibility data link. transmissions over data link from primary station point-to-point point-to-multi-point. There always only primary station while other stations must secondary stations. After obeying media access rules primary will send connection request information 9600 bit/s other device, this data will include information such address other capabilities such data rate, etc. responding device will assume secondary role and, after obeying media access rules, return information that contains address capabilities. primary secondary will then change data rate other link parameters common defined capabilities described information transfer. primary will then send data secondary confirming link data rate capabilities. devices connected data transferred between primary secondary under complete control primary. Rules defined which ensure that secondary primary both able efficiently transfer data. station that capable contend play primary station role. role primary determined dynamically when link connection established continues until connection closed (the exception that there method provided primary secondary point point link exchange roles without closing connection).
Sniff- Open Address Discovery
17265
Figure IrDA Protocol Stack
IrDA Link Access Protocol (IrLAP)
IrLAP, derived from existing asynchronous data communications standard adaptation HDLC). provides guidelines link access which software searches other machines connect (sniffing), recognizes other machines (discovery), resolves addressing conflicts, initiates connection information exchange, manages disconnection. During data transfer, IrLAP responsible providing reliable error detection, retransmission, flow control. While discovery address conflict resolution procedures somewhat unique IrLAP, link initialization/ shutdown, connection startup, disconnection information transfer procedures resemble similar operations HDLC protocols adapted IrDA serial infrared environment. link operates essentially follows: device (primary) will want connect another device (either automatic detection discovery sniffing capability IrLAP, direct user request). data link involves least primary
Document Number: 82504 Rev.1.4, 20-Sep-06
Connect
Information Transfer
Disconnect
Address Conflict Resolution 17266
Reset
Figure IrLAP Operation Procedures
www.vishay.com
IRDC, Part Protocol
Vishay Semiconductors IrDA Infrared Link Management Protocol (IrLMP)
Once connection established, IrLMP manages available functions applications between communicating devices. IrLMP determines capabilities connected devices (discovery) manages negotiation link parameters correct data transfer (link control). link management framework also provides means device establish coexisting access connection between multiple devices (multiplexing). Discovery occurs when devices first encounter each other. Each service each protocol device will have registered with link management. information registered includes both standard protocol specific information. application query capabilities devices within range. Once application device determined which service protocol wishes use, requests link control protocol. link management framework allows multiplexing application transport protocols same link connection same time. Multifunctional devices have requirements link support concurrent activities. While IrDA Link Access Protocol, IrLAP, provides single connection between given pair IrDA compliant devices, provides means multiple application components share coexisting access that connection. useful feature capabilities would have mobile user wishing handheld/PDA note-book computer synchronize systems, check/send/ receive electronic mail, reconcile scheduling address book (PIM) data, also initiate deferred printing when makes contact with owner's desktop personal computer (PC) network gateway. Each activity controlled distinct application components within each device (mobile unit each component separate requirement locate peer component establish relevant connection. IrDA Link Management Protocol, IrLMP, mandatory component IrDA compliant devices addresses both previous needs mentioned. Connection multiplexing services provided IrLMP Multiplexer (LM-MUX). Location peer application components supported IrLMP Information Access Service(LMIAS) IrLMP Multiplexer (LM-MUX) provides multiplexed channels IrLAP connection. Each these called Link Service Access Point LSAPconnections (distinguished from IrLAP connections) carries logical separated information stream. multiplexer operates modes. multiplexed mode, multiplexer will accept data from clients (transport entities directly bound applications). exclusive mode single LSAP-connection claims access medium. IrLMP Information Access Service (LM-IAS) direct client LM-MUX operates client server manner. Application components that wish make themselves accessible peer components other devices "describe" themselves creating object whose attributes carry essential parameters required establish connection between peers. application component seeking peer application component inspects objects within remote LM-IAS information base. Assuming suitable object exists, connection parameters mechanism retrieved, which accessible LM-IAS. used enumerate devices available. resulting list devices sorted/prioritized basis information hints supplied discovery responses.
IrDA Physical Layer (IrPHY)
Physical Layer provides guidelines physical connection equipment using defines specifications which infrared transceivers must able meet. specifications Physical Layer were already described previous chapter.
www.vishay.com
Document Number: 82504 Rev.1.4, 20-Sep-06
IRDC, Part Protocol
Vishay Semiconductors IrDA Flow Control Mechanism (Tiny
Whilst IrLAP provides flow-control mechanism between peer IrLAP entities, introduction multiplexed channels above IrLAP IrLMP LM-MUX introduces problem. Reliance IrLAP provide flow-control multiplexed channel result dead-locks consumption data from multiplexed channel dependent data flowing adjacent multiplexed channel. Conversely, inbound data multiplexed channel cannot consumed underlying IrLAP connection cannot flow controlled possibility deadlock, inbound data (freshly arrived buffered) must discarded event buffer exhaustion. Sadly this reduces reliable delivery service provided IrLAP best effort delivery service provided IrLMP LM-MUX (when multiple multiplexed channels operation).There least possible solutions restoring reliable delivery service above IrLMP LM-MUX. Provide application stream flow-control mechanism above LM-MUX between peer application entities. This ensures that there always sufficient buffer space available accommodate in-bound application data. Provide application stream retransmission mechanism above LM-MUX that recovers from loss data that arises inbound buffering become exhausted. Tiny protocol provides: Independently flow controlled transport connections Segmentation re-assembly starting with what kinds ports will emulated. IrCOMM emulates RS-232 (EIA/TIA-232-E) serial ports, Centronics parallel ports like those found most personal computers. four service types used emulate these ports core this specification. Before discussing service types, however, there some basic differences between wired IrDA communications consider. Wired communications methods send streams information both directions once, because there multiple wires (some send data some receive data from). With infrared, there equivalent only wire (the path through air). This following implications: IrDA protocols send packets time.If device tried send data listen data same time, would "hear" itself device wants communicate with. IrDA devices achieve communications take turns, also known "turning link around". This happens least every made more frequent necessary. This latency makes impossible perfectly emulate wired COMM environment very timing sensitive operations will disrupted.Fortunately, many communication tasks sensitive, therefore IrCOMM. information carried multiple wires must carried single "wire". This accomplished subdividing packets into data control parts. this logical data channel control channel created, various wires emulated. different level, IrCOMM intended legacy applications, applications that know about serial parallel ports know nothing about IrDA protocols. IrDA protocols, however, have very different procedures APIs from wired COMMs. Suppose, example, word processing application wants print using IrDA protocols, application must first "discover" printer (locate printer IR-space), then check printer find information needed connect. Since word processing application legacy application) knows nothing about this, IrCOMM maps these operations into normal COMM operations that completely transparent. purposes IrCOMM complete communication path involves applications running different devices (the communication endpoints) with communication segment between them.
IrDA Serial Parallel Port Emulation (IrCOMM)
IrCOMM defines emulation Serial Parallel ports over IrLMP/IrLAP protocol stack. motivation IrCOMM comes from many printing communication applications which standard communication APIs talk other devices serial parallel ports. making IrDA protocols accessible these APIs, many existing applications including printing over IrDA infrared link without change. This intent support so-called legacy applications basis IrCOMM. applications encouraged take better advantage IrDA protocols using their capabilities directly. Emulating COMM ports raises number questions,
Document Number: 82504 Rev.1.4, 20-Sep-06
www.vishay.com
IRDC, Part Protocol
Vishay Semiconductors
communication segment consist solely connections network. figure below shows complete communication path. between type type therefore, IrCOMM implementor determine information passed IrCOMM protocol implementation. Since devices know type other device communication path, they must pass information specified protocol which they have knowledge. IrCOMM emulates serial parallel ports. However, printing communications applications communication ports variety ways. address this need, IrCOMM provides four service types classes: 3-Wire raw, 3-Wire, 9-Wire, Centronics. service types fall into camps, which called cooked; differences hinge whether control channel supplied type flow control used. 3-Wire provides data channel only, uses IrLAP flow control. "cooked" service types (3Wire, 9-Wire, Centronics) support control channel, employ Tiny flow control. 3-Wire This service type used serial parallel emulation when single exclusive connection acceptable, only data circuits need emulated non-data circuits corresponding wired setting carry information). name this service comes from notion emulating minimum three RS-232 circuits required full duplex communications. circuits shown below.
CCITT Signal Description Signal Common Transmitted Data (TD) Received Data (RD) Comment This circuit needed circuits that drove definition name. This connection carries data transmitted This connection carries data received
Application
Device
17267
Communication Segment
Application
Device
IrCOMM intended cover applications that make serial parallel ports devices which they reside. simple case, communication segment link from device another (direct connect). case where communication segment network, used path between device networking connection device like modem. Modems communicate through network using wire, radio IrCOMM only concerned with connection between devices direct connect case between device modem network case. There other configurations that IrCOMM support such modules that communicate side provide wired interface other side. These devices really modems offer similar service thus, explicitly discussed. Basically device types exist that IrCOMM must accommodate. Type devices communication points such computers printers. Type devices those that part communication segment such modems. Though IrCOMM does make distinction between these device types protocol, accommodating both types devices impacts IrCOMM protocol. figures below illustrate IrCOMM device types into communication paths.
Device with IrDA (Type Device with IrDA (Type
17268
Device with IrDA (Type
Device with IrDA (Type
Wire
Device IrDA
information transferred between IrCOMM entities been defined support both type type devices. Some information only needed type devices while other information intended used both. protocol distinction made
Here main attributes 3-Wire service class: Only non-IAS IrLMP connection open 3-Wire used other connections must closed before established, others must wait until connection closed before they connect.This because 3-Wire uses flow control features IrLAP, which result deadlock condition more than non-IAS connection open. Minimal Implementation. IrCOMM data sent directly IrLMP IrLMP packets. data that follows IrLMP bytes IrLMP packet IrCOMM data, (i.e., information that would travel over data line(s) wired interface). control channel available comDocument Number: 82504 Rev.1.4, 20-Sep-06
www.vishay.com
IRDC, Part Protocol
Vishay Semiconductors
municate information about state other leads (e.g., RTS/CTS), software flow control settings, like. service which employs 3-Wire must able without that information. link merely channel movement data. This service used emulate both serial parallel ports. This seem counter-intuitive (who ever heard 3-Wire parallel port?), remove non-data circuits (which 3-Wire does emulate), serial parallel equivalent, i.e., just streams data. IrLPT IrDA service commercially available printing devices. equivalent 3-Wire functionality, slightly different uses IAS. 3-Wire Like 3-Wire raw, name this service comes from minimum three RS-232 circuits required full duplex communications. Like 3-Wire raw, intended both serial parallel ports. However, there following important differences noted: 3-Wire service class makes Tiny flow control, that coexist with other connections that employ higher level (not IrLAP) flow control (including other cooked IrCOMM connections). limited like 3-Wire single IrLMP connection. 3-Wire service class supports control channel sending information like data format. control channel mechanism described chapter titled Frame Formats Control Channel. Because need flow control control channel, 3-Wire service type uses more elaborate frame format. 9-Wire name this service class comes from notion emulating circuits RS-232 interface which part standard compatible Unlike previous services true name; 9-Wire emulates serial ports only. Three circuits same described 3-Wire service classes. other listed below.
CCITT Signal Description Request Send (RTS) Clear Send (CTS) Data Ready (DSR) Data terminal Ready (DTR) Data Channel received line signal detector (RLSD), Carrier Detect (CD) Calling indicator, ring Indicator (RI)
Some attributes this service listed below. Like 3-Wire, uses Tiny flow control mechanism. also uses same control channel mechanism sending information like data format. control channel used send states other RS-232 leads they change. Centronics This service intended emulate function standard Centronics interface. This service parallel ports only. Some attributes this service listed below. uses Tiny flow control mechanism. uses same control channel mechanism used 3-Wire send status/changes additional circuits.
IrDA Object Exchange Protocol (IrOBEX)
most basic desirable uses IrDA infrared communication protocols simply send arbitrary "thing", data object, from device another, make easy both application developers users refer this object exchange (uncapitalized), subject protocol IrOBEX (for IrDA Object Exchange, OBEX short). OBEX compact, efficient, binary protocol that enables wide range devices exchange data simple spontaneous manner. OBEX being defined members Infrared Data Association interconnect full range devices that support IrDA protocols. not, however, limited IrDA environment. OBEX performs function similar HTTP, major protocol underlying World Wide Web. However, OBEX works many very useful devices that cannot afford substantial resources required HTTP server, also targets devices with different usage models from Web. OBEX enough like HTTP serve compact final device "not quite" Web. major OBEX "Squirt" "Slurp" application, allowing rapid ubiquitous communications among portable devices dynamic environments. instance, laptop user squirts file another laptop PDA; industrial computer slurps status diagnostic information from piece factory floor machinery; digital camera squirts pictures into film development kiosk, lost queried (slurped) electronic business card owner. However, OBEX limited quick connect-transfer-disconnect scenarios also allows sessions which transfers take place over period time, maintaining connection even when idle.
www.vishay.com
Document Number: 82504 Rev.1.4, 20-Sep-06
IRDC, Part Protocol
Vishay Semiconductors
PCs, pagers, PDAs, phones, auto-tellers, information kiosks, calculators, data collection devices, watches, home electronics, industrial machinery, medical instruments, automobiles, pizza ovens, office equipment candidates using OBEX. support this wide variety platforms, OBEX designed transfer flexibly defined "objects"; example, files, diagnostic information, electronic business cards, bank account balances, electrocardiogram strips, itemized receipts grocery store. "Object" lofty technical meaning here; intended convey flexibility what information transferred. OBEX also used Command Control functions directives TVs, VCRs, overhead projectors, computers machinery. OBEX consists major parts: model representing objects (and information that describes objects), session protocol provide structure "conversation" between devices. OBEX designed fulfill following major goals:
IrDA Infrared Transfer Picture (IrTran-P)
IrTran-P (Infrared Transfer Picture) image communication scheme digital camera based Infrared Communication Standard specification created IrDA. IrTran-P specification should generally used together with IrDA standard specifications. IrTran-P placed upper layer IrSIR, IrLAP, IrLMP, TinyTP IrCOMM which already established IrDA standard specifications. SCEP (Simple Command Execute Protocol) bFTP (Binary File Transfer Protocol) necessary exchanging image between devices mutually exchanging properties devices. image format (file) called (Uni Picture Format) exchanged such entity (UPF image format category IrDA, found appendix IrTranP specification). IrTran-P generic name given these components.
(Uni Picture Format) bFTB (binary File Transfer Protocol)
wide world applications Default OBEX applications
(Command Definition)
SCEP (Simple Command Execute Protocol)
(connection management, segmentation reassemple)
IrCOMM
OBEX protocol
(RS232Cemulation)
IrLMP-IAS
Various Transports (TinyTP, Connectionless) Services
(Information Acces Service)
Tiny
(flow control multiplexed channel)
IrMP-MUX (Link Management Protocol)
IrLMP LM-MUX IrLAP
17269
IrLAP (Link Acces Protocol)
17270
IrDA (115.2kbit/s) (4.0Mbit/s)
Figure OBEX IrDA architecture
Application friendly provide tools rapid development applications Compact minimum strain resources small devices Cross platform Flexible data handling, including data typing support standardized types this will allow simpler devices user through more intelligent handling data inside. Maps easily into Internet data transfer protocols Extensible provides growth path future needs like security, compression, other extended features without burdening more constrained implementations. Debuggable
SCEP establishes session IrCOMM provides transparent session which notifies upper layer command. procedure SCEP developed lower layer making advantage that IrDA protocol "error free", high speed session layer matching IrDA protocol. apparent from name, bFTP provides service transferring binary file. bFTP assumes virtual file system together with communication protocol. bFTP aspect which enables easily implemented, because assumes such simple file system that will allow binary file stored with name". Moreover, bFTP characterized query function which allows query functions properties device image format available theme this section, i.e., image transfer. This query function simplifies user interface digital camera,
Document Number: 82504 Rev.1.4, 20-Sep-06
www.vishay.com
IRDC, Part Protocol
Vishay Semiconductors
allows most suitable data image transferred between digital cameras printers facing each other. addition, this function makes possible user transfer, communicate print suitable image data regardless difference platform model just "selecting photograph sent pushing transmission button". mentioned earlier, standard image format included category IrDA standard. IrDA standards were originally provided defining standardizing protocol connection with infrared communications. Therefore, scope define contents image transfer. However, order ensure mutual connectivity application digital camera, required decide image format that image data sent infrared communication reliably reproduced. Therefore, advocating IrTran-P standard IrDA, specific contents image format IrTran-P defined described appendix. image file format based JPEG base line. JFIF, which JPEG file, makes image various color forms available employs high level compression scheme. this reason, JFIF regarded industry standard image file format today. Since JPEG format enabling variety color forms, compromise required some extent order realize standard cost, example adopting only part format standard. UPF, among formats included base line JPEG, format which allows devices least reliably display mutually transfer image defined indispensable one, others regarded option. more details, please refer sections later part this document. characteristic digital camera that data accompanying photograph taken digital camera, such photo-taking date/time orientation (direction) image other additional data, cannot covered data within JPEG format. view such background, designed that data separated stored header arranged file without changing image data scheme JPEG Base Line all. addition, header expendability allows vendor-unique function added thereto. This makes possible separate data necessary digital video camera from data necessary display expansion image. This advantageous that existing JPEG techniques used where they stand have changed. compact device like digital camera, when using existing
Document Number: 82504 Rev.1.4, 20-Sep-06
hardware software, e.g. case where algorithm JPEG compression/expansion like performed hardware fixedly used firm ware, undesirable change JPEG itself. further advanced step, designed that additional data ambiguous point within data JPEG scheme arranged header part. additional data includes factors such white level, black level color-difference signal, necessary reproducing image with correct brightness color. Although format digital camera being examined various organizations, conclusive decision been made. most cases, arrangement such addition JPEG like been proposed. However, will take long time reach conclusion satisfactory companies concerned. approach making best existing standard, wherein data necessary digital camera separated added assure expendability, more realistic than approach waiting standard defined finalized. Though defined appendix, indispensable order that IrTran-P standard able support image format scheme. IrTranP, sender starts operation which transfers picture data from digital camera. Operation User With "selection specific picture" "transmission button" user puts digital camera sender into transmission state. assumed that device receiver always receiving state info picture data receiving state "reception button". Establishment Session SCEP digital camera sender carries discovery procedure using IrDA protocols performs connection physical IrCOMM layers IrDA protocols accordance with IrDA protocols. When IrDA transmission path established, SCEP makes "session establishment request" from sender receiver digital camera, printer receiver implemented with SCEP, must make response either "session established" "session establishment rejected". Query Operation bFTP (Query function) When session SCEP established, digital camera sender issues Query request order recognize picture processing functions receiver. information mutually
www.vishay.com
IRDC, Part Protocol
Vishay Semiconductors
exchanged Query request includes transmittable receivable picture size, picture compression format basic picture size device. Since this information exchanged before transfer picture data, picture data transferred "the most reasonable format" between devices different platforms. IrTran-P, "mandatory format" defined among picture data formats both sides, whereby picture reliably exchanged between devices different grades manufacturers. Furthermore, power supply condition device, receivable data capacity etc. should queried. This makes possible deal with applications portable system. Transfer Picture Data bFTP Transfer picture data started once most appropriate picture format both sender receiver been determined Query. SCEP performs data transfer high transmission rate making IrDA protocols. After file transfer completed, next picture data subsequently transmitted, session disconnected SCEP. (Accordingly, even simple model transmit more than picture succession.) Completion Session SCEP When picture transfer been completed, digital camera sender disconnects session SCEP. Thereafter, disconnection request issued IrCOMM lower layers IrDA protocols picture transfer operation been completed. IrMC Call Control specification enables call control mobile handsets. IrMC Audio Specification enables real time audio transmission respectively. These specifications communication between handset handset cradle. Data Transmission IrMC framework uses existing IrDA specifications much possible. IrDA connection-oriented services used connectionless service (Ultra) further defined applicable IrMC devices. Physical Layer Considerations Because power consumption requirements IrMC devices very critical, power option these devices been specified already IrPHY version 1.2. This specification defines lighter physical layer allows times savings drive current. should noted that this specification, which only expects Specifications Mobile Communications (IrMC) Version IrMC devices capable link distance from IrMC device IrMC device from IrMC device standard IrDA device, optional original IrDA-SIR values used IrMC device implementations. Despite shorter communication range some IrMC devices, devices must clearly compatible with IrDA-SIR short range. Devices supporting IrCOMM communications with personal computers should realize that interference shielding imperfect. Mobile Communication applications standard transceivers, fulfilling IrDA, physical layer specification applied. However, especially mobile phone application demand high immunity must considered. Vishay Semiconductors supplies devices suited these applications.
Mobile Communication Standard (IrMC)
IrDA IrMC specification defines rules utilization wireless communications equipment, e.g., mobile handsets, PDAs, PCs, notebook computers pagers. IrMC specification enables IrMC Object exchange between variety applications. instance, IrMC specification enables easy exchange business cards between Phone Book Applications text messages between Messaging Applications calendar todo items between Calendar Applications short notes between Note applications
www.vishay.com
Document Number: 82504 Rev.1.4, 20-Sep-06
IRDC, Part Protocol
Vishay Semiconductors Financial Messaging (IrFM)
IrFM profiles have been developed enable digital payment system which will transaction costs merchant financial institutions, charge-back fees merchants through electronic warehousing transaction receipts, provide simpler method financial transaction tracking individuals personal business use. simple words: enabled devices mobile phones PDAs will include credit card information transaction will done over Infrared beaming. IrFM provides quick seamless users infrared enabled portable devices, such PDAs mobile phones, services merchandise beaming their "soft" credit cards, debit cards, checks, cash, other financial instruments point sale device (POS), ATM, vending machine other compatible payment terminal. IrFM Profiles define minimum technical requirements needed implement cases described. Potential devices implementing these Profiles include pagers, PDAs mobile phones communicating with terminals, vending machines, ATMs other existing devices enabled with infrared adapters, devices with IrDA capability built IrFM compatible with Physical Layer standard physical layer compliant hardware transceiver will support IrFM. Early adopters this financial messaging scenario will include many millions users IrDA enabled PDA's mobile phones; paying meals restaurants fast food outlets, buying pump, making purchases types stores, going movies, using public transportation systems host other applications made possible electronic wallet concept. manual card swipe/card reader interaction between consumer's physical card point sale terminal replaced consumer's handheld device IR-enabled point sale terminal. After transaction been "beamed", backend processing transaction treated process occurred card swipe. backend processing changes required.
IrSimple- Simple Connect Standard
IrSimple (Acronym: IrSC), latest additions upper layer protocols, does replace enhances most other application based protocols providing more efficient mechanism transfer specific object data formats such graphic files that typically associated with small portable devices maintaining lowest usage memory. Frequent scenarios transmission pictures between mobile phones well from mobiles sets. This protocol also relies binding Access Management protocols. Because must maintain degree integrity with other application's protocol that would also allow handle standard bidirectional transmission small data files, makes sequence manager protocol IrSMC segmentation reassembly frames (flow control), primarily between application protocols link management protocol IrLMP. Unlike with other robust complex data transfer protocols, IrSC specifically aimed visual (graphical data transfers). mandatory receiving station maintain bidirectional link because successful transmission data visually ackknowledged. Infrared Data Association (IrDA) announced availability IrSimple Protocol Profile Specifications under brand name SimpleShotTM. Simple Shot enables mobile devices like Camera Phones wireless transmit digital images similarly enabled Televisions, Monitors, Projectors Photo Kiosks. SimpleShot frees billions digital images trapped Camera Phones PDAs, allowing them viewed large screens quickly printed. IrDA Special Interesting Group (SIG) developed perfected SimpleShot fast, wireless communication between mobile devices digital home appliances.
Document Number: 82504 Rev.1.4, 20-Sep-06
www.vishay.com
IRDC, Part Protocol
Vishay Semiconductors Appendix
List Terms Abbreviations: IrDA IrLAP IrLMP IrPHY IrTRAN-P IrCOMM IrOBEX Tiny LM-MUX LM-IAS SCEP BFTP IrMC IrFM IrSC Infrared Data Association IrDA Link Access Protocol IrDALink Management Protocol IrDA Physical Layer IrDA Transfer Picture IrDA "Serial Parallel Port Emulation over IrDA Object Exchange Protocol Flow control mechanism with IrLMP IrLMP Multiplexer IrLMP Information Access Service Simple Command Execute Protocol binary File Transfer Protocol Picture Format Serial Infrared Fast Infrared IrDA Mobile Communication IrDA Financial Messaging IrSimple(TM), SimpleShot(TM)
www.vishay.com
Document Number: 82504 Rev.1.4, 20-Sep-06
Symbols Terminology
Vishay Semiconductors
Symbols Terminology
anode Anode terminal ampere unit electrical current radiant sensitive area That area which radiant sensitive specified range distance E.g. distance between emitter (source) detector base Base terminal Error Rate bit/s data rate signaling rate 1000 bit/s kbit/s, bit/s Mbit/s capacitance Unit: (farad) coulomb cathode, cathode terminal collector, collector terminal degree Celsius Celsius temperature, symbol defined quantity equation unit Celsius temperature degree Celsius, symbol numerical value Celsius temperature expressed degrees Celsius given 273.15 follows from definition that degree Celsius equal magnitude kelvin, which turn implies that numerical value given temperature difference temperature interval whose value expressed unit degree Celsius (°C) equal numerical value same difference interval when value expressed unit kelvin candela unit luminous intensity. candela luminous intensity, given direction, source that emits monochromatic radiation frequency 1012 hertz that radiant intensity that direction 1/683 watt steradian. (16th General Conference Weights Measures, 1979) sr-1 diode capacitance Total capacitance effective between diode terminals case, junction parasitic capacitances
Document Number: 82512 Rev. 1.4, 06-Oct-06
junction capacitance Capacitance junction diode, decreases with increasing reverse voltage apparent virtual) source size emitter) measured diameter optical source used calculate safety laser class source. IEC60825-1 11146-1 emitter Emitter terminal (phototransistor) illumination standard illuminant According 5033 306-1, illumination emitted from tungsten filament lamp with color temperature 2855.6 which equivalent standard illuminant Unit: (Lux) ambient illumination standard illuminant echo Unprecise term describe behavior output IrDA® transceivers during transmission. "echo off" means that blocking receiver output quiet during transmission echo Unprecise term describe behavior output IrDA® transceivers during transmission. "echo means that receiver output active often undefined during transmission. correct data reception after transmission receiver channel must cleared during latency period irradiance point surface) Quotient radiant flux incident element surface containing point, area that element. Equivalent definition. Integral, taken over hemisphere visible from given point, expression where radiance given point various directions incident elementary beams solid angle angle between these beams normal surface given point
Unit: illuminance point surface) Quotient luminous flux incident
www.vishay.com
Symbols Terminology
Vishay Semiconductors
element surface containing point, area that element. Equivalent defnition. Integral, taken over hemisphere visible from given point, expression where luminance given point various directions incident elementary beams solid angle angle between these beams normal surface given point
ICEO
idle
Unit: farad Unit: frequency Unit: s-1, (Hertz) cut-off frequency detector devices frequency which, constant signal modulation depth input radiant power, demodulated signal power decreased frequency value. Example: incident radiation generates photocurrent photo voltage 0.707 times value radiation signal drop, other references occur e.g. switching frequency Fast Infrared, SIR, data rate Mbit/s light current General: Current which flows through device irradiation/illumination base current base peak current collector current collector light current Collector current under irradiation Collector current which flows specified illumination/irradiation collector dark current, with open base Collector-emitter dark current radiant sensitive devices with open base without illumination/radiation repetitive peak collector current Mode operation where device (e.g. transceiver) fully operational expecting receive signal operation case transceiver waiting receive optical input
send optical output response applied electrical signal radiant intensity source, given direction) Quotient radiant flux leaving source propagated element solid angle containing given direction, element solid angle Unit: sr-1 Note: radiant intensity emitters typically measured with angle 0.01 mechanical axis off-axis maximum irradiation pattern continuous forward current current flowing through diode forward direction IFAV average (mean) forward current peak forward current IFSM surge forward current short-circuit current That value current which flows when photovoltaic cell photodiode short circuited terminals output current photocurrent That part output current photoelectric detector, which caused incident radiation reverse current, leakage current Current which flows through reverse biased semiconductor pn-junction Abbreviation infrared reverse current under irradiation Reverse light current which flows specified irradiation/illumination photoelectric device IrDA® Infrared Data Association profit organization generating infrared data communication standards IRED infrared emitting diode Solid state device embodying junction, emitting infrared radiation when excited electric current. also LED: Solid state device embodying junction, emitting optical radiation when excited electric current. reverse dark current, dark current Reverse current flowing through photoelectric device absence irradiation
Document Number: 82512 Rev. 1.4, 06-Oct-06
www.vishay.com
Symbols Terminology
Vishay Semiconductors
IrPHY version IrDA®, data communication specification covering data rates from kbit/s 115.2 kbit/s guaranteed operating range more than meter cone IrPHY version were implemented IrDA® standard with version 1.1, replacing version IrPHY version Added Power Standard IrDA® standard, replacing version 1.1. Power Standard describes current saving implementation with reduced range (min. other Power Devices min. full range devices). IrPHY version extended Power Option higher rates replacing version 1.2. IrPHY version VFIR added, replacing version quiescent current supply current dark ambient supply current bright ambient luminous intensity source, given direction) Quotient luminous flux leaving source propagated element solid angle containing given direction, element solid angle Unit: sr-1 Note: luminous intensity emitters typically measured with angle 0.01 mechanical axis off-axis maximum irradiation pattern luminous efficacy radiation Quotient luminous flux corresponding radiant flux Unit: Note: When applied monochromatic radiations, maximum value denoted symbol 1012 photopic vision. 1700 scotopic vision. other wavelengths: kelvin unit thermodynamic temperature, fraction 1/273.15 thermodynamic temDocument Number: 82512 Rev. 1.4, 06-Oct-06
perature triple point water (13th CGPM (1967), Resolution unit kelvin symbol should used express interval difference temperature. Note: addition thermodynamic temperature (symbol expressed kelvins, also made Celsius temperature (symbol defined equation T-T0, where 273.15 definition. express Celsius temperature, unit "degree Celsius", which equal unit "kelvin" used; this case, "degree Celsius" special name used place "kelvin". interval difference Celsius temperature can, however, expressed kelvins well degrees Celsius Latency receiver latency allowance maximum time after node ceases transmitting before node's receiving recovers specified sensitivity IRED Light Emitting Diode LED: Solid state device embodying junction, emitting optical radiation when excited electric current. term correct only visible radiation, because light defined visible radiation (see "Radiation Light"). infrared emitting diodes term IRED correct term. Nevertheless common correct "LED" also IREDs radiance given direction, given point real imaginary surface) Quantity defined formula
where radiant flux transmitted elementary beam passing through given point propagating solid angle containing given direction; area section that beam containing given point; angle between normal that section direction beam Unit: sr-1 lumen Unit luminous flux Unit illuminance meter unit length
www.vishay.com
Symbols Terminology
Vishay Semiconductors
radiant exitance point surface) Quotient radiant flux leaving element surface containing point, area that element. Equivalent definition. Integral, taken over hemisphere visible from given point, expression where radiance given point various directions emitted elementary beams solid angle angle between these beams normal surface given point.
Unit: Medium speed SIR, with data rate kbit/s 1152 kbit/s Mode Electrical input output port transceiver device receiver bandwidth N.A. Numerical Aperture N.A. Term used characteristic sensitivity intensity angles fiber optics objectives Noise Equivalent Power Ptot total power dissipation power dissipation, general Radiation Light visible radiation optical radiation capable causing visual sensation directly. Note: There precise limits spectral range visible radiation since they depend upon amount radiant power reaching retina responsivity observer. lower limit generally taken between upper limit between Radiation Light optical radiation Electromagnetic radiation wavelengths between region transition X-rays region transition radio waves Radiation Light infrared radiation Optical radiation which wavelengths longer than those visible radiation. Note: infrared radiation, range between commonly sub-divided into: IR-A 1400 IR-B IR-C
www.vishay.com
dark resistance feedback resistor internal resistance isolation resistance load resistance serial resistance shunt resistance shunt resistance detector diode dynamic resistance diode zero bias. Typically measured voltage forward reverse, peak-to-peak RthJA thermal resistance, junction ambient RthJC thermal resistance, junction case electrical data output port transceiver device second unit time 3600 absolute sensitivity Ratio output value radiant-sensitive device input value physical quantity: Units: E.g. A/lx, A/W, A/(W/m2) spectral sensitivity wavelength absolute spectral sensitivity wavelength ratio output quantity radiant input quantity range wavelengths )/dx( E.g., radiant power specified wavelength falls radiationsensitive area detector generates photocurrent Iph. ratio between generated photocurrent radiant power which falls detector: Unit: )rel spectral sensitivity, relative Ratio spectral sensitivity considered wavelength spectral sensitivity certain wavelength taken reference: )rel )/s( spectral sensitivity reference wavelength Electrical input port transceiver device receiver sensitivity Electrical input port transceiver device shut down transceiver shutdown Mode operation where device switched sleep mode (shut down) external signal after quiescent period keeping some
Document Number: 82512 Rev. 1.4, 06-Oct-06
Symbols Terminology
Vishay Semiconductors
functions alive prepared fast transition operating mode. Might some cases identical with "Standby" Serial Infrared, Term used IrDA® describe infrared data transmission including 115.2 kbit/s. IrDA® data communication covers kbit/s 115.2 kbit/s, equivalent basic serial infrared standard introduced with physical layer version IrPhy version split power supply Term using separated power supplies different functions transceivers. Receiver circuits need well-controlled supply voltages. IRED drivers don't need controlled supply voltage need much higher currents. Therefore safes cost control IRED current supply have separated supply. that some modified design rules have taken into account designing ASIC. This used nearly Vishay transceivers described US-Patent 6,157,476 steradian (sr) unit solid angle Solid angle that, having vertex centre sphere, cuts area surface sphere equal that square with sides length equal radius sphere. (ISO, 31/1-2.1, 1978) Example: unity solid angle, terms geometry, angle subtended center sphere area surface numerically equal square radius (see figures below) Other than figures might suggest, shape area doesn't matter all. shape surface sphere that holds same area will define solid angle same size. unit solid angle steradian (sr). Mathematically, solid angle dimensionless, practical reasons, steradian assigned Standby Mode operation where device prepared quickly switched into idle operating mode external signal period time (duration) temperature 273.15 Unit: (kelvin) temperature (degree Celsius) Instead sometimes used temperature with time time ambient temperature self-heating significant: temperature surrounding below device, under conditions thermal equilibrium. self-heating insignificant: temperature surroundings device ambient temperature range absolute maximum rating: maximum permissible ambient temperature range temperature coefficient ratio relative change electrical quantity change temperature which causes under otherwise constant operating conditions colour temperature (BE) temperature Planckian radiator whose radiation same chromaticity that given stimulus Unit: Note: reciprocal colour temperature also used, unit (BE) case temperature temperature measured specified point case semiconductor device. Unless otherwise stated, this temperature given temperature mounting base devices with metal delay time fall time time interval between upper specified value lower specified value trailing edge pulse. Note: common value signal upper specified value value lower specified value junction temperature spatial mean value temperature during operation. case phototransistors, mainly temperature collector junction because inherent temperature maximum turn-off time turn-on time pulse duration time interval between specified value leading edge pulse specified value trailing edge output pulse
Tamb
Tamb
Tcase
toff
Document Number: 82512 Rev. 1.4, 06-Oct-06
www.vishay.com
Symbols Terminology
Vishay Semiconductors
Note: most cases specified value signal input pulse duration output pulse duration rise time time interval between lower specified value upper specified value trailing edge pulse. Note: common value signal upper specified value value lower specified value Storage time storage time soldering temperature Maximum allowable temperature soldering with specified distance from case duration Tstg storage temperature range temperature range which device stored transported without applied voltage Electrical data input port transceiver device volt standard luminous efficiency function photopic vision (relative human sensitivity) spectral luminous efficiency monochromatic radiation wavelength photopic vision; scotopic vision) Ratio radiant flux wavelength that wavelength such that both radiations produce equally intense luminous sensations under specified photometric conditions chosen that maximum value this ratio equal supply voltage (positive) VCEsat collector-emitter saturation voltage saturation voltage voltage between collector emitter specified (saturation) conditions, i.e., IB), whereas operating point within saturation region supply voltage (positive) forward voltage voltage across diode terminals which results from flow current forward direction VFIR SIR, data rate Mbit/s Vlogic reference voltage digital data communication ports output voltage
www.vishay.com
output voltage change (differential output voltage) open circuit voltage voltage measured between photovoltaic cell photodiode terminals specified irradiance/illuminance (high impedance voltmeter!) output voltage high output voltage photovoltage voltage generated between photovoltaic cell photodiode terminals irradiation/ illumination reverse voltage junction) Applied voltage such that current flows reverse direction reverse (breakdown) voltage voltage drop which results from flow defined reverse current supply voltage (most negative) supply voltage most cases: Ground) angle half transmission distance quantum efficiency 1/2; half intensity angle radiation diagram, angle within which radiant luminous) intensity greater than equal half maximum intensity. Note: IEC60747-5-1 using 1/2. Vishay data sheets mostly used 1/2; half sensitivity angle sensitivity diagram, angle within which sensitivity greater than equal half maximum sensitivity. Note: IEC60747-5-1 using 1/2. Vishay data sheets mostly used solid angle, steradian IEC60050(845)-definition space enclosed rays, which emerge from single point lead points closed curve. assumed that apex cone formed this center sphere with radius that cone intersects with surface sphere, then size surface area sphere subtending cone measure solid angle A/r2 full sphere equivalent cone with angle forms solid angle
Document Number: 82512 Rev. 1.4, 06-Oct-06
Symbols Terminology
Vishay Semiconductors
(1-cos sin2 Unit: (steradian) wavelength maximum spectral luminous efficiency function range spectral bandwidth range wavelengths where spectral sensitivity spectral emission remains within maximum value radiant flux; radiant power Power emitted, transmitted received form radiation. Unit: Watt luminous flux Quantity derived from radiant flux evaluating radiation according action upon standard photometric observer. photopic vision
wavelength, general centroid wavelength Centroid wavelength spectral distribution, which calculated "centre gravity wavelength" according
dominant wavelength wavelength peak sensitivity peak emission
where spectral distribution radiant flux spectral luminous efficiency. Unit lumen lm/W: Note: values (photopic vision) (scotopic vision), IEC60050 (845-01-56).
Document Number: 82512 Rev. 1.4, 06-Oct-06
www.vishay.com
Symbols Terminology
Vishay Semiconductors
65.5°
1.0sr
20.5°
0.01sr
6.5°
0.1sr
8584
Definitions
Databook Nomenclature nomenclature usage symbols, abbreviations terms inside Vishay Semiconductors IRDC Databook based standards. special optoelectronic terms definitions referring Multilingual Dictionary (Electricity, Electronics Telecommunications), Fourth edition (2001-01), IEC50 (Now: IEC60050). references taken from current editions IEC60050 (845), IEC60747-5-1 IEC60747-5-2. Measurement conditions based other international standards especially guided IEC60747-5-3. Editorial notes: typographical limitations variables cannot printed italics format, which usually mandatory. databook general using American spelling (AE). International standards written British English (BE). Definitions copied without changes from original text. Therefore these contain British spelling. Radiant Luminous Quantities Their Units These kinds quantities have same basic symbols, identified respectively, where necessary, subscript (energy) (visual), e.g. note. Note: Photopic scotopic quantities. Luminous (photometric) quantities kinds, those used photopic vision those used scotopic vision. wording definitions cases being almost identical, single definition generally sufficient with appropriate adjective, photopic scotopic added where necessary. symbols scotopic quantities prime I'v, etc), units same both cases.
www.vishay.com
Document Number: 82512 Rev. 1.4, 06-Oct-06
Symbols Terminology
Vishay Semiconductors
general, optical radiation measured radiometric units. Luminous (photometric) units used when optical radiation weighted sensitivity human eye, correctly spoken, standard photometric observer (Ideal observer having relative spectral responsivity curve that conforms function photopic vision function scotopic vision, that complies with summation implied definition luminous flux). Note: With given spectral distribution radiometric quantity equivalent photometric quantity evaluated. However, from photometric units without knowing radiometric spectral distribution general cannot recover radiometric quantities. Radiometric Terms, Quantities Units
Photometric Term Luminous power Luminous flux Luminous intensity Illuminance Luminous exitance Luminance Equivalent Radiometric Term Radiant power Radiant flux Radiant intensity Irradiance Radiant exitance Radiance
radiometric terms used describe quantities optical radiation. relevant radiometric units are:
Radiometric Term Radiant power, Radiant flux Radiant intensity Irradiance Radiant Exitance Radiance Symbol
Unit W/sr W/m2 W/m2 W/(sr
Reference IEC50 (845-01-24) IEC50 (845-01-30) IEC50 (845-01-37) IEC50 (845-01-47) IEC50 (845-01-34)
Table Radiometric Quantities Units
Photometric Terms, Quantities Units photometric terms used describe quantities optical radiation wavelength range visible radiation (generally assumed range
Unit
Symbol
Reference IEC50 (845-01-25)
IEC50 (845-01-51) Table Photometric Quantities Units lm/sr lm/m2 (Lux) lm/m2 cd/m2 IEC50 (845-01-31) IEC50 (845-01-50) IEC50 (845-01-38) IEC50 (845-01-52) IEC50 (845-01-48) IEC50 (845-01-35)
Photometric units derived from radiometric units weighting them with wavelength dependent standardized human sensitivity function, so-called CIE-standard photometric observer. There different functions photopic vision scotopic vision (V'( following shown, luminous flux derived from radiant power spectral distribution. equivalent other photometric terms derived from radiometric terms same way. Relation between distance irradiance (illuminance) (Ev) intensity (Iv) relation between intensity source resulting irradiance distance given basic square root rule law. emitted intensity generates distance irradiance Ie/r2. This relationship valid under near field conditions should used below distance smaller than times emitter source diameter.
18145
Document Number: 82512 Rev. 1.4, 06-Oct-06
www.vishay.com
Symbols Terminology
Vishay Semiconductors
Using single radiation point source, gets following relation between parameter Examples Calculate irradiance with given intensity distance Transceivers with specified intensity mW/sr will generate distance irradiance 100/12 mW/m2. distance irradiance would 100/102 mW/m2. Calculate range system with given intensity irradiance threshold. When receiver specified with sensitivity threshold irradiance mW/m2, transmitter with intensity mW/sr resulting range calculated 2.45
www.vishay.com
Document Number: 82512 Rev. 1.4, 06-Oct-06
Data Sheet Structure
Vishay Semiconductors
Data Sheet Structure
Data sheet information generally presented following sequence: Description Features Applications Absolute maximum ratings Optical electrical characteristics Typical characteristics (diagrams) Dimensions (mechanical data) Additional information device performance provided necessary. thermal resistance junction ambient (RthJA) quoted that which would measured without artificial cooling, i.e., under worst-case conditions. Temperature coefficients, other hand, listed together with associated parameters under "Optical Electrical Characteristics".
Optical Electrical Characteristics
most important operational optical electrical characteristics (minimum, typical maximum values) grouped under this heading, together with associated test conditions supplemented with curves.
Description
following information provided: Type number, semiconductor materials used, sequence zones, technology used, device type and, necessary, construction. Also, short-form information typical applications special features given.
Typical Characteristics (Diagrams)
Besides static (dc) dynamic (ac) characteristics, family curves given specified operating conditions. Here, typical independence individual characteristics shown.
Dimensions (Mechanical Data)
this section, important dimensions connection sequences given, supplemented circuit diagram. Case outline drawings carry DIN-, JEDEC commercial designations. Information angle sensitivity intensity weight completes list mechanical data. Note: dimensional information does include tolerances, then following applies: Lead length mounting hole dimensions minimum values. Radiant sensitive emitting area respectively typical, other dimensions maximum. device accessories must ordered separately order number must quoted.
Absolute Maximum Ratings
These define maximum permissible operational environmental conditions. these conditions exceeded, this could result destruction device. Unless otherwise specified, ambient temperature assumed absolute maximum ratings. Most absolute ratings static characteristics; they measured pulse method, associated measurement conditions stated. Maximum ratings absolute (i.e., interdependent). equipment incorporating semiconductor devices must designed that even under most unfavorable operating conditions, specified maximum ratings devices used never exceeded. These ratings could exceeded because changes supply voltage, properties other components used this equipment, control settings, load conditions, drive level, environmental conditions properties devices themselves (i.e., ageing). Some thermal data given under heading "Absolute Maximum Ratings" (e.g., junction temperature, storage temperature range, total power dissipation). This because imposes limit application range device.
Additional Information
Preliminary specifications This heading indicates that some information given here subject changes. developments This heading indicates that device concerned should used equipment under development. device however, available present production.
Document Number: 82635 Rev. 1.1, 29-Sep-05
www.vishay.com
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductor Standard Bar-Code Labels
Standard code labels finished goods standard code labels product labels used identification goods. finished goods packed final packing area. standard packing units labeled with standard code (3-of-9 code (code conforming MIL-STD-1189) before transported finished goods warehouses. labels each packing unit with Vishay Semiconductor GmbH specific data. content label show following table figure future change from barcodes expected. That will look shown figure transceivers following logos used inside code label which shown figure following lead (Pb)-free categories (see figure figure meant describe lead (Pb)-free level interconnect terminal finish/material components and/or solder used board assembly.
SnAgCu (shall included category alloys with excluding SnAgCu Precious metal (e.g. NiPd, NiPdAu) SnZn, SnZnx contains temperature solder containing Indium symbol unassigned
Lead (Pb)-free category Origin Machine (CPU) number acceptance seal signature date Plant location code Lead (Pb)-free logo Device selection code Date code number Quantity RoHS compliance logo
19873
Device type
Working week shift
Remark: Multi Date Codes would marked field this label lead
Figure Barcode label, detailed description
Terminations lead (Pb)-free designed
Totally lead (Pb)-free designed
19874
19877
Lead (Pb)-free categories
Figure barcode label (according Barcode Standard Label 417) lead (Pb)-free device, equivalent that shown figure
Figure Logos inside label
www.vishay.com
Document Number: 82601 Rev. 1.7, 20-Sep-06
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors Moisture Proof Packing
reel with taped components packed moisture proof aluminum protect devices from absorbing moisture during transportation storage. This finally packed cardboard box. reel well labels, which described following (see figure This example little variations between different plants.
Moisture Level Sticker BarCode Sticker Label
Pb-free information part code label, when missing "lead (Pb)-free"-label (figure attached. addition "Moisture-Sensitive Identification Label (MSID)" applied (figure
Aluminum
19880
Reel
18298
Figure Product (top) taping label
Figure Moisture proof packing
Inside aluminum with reel desiccant humidity indicator (figure
19881
Figure Lead (Pb)-free logo
19878
Figure Desiccant (example, left) humidity indicator card
19882
reel barcode product label taping label (figure yellow sticker (figure
Figure Moisture-Sensitive Identification Label (MSID)
19879
Figure sticker
Document Number: 82601 Rev. 1.7, 20-Sep-06
www.vishay.com
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
same stickers reel will shown. addition moisture-sensitivity caution label shown figure describes storage drying procedures.
LEVEL
CAUTION
This contains MOISTURE-SENSITIVE DEVICES
Figure 330-mm reel with labels. labels rear. Lead (Pb)-free information barcode label.
Shelf life sealed bag: months relative humidity (RH) After this opened, devices that will subjected soldering reflow equivalent processing (peak package body temp. must Mounted within hours factory condition °C/60 Stored Devices require baking befor mounting Humidity Indicator Card when read met. baking required, devices baked for: hours °C/- (dry air/nitrogen) hours device containers hours suitable reels tubes Seal Date:
blank, barcode label) Note: Level body temperature defined JEDEC Standard JSTD-020
Final Packing
sealed reel packed into cardboard box, which size. secondary cardboard used shipping purposes, with following sizes, slightly different different production locations, following tables. Table Secondary boxes Malaysia, location code
Size, Length Width Height 1000 Quantity boxes
Figure JEDEC Standard JSTD-020 Level label included bags
following reels different size shown with labeling (figure figure 12).
Philippines, location code
Size, Length Width Height Quantity boxes
boxes same labels will used.
19889
Figure 180-mm reel with labels. labels rear. Lead (Pb)-free marking barcode; here additional lead (Pb)-free sticker applied.
www.vishay.com
Document Number: 82601 Rev. 1.7, 20-Sep-06
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors Recommended Method Storage
storage recommended soon been opened prevent moisture absorption. following conditions should observed, boxes available: Storage temperature Storage humidity max. After more than hours under these conditions moisture content will high reflow soldering. case moisture absorption, devices will recover former condition drying under conditions given label aluminium shown figure Such JEDEC Standard JSTD-020 Level label included bags (see figure 10).
Precaution
Proper storage handling procedures should followed prevent damage devices especially when these removed from Antistatic Shielding Bag. "Electro-Static Sensitive Devices"warning labels (figure affixed packaging.
Order Information, Related Packing Units, Tape Reel Size Labeling
this document packing labeling information transceivers compiled.
Description Quantity Reel Orientation tape mounting TFBS4650-TR1 Side view 1000 TFBS4650-TR3 Side view 2500 TFBS4652-TR1 Side view 1000 TFBS4652-TR3 Side view 2500 TFBS5700-TR3 Side view 2500 TFBS4711-TR1 Side view 1000 TFBS4711-TR3 Side view 2500 TFBS5711-TR1 Side view 1000 TFBS5711-TR3 Side view 2500 TFBS6711-TR1 Side view 1000 TFBS6711-TR3 Side view 2500 TFBS6712-TR1 Side view 1000 TFBS6712-TR3 Side view 2500 TFDU4300-TR1 Side view TFDU4300-TR3 Side view 2500 TFDU4300-TT1 view TFDU4300-TT3 view 2500 TFDU5307-TR1 Side view TFDU5307-TR3 Side view 2500 TFDU5307-TT1 view TFDU5307-TT3 view 2500 TFDU6300-TR3 Side view 2500 TFDU6300-TT3 view 2500 TFDU6301-TR3 Side view 2500 TFDU6301-TT3 view 2500 TFBS4710-TR1 Side view 1000 TFBS6614-TR3 Side view 2500 TFDU2201-TR1 Side view TFDU2201-TR3 Side view 2250 TFDU4202-TR1 Side view TFDU4202-TR3 Side view 2250 TFDU4203-TR1 Side view TFDU4203-TR3 Side view 2250 TFDU4100-TR3 Side view 1000 TFDU4100-TT3 view 1000 TFDU6102-TR3 Side view 1000 TFDU6102-TT3 view 1000 TFDU8108-TR3 Side view 1000 TFDU8108-TT3 view 1000 TOIM4232 view Table1. Transceiver tape drawing reel size reference according type order text Document Number: 82601 Rev. 1.7, 20-Sep-06 Part Tape Figure-No Reel Reel Reel Table
www.vishay.com
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
Shape Reel Dimensions
Drawing-No.: 9.800-5090.01-4 Issue: 29.11.05
14017
Tape Reel
Tape Width
max.
min. 16.4 16.4 24.4
max. 22.4 22.4 30.4
min. 15.9 15.9 23.9
max. 19.4 19.4 27.4
(According 60286-3: 1998)
Leader Trailer
Trailer
devices devices
Leader
devices
min. min.
Start
11818
Trailer
Figure Leader trailer
Leader
Cover Tape Peel Strength
According Peel Strength: (300 mm/min peel angle
www.vishay.com
Document Number: 82601 Rev. 1.7, 20-Sep-06
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
Tape Dimensions
19867
Drawing-No.: 9.700-5296.01-4 Issue: 08.12.04 Figure Tape package side view oriented
19868
Drawing-No.: 9.700-5294.01-4 Issue: 08.12.04 Figure Tape package side view oriented
Document Number: 82601 Rev. 1.7, 20-Sep-06
www.vishay.com
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
19856
Drawing-No.: 9.700-5279.01-4 Issue: 08.12.04 Figure Tape package side view oriented
19855
Drawing-No.: 9.700-5280.01-4 Issue: 03.11.03 Figure Tape package view oriented www.vishay.com Document Number: 82601 Rev. 1.7, 20-Sep-06
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
19869
Drawing-No.: 9.700-5299.01-4 Issue: 18.08.05 Figure Tape 2.74 package side view oriented
19870
Drawing-No.: 9.700-5227.01-4 Issue: 03.09.99 Figure Tape 2.75 package side view oriented
Document Number: 82601 Rev. 1.7, 20-Sep-06
www.vishay.com
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
19871
Drawing-No.: 9.700-5297.01-4 Issue: 08.04.05 Figure Tape package side view oriented
19872
Drawing-No.: 9.700-5251.01-4 Issue: 02.09.05 Figure Tape package view oriented www.vishay.com Document Number: 82601 Rev. 1.7, 20-Sep-06
Taping, Labeling, Storage, Packing Marking
Vishay Semiconductors
19876
Drawing-No.: 9.700-5284.01-4 Issue: 24.07.03 Figure Tape package view oriented
Marking Transceiver Modules
Date code
Package specific Selection Vishay Year Type kbit/s, Work week Manufacturing Mbit/s, location Standard, Mbit/s, DIL, Through Hole Receiver added Note: optional Mbit/s, VFIR omitted when space marking limited (leadframe) 2.75 (leadframe) Example: (leadframe) marking 4650V61268 PCB-based identifies PCB-based, 17273-1 TFBS4650, produced Vishay week year 2006 location (Krubong, Malaysia)
Document Number: 82601 Rev. 1.7, 20-Sep-06
www.vishay.com
Environmental Health Safety Policy
Vishay Semiconductors
www.vishay.com
Document number: 81375 Rev. 1.0, 18-Aug-06
Surface Mount Assembly Instruction
Vishay Semiconductors Soldering Process
When assembling IrDC transceivers printed circuit board (PCB), useful have understanding properties materials used during manufacturing. While IrDC transceivers semiconductor dice other constituents processed semiconductor industry, there considerable differences between transceivers other semiconductor devices. most important differences molding material that used manufacture. Packaging material used transceivers must transparent infrared radiation order emit receive optical signals. However, visible light might disturb proper performance transceiver ASIC. special mixed into encapsulant block visible light. This results transceiver appearing black. need good optical performance requires pure resin. other ingredients added. encapsulant used standard integrated circuits (IC), however, mixture resin (typically other ingredients (e.g. nearly silica sand). This mixture results more uniform mechanical properties semiconductor die, leadframe encapsulant. Figure figure show difference between filled unfilled epoxy resin. following table shows main differences between types mold compound
18052
Figure molding compound resin)
18053_1
Figure Clear molding compound (100 resin)
Table
Characteristics Optical Properties Hardness Coefficient thermal expansion Glass transition temperature Thermal conductivity Moisture ingress Mold Compound Light Blocking High (matched leadframe die) High (160 High IrDC Mold Compound Transparent (brittle) High (120 High
standard molded integrated circuit will have constituents nicely matched each other terms thermal expansion. typical package
rather free mechanical stress compared IrDC transceiver, which experience more mechanical stresses during manufacturing.
Document Number: 82602 Rev. 1.3, 20-Sep-06
www.vishay.com
Surface Mount Assembly Instruction
Vishay Semiconductors Moisture Sensitivity
high rate moisture ingress another property optical clear molding compound. saturation value room temperature moisture intake roughly factor larger than filled molding compound. this high rate moisture ingress transceivers more prone "popcorn effect". possible void (delamination, bubble) inside package will filled very quickly with moisture. Even whole package soak considerable amount moisture. Whenever package heated above boiling point water, very high vapor pressure builds inside voids. This pressure cause package crack creates severe delamination. amount moisture absorbed package determined exposure time humid air. exposure time allowed particular package defined moisture sensitivity level (MSL) according JEDEC standards J-STD-020 JESD22-A113. Vishay transceivers designed withstand three subsequent passes through reflow soldering oven using recommended reflow temperature-time profile when package been exposed longer than hours environmental conditions °C/60 This correlates parts will delivered moisture barrier containing desiccant humidity indicator card. long parts stored sealed bag, performance will degrade. soon opened, material should consumed within hours must stored place (chamber which purged with like nitrogen) baked according sticker reel. more sensitive thermal stress than most other components, recommended that these used determine optimum soldering conditions. subsequent recommendations followed excellent results achieved despite limitations materials used.
Reflow Solder Profile
There distinct tasks temperature-time profile solder process: Prepare components stress soldering temperature. Solder components PCB. main idea behind this pre-soldering preparation (neglecting solder paste activation like) have very small temperature difference between components. This allows peak temperature damage free soldering. There different profile types used industry nowadays. most often used type past still today ramp-soak-spike profile (RSS). convection oven allows ramp-to-spike profile (RTS), application this type increasing. solder profile consists roughly three distinct phases. Pre-heating Soak Phase: standard components, this phase where parts should come roughly same temperature. This achieved either keeping certain time specific temperature (RSS) ramp-up temperature certain speed (RTS) have parts times profile same temperature. Soldering: During this phase, actual soldering takes place. recommend exceed peak temperature device should exposed higher temperatures than more than (TFDUxxxx) (TFBSxxxx) depending type transceiver Cool Down: should cooled down rather quickly have fine grain solder joint. outlined previously transceiver package built-in mechanical stress, which should reduced before submitting part actual solder temperature. This stress relieved during soak phase.
Reflow Soldering
Vishay Semiconductor transceivers surface mount devices designed assembled printed circuit boards (PCB) using reflow soldering. State reflow soldering so-called convection reflow oven. Recommendations reflow conditions only given general terms since each should considered individually depending size distribution components. Because IrDA transceivwww.vishay.com
Document Number: 82602 Rev. 1.3, 20-Sep-06
Surface Mount Assembly Instruction
Vishay Semiconductors
Depending encapsulant material used packaging, best soak temperature range time interval rule thumb, temperature should slightly above glass transition temperature dwell time must long enough allow stress relief. This most conveniently realized with profile. profiles, thermal conductivity compared standard components should considered. transceiver into thermal equilibrium with allow internal stress relief thermal ramp-up rate normally must lower than standard components.
Wave Soldering
TFDUxxxx TFBSxxxx transceiver devices wave soldering recommended.
Manual Soldering
Manual soldering standard method use. However, production process cannot recommended because risk damage quite highly depending experience operator. Nevertheless, added chapter, describing manual soldering desoldering. Before soldering desoldering sure that devices boards) correctly dried corresponding given MSL-condition. equivalent standard JEDEC J-STD033A, "Handling, Packing, Shipping Moisture/Reflow Sensitive Surface Mount Devices".
Vishay Semiconductor recommended Profile
s.30 Tpeak
Storage
storage drying processes VISHAY transceivers (TFDUxxxx TFBSxxx) equivalent MSL4 otherwise specified data sheet. data drying procedure given labels packing also application note "Taping, Labeling, Storage Packing"
Temperature/°C
°C.3 °C/s s.120 max. °C.4 °C/s max.
Pick Place
Time/s
19693
Vishay Semiconductor recommended Profile
Tpeak max.
reliable pick place operation adequate flat area topside module important. Vishay Semiconductors always design transceivers have flat surface topside pick place. non-symmetric package very common opto-electronic parts pick-up position expected case center package. best pick-up location indicated data sheet drawings "mounting center". coincides with center hole pocket carrier tape.
Temperature/°C
°C/s
°C/s
Time above °C/s Time above Peak temperature Tpeak
19694
Time/s
Document Number: 82602 Rev. 1.3, 20-Sep-06
www.vishay.com
Surface Mount Assembly Instruction
Vishay Semiconductors Manual Soldering
Although IrDC transceivers surface mount components therefore designed reflow soldering, possible solder these manually using soldering irons. sure that devices correctly dried corresponding MSL4 conditions. Based long-standing experience some Vishay Semiconductors customers following rules should observed: standard Pb-Sn solder high power least temperature controlled soldering iron Soldering iron temperature Soldering time second maximum lead Avoid mechanical stress leads during soldering cool down
18270
18272
Step Start with only some solder
Step Solder lead lead prepared step
18271
18273
Step Place transceiver appropriate position
Step Solder quickly skillfully remaining leads
www.vishay.com
Document Number: 82602 Rev. 1.3, 20-Sep-06
Surface Mount Assembly Instruction
Vishay Semiconductors Desoldering
necessary remove transceiver from replacement investigation without damage same constraints apply soldering. Excessive heat mechanical strain (e.g. usage pliers) could result cracks damaged wire bonds. Bake whole board according MSL4 before removing part avoid moisture effects. Vishay recommends procedures which have been found give most consistent results:
method
Nozzle temperature Lead temperature (nozzle from device) Hold device with long tweezers Apply angle lead moving nozzle heat leads apply heat from back side when components mounted back under transceiver When solder melts push gently lift device lift leads important that little mechanical force possible applied leads when package softened heat. excessive force tear leads causing internal damage wire bonds.
Soldering iron method
high thermal capacity soldering iron solder iron with very broad Hold device with long nose tweezers Heat leads apply force until solder melts Push unit away without force
18274
18276
broad desoldering with solder iron
When solder completely molten push transceiver gently solder pads
18275
Apply heat uniformly whole leads
Document Number: 82602 Rev. 1.3, 20-Sep-06
www.vishay.com
Window Size Housings
Vishay Semiconductors
Window Size Housings
Figure minimum window size relation distance between window transceiver described. Generally speaking, transmission loss should accounted design calculations that output power input sensitivity requirements system design. external filter should placed squarely against transceiver otherwise reflection cause emitter power loss decrease receiver sensitivity system. Optically transparent window materials available from different sources, e.g. Bayer, Rohm Haas (see "Source Accessories"). optical window must minimum size rectangular elliptical reduce IrDA performance. following expressions apply figures 0.54a 0.54a where Dimensions given dimensions different packages follows:
Device Package Type Baby Face (TFDUx1xx) family family TFDUx3xx) family TFBSx7xx) family TFBSx6xx) Micro Face TFDUx2xx) (mm) (mm) Figure View from above, example Micro Face package
Window
18062-1
Figure View from side, example Baby Face package
Window
18063-1
Window
Window
18061-1
18064-1
Figure View from above, example Baby Face package
Figure View from side, example Micro Face package
www.vishay.com
Document Number: 82506 Rev. 1.4, 09-Sep-05
Window Size Housings
Vishay Semiconductors
Recessed window avoiding scratches Recessed transceiver recommended shield against ambient (sun)light ±15°
Some recommendations enhance robustness your design: make window larger than needed, otherwise will unnecessarily increase influence ambient (sun) light. larger distance better shielding against ambient light. outer window surface recessed against surrounding case material protect window from scratches, abrasion, dust, etc.
Avoid vignettation limit reception angle
15809
Figure
Figure Avoid unintentional lens effect your window
Document Number: 82506 Rev. 1.4, 09-Sep-05
www.vishay.com
Sources Accessories Testing
Vishay Semiconductors
Source
Other recent searches
SOP18 - SOP18 SOP18 Datasheet
S1C3 - S1C3 S1C3 Datasheet
MAP200 - MAP200 MAP200 Datasheet
IS41LV8205A - IS41LV8205A IS41LV8205A Datasheet
HT1609L - HT1609L HT1609L Datasheet
HD74LV573A - HD74LV573A HD74LV573A Datasheet
CS51031 - CS51031 CS51031 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
