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Altera Device Package Information


This data sheet provides package information for Altera® devices. It includes these sections:

Altera Device Package Information
May 2005, vers.13.0 Data Sheet
Introduction
This data sheet provides package information for Altera® devices. It includes these sections:
Device & Package Cross Reference (below) Thermal Resistance (starting on page 14) Package Outlines (starting on page 32)
In this data sheet, packages are listed in order of ascending pin count.
Device & Package Cross Reference
Table 1 through 13 show the devices available in Ball Grid Array (BGA), Fineline Ball Grid Array (FBGA), Ultra FineLine Ball-Grid Array (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Ceraqmic Dual In-Line Package (CerDIP), and Hybrid Fineline BGA (HFBGA):
Stratix® series FPGAs Cyclone series FPGAs MAX® series CPLDs HardCopy® series Structured ASICs APEX series FPGAs ACEX® 1K FPGAs Mercury FPGAs FLEX® series FPGAs Excalibur FPGA Enhanced configuration devices
Altera Corporation
DS-PKG-13.0
Altera Device Package Information Data Sheet
Table 1. Stratix II Devices Device
EP2S15 Flip Chip FBGA Flip Chip FBGA EP2S30 Flip Chip FBGA Flip Chip FBGA EP2S60 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S90 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S130 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP2S180 Flip Chip FBGA Flip Chip FBGA
Package
Table 2. Stratix GX Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP1SGX25F EP1SGX40D EP1SGX40G Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Table 3. Stratix Devices Device
EP1S10 Flip Chip FBGA BGA FBGA Flip Chip FBGA EP1S20 Flip Chip FBGA BGA FBGA Flip Chip FBGA EP1S25 BGA FBGA Flip Chip FBGA Flip Chip FBGA EP1S30 Flip Chip FBGA Flip Chip BGA Flip Chip FBGA EP1S40 Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA EP1S60 Flip Chip BGA Flip Chip FBGA Flip Chip FBGA EP1S80 Flip Chip BGA Flip Chip FBGA Flip Chip FBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Table 4. Cyclone II Devices Device
EP2C5 TQFP PQFP FBGA EP2C8 TQFP PQFP FBGA EP2C20 PQFP FBGA FBGA EP2C35 FBGA FBGA EP2C50 FBGA FBGA EP2C70 FBGA FBGA
Package
Table 5. Cyclone Devices Device
EP1C3 TQFP TQFP EP1C4 FBGA FBGA EP1C6 TQFP PQFP FBGA EP1C12 PQFP FBGA FBGA EP1C20 FBGA FBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Table 6. MAX Series Devices Device MAX II Devices
EPM240 EPM570 TQFP TQFP TQFP FBGA EPM1270 TQFP FBGA EPM2210 FBGA FBGA 100 100 144 256 144 256 256 324
Package
MAX 9000 Devices
EPM9320 EPM9320A EPM9560 BGA BGA BGA 356 356 356
MAX 7000B Devices
EPM7032B PLCC PQFP TQFP UBGA EPM7064B TQFP UBGA FBGA TQFP EPM7128B UBGA TQFP FBGA BGA TQFP UBGA FBGA 44 44 44 49 44 49 100 100 49 100 100 100 144 169 256
Altera Corporation
Altera Device Package Information Data Sheet
Table 6. MAX Series Devices (Continued) Device
EPM7256B TQFP TQFP UBGA PQFP FBGA EPM7512B TQFP UBGA PQFP FBGA BGA
Package
MAX 7000AE Devices
EPM7032AE PLCC TQFP EPM7064AE PLCC TQFP TQFP UBGA FBGA FBGA EPM7128AE PLCC TQFP FBGA UBGA TQFP FBGA EPM7256AE TQFP FBGA TQFP PQFP FBGA 44 44 44 100 144 49 100 256 84 100 100 169 144 256 100 100 144 208 256
Altera Corporation
Altera Device Package Information Data Sheet
Table 6. MAX Series Devices (Continued) Device
EPM7512AE TQFP PQFP BGA FBGA
Package
MAX 7000A Devices
EPM7128A PLCC TQFP FBGA TQFP FBGA EPM7256A TQFP TQFP PQFP FBGA 84 100 100 144 256 100 144 208 256
Table 7. HardCopy Series Devices Device
HC20K400 HC20K600 HC1S25 BGA Flip Chip FBGA FBGA BGA HC1S80 HC1S60 HC1S30 HC1S40 Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Table 8. APEX Series Devices Device APEX II Devices
EP2A15 Flip Chip FBGA Flip Chip BGA EP2A25 Flip Chip FBGA Flip Chip BGA Flip Chip FBGA EP2A40 Flip Chip FBGA Flip Chip BGA Flip Chip FBGA EP2A70 Flip Chip BGA Flip Chip FBGA 672 724 672 724 1, 020 672 724 1, 020 724 1, 508
Package
APEX 20KE Devices
EP20K30E TQFP FBGA PQFP FBGA EP20K60E TQFP FBGA PQFP PQFP FBGA BGA EP20K100E TQFP FBGA PQFP PQFP FBGA BGA EP20K160E TQFP PQFP PQFP BGA FBGA 144 144 208 324 144 144 208 240 324 356 144 144 208 240 324 356 144 208 240 356 484
Altera Corporation
Altera Device Package Information Data Sheet
Table 8. APEX Series Devices (Continued) Device
EP20K200E PQFP PQFP BGA FBGA BGA FBGA EP20K300E PQFP BGA FBGA EP20K400E BGA Flip Chip FBGA EP20K600E BGA Flip Chip FBGA Flip Chip FBGA EP20K1000E Flip Chip BGA Flip Chip FBGA Flip Chip FBGA EP20K1500E Flip Chip BGA Flip Chip FBGA
Package
APEX 20KC Devices
EP20K200C PQFP PQFP BGA FBGA EP20K400C BGA Flip Chip FBGA EP20K600C BGA Flip Chip FBGA Flip Chip FBGA EP20K1000C Flip Chip BGA Flip Chip FBGA Flip Chip FBGA 208 240 356 484 652 672 652 672 1, 020 652 672 1, 020
Altera Corporation
Altera Device Package Information Data Sheet
Table 8. APEX Series Devices (Continued) Device APEX 20K Devices
EP20K100 TQFP PQFP PQFP FBGA BGA EP20K200 PQFP PQFP BGA FBGA EP20K400 BGA PGA Flip Chip FBGA 144 208 240 324 356 208 240 356 484 652 655 672
Package
Table 9. ACEX 1K Devices Device
EP1K10 TQFP TQFP PQFP FBGA EP1K30 TQFP PQFP FBGA EP1K50 TQFP PQFP FBGA FBGA EP1K50S FBGA FBGA EP1K100 PQFP FBGA FBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Table 10. Mercury Devices Device
EP1M120 EP1M350 Flip Chip FBGA Flip Chip FBGA
Package
Table 11. FLEX Series Devices Device FLEX 10KA Devices
EPF10K10A TQFP TQFP PQFP FBGA EPF10K30A TQFP PQFP PQFP FBGA BGA FBGA EPF10K100A RQFP BGA FBGA BGA EPF10K250A PGA BGA 100 144 208 256 144 208 240 256 356 484 240 356 484 600 599 600
Package
FLEX 10KS Devices
EPF10K50S TQFP PQFP PQFP FBGA BGA FBGA 144 208 240 256 356 484
Altera Corporation
Altera Device Package Information Data Sheet
Table 11. FLEX Series Devices (Continued) Device
EPF10K200S RQFP BGA FBGA BGA FBGA
Package
FLEX 10KE Devices
EPF10K30E FBGA FBGA EPF10K50E FBGA FBGA EPF10K100E FBGA BGA FBGA EPF10K130E PQFP BGA FBGA BGA FBGA EPF10K200E PGA BGA FBGA 256 484 256 484 256 356 484 240 356 484 600 672 599 600 672
FLEX Devices
EPF10K30 RQFP RQFP BGA EPF10K50 RQFP BGA PGA EPF10K50V PQFP FBGA BGA FBGA 208 240 356 240 356 403 240 484 356 484
Altera Corporation
Altera Device Package Information Data Sheet
Table 11. FLEX Series Devices (Continued) Device
EPF10K70 RQFP PGA EPF10K100 EPF10K130V PGA PGA BGA EPF6016 TQFP PQFP PQFP BGA EPF6016A TQFP FBGA TQFP PQFP FBGA EPF6024A TQFP PQFP PQFP BGA FBGA
Package
Table 12. Excalibur Devices Device
EPXA1 FBGA Flip Chip FBGA EPXA4 Flip Chip FBGA Flip Chip FBGA EPXA10 Flip Chip FBGA
Package
Table 13. Enhanced Configuration Devices Device
EPC16 UBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Thermal Resistance
Table 14 through 32 provide JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for the following Altera device families:
Stratix series FPGAs Cyclone series FPGAs MAX series CPLDs HardCopy series Structured ASICs APEX series FPGAs ACEX 1K FPGAs Mercury FPGAs FLEX series FPGAs Excalibur FPGA Classic devices
Table 14. Thermal Resistance of Stratix II Devices Device
EP2S15
Pin Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
JA (° C / W) 200 ft. / min.
EP2S30
EP2S60
1, 020 Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 14. Thermal Resistance of Stratix II Devices (Continued) Device
EP2S90
Pin Count
Package
Flip Chip HFBGA Flip Chip FBGA
JA (° C / W) 200 ft. / min.
1, 020 Flip Chip FBGA 1, 508 Flip Chip FBGA EP2S130 780 Flip Chip FBGA
1, 020 Flip Chip FBGA 1, 508 Flip Chip FBGA EP2S180 1, 020 Flip Chip FBGA 1, 508 Flip Chip FBGA
Table 15. Thermal Resistance of Stratix GX Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D EP1SGX25D EP1SGX25F EP1SGX40D EP1SGX40G
Pin Count
Package
Flip Chip FBGA Flip Chip FBGA
JA (° C / W) Still Air
JA (° C / W) 100 ft. / min.
JA (° C / W) 400 ft. / min.
1020 Flip Chip FBGA 1020 Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 16. Thermal Resistance of Stratix Devices
Device
EP1S10
Pin Count
Package
Flip Chip FBGA BGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA BGA FBGA Flip Chip FBGA BGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA
JA (° C / W) 100 ft. / min.
EP1S20
EP1S25
EP1S30
EP1S40
EP1S60
EP1S80
Altera Corporation
Altera Device Package Information Data Sheet
Table 17. Thermal Resistance of Cyclone II Devices Device
EP2C5
Pin Count
Package
TQFP PQFP FBGA TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
JA (° C / W) Still Air
EP2C8
EP2C20
EP2C35
EP2C50
EP2C70
Table 18. Thermal Resistance of Cyclone Devices
Device
EP1C3
Pin Count
Package
TQFP TQFP TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA
JA (° C / W) 100 ft. / min.
EP1C6
EP1C12
EP1C20
Altera Corporation
Altera Device Package Information Data Sheet
Table 19. Thermal Resistance of MAX II Devices Device
EPM240 EPM570
Pin Count
Package
TQFP TQFP TQFP FBGA TQFP FBGA FBGA FBGA
JA (° C / W) 100 ft. / min.
EPM1270
EPM2210
Table 20. Thermal Resistance of MAX 9000 Devices Device
EPM9320
Pin Count
Package
PLCC RQFP PGA BGA PLCC RQFP BGA PLCC RQFP RQFP RQFP RQFP RQFP RQFP PGA RQFP BGA RQFP RQFP BGA
JA (° C / W) 100 ft. / min.
EPM9320A
EPM9400
EPM9480
EPM9560
EPM9560A
Altera Corporation
Altera Device Package Information Data Sheet
Table 21. Thermal Resistance of MAX 7000 Devices Device
EPM7032
Pin Count
Package
PLCC PQFP TQFP
JA (° C / W) Still Air
EPM7032B
PLCC TQFP
49 EPM7032S 44
UBGA PLCC TQFP
EPM7032V
PLCC TQFP
EPM7032AE
PLCC TQFP
EPM7064S
PLCC TQFP
84 100 EPM7064 44
PLCC TQFP PLCC TQFP
68 84 100 EPM7064AE EPM7064B 44
PLCC PLCC PQFP PLCC TQFP
UBGA TQFP FBGA
EPM7096
PLCC PLCC PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table 21. Thermal Resistance of MAX 7000 Devices (Continued) Device
EPM7128A
Pin Count
Package
PLCC TQFP FBGA
JA (° C / W) Still Air
144 256 EPM7128B 49 100
TQFP FBGA UBGA TQFP FBGA
144 169 256 EPM7128E 84 100 160 EPM7128S 84 100
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP
160 EPM7128AE 84 100
PQFP PLCC TQFP FBGA
144 169 256 EPM7160E 84 100 160 EPM7160S 84 100 160 EPM7192S EPM7192E 160 160
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP PQFP PGA PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table 21. Thermal Resistance of MAX 7000 Devices (Continued) Device
EPM7256A
Pin Count
Package
TQFP TQFP PQFP FBGA TQFP TQFP UBGA PQFP FBGA PGA PQFP RQFP PQFP RQFP
JA (° C / W) Still Air
EPM7256B
EPM7256E
EPM7256S
EPM7256AE
FBGA TQFP TQFP PQFP FBGA TQFP PQFP BGA FBGA
EPM7512AE
EPM7512B
TQFP UBGA PQFP BGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 22. Thermal Resistance of MAX 3000A Devices
Device
EPM3032A
Pin Count
Package
TQFP PLCC
JA (° C / W) 100 ft. / min.
EPM3064A
TQFP PLCC
100 EPM3128A 100 144 EPM3256A 144 208 EPM3512A 208 256
TQFP TQFP TQFP TQFP PQFP PQFP FBGA
Table 23. Thermal Resistance of HardCopy Devices
Device
HC20K400 HC20K600 HC1S25
Pin Count
Package
BGA Flip Chip FBGA FBGA BGA
HC1S30 HC1S40 HC1S60 HC1S80
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Table 24. Thermal Resistance of APEX II Devices
Device
EP2A15
Pin Count
Package
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid)
Altera Corporation
Altera Device Package Information Data Sheet
Table 24. Thermal Resistance of APEX II Devices (Continued)
Device
EP2A25
Pin Count
Package
FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid)
1020 Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) EP2A40 672 Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) 724 Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid) 1, 020 Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) EP2A70 724 Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid) 1, 508 Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
Table 25. Thermal Resistance of APEX 20K & APEX 20KE Devices
Device
EP20K30E
Pin Count
Package
TQFP PQFP FBGA FBGA TQFP FBGA PQFP PQFP FBGA BGA
EP20K60E
Altera Corporation
Altera Device Package Information Data Sheet
Table 25. Thermal Resistance of APEX 20K & APEX 20KE Devices (Continued)
Device
EP20K100
Pin Count
Package
TQFP PQFP PQFP FBGA BGA TQFP FBGA PQFP PQFP FBGA BGA TQFP PQFP PQFP BGA FBGA PQFP PQFP BGA FBGA PQFP PQFP BGA FBGA BGA FBGA PQFP PQFP BGA FBGA PQFP BGA FBGA
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K200C
EP20K300E
Altera Corporation
Altera Device Package Information Data Sheet
Table 25. Thermal Resistance of APEX 20K & APEX 20KE Devices (Continued)
Device
EP20K400
Pin Count
Package
BGA PGA FBGA FBGA w / fin (1) BGA FBGA (Cu lid) FBGA (AlSiC lid)
EP20K400E EP20K400C
672 EP20K600E EP20K600C 652 672
FBGA w / fin (1) BGA FBGA (Cu lid) FBGA (AlSiC lid)
FBGA w / fin (1) FBGA (Cu lid) FBGA (AlSiC lid)
1, 020 EP20K1000E EP20K1000C 652
FBGA w / fin (1) BGA (Cu lid) BGA (AlSiC lid)
FBGA w / fin (1) FBGA (Cu lid) FBGA (AlSiC lid)
FBGA w / fin (1)
Altera Corporation
Altera Device Package Information Data Sheet
Table 25. Thermal Resistance of APEX 20K & APEX 20KE Devices (Continued)
Device
EP20K1500E
Pin Count
Package
BGA (Cu lid) BGA (AlSiC lid)
FBGA FBGA w / fin (1) FBGA (Cu lid) FBGA (AlSiC lid)
1, 020 Note to Table 25:
FBGA w / fin (1)
"fin" is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera performed the thermal calculations in Table 25 using the following fin specifications: width: 0.25 mm height: 7.0 mm pitch: 1.5 mm base thickness: 0.5 mm.
Table 26. Thermal Resistance of ACEX 1K Devices
Device
EP1K10
Pin Count
Package
TQFP TQFP PQFP FBGA TQFP PQFP FBGA TQFP PQFP FBGA FBGA PQFP FBGA FBGA
JA (° C / W) 100 ft. / min.
EP1K30
EP1K50
EP1K100
Altera Corporation
Altera Device Package Information Data Sheet
Table 27. Thermal Resistance of Mercury Devices
Device
EP1M120
Pin Count
Package
FBGA (Cu lid) FBGA (AlSiC lid) FBGA (Cu lid) FBGA (AlSiC lid)
JA (° C / W) 200 ft. / min.
EP1M350
Table 28. Thermal Resistance of FLEX 10K Devices
Device
EPF10K10
Pin Count
Package
PLCC TQFP PQFP TQFP TQFP PQFP FBGA TQFP RQFP RQFP RQFP RQFP BGA TQFP PQFP PQFP FBGA BGA FBGA TQFP PQFP FBGA FBGA
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
EPF10K30E
Altera Corporation
Altera Device Package Information Data Sheet
Table 28. Thermal Resistance of FLEX 10K Devices (Continued)
Device
EPF10K40
Pin Count
Package
RQFP RQFP RQFP BGA PGA PGA (1)
EPF10K50
EPF10K50V
PQFP RQFP BGA FBGA TQFP PQFP PQFP FBGA FBGA TQFP PQFP PQFP FBGA BGA FBGA RQFP PGA PGA PGA (1) PGA (2)
EPF10K50E
EPF10K50S
EPF10K70
EPF10K100
EPF10K100A
RQFP BGA FBGA BGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 28. Thermal Resistance of FLEX 10K Devices (Continued)
Device
EPF10K100E
Pin Count
Package
PQFP PQFP FBGA BGA FBGA PGA BGA PQFP BGA FBGA BGA FBGA PGA BGA FBGA RQFP BGA FBGA BGA FBGA PGA BGA
EPF10K130V
EPF10K130E
EPF10K200E
EPF10K200S
EPF10K250A
Notes to Table 28:
(1) (2) With attached pin-fin heat sink. With attached motor-driven fan heat sink.
Table 29. Thermal Resistance of FLEX 8000 Devices Device
EPF8282A
Pin Count
Package
PLCC TQFP
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
Altera Corporation
Altera Device Package Information Data Sheet
Table 29. Thermal Resistance of FLEX 8000 Devices (Continued)
EPF8452A 84 100 160 160 EPF8636A 84 160 192 208 208 EPF8820A 144 160 192 208 208 225 EPF81188A 208 232 240 240 EPF81500A 240 240 280 304 PLCC TQFP PQFP PGA PLCC PQFP PGA PQFP RQFP TQFP PQFP PGA PQFP RQFP BGA PQFP PGA PQFP RQFP PQFP RQFP PGA RQFP 10.0 11.0 6.0 6.0 10.0 6.0 6.0 5.0 1.0 9.0 6.0 6.0 5.0 1.0 6.0 5.0 2.0 4.0 1.0 4.0 1.0 2.0 1.0 30.0 35.0 32.0 20.0 29.0 32.0 16.0 30.0 17.0 26.0 32.0 16.0 29.0 17.0 28.0 28.0 14.0 24.0 14.0 22.0 13.0 14.0 11.0 28.0 33.0 31.0 13.0 28.0 31.0 11.0 38.0 16.0 25.0 31.0 11.0 27.0 16.0 19.0 26.0 10.0 21.0 12.0 20.0 12.0 10.0 10.0 26.0 31.0 30.0 10.0 26.0 30.0 8.0 26.0 15.0 24.0 30.0 8.0 25.0 15.0 14.0 24.0 7.0 19.0 11.0 19.0 11.0 7.0 9.0 23.0 28.0 28.0 8.0 23.0 27.0 6.0 20.0 14.0 23.0 27.0 6.0 20.0 14.0 11.0 19.0 5.0 16.0 10.0 16.0 10.0 5.0 8.0
Table 30. Thermal Resistance of FLEX 6000 Devices
Device
EPF6010A
Pin Count
Package
TQFP TQFP TQFP PQFP PQFP BGA
EPF6016
Altera Corporation
Altera Device Package Information Data Sheet
Table 30. Thermal Resistance of FLEX 6000 Devices
Device
EPF6016A
Pin Count
Package
TQFP FBGA
144 208 256 EPF6024A 144 208 240 256
TQFP PQFP FBGA TQFP PQFP PQFP BGA FBGA
Table 31. Thermal Resistance of Excalibur Embedded Processor Solutions
Device
EPXA1
Pin Count
484 672 672 FBGA
Package
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
EPXA4
EPXA10
Altera Corporation
Altera Device Package Information Data Sheet
Table 32. Thermal Resistance of Classic Devices Device
EP600I
Pin Count
Package
PDIP CerDIP
28 EP610 24
PLCC CerDIP PDIP SOIC
28 EP610I 24
PLCC CerDIP PDIP
28 EP900I 40 44 EP910 40
PLCC PDIP PLCC CerDIP PDIP
44 EP910I 40
PLCC CerDIP PDIP
44 EP1800I EP1810 68 68
PLCC PLCC JLCC PLCC PGA
Package Outlines
The package outlines on the following pages are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95.
Altera Corporation
Altera Device Package Information
8-Pin Plastic Dual In-Line Package (PDIP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level P PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-001 Variation: BA 0.5 g Printed on moisture barrier bag A A1 A2 D E E1 L b c e 0.360 0.300 0.240 0.125 0.016 0.008
Package Information Description
Inches Min.
- - 0.130 TYP - 0.310 0.250 - 0.018 0.010 0.100 BSC
Maximum Lead Coplanarity NA
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
8-Pin Small Outline Integrated Circuit Package (SOIC)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level S SOIC Copper Regular: 85Sn:15Pb (Typ) Pb-free: NiPdAu (Preplated) MS-012 Var. AA 0.08 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
- - - 4.90 BSC 6.00 BSC 3.90 BSC 0.40 0.31 0.17 0° - 1.04 REF - - 1.27 BSC - 8° 0.51 0.25 1.27
Maximum
Maximum Lead Coplanarity 0.1 mm
Altera Corporation
Altera Device Package Information
Package Outline
See Detail A
Detail A
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
16-Pin Small Outline Integrated Circuit Package (SOIC)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level S SOIC Copper Pb-free: NiPdAu (Preplated) MS-013 Var. AA 0.4 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
- - - 10.30 BSC 10.30 BSC 7.50 BSC 0.40 0.31 0.20 0° - 1.40 REF - - 1.27 BSC - 8° 0.51 0.33 1.27
Maximum
Maximum Lead Coplanarity 0.1 mm
Altera Corporation
Altera Device Package Information
Package Outline
Pin 16
See Detail A
Detail A
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
20-Pin Plastic J-Lead Chip Carrier (PLCC)
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 Variation: AA 0.8 g Printed on moisture barrier bag A A1 A2 D D1 D2 E E1 E2 b c e 0.385 0.350 0.290 0.385 0.350 0.290 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.390 0.353 0.310 0.390 0.353 0.310 - 0.010 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference D CerDIP Alloy 42 Regular: 63Sn:37Pb (Typ.) MS-030 Variation: AF
Package Outline Dimension Table Specification Symbol Min.
A A1 D E E1 L b e - 0.015 1.240 0.290 0.280 0.125 0.015
Inches Nom.
- 0.028 1.260 0.305 0.295 - 0.018 0.100 BSC
Maximum Lead Coplanarity NA Weight 4.1 g Moisture Sensitivity Level Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin 12
Altera Corporation
Altera Device Package Information
24-Pin Plastic Dual In-Line Package (PDIP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) P PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn A A1 A2 D E E1 L b c e 1.245 0.300 0.245 0.125 0.014 0.008
Package Information Description
Inches Min.
- - 0.130 TYP 1.250 0.310 - - 0.018 0.010 0.100 BSC
JEDEC Outline Reference MS-001 Variation: AF Maximum Lead Coplanarity NA Weight Moisture Sensitivity Level 1.7 g Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin 24
Pin 12
Altera Corporation
Altera Device Package Information
24-Pin Small Outline Integrated Circuit Package (SOIC)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level S SOIC Copper Regular 85Sn:15Pb (Typ) MS-013 0.6 g Printed on moisture barrier bag Variation: AD
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
- - - 15.40 BSC 10.30 BSC 7.50 BSC 0.40 0.31 0.20 0° - 1.40 REF - - 1.27 BSC - 8° 0.51 0.33 1.27
Maximum
Maximum Lead Coplanarity 0.1 mm
Altera Corporation
Altera Device Package Information
Package Outline
Pin 24
Pin 12
See Detail A
Detail A
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
28-Pin Plastic J-Lead Chip Carrier (PLCC)
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 1.1 g Printed on moisture barrier bag Variation: AB A A1 A2 D D1 D2 E E1 E2 b c e 0.485 0.450 0.382 0.485 0.450 0.382 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.490 0.453 0.410 0.490 0.453 0.410 - 0.010 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 28
Pin 11
Altera Corporation
Altera Device Package Information
32-Pin Plastic Thin Quad Flat Pack (TQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
- - 1.00 9.00 BSC 7.00 BSC 9.00 BSC 7.00 BSC 0.60 1.00 REF - 0.37 - 0.80 BSC 3.5°
JEDEC Outline Reference MS-026 Variation: ABA Maximum Lead Coplanarity 0.004 inches (0.1mm) Weight Moisture Sensitivity Level 0.2 g Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin32
A1 See Detail A
DETAIL A
e C Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
40-Pin Ceramic Dual In-Line Package (CerDIP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level D CerDIP Alloy 42 Regular: 63Sn:37Pb (Typ.) MS-032 Variation: AD 12.8 g Printed on moisture barrier bag A A1 D E E1 L b c e
Package Information Description
Inches Min.
- 0.025 2.050 0.610 0.550 - 0.018 0.010 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
Pin 40
Pin 20
Altera Corporation
Altera Device Package Information
40-Pin Plastic Dual In-Line Package (PDIP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level P PDIP Copper Regular: 85Sn:15Pb (Typ.) MS-011 Variation: AC 6.0 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D E E1 L b c e 2.030 0.600 0.520 0.125 0.015 0.008 - 0.015
Inches Nom.
- - 0.150 BSC 2.050 - 0.540 - 0.018 - 0.100 BSC 2.070 0.625 0.560 0.135 0.022 0.012
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
Pin 40
Pin 20
Altera Corporation
Altera Device Package Information
44-Pin Plastic J-Lead Chip Carrier (PLCC)
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 2.3 g Printed on moisture barrier bag Variation: AC A A1 A2 D D1 D2 E E1 E2 b c e 0.685 0.650 0.582 0.685 0.650 0.582 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.690 0.653 0.610 0.690 0.653 0.610 - 0.010 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 44
Pin 17
Altera Corporation
Altera Device Package Information
44-Pin Plastic Quad Flat Pack (PQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-022 Variation: AB 0.5 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.29 0.11 0.73
Package Information Description
Millimeters Min.
- - 2.00 13.20 BSC 10.00 BSC 13.20 BSC 10.00 BSC 0.88 1.60 REF - - - 0.80 BSC -
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 11
See Detail A
DETAIL A e C Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
44-Pin Plastic Thin Quad Flat Pack (TQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: ACB 0.3 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
- - - 12.00 BSC 10.00 BSC 12.00 BSC 10.00 BSC 0.60 1.00 REF - 0.37 - 0.80 BSC 3.5°
Maximum Lead Coplanarity 0.004 inches (0.1mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 11
See Detail A A1
DETAIL A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
49-Pin Ultra Fineline Ball-Grid Array (UBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAB-2 0.1 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - 0.70 TYP 7.00 BSC 7.00 BSC 0.50 0.80 BSC 0.60
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D 7 6 5 4 3 2 1 BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
68-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-066 Variation: AC 10.4 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.114 1.100 1.100
Package Information Description
Inches Min.
0.177 0.050 TYP 0.127 1.120 1.120 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
68-Pin Plastic J-Lead Chip Carrier (PLCC)
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 4.6 g Printed on moisture barrier bag Variation: AE A A1 A2 D D1 D2 E E1 E2 b c e 0.985 0.950 0.882 0.985 0.950 0.882 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.990 0.954 0.910 0.990 0.954 0.910 - 0.008 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 68
Pin 10
Pin 26
Altera Corporation
Altera Device Package Information
84-Pin Plastic J-Lead Chip Carrier (PLCC)
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 Variation: AF 6.8 g Printed on moisture barrier bag A A1 A2 D D1 D2 E E1 E2 b c e 1.185 1.150 1.082 1.185 1.150 1.082 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 1.190 1.154 1.110 1.190 1.154 1.110 - 0.008 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 12 Pin 1 ID
Pin 32
Altera Corporation
Altera Device Package Information
88-Pin Ultra Fineline Ball-Grid Array (UBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-219 0.2 g Printed on moisture barrier bag A A1 A2 D E b e 0.40
Package Information Description
Millimeters Min.
- - - 11.00 BSC 8.00 BSC 0.45 0.80 BSC
Maximum Lead Coplanarity 0.005 inches (0.12 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
100-Pin Fineline Ball-Grid Array (FBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAC-1 1.6 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - - 11.00 BSC 11.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) - Option 1
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface.
Note: This POD is applicable to Q100 package of all products except EPC8 & EPC16, which are assembled in Option 2 package outlines.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-022 Variation: GC-1 1.6 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.22 0.11 0.73 - 0.25 2.50
Millimeters Nom.
- - 2.70 17.20 BSC 14.00 BSC 23.20 BSC 20.00 BSC 0.88 1.60 REF - - - 0.65 BSC - 7° - 0.40 0.23 1.03
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 100
Pin 30
See Detail A
Detail A
Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) - Option 2
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Note: This POD is applicable to Q100 package of EPC8 & EPC16 only.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Q PQFP Copper Regular: 85Sn:15Pb (Typ.) N / A
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D D1 E E1 L L1 b c e 0° 0.20 0.10 17.90 13.80 23.90 19.80 1.75 0.0
Millimeters Nom.
1.95 0.10 1.85 TYP 18.30 14.00 24.30 20.00 1.20 REF 2.15 REF 0.30 0.15 0.65 BSC - 10° 0.40 0.20 18.70 14.20 24.70 20.20
Maximum Lead Coplanarity 0.006 inches (0.15mm) Weight 1.6 g Moisture Sensitivity Level Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin 100
Pin 30
See Detail A
Detail A
Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: AED 0.5 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 1.00 16.00 BSC 14.00 BSC 16.00 BSC 14.00 BSC 0.60 1.00 REF - 0.22 - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin 100
Pin 25
See Detail A
DETAIL A
e C Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
144-Pin Fineline Ball-Grid Array (FBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAD-1 1.7 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - - 13.00 BSC 13.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW Pin A1 Corner
Altera Corporation
Altera Device Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: BFB 1.3 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 1.40 22.00 BSC 20.00 BSC 22.00 BSC 20.00 BSC 0.60 1.00 REF - 0.22 - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin 144
Pin 36
See Detail A
DETAIL A e C Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
160-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AG 19.9 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.120 1.540 1.540
Package Information Description
Inches Min.
0.190 0.050 TYP 0.140 1.560 1.560 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D
BOTTOM VIEW
Pin A1 Corner
Altera Corporation
Altera Device Package Information
160-Pin Plastic Quad Flat Pack (PQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-022 Variation: DD-1 5.4 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.22 0.09 0.50
Package Information Description
Millimeters Min.
- - 3.40 31.20 BSC 28.00 BSC 31.20 BSC 28.00 BSC - 1.60 REF - - - 0.65 BSC -
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin 160
Pin 40
See Detail A
DETAIL A e
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
169-Pin Ultra Fineline Ball-Grid Array (UBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAF-1 2.2 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.40
Package Information Description
Millimeters Min.
- - - 0.70 TYP 11.00 BSC 11.00 BSC 0.50 0.80 BSC
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
192-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AJ 21.0 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.127 1.740 1.740
Package Information Description
Inches Min.
0.192 0.050 TYP 0.142 1.760 1.760 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D
BOTTOM VIEW
Pin A1 Corner
Altera Corporation
Altera Device Package Information
208-Pin Plastic Quad Flat Pack (PQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: FA-1 5.7 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.50 - 0.25 3.20
Millimeters Nom.
- - 3.40 30.60 BSC 28.00 BSC 30.60 BSC 28.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5° 8° - 0.27 0.20 0.75
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 208
Pin 52
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
208-Pin Power Quad Flat Pack (RQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level R RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: FA-1 10.8 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.40 30.60 BSC 28.00 BSC 30.60 BSC 28.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 208
Pin 52
See Detail A
DETAIL A e
Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
232-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AJ 25.5 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.134 1.740 1.740
Package Information Description
Inches Min.
0.192 0.050 TYP 0.142 1.760 1.760 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D
BOTTOM VIEW Pin A1 Corner
Altera Corporation
Altera Device Package Information
240-Pin Plastic Quad Flat Pack (PQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: GA 7.0 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.40 34.60 BSC 32.00 BSC 34.60 BSC 32.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin 240
Pin 60
See Detail A
DETAIL A
e C Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
240-Pin Power Quad Flat Pack (RQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level R RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: GA 15.1 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.40 34.60 BSC 32.00 BSC 34.60 BSC 32.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin 240 Pin 1 Pin 1 ID
Pin 60
See Detail A
DETAIL A
e C Gage Plane b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) - Option 1
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Note: This POD is applicable to F256 package of all products except Cyclone II, which is assembled in Option 2 package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 1.9 g Printed on moisture barrier bag Variation: AAF-1
Package Outline Dimension Table Specification Min.
Millimeters Nom.
- - - 0.70 REF 17.00 BSC 17.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) - Option 2
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface.
Note: This POD is applicable to F256 package of Cyclone II product only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 1.9 g Printed on moisture barrier bag Variation: AAF-1
Package Outline Dimension Table Specification Min.
Millimeters Nom.
- - 1.05 REF - 17.00 BSC 17.00 BSC 0.50 1.00 BSC 0.55 0.80
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin Ball-Grid Array (BGA) - Option 1
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA Tin-lead alloy (63 / 37) Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAL-2 4.3 g Printed on moisture barrier bag A A1 A2 D E b e 0.60
Package Information Description
Millimeters Min.
- - - 27.00 BSC 27.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin Plastic Ball-Grid Array (BGA) - Option 2
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 2.1 g Printed on moisture barrier bag Variation: BAL-2 A A1 A2 A3 D E b e 0.60
Package Information Description
Millimeters Min.
- - - - 27.00 BSC 27.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW
Altera Corporation
Altera Device Package Information
280-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AL 29.5 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.125 1.940 1.940
Package Information Description
Inches Min.
0.185 0.050 TYP 0.135 1.960 1.960 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
304-Pin Power Quad Flat Pack (RQFP)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level R RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: JA 26.3 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.80 42.60 BSC 40.00 BSC 42.60 BSC 40.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
D D1 Pin 304 Pin 1 Pin 1 ID
Pin 76
See Detail A
DETAIL A
Gage Plane
b S L L1 0.25mm
Altera Corporation
Altera Device Package Information
324-Pin Fineline Ball-Grid Array (FBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAG-1 2.0 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - 0.70 REF 19.00 BSC 19.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW Pin A1 Corner
Altera Corporation
Altera Device Package Information
356-Pin Ball-Grid Array (BGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT or tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAR-2 7.0 g Printed on moisture barrier bag A A1 A2 D E b e 0.60
Package Information Description
Millimeters Min.
- - 35.00 BSC 35.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW
Pin A1 Corner
Altera Corporation
Altera Device Package Information
400-Pin Fineline Ball-Grid Array (FBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAH-1 2.2 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - 0.70 REF 21.00 BSC 21.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW Pin A1 Corner
Altera Corporation
Altera Device Package Information
403-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-128 Variation: AL 47.7 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.117 1.940 1.940
Package Information Description
Inches Min.
0.180 0.050 TYP 0.130 1.960 1.960 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ-1 5.8 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - - 23.00 BSC 23.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) - Option 2
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 2.4 g Printed on moisture barrier bag Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 23.00 BSC 23.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) - Option 3
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 5.7 g Printed on moisture barrier bag Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 23.00 BSC 23.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
503-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification
G PGA Alloy 42 Gold Over Nickel Plate MO-128 59.0 g Printed on moisture barrier bag Variation: AN A A1 A2 D E L b e 0.016 - 2.245 2.245
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level
Inches Min.
- 0.050 TYP - 2.260 2.260 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
599-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-128 Variation: AP 69.0 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 - 2.445 2.445
Package Information Description
Inches Min.
- 0.050 TYP - 2.460 2.460 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
600-Pin Ball-Grid Array (BGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT or tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW-1 12.0 g Printed on moisture barrier bag A A1 A2 D E b e 0.60
Package Information Description
Millimeters Min.
- - - 45.00 BSC 45.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
652-Pin Ball-Grid Array (BGA) Flip Chip - Option 1
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 16.1 g Printed on moisture barrier bag Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 45.00 BSC 45.00 BSC 0.75 1.27 BSC 0.90
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
652-Pin Plastic Ball-Grid Array (BGA) - Option 2
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 9.6 g Printed on moisture barrier bag Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 45.00 BSC 45.00 BSC 0.75 1.27 BSC 0.90
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 ID
Altera Corporation
Altera Device Package Information
655-Pin Ceramic Pin-Grid Array (PGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-128 Variation: AP 74.9 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 - 2.445 2.445
Package Information Description
Inches Min.
- 0.050 TYP - 2.460 2.460 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
672-Pin Fineline Ball-Grid Array (FBGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 7.7 g Printed on moisture barrier bag Variation: AAL-1 A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - - 27.00 BSC 27.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
672-Pin Fineline Ball-Grid Array (FBGA) - Option 2
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 3.0 g Printed on moisture barrier bag Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 27.00 BSC 27.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
672-Pin Fineline Ball-Grid Array (FBGA) - Option 3
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 7.7 g Printed on moisture barrier bag Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 27.00 BSC 27.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
672-Pin Platic Ball-Grid Array (BGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 5.2 g Printed on moisture barrier bag Variation: BAR-2
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 35.00 BSC 35.00 BSC 0.75 1.27 BSC 0.90
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Altera Corporation
Altera Device Package Information
724-Pin Ball-Grid Array (BGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 12.4 g Printed on moisture barrier bag Variation: BAR-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 35.00 BSC 35.00 BSC 0.75 1.27 BSC 0.90
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 8.9 g Printed on moisture barrier bag Variation: AAM-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 29.00 BSC 29.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
896-Pin FineLine Ball-Grid Array (FBGA)
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.5 g Printed on moisture barrier bag Variation: AAN-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 31.00 BSC 31.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
956-Pin Ball Grid Array (BGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Maximum Lead Coplanarity Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.6 g Printed on moisture barrier bag Variation: BAU-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 40.00 BSC 40.00 BSC 0.75 1.27 BSC 0.90
0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
1020-Pin Fineline Ball-Grid Array (FBGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.5 g Printed on moisture barrier bag Variation: AAP-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 33.00 BSC 33.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
1508-Pin Fineline Ball-Grid Array (FBGA) - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.6 g Printed on moisture barrier bag Variation: AAU-1
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 40.00 BSC 40.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
101 Innovation Drive San Jose, CA 95134 (408) 544-7000 http://www.altera.com