Copyright 1988, Texas Instruments Incorporated POST OFFICE 655303
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SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL TYPE POSITIVE EDGE TRIGGERED FLIP FLOPS WITH PRESET CLEAR
Copyright 1988, Texas Instruments Incorporated
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL TYPE POSITIVE EDGE TRIGGERED FLIP FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL TYPE POSITIVE EDGE TRIGGERED FLIP FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL TYPE POSITIVE EDGE TRIGGERED FLIP FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL TYPE POSITIVE EDGE TRIGGERED FLIP FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
SN5474, SN54LS74A, SN54S74 SN7474. SN74LS74A, SN74S74 DUAL TYPE POSITIVE EDGE TRIGGERED FLIP FLOPS WITH PRESET CLEAR
POST OFFICE 655303
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
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4-Jun-2007
PACKAGING INFORMATION
Orderable Device JM38510/00205BCA JM38510/00205BDA JM38510/00205BDA JM38510/07101BCA JM38510/07101BCA JM38510/07101BDA JM38510/07101BDA JM38510/30102B2A JM38510/30102B2A JM38510/30102BCA JM38510/30102BCA JM38510/30102BDA JM38510/30102BDA JM38510/30102SCA JM38510/30102SCA JM38510/30102SDA JM38510/30102SDA SN5474J SN5474J SN54LS74AJ SN54LS74AJ SN54S74J SN54S74J SN7474DR SN7474DR SN7474N SN7474N SN7474N3 SN7474N3 SN74LS74AD SN74LS74AD SN74LS74ADBR SN74LS74ADBR SN74LS74ADBRE4 SN74LS74ADBRE4 SN74LS74ADBRG4 SN74LS74ADBRG4 Status OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP LCCC LCCC CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP CDIP SOIC SOIC PDIP PDIP PDIP PDIP SOIC SOIC SSOP SSOP SSOP SSOP SSOP SSOP Package Drawing Pins Package Plan Green (RoHS Sb/Br) Green (RoHS Sb/Br) Lead/Ball Finish Call Call Call SNPB SNPB Peak Temp Call Call Call Type Type Type Type
POST-PLATE Type POST-PLATE Type SNPB SNPB SNPB SNPB Call Call SNPB SNPB SNPB SNPB Call Call Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Type Type Type Type Type Type Type Type Call Call Type Type Type Type Call Call Call Call Call Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS
Addendum-Page
PACKAGE OPTION ADDENDUM
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4-Jun-2007
Orderable Device
Status
Package Type SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC CDIP CDIP PDIP PDIP PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC
Package Drawing
Pins Package Plan Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish
Peak Temp
SN74LS74ADE4 SN74LS74ADE4 SN74LS74ADG4 SN74LS74ADG4 SN74LS74ADR SN74LS74ADR SN74LS74ADRE4 SN74LS74ADRE4 SN74LS74ADRG4 SN74LS74ADRG4 SN74LS74AJ SN74LS74AJ SN74LS74AN SN74LS74AN SN74LS74AN3 SN74LS74AN3 SN74LS74ANE4 SN74LS74ANE4 SN74LS74ANSR SN74LS74ANSR SN74LS74ANSRG4 SN74LS74ANSRG4 SN74S74D SN74S74D SN74S74DE4 SN74S74DE4 SN74S74DG4
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Call Type Type Call Call Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Addendum-Page
PACKAGE OPTION ADDENDUM
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4-Jun-2007
Orderable Device SN74S74DG4 SN74S74DR SN74S74DR SN74S74DRE4 SN74S74DRE4 SN74S74DRG4 SN74S74DRG4 SN74S74N SN74S74N SN74S74N3 SN74S74N3 SN74S74NE4 SN74S74NE4 SN74S74NSR SN74S74NSR SN74S74NSRE4 SN74S74NSRE4 SN74S74NSRG4 SN74S74NSRG4 SNJ5474J SNJ5474J SNJ5474W SNJ5474W SNJ54LS74AFK SNJ54LS74AFK SNJ54LS74AJ SNJ54LS74AJ SNJ54LS74AW SNJ54LS74AW SNJ54S74FK SNJ54S74FK SNJ54S74J
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP PDIP PDIP PDIP PDIP CDIP CDIP LCCC LCCC CDIP CDIP LCCC LCCC CDIP
Package Drawing
Pins Package Plan Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call Call Call Call
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Call Call Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Call Call Call
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
POST-PLATE Type POST-PLATE Type SNPB SNPB Type Type Type Type
POST-PLATE Type POST-PLATE Type SNPB Type
Addendum-Page
PACKAGE OPTION ADDENDUM
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4-Jun-2007
Orderable Device SNJ54S74J SNJ54S74W SNJ54S74W
Status ACTIVE ACTIVE ACTIVE
Package Type CDIP
Package Drawing
Pins Package Plan
Lead/Ball Finish SNPB
Peak Temp Type Type Type
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE REEL INFORMATION
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Device
Package Pins
Site
Reel Diameter (mm)
Reel Width (mm)
(mm)
(mm)
(mm)
(mm)
Pin1 (mm) Quadrant
SN74LS74ADBR SN74LS74ADR SN74LS74ANSR SN74S74DR SN74S74NSR
10.5 10.5
TAPE REEL INFORMATION
Device SN74LS74ADBR SN74LS74ADR SN74LS74ANSR SN74S74DR SN74S74NSR Package Pins Site Length (mm) 346.0 346.0 346.0 346.0 346.0 Width (mm) 346.0 346.0 346.0 346.0 346.0 Height (mm) 33.0 33.0 33.0 33.0 33.0
Pack Materials-Page
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
POST OFFICE 655303
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MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
POST OFFICE 655303
DALLAS, TEXAS 75265
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