THIN FILM PRODUCTS vishay ElEctro-films vsD-Db0005-0404
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THIN FILM PRODUCTS
High Density Interconnects Hybrid Resistors/Capacitors Microwave Components Inductors High Sensors
VISHAY INTERTECHNOLOGY, INC.
DISCRETE SEMICONDUCTORS
RECTIFIERS
SMALL-SIGNAL DIODES
ZENER SUPPRESSOR DIODES MOSFETs TRANSISTORS
OPTOELECTRONICS
PASSIVE COMPONENTS
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MAGNETICS
Schottky (single, dual) Standard, Fast Ultra-Fast Recovery (single, dual) Clamper/Damper Bridge Superectifier Sinterglass Avalanche Diodes Schottky Switching (single, dual) Tuner/Capacitance (single, dual) Bandswitching Zener Diodes (single, dual) (TransZorb, Automotive, ESD, Arrays) Power MOSFETs JFETs Bipolar Transistors Dual Gate MOSFETs MOSMICs® Emitters, Detectors Receiver Modules Opto Couplers Solid State Relays Optical Sensors LEDs Segment Displays Infrared Data Transceiver Modules Custom products Power Analog Switches Tantalum Capacitors Solid Tantalum Capacitors Tantalum Capacitors Ceramic Capacitors Multilayer Chip Capacitors Disc Capacitors Film Capacitors Power Capacitors Heavy Current Capacitors Aluminum Capacitors Silicon Capacitors Foil Resistors Film Resistors Thin Film Resistors Thick Film Resistors Metal Oxide Film Resistors Carbon Film Resistors Wirewound Resistors Variable Resistors Cermet Variable Resistors Wirewound Variable Resistors Conductive Plastic Variable Resistors Networks/Arrays Non-Linear Resistors Thermistors Thermistors Varistors Inductors Transformers
INTEGRATED MODULES STRESS SENSORS TRANSDUCERS
DC/DC CONVERTERS STRAIN GAGES INSTRUMENTS PHOTOSTRESS® INSTRUMENTS TRANSDUCERS Load Cells Weighing Systems
WORLD'S LARGEST MANUFACTURERS DISCRETE SEMICONDUCTORS PASSIVE COMPONENTS
Thin Film Products Vishay Electro-Films, Inc.
Vishay Electro-Films, Inc.
Gilbane Street Warwick, Rhode Island 02886 Phone: 738-9150 Fax: +1401738-4389 www.vishay.com
NOTICE
information this catalog been carefully checked accuracy, though believed correct, warranty, either express implied, made either applicability compatibility with, specific requirements; does Vishay Intertechnology, Inc. affiliates assume responsibility correctness this information, damages consequent use. such printed materials legally binding unless confirmed writing pursuant German Code Civil Law. Warning Regarding Life Support Applications products listed this catalog generally recommended life support systems where failure malfunction component directly threaten life cause injury. user products such applications assumes risks such will agree hold Vishay Intertechnology, Inc. companies whose products represented this catalog, harmless against damages.
HIGH DENSITY INTERCONNECT CHIP RESISTORS
Vishay Electro-Films
High Density Interconnects
CHIP MICROWAVE RESISTORS CAPACITORS
Hybrid Resistors/Capacitors
Microwave Components
RESISTOR CAPACITOR ARRAYS
Vishay Electro-Films, Inc. Thin Film Technology
Inductors
CHIP RESISTOR ARRAYS CHIP VOLTAGE DIVIDERS HIGH SENSOR
High Sensors
CHIP INDUCTOR METALIZED WAFERS PACKAGED PRODUCTS NETWORKS
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Table Contents
Vishay Electro-Films
THIN FILM PRODUCTS
THIN FILM HIGH DENSITY INTERCONNECT PRODUCTS
High Density Interconnect Flow Chart Single Layer Multi Layer. General Design Guidelines Ceramic.Design Layout Guidelines: Ceramic. Microwave .Design Layout Guidelines: Microwave Silicon .Design Layout Guidelines: Silicon.
THIN FILM CHIP RESISTORS, WIRE BONDABLE
Chip Resistors, Single Value Flow Chart CC1.20 NiCr Alumina CC2.30 NiCr Alumina CC3.50 NiCr Alumina CC4.50 NiCr Alumina CC5.100 NiCr Alumina CC6.30 NiCr Alumina CC8.20 NiCr Alumina SFC.20 Ta2N Alumina Ta2N Silicon. Ta2N Silicon with Part Mark. SFN.20 NiCr Silicon. Ta2N Megohm silicon NiCr Silicon. Ta2N Quartz NiCr Quartz Ta2N Megohm Quartz Ta2N Back-Contact Silicon BCM.15 Ta2N Back-Contact Silicon Ta2N Back-Contact Silicon with Part Mark Ta2N 500mW Silicon Ta2N Silicon Chip Resistors Dual Value Flow Chart Ta2N Center-Tap Alumina NiCr Center-Tap Alumina .100 NiCr Center-Tap Alumina (Low Ohmic).30 Ta2N Center Silicon Custom Networks Ta2N Dual Resistor Divider Silicon. NiCr Center-Tap Silicon Ta2N Center-Tap Silicon C.40 Ta2N Megohm Center-Tap Silicon Ta2N Center-Tap Quartz CC7, NiCr User Trim Alumina. SC7, NiCr User Trim Silicon
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Revision: 28-May-04
Table Contents
Vishay Electro-Films
MICROWAVE RESISTORS
Microwave Resistors Flow Chart Thin Film Microwave Components Ta2N Microwave Alumina.90 Ta2N Microwave Alumina.92 Ta2N Microwave Alumina.94 Ta2N Microwave Alumina.96 TMR. Ta2N Multi-Tap Alumina.98
MOS/NMOS CAPACITORS
MOS/NMOS Capacitors Flow Chart .100 Series. Single Value Chip Wire Capacitors.101 CBA. Four Capacitor Binary Array .104 CBB, Five Capacitor Binary Array.106
FILTER NETWORKS
Filter Networks Flowchart .108 RCN. Resistor/Capacitor Filter Networks .109
CHIP RESISTOR ARRAYS
Chip Resistor Arrays Flow Chart .111 CLA, CLB. Ta2N Isolated Common Array.112 MTR. Ta2N Multi-Tap Silicon .114 Ta2N Multi-Tap Silicon .116
CHIP VOLTAGE DIVIDERS
Chip Voltage Dividers Flow Chart.118 Ta2N Voltage Dividers Silicon .119
HIGH SENSORS
High Sensors Flow Chart .121 High Resistors Silicon .122
INDUCTORS
Inductors Flow Chart .124 Spiral Chip Inductor .125
METALIZED COMPONENTS
Metalized Plates Flow Chart.127 Metalized Plates .128 Conductor Hybrid Circuit Substrates.129
THIN FILM SURFACE MOUNT NETWORKS
Packaged Product Networks Flow Chart .130 Single Layer Resistor Carrier.131
RESISTORS NETWORK TIME STABILITY CURVES .133 THICKNESS CONVERSION CHART.134
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Revision: 28-May-04
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Alphabetical Product Index
Vishay Electro-Films
PAGE
ATA. BCM. CBB, CC1. CC2. CC3. CC4. CC5. CC6. CC7, CC8. Ceramic Guidelines Chip Resistor Arrays Flow Chart. Chip Resistors Dual Value Flow Chart. Chip Resistors Single Value Flow Chart. Chip Voltage Dividers Flow Chart CLA, CTA. CTN. CTR. (Low Ohmic). Custom Networks Filter Networks Flow Chart Multi Layer. Single Layer High Density Interconnect Flow Chart. High Sensors Flow Chart. Conductor Circuit Substrates
PAGE
Inductors Flow Chart Microwave Guidelines Microwave Resistors Flow Chart. Metalized Plates Metalized Plates Flow Chart. MIF. MOS/NMOS Capacitors Flow Chart. MTT. Series Packaged Product Networks Flow Chart. PSC. PWA. PWB. QFX. Resistor Network Time Stability Curves. SC7, SFC. SFN. Silicon Guidelines. SLR. Thickness Conversion Chart Thin Film Microwave Components.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Revision: 29-Mar-04
Substrate Product Flow Chart
Vishay Electro-Films
SUBSTRATE CHARACTERISTICS PATTERN CAPABILITIES RESISTOR PARAMETERS PROTECTIVE COATING HIGH CONDUCTANCE POWER LINES LASER MACHINED SHAPES
HIGH DENSITY INTERCONNECT
Thin Film High Density Interconnect Products (HDI)
SINGLE LAYER
HIGH DENSITY INTERCONNECT PRODUCTS
LINE WIDTH CONTROL
POLYIMIDE SUPPORTED BRIDGES BACKSIDE PATTERNING MULTILAYER FRONT BACK CONNECTION MULTI-LAYER INTERCONNECT METALIZATION HIGH TEMPERATURE APPLICATIONS
GENERAL INFORMATION
GENERAL DESIGN GUIDELINES
DESIGN LAYOUT DESIGN LAYOUT DESIGN LAYOUT GUIDELINES GUIDELINES GUIDELINES CERAMIC SILICON MICROWAVE QUARTZ APPLICATIONS
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61055 Revision: 20-Nov-03
www.vishay.com
HIGH DENSITY INTERCONNECT
Substrate Design Guidelines Single Layer
Vishay Electro-Films
GENERAL INFORMATION
Vishay Electro-Films (EFI) produced high quality, patterned thin-film substrates volume since 1974 both hybrid circuit microwave industries. These products used both military industrial hybird circuit applications. unique volume capability achieved through high capacity metalizing systems patterning processes providing tight process parameter control, product uniformity, production flexibility. This long term experience with engineering manufacturing these products naturally evolved into expertise necessary engineer manufacture high density multi-layer products, flip chip ball grid array technologies specific application oriented devices. Although high percentage hybrid microwave substrates produced with conductor patterns only, majority have associated circuit resistors deposited well. Customers active devices other passive components required. High density multi-layer products developed with Vishay customer working team. Because high complexity these devices their close relationship product performance, this team approach assures optimum performance price. Vishay EFI's processes equipment have been designed support production small lots well high volume runs same production class 1000 lines. processing performed contiguous class clean rooms. Substrates available wide variety materials, conductor adhesion metals with either nichrome tantalum nitride resistors depending application, customer preference, manufacturing requirements. Other options include: metalized-through holes, filled vias, backside metalization patterning, wrap around patterned edges, thick copper power line conductors, both aluminum gold wire bond pads same substrate provide monometalic interfaces very high temperature applications. Vishay manufactures patterned substrates hybrid circuit industry large inches inches, many with high density fine lines sometimes with hundreds resistors. Patterning both surfaces, interconnections metalized through holes patterned wrap-around edges. Vishay proprietary, military approved, patterned, resistor overcoat protection (required 0.1% tighter tolerances). Polyimide available where possible additional cost. Overcoat polyimide insulation wire bonding over conductors. Special bond metalization very high temperature applications. In-house laser machining specially shaped substrates. Beryllium Oxide Aluminum Nitride substrate material very high power applications. Multi-level metalization using polyimide insulation. Vishay EFI's high quality maintained extensive statistical process controls league with product assurance teams composed production, engineering product assurance personnel. added control, 100% substrates visually inspected MIL-STD-883 Method 2032, level Vishay standard industrial specification required. 100% resistors tested value tolerance. Customer-specific inspection test requirements also included.
DESIGN LAYOUT
Most customers provide their layout design, leaving appropriate space Vishay design-in resistors proper locations. Vishay guidelines provide parameters required calculating resistor areas well design parameters necessary proper thin film processing manufacture. After order placement Vishay will design resistor details review layout design sometimes suggesting small modifications facilitate manufacture. required, Vishay provide layout design hybrid substrates from schematic. either case completed layout design always sent customer final approval prior mask fabrication.
SYSTEMS
Vishay systems compatible with AUTOCAD, thus designs often received from customer direct data link. Additionally, Vishay assembles resistor probe cards laser trimming testing in-house.
This extensive internal production tooling capability enables Vishay focus designs initial delivery requirements, free from difficulties that sometimes arise from subcontractor delays.
MASK FABRICATION
Vishay masks fabricated outside vendors. Vishay developed working arrangements direct data links with select vendors quick turn around mask sets.
PRICE QUOTATION
your layout complete, send with appropriate data Vishay Application Engineering Department (401) 738-9150 FAX: (401) 738-4389. already have completed layout, contact Application Engineers discuss your requirements. Please include table resistor values, tolerances, temperature coefficients resistance (TCR) power dissipations.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Document Number: 61056 Revision: 13-Jan-04
Substrate Design Guidelines Single Layer
Vishay Electro-Films
SUBSTRATE CHARACTERISTICS
Material Surface Finish Al2O3 Dimensions Dimensional Tolerance Thickness Thickness Tolerance
Al2O3, BeO, AIN, Quartz, Silicon, Sapphire, Ferrite
HIGH DENSITY INTERCONNECT
Fired, maximum; Polished, 0.5in 0.02 inches 0.02 inches inches inches
0.005 inches scribed; 0.001 inches cut) 0.005 inches 0.050 inches 0.002 inches standard tight 0.0005 inches NiCr, Ta2N TiW, Solder
Sputtered Resistor
Sputtered Metalization Electro-Plated Metals Electroless Plated
PATTERN CAPABILITIES
Conductor Line Width Conductor Line Thickness Line Width Tolerance 0.002 inches, most economical; 0.001 inches, available 300inch; 0.002 inches thick standard; 0.006 inches available 0.0001 inch 150inches thickness over inch span
Through Hole Minimum Diameter 0.005 inches dependent substrate thickness
Through Hole Tolerance, Diameter Position Metalized Hole Diameter Substrate Thickness Ratio
0.002 inches minimum greater preferred
RESISTOR PARAMETERS
Value Range Absolute Tolerance Ratio Tolerance Absolute Ratio Long Term Stability 10MW 0.05% 0.01%* 50ppm/°C standard; 10ppm/°C available 5.0ppm/°C standard; 1.0ppm/°C available Absolute Ratio, graphs Resistor Long Term Stability datasheet
*Contact Applications Engineering tighter tolerances.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61056 Revision: 13-Jan-04
www.vishay.com
HIGH DENSITY INTERCONNECT
Substrate Design Guidelines Single Layer
Vishay Electro-Films
PROTECTIVE COATING
1975, Vishay Electro-Films (EFI) developed cost patternable overcoat protect resistors other critical areas from mechanical damage during handling. essential overcoat resistors 0.1% tighter tolerances maintain tolerance during assembly test hybrid, beneficial overcoat resistors. This overcoating material evaluated Rome Force Development Laboratory approved under MIL-STD-883.
this photograph dark areas where patterned overcoating been applied over resistors.
HIGH CONDUCTANCE POWER LINES
high power applications, Vishay provide power lines with 0.006 inches thick copper.
Copper conductors 0.002 inches thickness integrated substrates relatively close proximity fine line patterns without degradation patterning capability.
Copper lines isolated with nickel barrier layers prevent copper oxidation intermetalic diffusion during high temperature processing operation.
This photograph illustrates thick conductor bonding pads interconnects. Thin small-signal lines easily incorporated same substrate.
LASER MACHINED SHAPES
house laser machining ceramic provides Vishay with ability offer custom shaped ceramic substrates, outs holes special applications.
LINE WIDTH CONTROL
Vishay EFI's tight process controls extensive class clean room facilities, provide capability maintaining superior line width line edge definition critical elements such couplers filters. Lines microinches with spaces microinches tolerances microinches supplied volume.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Document Number: 61056 Revision: 13-Jan-04
Multi Layer
Vishay Electro-Films
HIGH DENSITY INTERCONNECT
Patterned Substrate Products
POLYIMIDE SUPPORTED BRIDGES
Vishay Electro-Films (EFI) extensive experience providing rugged well-defined bridges down 0.001 inch width with consistent dimensions. substrate right bridges associated with lange coupler section this microwave circuit. line drawing depicts close view bridge configuration. shaded portion drawing first conductor layer. sacrificial layer deposited patterned before second conductor layer place. intermediate layer then removed leaving completed bridge. same process done using polymide; this case intermediate polymide layer remains place finished part. Bridges supported polymide provide more rugged structure handling during final hybrid assembly.
LANGE COUPLERS
Combining fine pattern supported bridge capabilities, Vishay Electro-Films offer large coupler features down with pattern resolution mil. This type coupler offers compact design, wide band width loss parameters.
BACKSIDE PATTERNING FRONT BACK CONNECTION
Conductor interconnect patterns ground plane definition provided bottom surface substrate. Front back alignment held 0.003 inches. side side photographs below show bottom conductor patterns two-sided patterned substrate. Interconnection from bottom pattern metalized through holes. Front ground plate back side conduction pattern connections made metalized through holes, patterned wrap around edges means filled vias. Wherever possible metalized through holes patterned wrap around edges combination both) recommended. minimum recommended metalized through hole diameter substrate thickness. filled process adds significant complexity thus cost process. Filled vias, however, used provide additional thermal conductivity paths ground plate heat sink where necessary. Vias planar microinches.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61058 Revision: 28-May-04
www.vishay.com
HIGH DENSITY INTERCONNECT
Multi Layer
Vishay Electro-Films
MULTI-LAYER INTERCONNECT METALIZATION
Areas first level metalization overcoated with polyimide second level interconnects provided accommodate high density interconnect requirements. levels conductors seen areas substrate shown right. this case interconnects chips first layer conductors first layer made with wire bonding second layer. Interconnects also made metalized through vias.
HIGH TEMPERATURE APPLICATIONS
When designing hybrid assemblies operate temperatures above 125°C becomes important provide monometallic interconnects prevent intermetalic diffusion resultant long term reliability problems. these situations, Vishay Electro-Films (EFI) developed processes depositing both aluminum gold bonding pads same substrate. This structure provides monometallic interconnects. Aluminum wire used connect from aluminum pads substrate. Similarly, gold wire used connect gold pads substrate gold hermetic package terminals. Appropriate barrier metals included substrate processing provide long term reliability high temperature applications. Products using this technology have successfully operated 250°C. graph Resistor Long Term Stability data sheet illustrates stable performance Vishay nichrome resistors 200°C operating temperature. photgraph right shows aluminum bonding pads (light gray) around active chip bond pad. These aluminum pads connected gold conductor traces with appropriate metallic barrier metalization.
Aluminum Bond Pads
Active Chip Bond
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Document Number: 61058 Revision: 28-May-04
General Design Guidelines
Vishay Electro-Films
HIGH DENSITY INTERCONNECT
Standard Layout Guidelines
DESIGN CAPABILITIES
Thin Film High Density Interconnect design guide directed engineers looking design following: Simple resistor networks Integrated resistor-capacitor networks Multilayer substrate that involve layers Custom thin film substrate alumina (AI2O3) Aluminum nitride (AlN) beryllium oxide (BeO) Substrates with special shapes, vias, patterns Substrates microwave applications wide array capabilities allows users find solutions applications servicing many markets such Military Automotive Instrumentation microwave Telecommunications CATV, fiber optic wireless Aerospace Medical
DIMENSIONS inches (millimeters)
MAXIMUM SUBSTRATE SIZE 4.1" [104] 4.1" [104] CONDUCTORS RESISTORS VALUES TOLERANCES
VALUE 0.1% LAYER LAYER VALUE REGISTRATION 0.0005" [0.01] WIDTH: 0.002" [0.05] MIN. WIDTH: 0.002" [0.05] MIN.
METAL PULLBACK 0.003" [0.08] PREFERRED
LENGTH: 0.002" [0.05] MIN.
LENGTH: 0.005" [0.13] MIN.
0.005" [0.13] MIN. HALF VIA. EDGE WRAP
BRIDGE
0.003" [0.08] MIN. LATERAL RESISTOR SPACING (FOR LASER ENTRY) LINE SPACING 0.0005" [0.013] MIN. TOL. 0.0001" [0.003] LINE WIDTH 0.0005" [0.013] MIN. TOL. 0.0001" [0.003] 0.001" [0.025] CONTACT BRIDGES SUPPORTED MULTILAYER CONDUCTORS LAYERS) 0.005" [0.13] TYP.
MIN. DIA. 0.010" [0.254] SUBSTRATE THICKNESS
SLOTTED EDGEWRAP 0.007" [0.18] 0.005" [0.13] INTRUSION 0.006" [0.15] RADIUS 0.020" [0.51] WIDTH
DIELECTRIC VIAS 0.002" [0.08] DIA. BACK PATTERN
BRIDGE HOLES MACHINED FEATURES
REGISTRATION CIRCUIT 0.002" [0.05] ANNULUS 0.005" [0.13] PLATED THRU HOLES 0.0025" [0.064] FILLED VIAS 0.004" [0.01] VENTED FILLED VIAS FRONT BACK PATTERN REGISTRATION 0.002" [0.05] THIN FILM CAPACITORS VALUE: 0.15pF/SQ. (Si3N4) VALUE: 0.055pF/SQ. (POLY) CONDUCTOR OVERLAP AREA
CIRCUIT FEATURE LOCATION TOLERANCE 0.002" [0.05] RELATIVE CIRCUIT DATUM
RADIUS 0.006 [0.15]
DIELECTRIC AREA HOLE LOCATION 0.002" [0.51] NON-CUMMULATIVE
CUTOUT
TOLERANCE 0.003" [0.08] 0.020" [0.51] MIN.
DIAMOND SAWN 0.001" [0.025] 0.003" [0.08] STD.
CUTOUT
GREATER 0.020" [0.51] HOLE DIAMETER] SUBSTRATE THICKNESS PLATED THRU HOLES 0.007" FILLED VIAS MEASURED FROM LASER EXIT SIDE SURFACE DIAMETER 0.001" [0.025] THRU DIAMETER 0.001" 0.010" [0.25] THICKNESS SPACING 0.015" [0.38] MIN. HOLE DIAMETER LASER FEATURES 0.003" [0.08]
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61081 Revision: 28-May-04
www.vishay.com
HIGH DENSITY INTERCONNECT
Guidelines: Ceramic
Vishay Electro-Films
Design Layout Guidelines Ceramic Substrates
CERAMIC SUBSTRATES
following information criteria layout designer. Deviation from rules stated below must done with extreme care. criteria layout designer follows: maximum active area ceramic plate nominal size plate minus 0.250 inches. Example 2.00 inches square plate would have active area 1.750 inches square. preferred distance conductor, from substrate border 0.005 inches. acceptable distance 0.002 inches. preferred conductor line width 0.004 inches greater. preferred space between conductors 0.004 inches. acceptable distance 0.002 inches. preferred probe size 0.010 inches 0.010 inches. acceptable probe size opening 0.006 inches 0.006 inches. acceptable Kelvin probe size opening 0.008 inches 0.006 inches. Place probe pads close outside pattern edge possible, adhering minimum guidelines, eliminate probes from shadowing resistors during laser trim. preferred minimum resistor line width space 0.001 inches. acceptable minimum line width space 0.0005 inches. power density 100W/square 100Watts/inches square film temperature +125°C. current density (Id), expressed mA/mil line width, inversely proportional resistivity resistor material.
0.004 inches
RESISTOR LINE WIDTH
0.003
Design rule 200W/square material. Design nominal value with nominal trim range. trim range include trim block, link link. Design rule 150W/square material. Design nominal value with nominal trim range. trim range include trim block, link link. preferred spacing between adjacent conductor resistor 0.004 inches. acceptable spacing 0.002 inches. preferred spacing laser entry exit 0.003 inches between adjacent circuit elements. minimum spacing 0.002 inches.
0.004 inches
(k)/ (resistivity) where k=(100)(mA/mil)(ohms/square) Example (for 25W/square); [(100)(mA/mil)(W/square)/ (25W/square)] 4mA/mil line width Example (for 50W/square): [(100)(mA/mil)(W/square)/ (50W/square)] 2mA/mil line width optimum resistivity absolute listed below: absolute 15ppm/°C 125W/square. absolute 15ppm/°C 25ppm/°C 125W square 150W/square lower yield). absolute 26ppm/°C 49ppm/°C 125W/square 175W/square lower yield). absolute 50ppm/°C nominal resistivity design must within range 200W/square. Resistors shall designed using following criteria: resistor with absolute tolerance tighter than 0.1% accuracy requires additional high resolution fine trim area with minimum trim range nominal value.
Resistor/conductor interface nominally 0.002 inches. conductor widths 0.004 inches less, overlap resistor termination conductor attach area one-half conductor width. conductor widths greater than 0.004 inches, overlap resistor termination conductor attach area one-half conductor width maximum 0.005 inches.
0.002 inches 0.002 inches
0.002 inches
0.002 inches 0.002 inches
Resistor line widths less than 0.002 inches require "step-up" 0.002 inches conductor/resistor interface.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Document Number: 61059 Revision: 13-Nov-03
Guidelines: Ceramic
Vishay Electro-Films
HIGH DENSITY INTERCONNECT
0.002 inches
0.002 inches
0.001 inches
Typical designs trim follows:
FINISH START
FINISH
START minimum line width 0.005 inches MINIMUM WIDTH
START
corner square considered squares.
CORNER SQUARE
RESISTOR LINEWIDTH
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61059 Revision: 13-Nov-03
www.vishay.com
HIGH DENSITY INTERCONNECT
Guidelines: Ceramic
Vishay Electro-Films
DESIGN LAYOUT GUIDELINES CERAMIC SUBSTRATES inches
BONDING PADS Minimum Bonding pads with overcoat Minimum Bonding pads with overcoat Preferred Bonding pads size Minimum distance from conductor substrate border Preferred distance from conductor substrate border RESISTOR CONDUCTOR INSERTION Resistor conductor edge Preferred resistor conductor edge Resistor conductor insertion Preferred resistor conductor insertion Resistor line width less than require step-up MINIMUM SPACING Resistor conductor Preferred distance from resistor conductor Resistor resistor (same resistor) Resistor resistor (adjacent resistor) Conductor conductor Preferred conductor conductor Distance from resistor substrate border Preferred distance from resistor substrate border MINIMUM DIMENSIONS Conductor width traces Preferred conductor width Resistor width Preferred resistor width Laser entry Preferred laser entry Laser kerf width Laser kerf (customer specification) width street width Overcoat distance from insertion point resistor Overcoat covering overlap Notes: must shaped with notch rounded corner. drawings must show where measure linewidths. designs must have alignment marker. corner square resistor considered squares. resistor with tolerance tighter than 0.1% accuracy requires additional high resolution fine trim area with minimum trim range nominal value. active area herman ceramic plate 4.16 inches 3.36 inches. active area super herman ceramic plate 4.16 inches 4.16 inches. active area quartz plate 2.75 inches 2.75 inches. 0.003 0.006 0.002 0.002 0.002 0.003 0.005 (Per customer specs.) 0.005 0.006 0.002 0.002 0.001 0.002 0.005 (0.001 greater) 0.0025 0.003 0.005 0.002 0.004 0.005 0.001 0.002 0.0005 0.001 0.002 0.003 0.004 0.0025 0.004 0.001 0.002 0.004 0.005 0.007 0.001 0.002 0.002 0.002 0.001 0.002 0.002 0.002 QUARTZ 0.006 0.006 0.008 0.008 0.010 0.010 0.002 0.003 ALUMINA 0.006 0.006 0.008 0.008 0.010 0.010 0.003 0.005
(0.003 inches attached width)
(same space resistor linewidth)
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Document Number: 61059 Revision: 13-Nov-03
Guidelines: Ceramic
Vishay Electro-Films
DESIGN LAYOUT GUIDELINES CERAMIC CHIP COMPONENTS inches
BONDING PADS NON-KELVIN KELVIN-(R 1kW) 100kW TOL. MINIMUM SPACING Resistor Bonding Resistor Metal Resistor Resistor (same resistor) Resistor Resistor (adjacent resistor) Metal Metal MINIMUM OVERLAP Metal Oxide Window Metal Back Contact Resistor Back Contact Resistor Metal MINIMUM DIMENSIONS Aluminum width Gold width Resistor width Resistor Metal Connections Ladder Rung width Ladder width Back Contact Window Street width Ladder Centers (nicking allowed) Ladder Centers nicking allowed) Solid Trim Power Density Conservative Power Density Maximum Notes: possible Kelvin should designs edge sensing. bonding should shaped differently orientation purposes. drawings will show where measure linewidth value critical applications. Laser entries will 0.0015 square inches minimum. Overcoat opening shall include street alignment marker. 0.0005 0.002 0.0005 0.0005 0.0005 0.0015 0.008 RUNG WIDTH RUNG WIDTH Allowed 500W/square inches 5kW/square inch Resistor Continuous under Metal Edges Resistor Metal Coincide 0.0007 0.0006 (smaller resistor width 0.0005) 0.0005 0.001 ALUMINA 0.004 0.004 0.004 0.007
HIGH DENSITY INTERCONNECT
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61059 Revision: 13-Nov-03
www.vishay.com
HIGH DENSITY INTERCONNECT
Guidelines: Microwave
Vishay Electro-Films
Design Layout Guidelines Microwave Applications
following guidelines thin film substrate design presented provide microwave designer with practical production achievable thin film parameter capabilities well provide relative cost impact achieve tightest specifications. This cost relation indicated providing achievable limits: with little cost premium other some level cost impact. tightest tolerances should specified only where required circuit performance. tightest tolerances specified parameters, even required, unnecessary costs will result. SUBSTRATE SIZE: Sizes available most substrate materials inches inches. Size tolerances: Scribe break 0.003 inches most economical size 0.001 inches small premium Surface finish: microinch fired most economical microinch microinch maximum polished small premium Thickness tolerance fired: 0.015 0.002 inches (standard), 0.001 inches small premium 0.010 0.001 inches (standard), 0.0005 inches premium Thickness tolerance polished: 0.0005 inches standard METALIZATION: Sputtered: NiCr, Ta2N, TiW, Electro- Plated microinches), microinches), 0.005 inches). (Thick copper selectively plated power lines). Compatibility: While majority these materials used multilayer combinations, some combinations compatible dependent patterning requirements. combinations widely used when doubt, please contact Vishay Electro-Films (EFI) application engineering before finalizing specifications. PATTERNS: Minimum Line Widths Spaces: 0.0005 inches Line Width Tolerance: Metal thickness microinches 0.0001 inches (standard) 0.00005 inches (premium) Metal thickness over microinches 0.0001 inches each microinches thickness: Tighter discussion with Vishay application engineering (premium). Metalization Substrate Edge: metalization brought substrate edge, slight disturbance metal will occur because sawing scribing operation. this slight disturbance acceptable, 0.002 inch designed pullback from edge required. This also applies backside groundplane.
0.002 INCH METAL PULLBACK FROM SUBSTRATE EDGE REQUIRED
METAL
SUBSTRATE SCALE
BRIDGES: Width: 0.001 inch minimum (standard); 0.005 inch (premium); (either true bridge over polyimide dielectric). THROUGH HOLES: Diameter: 0.006 inch minimum Taper hole will tapered down from laser spot entry side, normally side, 0.001 inch every 0.010 inches substrate thickness. smallest diameter will used hole dimension.
0.010 INCHES
(NOT SCALE)
0.0005 INCHES
Patterned Metalized Slits: slits, 0.002 inches wide 0.006 inches long, will placed typically 180° opposite across via. They will placed signal path unless there option. METALIZED THROUGH HOLES: Patterns: When designing through hole patterns, design aminimum 0.005 inches ring around each hole (see figure below) allow tolerance build-up caused hole placement, manufacturing alignment, diameter tolerance, slight laser entrance hole rounding other factors.
0.005 INCHES MINIMUM
this presents severe design problem, contact Vishay application engineering.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
Document Number: Revision: 12-Nov-03
Guidelines: Microwave
Vishay Electro-Films
METALIZED THROUGH HOLES (continued) Double Sided, Front Back Alignment: 0.002 inch (standard), tighter, consult Vishay Application Engineering (premium). Metalization: same metalization layers should used each side substrate when metalized through holes used. (Plating thickness different). example, resistor material required side, should also used bottom side adhesion layer. Size: Metalized through hole diameters should have minimum ratio with substrate thickness. FILLED VIAS: Diameter 0.007 inch standard. Center center hole placement 0.000015 inch minimum. Surface finish: substrate will normally supplied with polished lapped surface necessitated fill process. Planarity: filled will extend above substrate recessed below substrate more than 500in Patterned Metalization Slits: slits, 0.002 inch wide 0.006 inch long, will placed typically 180° opposite across via. They will placed signal path unless there option. Design: Value: Ta2N, Vishay recommends that resistors designed value with trim range (e.g. block resistors, width.) high frequency resistors will laser edge trimmed value preserve frequency response (see figure below). However, Vishay supply resistors standard (10% demand) looser tolerance which designed 100% value with laser trimming. Matching identically designed resistors relatively close proximity, held without trimming. nichrome resistors, design resistors value with trim range.
HIGH DENSITY INTERCONNECT
Resistor laser trimmed around center line maintain frequency response
Power: insure adequate long term stability, following guidelines should used relative power handling (current density).
RESISTIVITY (OHMS/SQUARE)
SLITS METAL
CURRENT/0.001 INCH LINE WIDTH 0.5mA
Hermeticity: Non-Hermetic.
RESISTORS Material: Resistors either nichrome tantalum nitride. most microwave applications tantalum nitride recommended unless unusual tolerances long term stability requirements exist. Resistivity: Recommended resistivity Ta2N -100 ohms/ square; NiCr ohms/square. Temperature Coefficient: Ta2N, ohms/square, less than ±100ppm/°C; 51-100 ohms/square less than ±150ppm/°C. NiCr, ohm/square, less than 50ppm/°C.
Stabilization Temperature: best long term stability, Ta2N resistors should stabilized approximately 425°C. However, please note that nickel been specified under gold solderability, temperatures above 350°C will cause nickel diffuse into gold creating problems. One, nickel oxide will form gold surface making soldering difficult secondly, resistivity gold will increase perhaps adversely effecting electrical performance. Specifying palladium place nickel will reduce eliminate problem. most microwave applications where resistor tolerances (Ta2N) greater, stabilization temperature 350°C, nominal, should provide adequate long term stability, Remember that resistors designed 100% value with trim allowed, some range stabilization temperature required provide cost yields. case recommended that stabilization temperature less than 300°C.
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: Revision: 12-Nov-03
www.vishay.com
HIGH DENSITY INTERCONNECT
Guidelines: Silicon
Vishay Electro-Films
Design Layout Guidelines Silicon Substrates
SILICON SUBSTRATES
following information criteria layout designer. Deviation from rules stated below must done with extreme care. criteria layout designer follows: standard wafer dimensions inches inches. minimum spacing metal finished substrate edge 0.001 inches. minimum line width space resistive material 0.00015 inches. line width aluminum conductor 0.0005 inches, line width gold conductor 0.001. minimum bond size 0.008 inches 0.005 inches. With 0.008 inches along edge substrate, unless otherwise specified. power density silicon 2500 watts/inches square ohms square. current density expressed mA/mil inversely proportional resistivity resistor material. Examples various sheet resistivities:
10000 Watts/inches square 5000 Watts/inches square 2500 Watts/inches square 1250 Watts/inches square 14.14 A/inches 7.07 A/inches 3.53 A/inches 1.75 A/inches 14.14 mA/milinches 7.07 mA/milinches 3.53 mA/milinches 1.75 mA/milinches
Kerfs Detail
Laser entries require 0.0015 inches square minimum. Design rule percentages parts follows: Design nominal value with trim range nominal trim range (preferred) Design nominal value with trim range nominal trim range (acceptable) Minimum spacing between metal resistor 0.001 inches. Spacing between resistor resistor (adjacent resistor) 0.0005 inches. Spacing between resistor resistor (same resistor) smaller resistor width 0.0005 inches. overcoat required must overlap bond pads 0.00025 inches. street must free overcoat material. Most silicon parts require kerf marks, made resistor material, which placed street. These kerfs usually placed four corners substrate. They placed approximately 0.0005 inches away from bond pad. silicon parts require alignment marker upper right corner substrate street (see illustration)
Maximum Substrate Edge (Step Repeat) Detail
ohms/square ohms/square ohms/square ohms/square
ABCD
ABCD
resistors with ratio tolerance 0.01% that cannot designed using link design will require solid trim capable providing trim resolution required tolerance. resistor line widths that smaller than 0.0005 inches will require "step-up" 0.0005 inches resistor/ conductor interface.
PATTERN AREA
Detail
Street Width
0.0005 Inches
0.0005 Inches
0.0005 Inches Typ. 0.003 Inches
0.0035 Inches minimum
0.0001 inches 0.0002 inches 0.001 Inches
0.0002
0.0005 0.0005 inches Detail
RESISTOR Rev. CONDUCTOR Rev.
ABCD
Detail
0.0015 Inches
ABCD
0.0005
Detail
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61061 Revision: 12-Nov-03
Guidelines: Silicon
Vishay Electro-Films
DESIGN LAYOUT GUIDELINES SILICON SUBSTRATES/CHIP COMPONENTS inches
BONDING PADS NON-KELVIN KELVIN-(R ohm) 100k TOL. MINIMUM SPACING Resistor Bonding Resistor Metal Resistor Resistor (same resistor) Resistor Resistor (adjacent resistor) Metal Metal MINIMUM OVERLAP Metal Oxide Window Metal Back Contact Resistor Back Contact Resistor Metal MINIMUM DIMENSIONS Aluminum width Gold width Resistor width Resistor Metal Connections Ladder Rung width Ladder width Back Contact Window Street width Ladder Centers (nicking allowed) Ladder Centers nicking allowed) Solid Trim Power Density Conservative 50W/square Power Density Maximum* Notes possible Kelvin should designs edge sensing. bonding should shaped differently orientation purposes. drawings will show where measure line width value critical applications. Laser entries will 0.0015 square inches minimum. Overcoat opening shall include street alignment marker. Maximum ratings degrade long term drift characteristics. Preferred 25kW/square inches 50kW/square inches 0.0005 0.001 0.0001 0.00025 0.0002 0.0015 0.003 0.003 0.006 0.0005 0.001 0.0001 0.00025 0.0002 0.0015 0.008 RUNG WIDTH RUNG WIDTH 0.0015 Preferred 200W/square inches 2.5kW/square inches Allowed 500W/square inches 5kW/square inches 0.0005 0.002 0.0005 0.0005 0.0005 0.0015 0.008 0.0005 0.0005 0.0005 Resistor Continuous under Metal Edges Resistor Metal Coincide 0.0005 0.001 0.0007 0.0006 0.0007 0.0006 (smaller resistor width 0.0005) 0.0005 0.001 0.0005 0.001 0.0007 0.0006 SILICON 0.004 0.004 0.004 0.007 QUARTZ 0.004 0.004 0.004 0.007 ALUMINA 0.004 0.004 0.004 0.007
HIGH DENSITY INTERCONNECT
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61061 Revision: 12-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
CHIP RESISTORS
Thin Film Chip Resistors Wire Bondable Single Value
SIZE (inches) POWER VALUE RANGE PERFORMANCE FILM MODEL
ALUMINA
SINGLE-VALUE TOP-CONTACT
SILICON 0.020 0.020 25mW QUARTZ 0.020 0.020 25mW 510K 0.050 0.050 20mW 500K
Ta2N
QFM.48
NiCr
QFN.50
SINGLE-VALUE CHIP RESISTOR
Ta2N
QFX.
0.020 0.020 250mW 0.015 0.015 100mW 100K
Ta2N
BCR.54
SINGLE-VALUE BACK-CONTACT
SILICON
Ta2N
BCM.56
0.022 0.022 250mW
Ta2N
BCP.58
0.030 0.045 watt POWER SILICON 0.070 0.070 watt
Ta2N
PWA.60
Ta2N
PWB.62
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
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technical questions contact: efi@vishay.com
Document Number: 61054 Revision: 20-Nov-03
Vishay Electro-Films
SIZE (inch) POWER VALUE RANGE 0.020 0.040 40mW 0.030 0.030 0.050 0.050 100mW 125K 0.050 0.0100 175mW 400K 0.100 0.100 400mW 0.030 0.045 65mW -59K 0.020 0.020 40mW 0.020 0.020 50mW SIZE (inches) POWER VALUE RANGE PERFORMANCE FILM MODEL
CHIP RESISTORS
NiCr
CC1.22
NiCr
CC2.24
NiCr
CC3.26
NiCr
CC4.28
NiCr
NiCr
CC6.32
NiCr
CC8.34
Ta2N
SFC.36
PERFORMANCE
FILM
MODEL
0.020 0.020 250mW
Ta2N
SFM.38
Ta2N
SFP.40
0.020 0.020 125mW 510K 0.040 0.040 20mW 510K 0.050 0.050 400mW
NiCr
SFN.42
Ta2N NiCr
SFX.44 SC3.46
Performance
10ppm/°C 0.05%
25ppm/°C 0.1%
50ppm/°C 0.5%
100ppm/°C
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61054 Revision: 20-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0402 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Small single chip size: 0.020 0.040 inches
Product scale
Resistance range: Alumina substrate
stray capacitance: 0.2pF series single-value resistor chips offer small size, shunt capacitance solder option. CC1s nichrome resistor material offers excellent stability. CC1s manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. CC1s 100% electrically tested visually inspected MIL-STD-883. Resistor material: nichrome Resistor passivation coat optional Solder Pads optional
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES* TOLERANCES
Temperature Coefficient resistance values* andTightest Standard Tolerance Available tolerances diagram
0.5% 0.1% 25ppm/°C 50ppm/°C 100ppm/°C
Note* Only
standard strip line designs microwave applications
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Hermetic applications Stability, 1000 hours, 125°C, 40mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 125°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.2% maximum 0.1% maximum 55°C 125°C 0.25% maximum 0.1% maximum 400V 1012 minimum 100V maximum 40mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61001 Revision: 13-Nov-03
Thin Film 0402 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
0.020 0.020 0.020
Vishay Electro-Films
0.040
0.040
0.040
0.010
0.010
0.010
0.012 TYPICAL RANGE
0.012 TYPICAL RANGE
0.012 TYPICAL RANGE
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back solder attach Contact Applications Engineer 0.020 0.040 0.003 (0.5 0.08mm) 0.010 0.002 (0.254 0.03mm) 99.6% alumina, inch finish Nichrome 0.010 0.012 (0.175 0.30mm) minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 100ppm/°C TCR, Gold Terminations INSPECTION PRODUCT /PACKAGING FAMILY 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) 5000 RESISTANCE MULTIPLIER VALUE CODE first 0.01 significant digits resistance TOLERANCE CODE 0.1%* 0.25%* 0.5% 1.0% 2.0% 5.0% Coating standard 25ppm/°C 50ppm/°C 100ppm/°C TERMINATIONS Gold Solder
NOTE: Factory will convert order number into final part number
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61001 Revision: 13-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0303 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Chip size: 0.030 inches square Resistance range: Alumina substrate stray capacitance: 0.2pF series single-value resistor chips offer relatively small size, shunt capacitance solder option. CC2s nichrome resistor material offers excellent stability. CC2s manufactured using Vishay Electro Films (EFI) sophisticated thin film equipment manufacturing technology. CC2s 100% electrically tested visually inspected MIL-STD-883. Resistor material: nichrome Resistor passivation coat optional Tolerances 0.05%
Product scale
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Temperature Coefficient resistance values* Tightest Standard Tolerance Available tolerances diagram
0.1% 0.05% 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Hermetic applications Stability, 1000 hours, 125°C, 100mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 125°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.2% maximum 0.1% maximum 55°C 125°C 0.25% maximum 0.1% maximum 400V 1012 minimum 100V 100mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61077 Revision: 13-Nov-03
Thin Film 0303 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.030
0.030
0.030
0.030
0.004
0.024
0.006 0.010
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Terminations: Aluminum, Nickel solder Gold back solder attach Contact Applications Engineer 0.030 0.030 0.003 (1.27 1.27 0.076mm) 0.010 0.002 (0.25 0.05mm) 99.6% alumina, inch finish Nichrome 0.004 0.006 (0.100 0.15mm) minimum minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Terminations INSPECTION PRODUCT /PACKAGING FAMILY 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) 5000 RESISTANCE MULTIPLIER VALUE CODE first 0.01 significant digits resistance TOLERANCE CODE 0.05%* 0.1%* 0.25%* 0.5% 1.0% 2.0% 5.0% *Coating standard 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C TERMINATIONS Gold Solder
NOTE: Factory will convert order number into final part number
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61077 Revision: 13-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0505 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Chip size: 0.050 inches square Resistance range:
Product scale
125k
Alumina substrate stray capacitance: 0.2pF
series single-value resistor chips offer relatively small size, shunt capacitance solder option. CC3s nichrome resistor material offers excellent stability. CC3s manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. CC3s 100% electrically tested visually inspected MIL-STD-883.
Resistor material: nichrome Resistor passivation coat optional Tolerances 0.05% Solder optional
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Temperature Coefficient resistance values* Tightest Standard Tolerance Available tolerances diagram
0.1% 0.05% 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C
125K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Hermetic applications Stability, 1000 hours, 125°C, 100mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 125°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.2% maximum 0.1% maximum 55°C 125°C 0.25% maximum 0.1% maximum 400V 1012 minimum 100V 100mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61002 Revision: 12-Nov-03
Thin Film 0505 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.050
0.050
0.044
0.010
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back solder attach Contact Applications Engineer 0.050 0.050 0.003 (1.27 1.27 0.076mm) 0.010 0.002 (0.25 0.05mm) 99.6% alumina, inch finish Nichrome 0.010 0.044 (0.254 0.117mm) minimum minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Terminations INSPECTION PRODUCT FAMILY /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) 5000 RESISTANCE MULTIPLIER VALUE CODE first 0.01 significant digits resistance TOLERANCE CODE 0.05%* 0.1%* 0.25%* 0.5% 1.0% 2.0% 5.0% *Coating standard 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C TERMINATIONS Gold Solder
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61002 Revision: 12-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0510 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Chip size: 0.050 0.100 inches Resistance range:
Product scale
400k
Alumina substrate stray capacitance: 0.2pF
series single-value resistor chips offer increased power larger size, shunt capacitance solder option. CC4s nichrome resistor material offers excellent stability. CC4s manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. CC4s 100% electrically tested visually inspected MIL-STD-883.
Resistor material: nichrome Resistor passivation coat optional Tolerances 0.05% Solder optional
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Temperature Coefficient resistance values* tolerances Standard Tolerance Available Tightest diagram
0.1% 0.05% 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C
200K
400K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Hermetic applications Stability, 1000 hours, 125°C, 175mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 125°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.2% maximum 0.1% maximum 55°C 125°C 0.25% maximum 0.1% maximum 400V 1012 minimum 100V maximum 175mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61004 Revision: 12-Nov-03
Thin Film 0510 Size Resistor Alumina
DIMENSIONS inches
Vishay Electro-Films
SCHEMATIC
CHIP RESISTORS
0.050
0.100
0.065
0.045
0.015
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back solder attach Contact Applications Engineer 0.050 0.100 0.003 (1.27 2.54 0.076mm) 0.010 0.002 (0.254 0.05mm) 99.6% alumina, inch finish Nichrome 0.015 0.045 (0.381 1.143mm) minimum minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Terminations PRODUCT INSPECTION /PACKAGING FAMILY 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) 8000 RESISTANCE MULTIPLIER VALUE CODE first 0.01 significant digits resistance TOLERANCE CODE 0.05%* 0.1%* 0.25%* 0.5% 1.0% 2.0% 5.0% *Coating standard 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C TERMINATIONS Gold Solder
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61004 Revision: 12-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 1010 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Chip size: 0.100 inches square
Product scale
Resistance range: Alumina substrate
stray capacitance: 0.2pF series single-value resistor chips offer increased power larger size, shunt capacitance solder option. CC5s nichrome resistor material offers excellent stability. CC5s manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. CC5s 100% electrically tested visually inspected MIL-STD-883. Resistor material: nichrome power rating: 400mW Resistor passivation coat optional Tolerances 0.05% Solder optional
APPLICATIONS
Vishay chip resistors have excellent power dissipation capability ideally suited prototyping. suitable high moisture applications unless protected. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Temperature Coefficient resistance values* tolerances diagram Tolerance Available Tightest Standard
0.1% 0.05% 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C
500K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Stability, 1000 hours, 125°C Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 125°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.1% maximum 55°C 125°C 0.25% maximum 0.25% maximum 200V 1012 minimum 200V maximum 400mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61005 Revision: 13-Jan-04
Thin Film 1010 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
0.094 0.0075
Vishay Electro-Films
0.100
0.0075
0.100
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back solder attach Contact Applications Engineer 0.100 0.100 0.003 (2.54 2.54 0.076mm) 0.010 0.002 (0.254 0.05mm) 99.6% alumina Nichrome 0.0075 0.094 (0.190 2.375mm) minimum minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Terminations INSPECTION PRODUCT /PACKAGING FAMILY 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) 8000 RESISTANCE MULTIPLIER VALUE CODE first 0.01 significant digits resistance TOLERANCE CODE 0.05%* 0.1%* 0.25%* 0.5% 1.0% 2.0% 5.0% *Coating standard 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C TERMINATIONS Gold Solder
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61005 Revision: 13-Jan-04
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0304 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Chip size: 0.030 0.045 inches
Product scale
Resistance range: Alumina substrate
stray capacitance: 0.2pF series single-value resistor chips offer small size, shunt capacitance solder option. CC6s nichrome resistor material offers excellent stability. CC6s manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. CC6s 100% electrically tested visually inspected MIL-STD-883. Resistor material: nichrome Resistor passivation coat optional Tolerances 0.05% Solder optional
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic applications where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Temperature Coefficient resistance values* tolerances diagram
0.1% Tightest Standard Tolerance Available 0.05% 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Hermetic applications Stability, 1000 hours, 125°C, 65mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 125°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.2% maximum 0.1% maximum 55°C 125°C 0.25% maximum 0.1% maximum 400V 1012 minimum 100V maximum 65mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61006 Revision: 12-Nov-03
Thin Film 0304 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.030
0.045
0.020
0.010
0.024
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Terminations: Aluminum, Nickel solder (62/32) Gold back solder attach Contact Applications Engineer 0.030 0.045 0.003 (0.762 1.143 0.076mm) 0.010 0.002 (0.25 0.05mm) 99.6% alumina, microinch finish Nichrome 0.010 0.024 (0.254 0.61mm) minimum minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Terminations INSPECTION PRODUCT /PACKAGING FAMILY 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) 5000 RESISTANCE MULTIPLIER VALUE CODE first 0.01 significant digits resistance TOLERANCE CODE 0.05%* 0.1%* 0.25%* 0.5% 1.0% 2.0% 5.0% *Coating standard 10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C TERMINATIONS Gold Solder
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61006 Revision: 12-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0202 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Chip size: 0.020 inches square
Product scale
Resistance range: Alumina substrate
series resistor chips offer combination shunt capacitance, small size excellent stability. CC8s manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. CC8s 100% electrically tested visually inspected MIL-STD-883.
stray capacitance: 0.2pF Resistor material: nichrome with passivation coat Tolerances 0.5%
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environment where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.5% 25ppm/°C 50ppm/°C 100ppm/°C
PROCESS CODE CLASS CLASS
5.1K
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method (Passivated film) Stability, 1000 hours, 125°C, 25mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, 1000 hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.5% maximum 0.2% maximum 55°C 125°C 0.25% maximum 0.5% maximum 400V 1012 minimum 100V maximum 35mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61007 Revision: 20-Nov-03
Thin Film 0202 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.020
0.020
0.020 0.004
0.020 0.004
0.012 TYPICAL RANGE
0.006 TYPICAL RANGE
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Passivation Backing OPTIONS: Gold back solder attach Contact Applications Engineer 0.020 0.020 0.003 (0.5 0.08mm) 0.010 0.002 (0.25 0.05mm) 99.6% alumina, microinch finish Nichrome 0.004 0.006 (0.10 0.15mm) minimum minimum gold standard Thermalset Plastic None
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 5000 RESISTANCE VALUE first significant digits resistance MULTIPLIER CODE 0.01 TOLERANCE CODE 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61007 Revision: 20-Nov-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film 0202 Size Resistor Alumina
CHIP RESISTORS
FEATURES
Small size: 0.020 inches square
Product scale
Resistance range: Alumina substrate
series resistor chips offer combination shunt capacitance small size. SFCs tantalum nitride resistor material offers excellent resistance high moisture environments. SFCs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. SFCs 100% electrically tested visually inspected MIL-STD-883.
shunt capacitance: 0.2pF Resistor material: tantalum nitride Moisture resistant
APPLICATIONS
Vishay chip resistors provide excellent high-frequency response ideally suited prototyping. Typical application areas are: Amplifiers Oscillators Attenuators Couplers Filters
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 1.0% 50ppm/°C 100ppm/°C 250ppm/°C
PROCESS CODE CLASS CLASS
5.6K
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Stability, 1000 hours, 125°C, 25mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.5% maximum 0.5% maximum 55°C 125°C 0.25% maximum 0.5% maximum 400V 1012 minimum 100V maximum 62mW maximum 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61008 Revision: 02-Dec-03
Thin Film 0202 Size Resistor Alumina
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.020
0.020
0.020 0.004
0.020 0.004
0.012 TYPICAL RANGE
0.006 TYPICAL RANGE
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Gold back solder attach Contact Applications Engineer 0.020 0.020 0.003 (0.5 0.768mm) 0.010 0.002 (0.25 0.05mm) 99.6% alumina, microinch finish Tantalum nitride, self-passivating 0.004 0.006 (0.10 0.15mm) minimum minimum gold standard None
ORDERING INFORMATION
Example: 100% visual, 10%, 250ppm/°C TCR, Gold Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 5000 RESISTANCE VALUE first significant digits resistance MULTIPLIER CODE 0.01 TOLERANCE CODE 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61008 Revision: 02-Dec-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film Top-Contact Resistor
CHIP RESISTORS
FEATURES
Small size: 0.020 inches square
Product scale
Resistance range:
series single-value resistor chips offer small size, wide ohmic value range excellent power capacity. SFMs tantalum nitride resistor material offers excellent resistance high moisture environments. SFMs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. SFMs 100% electrically tested visually inspected MIL-STD-883.
power rating: 250mW Oxidized silicon substrate good power dissipation Resistor material tantalum nitride, self passivating Moisture resistant
APPLICATIONS
Vishay top-contact resistor chips designed handle substantial power loads many types hybrid packages. They ideally suited this purpose because their small size.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.5% 0.1% 25ppm/°C 50ppm/°C 100ppm/°C 250ppm/°C
PROCESS CODE CLASS *MIL-PRF-38534 inspection criteria CLASS
200K 360K 620K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method 250k 251k Moisture resistance, MIL-STD-202 Method Stability, 1000 hours, 125°C, 125mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds
35dB typical 20dB typical 0.5% maximum 0.25% maximum 55°C 125°C 0.25% maximum 0.5% maximum 200V 1012 minimum 100V maximum 250mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61017 Revision: 19-Mar-04
Thin Film Top-Contact Resistor
CONFIGURATIONS inches
CHIP RESISTORS
0.004 0.020 0.020
Vishay Electro-Films
0.007 0.020 0.016
0.006
0.004
0.016 TYPICAL RANGE
0.004 TYPICAL RANGE
0.004 TYPICAL RANGE
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Gold backing eutectic attach Gold bonding pads, minimum thickness Consult Applications Engineer 0.020 0.020 0.003 (0.5 0.076mm) 0.010 0.002 (0.254 0.05mm) Oxidized silicon, minimum SiO2 Tantalum nitride, self-passivating 0.004 0.004 (0.10 0.10mm) minimum aluminum None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100% visual, 100ppm/°C TCR, Aluminum Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 1000 RESISTANCE VALUE first digits resistance MULTIPLIER CODE 0.0001 0.001 0.01 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61017 Revision: 19-Mar-04
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film Top-Contact Resistor with Part Mark
CHIP RESISTORS
FEATURES
Part marked digits
Product scale
Small size: 0.022 inches square Resistance range:
series single-value resistor chips offer small size, wide ohmic value range excellent power capacity. SFPs part marked with resistance value allowing user ability visually determine resistance value chip. SFPs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. SFPs 100% electrically tested visually inspected MIL-STD-883.
power rating: 250mW Oxidized silicon substrate good power dissipation Resistor material: tantalum nitride, self passivating Moisture resistant
APPLICATIONS
Vishay small resistor chips widely used hybrid packages where space limited chip value marking important identification. part marked with resistance value. Wire bonding made pads chip.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.5% 0.1% 25ppm/°C 50ppm/°C 100ppm/°C 250ppm/°C
PROCESS CODE CLASS 200K 430K 620K CLASS
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method 250k 251k Moisture resistance, MIL-STD-202 Method Stability, 1000 hours, 125°C, 125mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds Values above available
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
35dB typical 20dB typical 0.5% maximum 0.25% maximum 55°C 125°C 0.25% maximum 0.5% maximum 200V 1012 minimum 100V maximum 250mW 0.25% maximum
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61000 Revision: 04-Dec-03
Thin Film Top-Contact Resistor with Part Mark
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.005
PART MARK PART MARK PART MARK
PART MARK
PART MARK
PART MARK
PART MARK
PART MARK
0.018
0.022
TYPICAL RANGE
TYPICAL RANGE
TYPICAL RANGE
TYPICAL RANGE
0.004
SCHEMATIC
STANDARD MARKING DIGITS XXXX Four significant digits value Multiplier 0.001 0.01 1000
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Gold backing eutectic attach Gold bonding pads, minimum thickness Consult Applications Engineer 0.022 0.022 0.003 (0.558 0.558 0.05mm) 0.010 0.002 (0.254 0.05mm) Oxidized silicon, minimum SiO2 Tantalum nitride, self-passivating 0.004 0.004 (0.10 0.10mm) minimum aluminum None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100% visual, 250ppm/°C TCR, Aluminum Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 1000 RESISTANCE VALUE first digits resistance MULTIPLIER CODE 0.01 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61000 Revision: 04-Dec-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
CHIP RESISTORS
FEATURES
Chip size: inches square
Product scale
Resistance range:
510k
Resistor material: nichrome Oxidized silicon substrate 125mW power
series resistor chips offer combination nichrome stability, good power rating small size. SFNs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. SFNs 100% electrically tested visually inspected MIL-STD-883.
APPLICATIONS
Vishay resistor chips widely used hybrid packages where space limited. Designed with capacity handle substantial power loads, they also have benefit nichrome stability. Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.1%
PROCESS CODE CLASS CLASS
10ppm/°C 25ppm/°C 50ppm/°C 100ppm/°C
*MIL-PRF-38534 inspection criteria
510K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method 250k 251k Stability, 1000 hours, 125°C, 50mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds 35dB typical 20dB typical 0.25% maximum 55°C 125°C 0.25% maximum 0.5% maximum 200V 1012 minimum 100V maximum 125mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61025 Revision: 19-Mar-04
NiCr Thin Film, Top-Contact Resistor
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.014
0.008
0.020
0.004
0.004
0.004
0.020
TYPICAL RANGE
TYPICAL RANGE 7.4K
0.004 TYPICAL RANGE 7.5K 510K
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Aluminum Pads Passivation (thermal plastic) Consult Applications Engineer 0.020 0.020 0.003 (0.51 0.51 0.05mm) 0.010 0.002 (0.254 0.05mm) Oxidized silicon, minimum SiO2 Nichrome (Passivation Optional) 0.004 0.004 (0.10 0.10mm) minimum Gold None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100% visual, 50ppm/°C TCR, Gold Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 1000 RESISTANCE VALUE first significant digits resistance MULTIPLIER CODE 0.01 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61025 Revision: 19-Mar-04
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film, Top-Contact Megohm Resistor
CHIP RESISTORS
FEATURES
Megohm resistance range: 0.51M
Product scale
Chip size: 0.040 inches square Reduced hybrid size Resistor material: tantalum nitride, self-passivating Oxidized silicon substrate
series resistor chips extends range available resistance Meg. These offer best combinations small size high value available. SFXs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. SFXs 100% electrically tested visually inspected MIL-STD-883.
APPLICATIONS
series megohm resistor chips designed hybrid packages which require small-size high-value resistors.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.1% 50ppm/°C 100ppm/°C 250ppm/°C 350ppm/°C 0.5%
PROCESS CODE CLASS CLASS
510K
3.3M
*MIL-PRF-38534 inspection criteria
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method 106, (Passivated only) Stability, 1000 hours, 125°C, 10mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds 12dB typical 0.5% maximum 1.0% maximum 55°C 125°C 0.25% maximum 0.5% maximum 400V 1012 minimum 100V maximum 20mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61018 Revision: 04-Dec-03
Thin Film, Top-Contact Megohm Resistor
DIMENSIONS inches
CHIP RESISTORS
0.040
Vishay Electro-Films
0.005 0.037
0.005
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing 0.040 0.040 0.003 (1.0 0.075mm) 0.010 0.002 (0.254 0.050mm) Oxidized silicon, minimum SiO2 Tantalum nitride, self-passivating 0.005 0.005 (0.127 0.127mm) minimum aluminum None, lapped semiconductor silicon
OPTIONS: Gold backing eutectic attach Resistance values above available 0.055 inches square size 0.030 inch square size also available with different values restrictions. Consult Applications Engineer
ORDERING INFORMATION
Example: 100% visual, 250ppm/°C TCR, Aluminum Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts, MIL-STD-883 Sample, visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 5000 RESISTANCE VALUE first significant digits resistance MULTIPLIER CODE 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61018 Revision: 04-Dec-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
CHIP RESISTORS
FEATURES
Small single chip size: 0.050 inches square
Product scale
Resistance range:
series resistor chips silicon offer combination nichrome stability, wide resistance range higher power rating than available same sized ceramic substrate. SC3's manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. SC3s 100% electrically tested visually inspected MIL-STD-883.
Resistor material: nichrome Oxidized silicon substrate good power dissipation 400mW capability User trimmable
APPLICATIONS
Vishay chip resistors have excellent power dissipation capability ideally suited prototyping. Typical application areas are: Amplifiers Couplers Oscillators Filters Attenuators Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.1% 25ppm/°C 50ppm/°C 100ppm/°C
PROCESS CODE CLASS *MIL-PRF-38534 inspection criteria CLASS
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Stability, 1000 hours, 125°C Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 150°C) rated power short-time overload, 25°C, seconds 20dB typical 0.1% maximum 55°C 125°C 0.25% maximum 0.25% maximum 200V 1012 minimum 100V maximum 400mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61014 Revision: 09-Dec-03
NiCr Thin Film, Top-Contact Resistor
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.050
0.045
0.050
0.0075
0.0075
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Gold backing eutectic attach Aluminum bonding pads, minimum thickness User trimmable Consult Applications Engineer 0.050 0.050 0.003 (1.27 1.27 0.076mm) 0.010 0.002 (0.254 0.05mm) Oxidized silicon, minimum SiO2 Nichrome 0.0075 0.045 (0.190 1.143mm) minimum minimum gold standard None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100% visual, 10%, 50ppm/°C TCR, Gold Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 5000 RESISTANCE VALUE first significant digits resistance MULTIPLIER CODE 0.01 TOLERANCE CODE 0.1% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61014 Revision: 09-Dec-03
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film, Top-Contact Resistor
CHIP RESISTORS
FEATURES
Small size, 0.020 inches square
Product scale
Resistance range: power rating: 25mW
series tantulum nitride quartz single-value resistor chips offer small size, wide ohmic value range excellent frequency response. QFMs tantalum nitride resistor material offers excellent resistance high moisture environments. QFMs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. QFMs 100% electrically tested visually inspected MIL-STD-883.
Quartz substrate: 0.1pF shunt capacitance Resistor material: tantalum nitride, self passivating Moisture resistant
APPLICATIONS
top-contact resistor chips designed handle substantial power loads many types hybrid packages. They ideally suited this purpose because their small size.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.5% 0.1% 25ppm/°C 50ppm/°C 100ppm/°C 250ppm/°C
PROCESS CODE CLASS CLASS Aluminum Terminations *MIL-PRF-38534 inspection criteria 200K 430K 620K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method 250k 251k Moisture resistance, MIL-STD-202, Method Stability, 1000 hours, 125°C, 125mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds
35dB typical 20dB typical 0.5% maximum (0.25% 0.01 maximum 55°C 125°C 0.25% maximum 0.5% maximum 200V 1012 minimum 100V maximum 25mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61078 Revision: 23-Mar-04
Thin Film, Top-Contact Resistor
CONFIGURATIONS inches
CHIP RESISTORS
0.004 0.020
Vishay Electro-Films
0.020
0.007 0.020 0.016
0.006
0.004
0.016 TYPICAL RANGE
0.004 TYPICAL RANGE
0.004 TYPICAL RANGE
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Gold backing eutectic attach Gold bonding pads, minimum thickness Consult Applications Engineer 0.020 0.020 0.003 (0.5 0.076mm) 0.010 0.002 (0.254 0.05mm) Quartz Tantalum nitride, self-passivating 0.004 0.004 (0.10 0.10mm) minimum minimum aluminum None, lapped Quartz
ORDERING INFORMATION
Example: 100% visual, 100ppm/°C TCR, Aluminum Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 1000 RESISTANCE VALUE first digits resistance MULTIPLIER CODE 0.0001 0.001 0.01 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61078 Revision: 23-Mar-04
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
CHIP RESISTORS
FEATURES
Chip size: 0.020 inches square
Product scale
Resistance range:
510k
series nichrome quartz resistor chips offer combination nichrome stability, excellent frequency response small size. QFNs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. QFNs 100% electrically tested visually inspected MIL-STD-883.
Resistor material: nichrome Quartz substrate: 0.1pF shunt capacitance Power: 25mW
APPLICATIONS
Vishay top-contact resistor chips widely used hybrid packages where space limited. Designed with capacity handle substantial power loads, they also have benefit nichrome stability. Recommended hermetic environments where exposed moisture.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.5% 0.1% 25ppm/°C 50ppm/°C 100ppm/°C 250ppm/°C
PROCESS CODE CLASS Gold Terminations *MIL-PRF-38534 inspection criteria CLASS
200K
360K
510K
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method 250k 251k Stability, 1000 hours, 125°C, 50mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds 35dB typical 20dB typical 0.1% maximum 55°C 125°C 0.25% maximum 0.5% maximum 200V 1012 minimum 100V maximum 25mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61079 Revision: 19-Mar-04
NiCr Thin Film, Top-Contact Resistor
DIMENSIONS inches
CHIP RESISTORS
Vishay Electro-Films
0.014
0.008
0.020
0.004
0.004
0.004
0.020
0.004 TYPICAL RANGE TYPICAL RANGE 7.4K TYPICAL RANGE 7.5K 510K
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Aluminum bonding pads, minimum thickness Consult Applications Engineer 0.020 0.020 0.003 (0.51 0.51 0.05mm) 0.010 0.002 (0.254 0.05mm) Quartz Nichrome (Passivation Optional) 0.004 0.004 (0.10 0.10mm) minimum gold None, lapped Quartz
ORDERING INFORMATION
Example: 100% visual, 50ppm/°C TCR, Gold Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) Available alternatives: Aluminum pads gold back Passivation (thermal plastic) PRODUCT FAMILY PROCESS CODE Process Code Table 1000 RESISTANCE VALUE first digits significant digits resistance MULTIPLIER CODE 0.01 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61079 Revision: 19-Mar-04
technical questions contact: efi@vishay.com
www.vishay.com
Vishay Electro-Films
Thin Film, Top-Contact Megohm Resistor
CHIP RESISTORS
FEATURES
Chip size: 0.050 inches square
Product scale
Resistance range: 500k
series, tantulum nitride quartz resistor chips combine high resistance with shunt capacitance. These offer best combinations small size, frequency response high value available. QFXs manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment manufacturing technology. QFXs 100% electrically tested visually inspected MIL-STD-883.
Quartz substrate: 0.1pF shunt capacitance Resistor material: tantalum nitride, self-passivating
APPLICATIONS
series resistor chips designed circuits requiring high values with lower shunt capacitance higher frequency operation.
TEMPERATURE COEFFICIENT RESISTANCE, VALUES TOLERANCES
Tightest Standard Tolerance Available 0.1% 50ppm/°C 100ppm/°C 250ppm/°C 350ppm/°C 0.5%
PROCESS CODE CLASS *MIL-PRF-38534 inspection criteria CLASS
500K
2.0M
4.2M
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER Noise, MIL-STD-202, Method Moisture resistance, MIL-STD-202 Method Stability, 1000 hours, 125°C, 10mW Operating temperature range Thermal shock, MIL-STD-202, Method 107, Test condition High temperature exposure, 150°C, hours Dielectric voltage breakdown Insulation resistance Operating voltage power rating 70°C (derated zero 175°C) rated power short-time overload, 25°C, seconds 12dB typical 0.5% maximum 0.5% maximum 55°C 125°C 0.25% maximum 0.5% maximum 400V 1012 minimum 400V maximum 20mW 0.25% maximum
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE +65.788.6668 FAX: +65.788.0988 SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 8237 FAX: 1953 USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
technical questions contact: efi@vishay.com
Document Number: 61031 Revision: 23-Mar-04
Thin Film, Top-Contact Megohm Resistor
DIMENSIONS inches
CHIP RESISTORS
0.050
Vishay Electro-Films
0.045
0.050
0.005
0.005
SCHEMATIC
MECHANICAL SPECIFICATIONS inches
PARAMETER Chip size Chip thickness Chip substrate material Resistor material Bonding size Number pads material Backing OPTIONS: Gold bonding pads, minimum Consult Applications Engineer 0.050 0.050 0.003 (1.25 1.25 0.75mm) 0.010 0.002 (0.254 0.05mm) Quartz Tantalum nitride, self-passivating 0.005 0.005 (0.127 0.127mm) minimum aluminum None, lapped Quartz
ORDERING INFORMATION
Example: 100% visual, 350ppm/°C TCR, mil, Aluminum Pads, Class Visual inspection INSPECTION /PACKAGING 100% visually inspected parts matrix tray MIL-STD-883 Sample, commercial visually inspected parts loaded matrix trays AQL) PRODUCT FAMILY PROCESS CODE Process Code Table 5000 RESISTANCE VALUE first digits significant digits resistance MULTIPLIER CODE 1000 10000 TOLERANCE CODE 0.1% 0.2% 0.5% 1.0% 2.0% 2.5% 5.0%
VISHAY ELECTRO-FILMS FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 GERMANY +49.9287.710 FAX: 9287.70435 ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 ITALY 39.2.300.11911 FAX: +39.2.300.11999 JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 SINGAPORE
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