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Altera Device Package Information
This data sheet provides package information Altera® devices. includes these sections:
Device Package Cross Reference (below) Thermal Resistance (starting page Package Outlines (starting page
this data sheet, packages listed order ascending count.
Device Package Cross Reference
Table through show devices available Ball Grid Array (BGA), Fineline Ball Grid Array (FBGA), Ultra FineLine Ball-Grid Array (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Ceraqmic Dual In-Line Package (CerDIP), Hybrid Fineline (HFBGA):
Stratix® series FPGAs Cycloneseries FPGAs MAX® series CPLDs HardCopy® series Structured ASICs APEXseries FPGAs ACEX® FPGAs MercuryFPGAs FLEX® series FPGAs ExcaliburFPGA Enhanced configuration devices
Altera Corporation
DS-PKG-13.0
Altera Device Package Information Data Sheet
Table Stratix Devices Device
EP2S15 Flip Chip FBGA Flip Chip FBGA EP2S30 Flip Chip FBGA Flip Chip FBGA EP2S60 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S90 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S130 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S180 Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020 1,508 1,020 1,508 1,020 1,508
Table Stratix Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP1SGX25F EP1SGX40D EP1SGX40G Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020 1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table Stratix Devices Device
EP1S10 Flip Chip FBGA FBGA Flip Chip FBGA EP1S20 Flip Chip FBGA FBGA Flip Chip FBGA EP1S25 FBGA Flip Chip FBGA Flip Chip FBGA EP1S30 Flip Chip FBGA Flip Chip Flip Chip FBGA EP1S40 Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP1S60 Flip Chip Flip Chip FBGA Flip Chip FBGA EP1S80 Flip Chip Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020 1,020 1,508 1,020 1,508 1,020 1,508
Altera Corporation
Altera Device Package Information Data Sheet
Table Cyclone Devices Device
EP2C5 TQFP PQFP FBGA EP2C8 TQFP PQFP FBGA EP2C20 PQFP FBGA FBGA EP2C35 FBGA FBGA EP2C50 FBGA FBGA EP2C70 FBGA FBGA
Package
Pins
Table Cyclone Devices Device
EP1C3 TQFP TQFP EP1C4 FBGA FBGA EP1C6 TQFP PQFP FBGA EP1C12 PQFP FBGA FBGA EP1C20 FBGA FBGA
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices Device Devices
EPM240 EPM570 TQFP TQFP TQFP FBGA EPM1270 TQFP FBGA EPM2210 FBGA FBGA
Package
Pins
9000 Devices
EPM9320 EPM9320A EPM9560
7000B Devices
EPM7032B PLCC PQFP TQFP UBGA EPM7064B TQFP UBGA FBGA TQFP EPM7128B UBGA TQFP FBGA TQFP UBGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices (Continued) Device
EPM7256B TQFP TQFP UBGA PQFP FBGA EPM7512B TQFP UBGA PQFP FBGA
Package
Pins
7000AE Devices
EPM7032AE PLCC TQFP EPM7064AE PLCC TQFP TQFP UBGA FBGA FBGA EPM7128AE PLCC TQFP FBGA UBGA TQFP FBGA EPM7256AE TQFP FBGA TQFP PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices (Continued) Device
EPM7512AE TQFP PQFP FBGA
Package
Pins
7000A Devices
EPM7128A PLCC TQFP FBGA TQFP FBGA EPM7256A TQFP TQFP PQFP FBGA
Table HardCopy Series Devices Device
HC20K400 HC20K600 HC1S25 Flip Chip FBGA FBGA HC1S80 HC1S60 HC1S30 HC1S40 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Package
Pins
1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices Device APEX Devices
EP2A15 Flip Chip FBGA Flip Chip EP2A25 Flip Chip FBGA Flip Chip Flip Chip FBGA EP2A40 Flip Chip FBGA Flip Chip Flip Chip FBGA EP2A70 Flip Chip Flip Chip FBGA 1,020 1,020 1,508
Package
Pins
APEX 20KE Devices
EP20K30E TQFP FBGA PQFP FBGA EP20K60E TQFP FBGA PQFP PQFP FBGA EP20K100E TQFP FBGA PQFP PQFP FBGA EP20K160E TQFP PQFP PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices (Continued) Device
EP20K200E PQFP PQFP FBGA FBGA EP20K300E PQFP FBGA EP20K400E Flip Chip FBGA EP20K600E Flip Chip FBGA Flip Chip FBGA EP20K1000E Flip Chip Flip Chip FBGA Flip Chip FBGA EP20K1500E Flip Chip Flip Chip FBGA
Package
Pins
1,020 1,020 1,020
APEX 20KC Devices
EP20K200C PQFP PQFP FBGA EP20K400C Flip Chip FBGA EP20K600C Flip Chip FBGA Flip Chip FBGA EP20K1000C Flip Chip Flip Chip FBGA Flip Chip FBGA 1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices (Continued) Device APEX Devices
EP20K100 TQFP PQFP PQFP FBGA EP20K200 PQFP PQFP FBGA EP20K400 Flip Chip FBGA
Package
Pins
Table ACEX Devices Device
EP1K10 TQFP TQFP PQFP FBGA EP1K30 TQFP PQFP FBGA EP1K50 TQFP PQFP FBGA FBGA EP1K50S FBGA FBGA EP1K100 PQFP FBGA FBGA
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table Mercury Devices Device
EP1M120 EP1M350 Flip Chip FBGA Flip Chip FBGA
Package
Pins
Table FLEX Series Devices Device FLEX 10KA Devices
EPF10K10A TQFP TQFP PQFP FBGA EPF10K30A TQFP PQFP PQFP FBGA FBGA EPF10K100A RQFP FBGA EPF10K250A
Package
Pins
FLEX 10KS Devices
EPF10K50S TQFP PQFP PQFP FBGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table FLEX Series Devices (Continued) Device
EPF10K200S RQFP FBGA FBGA
Package
Pins
FLEX 10KE Devices
EPF10K30E FBGA FBGA EPF10K50E FBGA FBGA EPF10K100E FBGA FBGA EPF10K130E PQFP FBGA FBGA EPF10K200E FBGA
FLEX Devices
EPF10K30 RQFP RQFP EPF10K50 RQFP EPF10K50V PQFP FBGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table FLEX Series Devices (Continued) Device
EPF10K70 RQFP EPF10K100 EPF10K130V EPF6016 TQFP PQFP PQFP EPF6016A TQFP FBGA TQFP PQFP FBGA EPF6024A TQFP PQFP PQFP FBGA
Package
Pins
Table Excalibur Devices Device
EPXA1 FBGA Flip Chip FBGA EPXA4 Flip Chip FBGA Flip Chip FBGA EPXA10 Flip Chip FBGA
Package
Pins
1,020 1,020
Table Enhanced Configuration Devices Device
EPC16 UBGA
Package
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Thermal Resistance
Table through provide (junction-to-ambient thermal resistance) (junction-to-case thermal resistance) values following Altera device families:
Stratix series FPGAs Cyclone series FPGAs series CPLDs HardCopy series Structured ASICs APEX series FPGAs ACEX FPGAs Mercury FPGAs FLEX series FPGAs Excalibur FPGA Classic devices
Altera transitioning industry-standard copper thermally enhanced thermally enhanced Flip Chip FBGA package offerings mentioned Process Change Notice PCN024 available Altera's website: This change affects APEX 20KE, APEX 20KC, APEX Mercury, Excalibur device families. Therefore, thermal resistance specifications provided devices affected this change. older packages identified using aluminum silicon carbide (AlSiC) lid, while newer packages identified using copper (Cu) lid. Thermally enhanced thermally enhanced Flip Chip FBGA packages offered newer Altera families, including Stratix Stratix were introduced using industry-standard lid. Therefore, these device specifications include only single thermal resistance specification.
Table Thermal Resistance Stratix Devices Device
EP2S15
Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
C/W)
0.36 0.36 0.21 0.21 0.13 0.13 0.13
C/W) Still
13.1 12.2 12.6 11.7 12.3 11.4 10.4
C/W) ft./min.
11.1 10.2 10.6 10.3
C/W) ft./min.
C/W) ft./min.
EP2S30
EP2S60
1,020 Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices (Continued) Device
EP2S90
Count
Package
Flip Chip HFBGA Flip Chip FBGA
C/W)
0.10 0.07 0.09 0.10 0.07 0.07 0.07 0.05 0.05
C/W) Still
12.0 11.0 10.2 10.9 10.1
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
1,020 Flip Chip FBGA 1,508 Flip Chip FBGA EP2S130 Flip Chip FBGA
1,020 Flip Chip FBGA 1,508 Flip Chip FBGA EP2S180 1,020 Flip Chip FBGA 1,508 Flip Chip FBGA
Table Thermal Resistance Stratix Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D EP1SGX25D EP1SGX25F EP1SGX40D EP1SGX40G
Count
Package
Flip Chip FBGA Flip Chip FBGA
C/W)
0.39 0.23 0.23 0.16
C/W) Still
11.1 10.8
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
1020 Flip Chip FBGA 1020 Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices
Device
EP1S10
Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA FBGA Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA
C/W)
0.38 0.43 0.30 0.31 0.25 0.25 0.17 0.18 0.17 0.18 0.13 0.13 0.13
C/W) Still
11.9 16.8 17.2 10.9 11.8 15.5 10.7 14.8 15.3 10.5 10.0 10.4 10.4
C/W) ft./min.
13.7 12.4 12.8 11.7
C/W) ft./min.
11.9 12.2 10.7 10.0 10.4
C/W) ft./min.
10.5 10.8
EP1S20
EP1S25
1020
EP1S30
1020
EP1S40
1020 1508
EP1S60
1020 1508
EP1S80
1020 1508
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Cyclone Devices Device
EP2C5
Count
Package
TQFP PQFP FBGA TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
C/W)
C/W) Still
30.4 30.2 29.8 30.2 29.6 24.2 19.4 18.6 18.4 17.7 16.9 16.3
C/W) ft./min.
29.3 29.2 26.1 28.3 28.8 28.1 15.4 14.6 14.4 13.7 11.9
C/W) ft./min.
27.9 27.3 23.6 26.9 26.9 20.5 25.8 17.8 14.8 13.3 12.6 12.4 11.8 11.1 10.5
C/W) ft./min.
25.5 22.3 21.7 24.9 21.7 18.5 20.6 13.1 11.7 11.1 10.9 10.2
EP2C8
EP2C20
EP2C35
EP2C50
EP2C70
Table Thermal Resistance Cyclone Devices
Device
EP1C3
Count
Package
TQFP TQFP TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA
C/W)
11.0 10.0
C/W) Still
37.5 31.1 29.4 27.2 28.7 26.0 24.3 23.0 21.0 20.7
C/W) ft./min.
35.4 29.4 28.0 24.7 24.5 23.4 20.2 19.8 17.7 17.5
C/W) ft./min.
33.4 27.9 26.7 22.1 22.3 20.8 18.1 17.7 15.6 15.5
C/W) ft./min.
29.8 25.5 24.7 17.8 20.5 17.1 16.4 16.1 14.1 13.9
EP1C6
EP1C12
EP1C20
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Devices Device
EPM240 EPM570
Count
Package
TQFP TQFP TQFP FBGA TQFP FBGA FBGA FBGA
C/W)
12.0 11.2 10.5 13.0 10.5 10.4
C/W) Still
39.5 38.7 32.1 37.4 31.4 33.5 30.2 29.8
C/W) ft./min.
37.5 36.6 30.3 33.1 29.7 29.3 26.1 25.7
C/W) ft./min.
35.5 34.6 28.7 30.5 28.2 26.8 23.6 23.3
C/W) ft./min.
31.6 30.8 26.1 28.4 25.8 24.7 21.7 21.3
EPM1270
EPM2210
Table Thermal Resistance 9000 Devices Device
EPM9320
Count
Package
PLCC RQFP PLCC RQFP PLCC RQFP RQFP RQFP RQFP RQFP RQFP RQFP RQFP RQFP
C/W)
C/W) Still
29.0 17.0 14.0 14.0 29.0 17.0 12.0 29.0 17.0 14.0 17.0 12.0 17.0 12.0 14.0 12.0 12.0 17.0 11.0 12.0
C/W) ft./min.
27.0 16.0 10.0 12.0 27.0 16.0 11.0 27.0 16.0 12.0 16.0 11.0 16.0 11.0 10.0 11.0 11.0 16.0 10.0 11.0
C/W) ft./min.
25.0 15.0 11.0 26.0 15.0 10.0 25.0 15.0 11.0 15.0 10.0 15.0 10.0 10.0 10.0 15.0 10.0
C/W) ft./min.
23.0 13.0 10.0 23.0 13.0 23.0 13.0 10.0 12.0 12.0 12.0
EPM9320A
EPM9400
EPM9480
EPM9560
EPM9560A
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices Device
EPM7032
Count
Package
PLCC PQFP TQFP
C/W)
10.0 15.0 14.0 10.0 14.0 23.0 10.0 14.0 14.0 14.0 14.0 11.0 13.0 14.0 23.0 12.0 21.0
C/W) Still
33.0 48.0 46.0 33.0 46.0 69.0 33.0 46.0 31.0 45.0 31.0 46.0 31.0 46.0 28.0 39.0 31.0 44.0 29.0 28.0 33.0 31.0 46.0 56.0 39.0 49.0 29.0 28.0 32.0
C/W) ft./min.
31.0 46.0 44.0 31.0 44.0 67.0 31.0 44.0 30.0 44.0 30.0 45.0 30.0 44.0 26.0 37.0 30.0 43.0 28.0 26.0 32.0 30.0 45.0 53.0 37.0 47.0 27.0 26.0 31.0
C/W) ft./min.
30.0 45.0 43.0 30.0 43.0 66.0 30.0 43.0 28.0 42.0 28.0 43.0 28.0 43.0 25.0 35.0 28.0 41.0 26.0 25.0 31.0 28.0 43.0 51.0 35.0 44.0 26.0 24.0 30.0
C/W) ft./min.
27.0 42.0 40.0 27.0 40.0 62.0 27.0 40.0 25.0 39.0 25.0 40.0 25.0 40.0 23.0 32.0 25.0 38.0 23.0 22.0 30.0 25.0 40.0 47.0 31.0 40.0 23.0 22.0 29.0
EPM7032B
PLCC TQFP
EPM7032S
UBGA PLCC TQFP
EPM7032V
PLCC TQFP
EPM7032AE
PLCC TQFP
EPM7064S
PLCC TQFP
EPM7064
PLCC TQFP PLCC TQFP
EPM7064AE EPM7064B
PLCC PLCC PQFP PLCC TQFP
UBGA TQFP FBGA
EPM7096
PLCC PLCC PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Continued) Device
EPM7128A
Count
Package
PLCC TQFP FBGA
C/W)
11.0 18.0 12.0 22.0 11.0 19.0 16.0 13.0 10.0 10.0 12.0 10.0 11.0 12.0 14.0 11.0 14.0 12.0 10.0 10.0 12.0
C/W) Still
28.0 37.0 44.0 31.0 38.0 53.0 38.0 46.0 32.0 44.0 40.0 29.0 32.0 32.0 30.0 38.0 35.0 33.0 30.0 38.0 43.0 33.0 42.0 39.0 29.0 32.0 33.0 35.0 37.0 33.0 32.0 20.0 32.0
C/W) ft./min.
26.0 35.0 42.0 29.0 36.0 50.0 36.0 44.0 30.0 42.0 38.0 28.0 31.0 31.0 28.0 36.0 34.0 32.0 28.0 36.0 40.0 30.0 40.0 37.0 28.0 31.0 32.0 28.0 35.0 32.0 31.0 13.0 31.0
C/W) ft./min.
25.0 33.0 39.0 28.0 34.0 48.0 34.0 41.0 29.0 39.0 36.0 26.0 30.0 30.0 26.0 34.0 33.0 31.0 26.0 34.0 38.0 28.0 38.0 35.0 26.0 30.0 31.0 26.0 33.0 31.0 30.0 10.0 30.0
C/W) ft./min.
22.0 30.0 35.0 25.0 31.0 44.0 31.0 37.0 26.0 35.0 33.0 23.0 29.0 28.0 23.0 30.0 32.0 30.0 23.0 30.0 37.0 26.0 36.0 31.0 23.0 29.0 30.0 23.0 30.0 30.0 29.0 26.0
EPM7128B
TQFP FBGA UBGA TQFP FBGA
EPM7128E EPM7128S
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP
EPM7128AE
PQFP PLCC TQFP FBGA
EPM7160E EPM7160S EPM7192S EPM7192E
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP PQFP PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Continued) Device
EPM7256A
Count
Package
TQFP TQFP PQFP FBGA TQFP TQFP UBGA PQFP FBGA PQFP RQFP PQFP RQFP
C/W)
12.0 12.0 13.0 13.0 12.0 10.0 11.0 10.0 12.0 11.0
C/W) Still
36.0 32.0 30.0 34.0 37.0 33.0 40.0 31.0 34.0 20.0 31.0 17.0 30.0 18.0 42.0 37.0 33.0 31.0 34.0 32.0 30.0 14.0 32.0 32.0 35.0 30.0 14.0 32.0
C/W) ft./min.
34.0 27.0 28.0 32.0 35.0 29.0 38.0 29.0 32.0 13.0 30.0 16.0 29.0 17.0 39.0 35.0 29.0 29.0 32.0 27.0 28.0 12.0 30.0 27.0 33.0 28.0 12.0 30.0
C/W) ft./min.
32.0 25.0 26.0 29.0 33.0 27.0 36.0 27.0 30.0 10.0 29.0 15.0 26.0 16.0 37.0 33.0 27.0 27.0 30.0 25.0 25.0 11.0 28.0 25.0 31.0 25.0 11.0 28.0
C/W) ft./min.
30.0 24.0 21.0 28.0 30.0 25.0 34.0 22.0 28.0 25.0 13.0 21.0 15.0 36.0 30.0 25.0 22.0 28.0 23.0 21.0 10.0 22.0 24.0 30.0 21.0 10.0 27.0
EPM7256B
EPM7256E
EPM7256S
EPM7256AE
FBGA TQFP TQFP PQFP FBGA TQFP PQFP FBGA
EPM7512AE
EPM7512B
TQFP UBGA PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 3000A Devices
Device
EPM3032A
Count
Package
TQFP PLCC
C/W)
14.0 14.0 12.0 12.0 11.0 11.0
C/W) Still
46.0 31.0 46.0 31.0 39.0 38.0 33.0 33.0 31.0 30.0 32.0
C/W) ft./min.
45.0 30.0 45.0 30.0 37.0 36.0 30.0 29.0 29.0 28.0 30.0
C/W) ft./min.
43.0 28.0 43.0 28.0 35.0 34.0 28.0 27.0 27.0 25.0 28.0
C/W) ft./min.
40.0 25.0 40.0 25.0 31.0 30.0 26.0 25.0 22.0 21.0 22.0
EPM3064A
TQFP PLCC
EPM3128A EPM3256A EPM3512A
TQFP TQFP TQFP TQFP PQFP PQFP FBGA
Table Thermal Resistance HardCopy Devices
Device
HC20K400 HC20K600 HC1S25
Count
Package
Flip Chip FBGA FBGA
C/W)
0.96 0.43 0.43 0.291 0.291
C/W) Still
13.0 19.7 19.3 10.9 10.9 12.22 12.22
C/W) ft./min.
10.2 15.8 15.6 8.54 8.54
C/W) ft./min.
13.9 13.8 7.02 7.02
C/W) ft./min.
12.4 12.3 5.82 5.82
HC1S30 HC1S40 HC1S60 HC1S80
1020 1020
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Table Thermal Resistance APEX Devices
Device
EP2A15
Count
Package
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
C/W)
0.22 0.34 0.23 0.35
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
10.8 11.6 10.0
Flip Chip lid) Flip Chip (AlSiC lid)
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX Devices (Continued)
Device
EP2A25
Count
Package
FBGA lid) Flip Chip FBGA (AlSiC lid)
C/W)
0.17 0.26 0.17 0.27 0.17 0.27 0.24 0.15 0.19 0.15 0.19 0.10 0.14 0.10 0.14
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
10.7 11.5 10.0 10.4 10.0 10.0 10.0
Flip Chip lid) Flip Chip (AlSiC lid)
1020 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) EP2A40 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip lid) Flip Chip (AlSiC lid) 1,020 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) EP2A70 Flip Chip lid) Flip Chip (AlSiC lid) 1,508 Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
Table Thermal Resistance APEX APEX 20KE Devices
Device
EP20K30E
Count
Package
TQFP PQFP FBGA FBGA TQFP FBGA PQFP PQFP FBGA
C/W)
14.0 11.0
C/W) Still
29.0 30.0 36.0 31.0 28.0 33.0 30.0 26.0 29.0 12.0
C/W) ft./min.
28.0 29.0 34.0 29.0 26.0 32.0 28.0 24.0 28.0 11.0
C/W) C/W) ft./min. ft./min.
26.0 27.0 32.0 28.0 25.0 30.0 26.0 21.0 26.0 10.0 25.0 22.0 29.0 25.0 24.0 27.0 21.0 17.0 24.0
EP20K60E
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Continued)
Device
EP20K100
Count
Package
TQFP PQFP PQFP FBGA TQFP FBGA PQFP PQFP FBGA TQFP PQFP PQFP FBGA PQFP PQFP FBGA PQFP PQFP FBGA FBGA PQFP PQFP FBGA PQFP FBGA
C/W)
C/W) Still
26.0 29.0 25.0 28.0 12.0 26.0 32.0 29.0 25.0 28.0 12.0 25.0 28.0 24.0 12.0 24.0 25.0 21.0 12.0 22.0 25.0 22.0 12.0 23.0 12.0 21.0 25.0 22.0 12.0 23.0 19.0 12.0 20.0
C/W) ft./min.
25.0 27.0 23.0 26.0 11.0 25.0 30.0 27.0 23.0 26.0 11.0 24.0 26.0 21.0 11.0 23.0 23.0 19.0 11.0 21.0 23.0 19.0 11.0 22.0 11.0 20.0 23.0 19.0 11.0 22.0 18.0 11.0 19.0
C/W) C/W) ft./min. ft./min.
24.0 25.0 20.0 25.0 10.0 24.0 29.0 25.0 20.0 25.0 10.0 23.0 23.0 19.0 10.0 22.0 20.0 17.0 10.0 20.0 20.0 18.0 10.0 21.0 10.0 19.0 20.0 18.0 10.0 21.0 16.0 10.0 18.0 23.0 20.0 17.0 23.0 23.0 26.0 20.0 17.0 23.0 22.0 19.0 16.0 21.0 17.0 15.0 19.0 17.0 16.0 20.0 18.0 17.0 16.0 20.0 15.0 17.0
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K200C
EP20K300E
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Continued)
Device
EP20K400
Count
Package
FBGA FBGA FBGA lid) FBGA (AlSiC lid)
C/W)
0.36 0.25 0.38 0.18 0.28 0.19 0.29 0.12 0.12 0.12 0.19
C/W) Still
11.6 10.9 11.7 10.8 11.6 10.4 10.6 11.4 10.2
C/W) ft./min.
C/W) C/W) ft./min. ft./min.
EP20K400E EP20K400C
EP20K600E EP20K600C
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA FBGA lid) FBGA (AlSiC lid)
1,020 EP20K1000E EP20K1000C
FBGA lid) (AlSiC lid)
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Continued)
Device
EP20K1500E
Count
Package
lid) (AlSiC lid)
C/W)
0.10 0.15 0.10 0.15
C/W) Still
10.1
C/W) ft./min.
C/W) C/W) ft./min. ft./min.
1,020
FBGA FBGA FBGA lid) FBGA (AlSiC lid)
1,020 Note Table
FBGA
"fin" extra heat sink that customers device. Several vendors make heat sinks, they have different sizes. Altera performed thermal calculations Table using following specifications: width: 0.25 height: pitch: base thickness:
Table Thermal Resistance ACEX Devices
Device
EP1K10
Count
Package
TQFP TQFP PQFP FBGA TQFP PQFP FBGA TQFP PQFP FBGA FBGA PQFP FBGA FBGA
C/W)
11.0 12.0
C/W) Still
37.0 31.0 30.0 37.0 28.0 30.0 31.0 26.0 29.0 30.0 25.0 28.0 28.0 24.0
C/W) ft./min.
35.0 29.0 29.0 35.0 27.0 28.0 29.0 25.0 28.0 28.0 24.0 26.0 26.0 23.0
C/W) ft./min.
33.0 28.0 27.0 33.0 26.0 26.0 28.0 24.0 25.0 27.0 23.0 23.0 25.0 22.0
C/W) ft./min.
29.0 25.0 22.0 30.0 24.0 21.0 25.0 23.0 20.0 24.0 22.0 18.0 23.0 21.0
EP1K30
EP1K50
EP1K100
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Mercury Devices
Device
EP1M120
Count
Package
FBGA lid) FBGA (AlSiC lid) FBGA lid) FBGA (AlSiC lid)
C/W)
0.58 0.87 0.22 0.34
C/W) Still
12.2 13.0 10.5 11.0
C/W) ft./min.
10.1 11.1
C/W) ft./min.
C/W) ft./min.
EP1M350
Table Thermal Resistance FLEX Devices
Device
EPF10K10
Count
Package
PLCC TQFP PQFP TQFP TQFP PQFP FBGA TQFP RQFP RQFP RQFP RQFP TQFP PQFP PQFP FBGA FBGA TQFP PQFP FBGA FBGA
C/W)
10.0
C/W) Still
28.0 26.0 29.0 35.0 29.0 30.0 33.0 24.0 17.0 14.0 17.0 13.0 12.0 25.0 29.0 25.0 28.0 12.0 24.0 28.0 30.0 31.0 26.0
C/W) ft./min.
26.0 25.0 27.0 33.0 28.0 29.0 30.0 23.0 16.0 12.0 16.0 12.0 11.0 24.0 27.0 22.0 26.0 11.0 22.0 27.0 28.0 29.0 25.0
C/W) ft./min.
24.0 24.0 25.0 31.0 26.0 27.0 28.0 22.0 15.0 11.0 15.0 11.0 10.0 23.0 24.0 20.0 24.0 10.0 21.0 26.0 26.0 28.0 24.0
C/W) ft./min.
22.0 23.0 20.0 28.0 25.0 21.0 26.0 21.0 13.0 10.0 12.0 10.0 22.0 19.0 17.0 23.0 20.0 24.0 21.0 25.0 22.0
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
EPF10K30E
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Continued)
Device
EPF10K40
Count
Package
RQFP RQFP RQFP
C/W)
C/W) Still
17.0 13.0 12.0 12.0 12.0 10.0 25.0 13.0 12.0 23.0 26.0 29.0 25.0 29.0 25.0 26.0 29.0 26.0 30.0 12.0 25.0 12.0 13.0 12.0 22.0 10.0
C/W) ft./min.
16.0 12.0 11.0 11.0 10.0 22.0 12.0 11.0 22.0 25.0 27.0 22.0 27.0 24.0 25.0 28.0 23.0 28.0 11.0 24.0 11.0 11.0 11.0 21.0
C/W) ft./min.
15.0 11.0 10.0 10.0 20.0 11.0 10.0 21.0 24.0 24.0 20.0 26.0 23.0 24.0 25.0 20.0 27.0 10.0 23.0 10.0 10.0 10.0 20.0
C/W) ft./min.
12.0 10.0 17.0 10.0 20.0 23.0 19.0 17.0 24.0 21.0 23.0 20.0 17.0 24.0 22.0 18.0
EPF10K50
EPF10K50V
PQFP RQFP FBGA TQFP PQFP PQFP FBGA FBGA TQFP PQFP PQFP FBGA FBGA RQFP
EPF10K50E
EPF10K50S
EPF10K70
EPF10K100
EPF10K100A
RQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Continued)
Device
EPF10K100E
Count
Package
PQFP PQFP FBGA FBGA PQFP FBGA FBGA FBGA RQFP FBGA FBGA
C/W)
C/W) Still
28.0 23.0 28.0 12.0 24.0 10.0 21.0 12.0 23.0 10.0 21.0 10.0 20.0 13.0 12.0 22.0 10.0 21.0 10.0
C/W) ft./min.
26.0 21.0 26.0 11.0 23.0 19.0 11.0 22.0 20.0 19.0 11.0 11.0 21.0 20.0
C/W) ft./min.
23.0 19.0 25.0 10.0 22.0 17.0 10.0 21.0 19.0 18.0 10.0 10.0 20.0 19.0
C/W) ft./min.
18.0 16.0 23.0 21.0 15.0 20.0 18.0 17.0 19.0 18.0
EPF10K130V
EPF10K130E
EPF10K200E
EPF10K200S
EPF10K250A
Notes Table
With attached pin-fin heat sink. With attached motor-driven heat sink.
Table Thermal Resistance FLEX 8000 Devices Device
EPF8282A
Count
Package
PLCC TQFP
C/W)
10.0 11.0
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
30.0 36.0 28.0 34.0 26.0 32.0 23.0 29.0
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX 8000 Devices (Continued)
EPF8452A EPF8636A EPF8820A EPF81188A EPF81500A PLCC TQFP PQFP PLCC PQFP PQFP RQFP TQFP PQFP PQFP RQFP PQFP PQFP RQFP PQFP RQFP RQFP 10.0 11.0 10.0 30.0 35.0 32.0 20.0 29.0 32.0 16.0 30.0 17.0 26.0 32.0 16.0 29.0 17.0 28.0 28.0 14.0 24.0 14.0 22.0 13.0 14.0 11.0 28.0 33.0 31.0 13.0 28.0 31.0 11.0 38.0 16.0 25.0 31.0 11.0 27.0 16.0 19.0 26.0 10.0 21.0 12.0 20.0 12.0 10.0 10.0 26.0 31.0 30.0 10.0 26.0 30.0 26.0 15.0 24.0 30.0 25.0 15.0 14.0 24.0 19.0 11.0 19.0 11.0 23.0 28.0 28.0 23.0 27.0 20.0 14.0 23.0 27.0 20.0 14.0 11.0 19.0 16.0 10.0 16.0 10.0
Table Thermal Resistance FLEX 6000 Devices
Device
EPF6010A
Count
Package
TQFP TQFP TQFP PQFP PQFP
C/W)
11.0 10.0 10.0
C/W) Still
35.0 28.0 28.0 30.0 26.0 28.0
C/W) ft./min.
33.0 26.0 26.0 28.0 24.0 22.0
C/W) C/W) ft./min. ft./min.
31.0 25.0 25.0 26.0 21.0 20.0 28.0 24.0 24.0 21.0 17.0 19.0
EPF6016
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX 6000 Devices
Device
EPF6016A
Count
Package
TQFP FBGA
C/W)
11.0 14.0 10.0 10.0 10.0
C/W) Still
35.0 36.0 29.0 30.0 32.0 27.0 29.0 26.0 28.0 30.0
C/W) ft./min.
33.0 34.0 28.0 29.0 30.0 26.0 28.0 23.0 22.0 29.0
C/W) C/W) ft./min. ft./min.
31.0 32.0 26.0 26.0 29.0 25.0 26.0 21.0 20.0 27.0 28.0 29.0 24.0 21.0 26.0 24.0 20.0 17.0 19.0 25.0
EPF6024A
TQFP PQFP FBGA TQFP PQFP PQFP FBGA
Table Thermal Resistance Excalibur Embedded Processor Solutions
Device
EPXA1
Count
FBGA
Package
C/W)
0.52 0.78 0.21 0.31 0.21 0.32 0.11 0.17
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
20.0 11.3 12.2 10.8 11.6 10.4 10.0 11.3 18.3 10.2 15.8 13.9
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
EPXA4
1,020 1,020
EPXA10
1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Classic Devices Device
EP600I
Count
Package
PDIP CerDIP
C/W)
22.0 18.0 16.0 10.0 18.0 17.0 13.0 18.0 22.0 16.0 23.0 10.0 12.0 23.0 10.0 17.0 29.0 16.0 13.0 12.0 13.0
C/W)
67.0 60.0 64.0 60.0 55.0 77.0 74.0 60.0 67.0 64.0 49.0 58.0 40.0 49.0 58.0 44.0 51.0 55.0 44.0 47.0 44.0 38.0
EP610
PLCC CerDIP PDIP SOIC
EP610I
PLCC CerDIP PDIP
EP900I EP910
PLCC PDIP PLCC CerDIP PDIP
EP910I
PLCC CerDIP PDIP
EP1800I EP1810
PLCC PLCC JLCC PLCC
Package Outlines
package outlines following pages listed order ascending count. Altera package outlines meet requirements JEDEC Publication
Altera Corporation
Altera Device Package Information
8-Pin Plastic Dual In-Line Package (PDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-001 Variation: Printed moisture barrier 0.360 0.300 0.240 0.125 0.016 0.008
Package Information Description
Inches Min.
0.015
Nom.
0.130 0.310 0.250 0.018 0.010 0.100
Max.
0.170 0.380 0.325 0.260 0.135 0.020 0.014
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
8-Pin Small Outline Integrated Circuit Package (SOIC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Regular: 85Sn:15Pb (Typ) Pb-free: NiPdAu (Preplated) MS-012 Var. 0.08 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
4.90 6.00 3.90 0.40 0.31 0.17 1.04 1.27 0.51 0.25 1.27
Maximum
1.75 0.25 1.65
1.35 0.10 1.25
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
16-Pin Small Outline Integrated Circuit Package (SOIC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Pb-free: NiPdAu (Preplated) MS-013 Var. Printed moisture barrier
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
10.30 10.30 7.50 0.40 0.31 0.20 1.40 1.27 0.51 0.33 1.27
Maximum
2.65 0.30 2.55
2.35 0.10 2.05
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
20-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Variation: Printed moisture barrier 0.385 0.350 0.290 0.385 0.350 0.290 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.390 0.353 0.310 0.390 0.353 0.310 0.010 0.050
Max.
0.180 0.395 0.356 0.330 0.395 0.356 0.330 0.021
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference CerDIP Alloy Regular: 63Sn:37Pb (Typ.) MS-030 Variation:
Package Outline Dimension Table Specification Symbol Min.
0.015 1.240 0.290 0.280 0.125 0.015
Inches Nom.
0.028 1.260 0.305 0.295 0.018 0.100
Max.
0.200 0.041 1.280 0.320 0.310 0.021
Maximum Lead Coplanarity Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Plastic Dual In-Line Package (PDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte 1.245 0.300 0.245 0.125 0.014 0.008
Package Information Description
Inches Min.
0.015
Nom.
0.130 1.250 0.310 0.018 0.010 0.100
Max.
0.170 1.255 0.325 0.270 0.135 0.022 0.014
JEDEC Outline Reference MS-001 Variation: Maximum Lead Coplanarity Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Small Outline Integrated Circuit Package (SOIC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Regular 85Sn:15Pb (Typ) MS-013 Printed moisture barrier Variation:
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
15.40 10.30 7.50 0.40 0.31 0.20 1.40 1.27 0.51 0.33 1.27
Maximum
2.65 0.30 2.55
2.35 0.10 2.05
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
28-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.485 0.450 0.382 0.485 0.450 0.382 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.490 0.453 0.410 0.490 0.453 0.410 0.010 0.050
Max.
0.180 0.495 0.456 0.438 0.495 0.456 0.438 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
32-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
1.00 9.00 7.00 9.00 7.00 0.60 1.00 0.37 0.80 3.5°
Max.
1.20 0.15 1.05
JEDEC Outline Reference MS-026 Variation: Maximum Lead Coplanarity 0.004 inches (0.1mm) Weight Moisture Sensitivity Level Printed moisture barrier
0.75 0.45 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Pin32
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
40-Pin Ceramic Dual In-Line Package (CerDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level CerDIP Alloy Regular: 63Sn:37Pb (Typ.) MS-032 Variation: 12.8 Printed moisture barrier
Package Information Description
Inches Min.
0.015 2.030 0.600 0.510 0.125 0.016 0.008
Nom.
0.025 2.050 0.610 0.550 0.018 0.010 0.100
Max.
0.225 0.035 2.070 0.620 0.590 0.020 0.012
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
40-Pin Plastic Dual In-Line Package (PDIP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PDIP Copper Regular: 85Sn:15Pb (Typ.) MS-011 Variation: Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
2.030 0.600 0.520 0.125 0.015 0.008 0.015
Inches Nom.
0.150 2.050 0.540 0.018 0.100 2.070 0.625 0.560 0.135 0.022 0.012
Max.
0.190
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
44-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.685 0.650 0.582 0.685 0.650 0.582 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.690 0.653 0.610 0.690 0.653 0.610 0.010 0.050
Max.
0.180 0.695 0.656 0.638 0.695 0.656 0.638 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
44-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: Printed moisture barrier 0.20 0.29 0.11 0.73
Package Information Description
Millimeters Min.
1.80
Nom.
2.00 13.20 10.00 13.20 10.00 0.88 1.60 0.80
Max.
2.45 0.25 2.20
Maximum Lead Coplanarity 0.004 inches (0.10
1.03 0.45 0.23
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
44-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
12.00 10.00 12.00 10.00 0.60 1.00 0.37 0.80 3.5°
Max.
1.20 0.15
Maximum Lead Coplanarity 0.004 inches (0.1mm)
0.75 0.45 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
49-Pin Ultra Fineline Ball-Grid Array (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAB-2 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.40 0.20
Millimeters Nom.
0.70 7.00 7.00 0.50 0.80 0.60
Max.
1.55 1.35
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
68-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-066 Variation: 10.4 Printed moisture barrier 0.016 0.114 1.100 1.100
Package Information Description
Inches Min.
0.154
Nom.
0.177 0.050 0.127 1.120 1.120 0.130 0.018 0.100
Max.
0.200 0.140 1.140 1.140 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
68-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.985 0.950 0.882 0.985 0.950 0.882 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.990 0.954 0.910 0.990 0.954 0.910 0.008 0.050
Max.
0.180 0.995 0.958 0.938 0.995 0.958 0.938 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
84-Pin Plastic J-Lead Chip Carrier (PLCC)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Variation: Printed moisture barrier 1.185 1.150 1.082 1.185 1.150 1.082 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 1.190 1.154 1.110 1.190 1.154 1.110 0.008 0.050
Max.
0.180 1.195 1.158 1.138 1.195 1.158 1.138 0.021
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
88-Pin Ultra Fineline Ball-Grid Array (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-219 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.25 0.80
Nom.
11.00 8.00 0.45 0.80
Max.
1.40
Maximum Lead Coplanarity 0.005 inches (0.12
0.50
Altera Corporation
Altera Device Package Information
Package Outline
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Corner
Altera Corporation
Altera Device Package Information
100-Pin Fineline Ball-Grid Array (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAC-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
11.00 11.00 0.60 1.00
Max.
1.70 1.10 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable Q100 package products except EPC8 EPC16, which assembled Option package outlines.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: GC-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.20 0.22 0.11 0.73 0.25 2.50
Millimeters Nom.
2.70 17.20 14.00 23.20 20.00 0.88 1.60 0.65 0.40 0.23 1.03
Max.
3.40 0.50 2.90
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable Q100 package EPC8 EPC16 only.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference PQFP Copper Regular: 85Sn:15Pb (Typ.)
Package Outline Dimension Table Specification Symbol Min.
0.20 0.10 17.90 13.80 23.90 19.80 1.75
Millimeters Nom.
1.95 0.10 1.85 18.30 14.00 24.30 20.00 1.20 2.15 0.30 0.15 0.65 0.40 0.20 18.70 14.20 24.70 20.20
Max.
2.15 0.20
Maximum Lead Coplanarity 0.006 inches (0.15mm) Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
1.00 16.00 14.00 16.00 14.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.20 0.15 1.05
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
144-Pin Fineline Ball-Grid Array (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAD-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
13.00 13.00 0.60 1.00
Max.
1.70 1.10 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.05 1.35
Nom.
1.40 22.00 20.00 22.00 20.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.60 0.15 1.45
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
160-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 19.9 Printed moisture barrier 0.016 0.120 1.540 1.540
Package Information Description
Inches Min.
0.160
Nom.
0.190 0.050 0.140 1.560 1.560 0.130 0.018 0.100
Max.
0.220 0.160 1.580 1.580 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
160-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: DD-1 Printed moisture barrier 0.20 0.22 0.09 0.50
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 31.20 28.00 31.20 28.00 1.60 0.65
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.004 inches (0.10mm)
1.03 0.40 0.23
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
169-Pin Ultra Fineline Ball-Grid Array (UBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAF-1 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.20 0.65
Nom.
0.70 11.00 11.00 0.50 0.80
Max.
1.70
Maximum Lead Coplanarity 0.005 inches (0.12mm)
0.60
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
192-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 21.0 Printed moisture barrier 0.016 0.127 1.740 1.740
Package Information Description
Inches Min.
0.167
Nom.
0.192 0.050 0.142 1.760 1.760 0.130 0.018 0.100
Max.
0.217 0.157 1.780 1.780 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
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Altera Corporation
Altera Device Package Information
208-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.20 0.17 0.09 0.50 0.25 3.20
Millimeters Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30 0.50 3.5° 0.27 0.20 0.75
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
208-Pin Power Quad Flat Pack (RQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 10.8 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
232-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 25.5 Printed moisture barrier 0.016 0.134 1.740 1.740
Package Information Description
Inches Min.
0.174
Nom.
0.192 0.050 0.142 1.760 1.760 0.130 0.018 0.100
Max.
0.210 0.150 1.780 1.780 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
240-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
240-Pin Power Quad Flat Pack (RQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: 15.1 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F256 package products except Cyclone which assembled Option package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAF-1
Package Outline Dimension Table Specification Min.
0.50 0.30
Millimeters Nom.
0.70 17.00 17.00 0.60 1.00 0.70
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
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Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F256 package Cyclone product only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Printed moisture barrier Variation: AAF-1
Package Outline Dimension Table Specification Min.
0.40 0.25
Millimeters Nom.
1.05 17.00 17.00 0.50 1.00 0.55 0.80
Max.
1.55
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
256-Pin Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Tin-lead alloy (63/37) Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAL-2 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
27.00 27.00 0.75 1.27
Max.
1.70 1.10
Maximum Lead Coplanarity 0.008 inches (0.20
0.90
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
256-Pin Plastic Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAL-2 0.60
Package Information Description
Millimeters Min.
0.35
Nom.
27.00 27.00 0.75 1.27
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
280-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 29.5 Printed moisture barrier 0.016 0.125 1.940 1.940
Package Information Description
Inches Min.
0.165
Nom.
0.185 0.050 0.135 1.960 1.960 0.130 0.018 0.100
Max.
0.205 0.145 1.980 1.980 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
304-Pin Power Quad Flat Pack (RQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: 26.3 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.55
Nom.
3.80 42.60 40.00 42.60 40.00 0.60 1.30 0.50 3.5°
Max.
4.50 0.50 4.05
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
DETAIL
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
324-Pin Fineline Ball-Grid Array (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAG-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30
Nom.
0.70 19.00 19.00 0.60 1.00
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
356-Pin Ball-Grid Array (BGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAR-2 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
35.00 35.00 0.75 1.27
Max.
1.70 1.10
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
400-Pin Fineline Ball-Grid Array (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAH-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30
Nom.
0.70 21.00 21.00 0.60 1.00
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
403-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 47.7 Printed moisture barrier 0.016 0.117 1.940 1.940
Package Information Description
Inches Min.
0.157
Nom.
0.180 0.050 0.130 1.960 1.960 0.130 0.018 0.100
Max.
0.203 0.143 1.980 1.980 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
23.00 23.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
23.00 23.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
23.00 23.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
503-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification
Alloy Gold Over Nickel Plate MO-128 59.0 Printed moisture barrier Variation: 0.016 2.245 2.245
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level
Inches Min.
Nom.
0.050 2.260 2.260 0.130 0.018 0.100
Max.
0.205 0.145 2.275 2.275 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
599-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 69.0 Printed moisture barrier 0.016 2.445 2.445
Package Information Description
Inches Min.
Nom.
0.050 2.460 2.460 0.130 0.018 0.100
Max.
0.205 0.145 2.475 2.475 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
600-Pin Ball-Grid Array (BGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW-1 12.0 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
45.00 45.00 0.75 1.27
Max.
2.00 1.10
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.90
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
652-Pin Ball-Grid Array (BGA) Flip Chip Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 16.1 Printed moisture barrier Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
652-Pin Plastic Ball-Grid Array (BGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
3.20 2.80 2.40
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
655-Pin Ceramic Pin-Grid Array (PGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 74.9 Printed moisture barrier 0.016 2.445 2.445
Package Information Description
Inches Min.
Nom.
0.050 2.460 2.460 0.130 0.018 0.100
Max.
0.205 0.145 2.475 2.475 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
672-Pin Fineline Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
27.00 27.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
0.70
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
672-Pin Fineline Ball-Grid Array (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
27.00 27.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
672-Pin Fineline Ball-Grid Array (FBGA) Option
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
27.00 27.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
672-Pin Platic Ball-Grid Array (BGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAR-2
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35
Millimeters Nom.
35.00 35.00 0.75 1.27 0.90
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
724-Pin Ball-Grid Array (BGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 12.4 Printed moisture barrier Variation: BAR-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
35.00 35.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
780-Pin FineLine Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAM-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
29.00 29.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
896-Pin FineLine Ball-Grid Array (FBGA)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.5 Printed moisture barrier Variation: AAN-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
31.00 31.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
956-Pin Ball Grid Array (BGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Maximum Lead Coplanarity Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.6 Printed moisture barrier Variation: BAU-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
40.00 40.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
1020-Pin Fineline Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.5 Printed moisture barrier Variation: AAP-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
33.00 33.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1508-Pin Fineline Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.6 Printed moisture barrier Variation: AAU-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
40.00 40.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Innovation Drive Jose, 95134 (408) 544-7000 http://www.altera.com
Copyright 2005 Altera Corporation. rights reserved. Altera, Programmable Solutions Company, stylized Altera logo, specific device designations, other words logos that identified trademarks and/or service marks are, unless noted otherwise, trademarks service marks Altera Corporation U.S. other countries. other product service names property their respective holders. Altera products protected under numerous U.S. foreign patents pending applications, maskwork rights, copyrights. Altera warrants performance semiconductor products current specifications accordance with Altera's standard warranty, reserves right make changes products services time without notice. Altera assumes responsibility liability arising application information, product, service described herein except expressly agreed writing Altera Corporation. Altera customers advised obtain latest version device specifications before relying published information before placing orders products services.

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