ASSP Power Management Applications (Rechargeable Battery) DC/DC c
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DS04-27264-2E
ASSP Power Management Applications (Rechargeable Battery)
DC/DC converter Charging Li-ion battery
MB39A134
DESCRIPTION
MB39A134 DC/DC converter charging Li-ion battery, which suitable down conversion, uses pulse width modulation (PWM) controlling charge voltage current independently. MB39A134 adapter detection comparator independent DC/DC converter controller, control source power supply system. supports wide input voltage range, enables current consumption standby mode, control charge voltage charge current with high precision, which perfect built-in Li-ion battery charger used devices such notebook
FEATURES
Support Cell Battery Pack Built-in constant current control loops Built-in adapter detection function (ACOK pin) Charge voltage accuracy ±0.7% Built-in charging voltage control without external setting resistor (4.20 V/Cell 4.10 V/Cell) Adjustable charge voltage with external resistor Built-in high accurate current detection amplifiers (±1%) input voltage difference (±5%) input voltage difference Input offset voltage (Current Amp1) (Current Amp2) Built-in Charging Current Control without external resistor 2.85 Adjustable charging current with external resistor Setting switching frequency using external resistor (Frequency setting capacitor integrated) Built-in under voltage lockout protection standby mode (Icc Typ) only adapter detection function operated Built-in regulator reducing loss P-ch Package TSSOP-24
APPLICATIONS
Built-in charger Notebook Handy terminal device etc.
Copyright©2008 FUJITSU MICROELECTRONICS LIMITED rights reserved 2008.9
MB39A134
ASSIGNMENT
(TOP VIEW)
-INC1 OUTC1 ADJ1 COMP1 ACOK VREF ACIN COMP2 ADJ2 OUTC2 CELLS BATT
+INC1 ADJ3 COMP3 +INC2
(FPT-24P-M08)
DS04-27264-2E
MB39A134
DESCRIPTIONS
Name -INC1 OUTC1 ADJ1 COMP1 ACOK VREF ACIN COMP2 Description Current detection amplifier (Current Amp1) inverted input pin. Current detection amplifier (Current Amp1) output pin. Error amplifier (Error Amp1) non-inverted input pin. Error amplifier (Error Amp1) output pin. adapter voltage detection block Comp.) output pin. ACIN ACOK Lo-Z, ACIN ACOK Hi-Z Reference voltage output pin. adapter voltage detection block Comp.) input pin. Error amplifier (Error Amp2) output pin. Charge current control block setting input pin. ADJ2 "GND Charge current control block output ADJ2 voltage ADJ2 "4.6 VREF" Charge current control block output Current detection amplifier (Current Amp2) output pin. Charge voltage setting switch Cells). CELLS VREF: Cells, CELLS GND: Cells, CELLS OPEN: Cells Current detection amplifier (Current Amp2) inverted input pin. Battery voltage input pin. Current detection amplifier (Current Amp2) non-inverted input pin. Power supply control pin. Setting level places DC/DC converter operating mode. Setting level places DC/DC converter standby mode. Error amplifier (Error Amp3) output pin. Charge voltage control block setting input pin. ADJ3 "GND Charge voltage setting 4.10 V/Cell ADJ3 "0.4 Charge voltage setting VADJ3 voltage/Cell ADJ3 "4.6 VREF" Charge voltage setting 4.20 V/Cell Triangular wAVe oscillation frequency setting resistor connection pin. Power supply ACOK function block. Power supply drive circuit External gate drive pin. Power supply reference voltage control circuit, output circuit. Constant voltage control state detection block Comp.) output pin. Ground pin. Current detection amplifier (Current Amp1) non-inverted input pin.
ADJ2
OUTC2 CELLS BATT +INC2
COMP3
ADJ3
+INC1
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MB39A134
BLOCK DIAGRAM
SYSTEM LOAD
ACIN
ACOK
Comp.>
Comp.> <Current Amp1>
OUTC1
+INC1
-INC1
<Error Amp1>
ADJ1 OUTC2
<PWM Comp.> -2.5 -1.5 Bias Voltage <VH> <OSC>
Drive
2.85
+INC2 <Current Amp2>
VCC-6
Battery
BATT ADJ2
<Error Amp2>
Charge Current Control
UVLO VREF UVLO
ADJ3 VREF 4.20 V/Cell 4.10 V/Cell
REFIN Control
<Error Amp3>
<VR1> 1.26
<REF> <CTL>
ON/OFF VREF
OPEN 2Cells 3Cells VREF 4Cells CELLS
COMP1
COMP2
VREF
24-pin
COMP3
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MB39A134
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Symbol VvCC VCC, VCC, pin, Output current input voltage Input voltage IOUT VCTL VINE VINC Power dissipation Storage temperature TSTG Duty 1/fosc Duty) ADJ1, ADJ2, ADJ3, CELLS, ACIN -INC1, +INC1, BATT, +INC2 Condition Rating VVREF 1282*1,*2 512*1,*2 Unit
diagram TYPICAL CHARACTERISTICS Maximum Power Dissipation Operating Ambient Temperature", package power dissipation from When mounted 10x10 two-layer square epoxy board. WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings.
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MB39A134
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage Reference voltage output current output current Symbol VVCC IVREF ADJ1 ADJ2 (internal reference voltage setting) ADJ2 (external voltage setting) ADJ3 (internal reference voltage setting) ADJ3 (external voltage setting) CELLS VINC ACIN input voltage ACOK output voltage ACOK output current input voltage Output current Switching frequency Timing resistor capacitor Reference voltage output capacitor Operating ambient temperature VACIN VACOK IACOK VCTL IOUT fOSC CVREF VREF Duty fosc Duty) +INC1, +INC2, -INC1, BATT Condition VCC, Value VVREF VVREF Unit
-600
VVREF VVREF VVCC 2000
VINE Input voltage
WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their representatives beforehand.
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MB39A134
ELECTRICAL CHARACTERISTICS
Parameter Threshold voltage Reference Voltage Block [REF] Input stability Load stability Short-circuit output current Switching Triangular frequency Wave Oscillator Frequency Block temperature [OSC] variation Input offset voltage Error Amplifier Block [Error Amp1] Input bias voltage Transconductance Error Amplifier Block [Error Amp2] Threshold voltage Transconductance Symbol VREF Value Condition Unit VREF VREF COMP1 ADJ1 ADJ2 VREF COMP3 ADJ3 VREF (4.20 V/Cell setting) COMP3 ADJ3 VREF (4.20 V/Cell setting) COMP3 ADJ3 GND, (4.10 V/Cell setting) COMP3 ADJ3 GND, (4.10 V/Cell setting) 4.963 4.950 -100 -0.5 5.000 5.000 5.037 5.050
VVREF1 VVREF2
VREF Line VREF Load
fOSC
df/fdT
IADJ1
1.5*
µA/V µA/V
VTH1
VTH1
VTH2
Error Amplifier Block [Error Amp3] Threshold voltage accuracy
-0.7
VTH3
-0.6
VTH4
-0.8
(Continued)
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MB39A134
VREF Value Condition Unit ADJ3 CELLS VREF BATT 16.8 BATT 16.8 +INC1 +INC2 pin, -100 +INC1 pin, -100 +INC1 +INC2 -100 +INC1 +INC2 -100 +INC1 +INC2 +INC2 +INC1 +INC2 pin, -100 25.2 Vvcc µA/V
Parameter
Symbol
Error Amplifier Block [Error Amp3]
Input current Transconductance
IBATTH1 IBATTL
I+INCH I-INCH
Input current
I+INCL I-INCL
VOFF1 Input offset voltage Current Detection Common Amplifier Block mode input [Current Amp1, voltage range Current Amp2] Voltage gain Frequency band width Output voltage Output source current Output sink current Comp. Block [PWM Comp.] Threshold voltage VOFF2 VOFF3
-225 -150 -255 -170 25.0
24.5
25.5
VOUTCH1 VOUTCH2 VOUTCL ISOURCE ISINK
OUTC1 OUTC2 OUTC1 OUTC2 Duty cycle Duty cycle 100%
(Continued)
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MB39A134
VREF Value Condition Unit Min. Typ. Max. Duty 1/fosc Duty) 19V, Duty 1/fosc Duty) 3300 3300 operation mode standby mode VREF VREF VREF ACOK VVCC- 1.245 1.215 -400* 400*
Parameter Output source current Output Block [OUT] Output sink current Output resistance Rise time Fall time Control Block [CTL] Bias Voltage Block [VH] Under Voltage Lockout Protection Circuit Block [UVLO] input voltage Input current Output voltage Threshold voltage Hysteresis width Threshold voltage Hysteresis width
Over Temperature
Symbol
ISOURCE
ISINK
VOFF ICTLH ICTLL
VTLH VTHL VTLH VTHL
VVCC- VVCC- 1.0*
Detection temperature Release temperature Threshold voltage Hysteresis width ACOK output leak current
Detection
VTLH VTHL ILEAK
1.270 1.295 1.250 1.285
Adapter Voltage Detection Block ACOK Comp.] output level voltage
VACOKL IVINL IVINH
ACOK ACIN ACIN
Current
consumption
(Continued)
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(Continued) Parameter Symbol VREF Value Condition Unit Min. Typ. Max. 4.20 V/Cell external setting 4.10 V/Cell ADJ3 Cells Cells Cells CELLS CELLS IVREF normal charge external setting ADJ2 ACIN 0.21 4.41 VVREF -8.3 4.41 4.50 VVREF 0.39 4.59 VVREF VVREF 4.59
Input voltage Threshold voltage
Charge Voltage Control Block Input current REFIN Control] Input voltage
VEXT IINL IINH
VEXT ICCS1
Input current Charge Current Input voltage Control Block [Charge Current Threshold voltage Control] Input current
General
Standby current ICCS2 Power supply current
This parameter isn't specified. This should used reference support designing circuits.
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MB39A134
TYPICAL CHARACTERISTICS
Power supply current Power supply voltage Power supply current (mA) input current ICTL (µA)
VCTL
input current, Reference voltage input voltage
VVCC IVREF
ICTL VVREF
Power supply voltage VVCC Reference voltage Power supply voltage Reference voltage VVREF Reference voltage VVREF
VCTL IVREF
input voltage VCTL Reference voltage Load current
VVCC VCTL
Power supply voltage VVCC Reference voltage Operating ambient temperature Triangular wave oscillation frequency fosc (kHz) Reference voltage VVREF
5.08 5.06 5.04 5.02 5.00 4.98 4.96 4.94 4.92 +100 VVCC VCTL IVREF
Load current IVREF (mA) Triangular wave oscillation frequency Power supply voltage
VCTL
Operating ambient temperature
Power supply voltage VVCC (Continued)
DS04-27264-2E
Reference voltage VVREF
1000
MB39A134
(Continued) Triangular wave oscillation frequency Operating ambient temperature Triangular wave oscillation frequency fosc (kHz) Triangular wave oscillation frequency fosc (kHz)
Triangular wave oscillation frequency Timing resistor
10000 VVCC VCTL 1000
VVCC VCTL
+100
1000
Operating ambient temperature Error amplifier threshold voltage Operating ambient temperature Error amplifier threshold voltage Error amplifier threshold voltage
8.500 8.475 8.450 8.425 8.400 8.375 8.350 8.325 8.300 +100 VVCC VCTL VCELLS OPEN
Timing resistor Error amplifier threshold voltage Operating ambient temperature
12.700 12.675 12.650 12.625 12.600 12.575 12.550 12.525 12.500 +100 VVCC VCTL VCELLS
Operating ambient temperature Error amplifier threshold voltage Operating ambient temperature Error amplifier threshold voltage
16.900 16.875 16.850 16.825 16.800 16.775 16.750 16.725 16.700 VVCC VCTL VCELLS
Operating ambient temperature Permissible dissipation Operating ambient temperature Permissible dissipation (mW)
1400 1282 1200 1000 +100
+100
Operating ambient temperature
Operating ambient temperature
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FUNCTIONAL DESCRIPTION
MB39A134 DC/DC converter which uses pulse width modulation (PWM) charging Li-ion battery controls charge voltage current when charging battery. includes charge control function battery adapter voltage detection function stably supply voltage from adapter battery system. When controlling charge voltage (constant voltage mode), voltage entered ADJ3 CELLS used arbitrary voltage. error amplifier (Error Amp3) compares BATT voltage with internal reference voltage generate control signal generating arbitrary charge voltage. When controlling charge current (constant current mode) current detection amplifier (Current Amp2) amplifies voltage drop generated between both ends charge current sense resistance (RS) times outputs through OUTC2 pin. error amplifier (Error Amp2) compares output voltage from current detection amplifier (Current Amp2) with voltage ADJ2 generate control signal executing constant current charge. When controlling adapter power, current detection amplifier (Current Amp1) amplifies difference between -INC1 voltage +INC1 voltage (VVREF) times outputs through OUTC1 when output voltage adapter drops. error amplifier (Error Amp1) compares output voltage from current detection amplifier (Current Amp1) with ADJ1 voltage generate control signal controlling charge current that adapter power kept constant. triangular wave voltage generated from triangular wave oscillator compared with lowest potential output voltages from error amplifier (Error Amp1, Error Amp2, Error Amp3) when former lower than latter, high side switching addition, Comp detects installation/removal adapter information generated through ACOK pin.
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MB39A134
DC/DC Converter Block
Reference voltage block (REF) reference voltage circuit (REF) uses voltage supplied from (pin generate stable voltage (Typ. that undergone temperature compensation. generated voltage used reference power supply internal circuitry This block output load current from reference voltage VREF (pin Triangular wave oscillator block (OSC) triangular wave oscillator builds capacitor frequency setting into, generates triangular wave oscillation waveform connecting frequency setting resistor with (pin 17). triangular wave input comparator Triangular wave oscillation frequency: fosc fosc (kHz) 17000 Error amplifier block (Error Amp1) This amplifier detects output signal from current detection amplifier (Current Amp1) outputs control signal. addition, stable phase compensation made available system connecting resistor capacitor COMP1 pin. Error amplifier block (Error Amp2) This amplifier detects output signal from current detection amplifier (Current Amp2), compares this output signal from charge current control circuit, outputs control signal used controlling charge current. addition, stable phase compensation made available system connecting resistor capacitor COMP2 pin. Error amplifier block (Error Amp3) This error amplifier (Error Amp3) detects output voltage from DC/DC converter, compares this output signal from REFIN controller circuit, outputs control signal. Arbitrary output voltage from Cell Cell connecting external resistor charging voltage ADJ3 (pin 16). addition, stable phase compensation made available system connecting resistor capacitor COMP3 pin. Current detection amplifier block (Current Amp1) current detection amplifier (Current Amp1) amplifies voltage difference between +INC1 (pin -INC1 (pin times signal output following error amplifier (Error Amp1) Current detection amplifier block (Current Amp2) current detection amplifier (Current Amp2) detects voltage drop both ends output sense resistor (RS) flow charge current, using +INC2 (pin BATT (pin signal amplified times output following error amplifier (Error Amp2)
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MB39A134
comparator block (PWM Comp.) comparator circuit (PWM Comp.) voltage-pulse width converter controlling output duty error amplifiers (Error Amp1 Error Amp3) depending their output voltage. comparator circuit compares triangular wave voltage generated triangular wave oscillator with error amplifier output voltage turns external output transistor (MOS FET) during interval which triangular wave voltage lower than error amplifier output voltage. Output block (OUT) output circuit uses totem-pole configuration capable driving external P-ch FET. output level sets output amplitude (Typ) using voltage generated bias voltage block (VH) This results increasing conversion efficiency suppressing withstand voltage connected external transistor (MOSFET) even wide range input voltages. (10) Power supply control block (CTL) Setting (pin level places standby mode. During standby mode, only adapter detection function operated. (The supply current typical standby mode.) function table
Power
adapter detection (Active) (Active)
(Standby) (Active)
(11) Bias voltage block (VH) bias voltage circuit outputs VVCC (Typ) minimum potential output circuit. standby mode, this circuit outputs potential equal VVCC.
Protection Functions
Under voltage lockout protection circuit block (UVLO) transient state momentary decrease supply voltage internal reference voltage (VREF pin) which occurs when power supply (VCC pin) turned cause malfunctions control resulting breakdown deterioration system. prevent such malfunction, under voltage lockout protection circuit detects internal reference voltage drop fixes (pin level. system restores when power supply internal reference reaches less than threshold voltage lockout protection circuit voltage level. Protection circuit (UVLO) operation function table When UVLO operating (VCC VREF voltage lower than UVLO threshold voltage.), logic following fixed value shown. Status DS04-27264-2E
MB39A134
Over temperature detection circuit protects from heat-destruction. temperature joint part reaches +150 circuit changes level "H", stops voltage output. addition, temperature joint part drops +125 output restarts again. Therefore, make sure design DC/DC power supply system that over heating protection does start frequently.
Detection Functions
adapter voltage detection block Comp.) adapter voltage detection block Comp.) detects that ACIN voltage below 1.25 (Typ) sets ACOK adapter voltage detection block Hi-Z. addition, higher voltage from either supplied power supply.
ACIN
ACOK Hi-Z
adapter
Micro controller
ACIN
ACOK
Comp.>
adapter detection voltage setting High 1.27 High 1.25
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MB39A134
Setting Charge Voltage
charge voltage (DC/DC output) input voltage ADJ3 (pin CELLS (pin ADJ3 (pin charge voltage cell. arbitrary charge voltage when external resistor set. doesn't need external resistor when ADJ3 (pin input VREF level level internal high accurate reference voltage. CELLS (pin series battery number when input VREF, OPEN level. setting ADJ3 (pin 16), CELLS (pin charge voltage (DC/DC output) shown below. ADJ3 Input Voltage VREF (ADJ3 CELLS OPEN VREF OPEN (ADJ3 VREF OPEN External voltage setting (ADJ3 VREF ADJ3 internal circuit 12.6 16.8 12.3 16.4 ADJ3 voltage ADJ3 voltage ADJ3 voltage Charge Voltage Note Cell 4.20 V/Cell Cell 4.20 V/Cell Cell 4.20 V/Cell Cell 4.10 V/Cell Cell 4.10 V/Cell Cell 4.10 V/Cell Cell ADJ3 voltage/Cell Cell ADJ3 voltage/Cell Cell ADJ3 voltage/Cell
ADJ3
Comparator_A 2.05 SELECTOR
Error Amp3
LOGIC
Comparator_B
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MB39A134
Setting Charge Current
Error amplifier block (Error Amp2) compares output voltage charge current control block ADJ2 (pin with output signal from current detection amplifier (current Amp2) outputs control signal used controlling maximum charge current battery. When current overflows rated value, current will constantly charged rated value, charge voltage will drop. Battery charge current setting voltage ADJ2
Upper limit charge current
Charge current control block output voltage voltage 0.075 Current detection amplifier block voltage gain (25.0 Typ) sense resistor Charge Current 1.425 VADJ2-0.075 2.85 (VADJ2-0.075) 3.79 2.66 (VADJ2-0.075)
ADJ2 Input Voltage VREF (ADJ2 External Voltage Setting (ADJ2 ADJ2 internal circuit
Charge Current Control Block Output Voltage VADJ2
ADJ2
Comparator_C
Error Amp2
Selector
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MB39A134
Example charge current setting
4.325
1.425
4.41 4.59 External setting when ADJ2
VADJ2 VVREF
Internal reference voltage setting when ADJ2 VREF
(mA) +INC1 Error (MB39A134)
VADJ2 (mV) VADJ2 VADJ2 VADJ2 VADJ2
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MB39A134
Setting Dynamically-Controlled-Charging
connecting shown example figure below, adopter voltage (VIN) drops becomes calculated Vth, then, dynamically-controlled charging loop reduce charge current keep settled power level. adopter voltage dynamically controlled charging mode: VREF
VREF Reference voltage (5.0 Typ)
Current detection amplifier block voltage gain (25.0 Typ)
VREF <Current Amp1> +INC1
-INC1
<Error Amp1>
ADJ1
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MB39A134
TRANSIT RESPONSE WHEN LOAD CHANGES SUDDENLY
constant voltage control loop constant current control loop independent each other when load changes suddenly, these control loops switch over each other. Overshoot battery voltage current generated delay control loop when changing mode. delay time determined phase compensation components values. When constant current control switches over constant voltage control when removing battery, control period with higher duty than rated charge voltage occurs, resulting voltage overshoot. such period, since battery removed, excessive voltage should applied battery. When constant voltage control switches over constant current control when installing battery, control period with higher duty than rated charge current occurs, resulting current overshoot. MB39A134, current overshoot with less.
Error Amp3 Output
Error Amp2 Output
Error Amp2 Output
Error Amp3 Output
Constant Current
Voltage
Constant Current
Battery Voltage
Battery Current
When charge control switches over from constant current control constant voltage control, control period with higher duty than rated charge voltage occurs, resulting voltage overshoot.
MB39A134, current overshoot with less.
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MB39A134
CONNECTION WITHOUT USING CURRENT AMP1, CURRENT AMP2 ERROR AMP1, ERROR AMP2
When Current Amp1, Error Amp1, used, please connect follows. +INC1 (pin 24), -INC1 (pin ADJ1 (pin ADJ2 (pin connected with VREF pin. +INC2 (pin connected with BATT (pin 12). OUTC1 (pin OUTC2 (pin10) open.
+INC1 -INC1 OUTC1 OUTC2
+INC2 BATT
"OPEN" "OPEN"
VREF
ADJ1
ADJ2 COMP1 COMP2
"OPEN" "OPEN"
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MB39A134
INPUT/OUTPUT EQUIVALENT CIRCUIT DIAGRAM
<Reference voltage block>
<Control bloc>
protection component
37.27
VREF
33.1
12.10
<Triangular wave oscillator block>
VREF
<Error amplifier block (Error Amp1)
VREF
OUTC1
COMP1
ADJ1
<Error amplifier block (Error Amp2)
VREF
<Error amplifier block (Error Amp3)
VREF
OUTC2
COMP2
-INE3
COMP3
+INE2
+INE3
<Current detection amplifier block (Current Amp1)
VREF
<Current detection amplifier block (Current Amp2)
VREF
+INC1 OUTC1
+INC2 OUTC2 -INC1 BATT
(Continued)
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MB39A134
<PWM comparator block>
VREF
<Output block>
COMP1 COMP2 COMP3
adapter detection block>
ACIN
ACOK
<Bias voltage block>
VREF
<Charge voltage setting block>
SELECTER
ADJ3
+INE3
4.5V
0.3V
(Continued)
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MB39A134
(Continued) <Charge current setting block>
VREF SELECTER
ADJ2
+INE2
<Cell switch block>
BATT VREF
CELLS
-INE3
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MB39A134
TYPICAL APPLICATION CIRCUIT
VSYS TPCA8102 TPCA8102 Wire short Q1-2 Q1-1 µPA2714GR CDRH104R-150 MBRA340T3 DTr2 DTr1 DTC144EET1G TPCA8102
0.22
ACOK
SW1-1 +INC2 COMP3 ADJ3 +INC1 BATT CELLS OUTC2 ADJ2 COMP2 OUTC1 OUTC2 0.001
ACOFF
0.022
CELLS
ADJ2
MB39A134
ACIN VREF ACOK
VREF 0.001
COMP1 ADJ1 OUTC1 -INC1
SGND
+INC1 -INC1
SW1-2
SW1-2 2.85
Place output V/Cell. Place output V/Cell. Place Cells operation. Place Cells operation. Open Cells operation.
Patterm short mounted
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Parts list Component Q1-1 Q1-2 DTr1 DTr2
Item P-ch P-ch P-ch P-ch P-ch Transistor Transistor Diode
Specification MB39A134 (Max) (Max) (Max) (Max) VCEO 0.45 (Max) Irms 0.022 0.001 0.001 0.22
Vendor TOSHIBA TOSHIBA TOSHIBA Semi Semi
Package TSSOP-24 SOP-8 Advance Advance Advance SC-75 RMDS
Parts µPA2714GR TPCA8102 TPCA8102 TPCA8102 DTC144EET1G MBRA340T3
Remarks
mounted
mounted
Inductor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor
SUMIDA
3225 3225 1608 1608 1608 1608 1608 1608 1608 1608
CDRH104R-150 C3225X5R1E106K C3225JC1E226M C1608JB1H223K C1608JB1H104K C1608JB1H104K C1608JB1H102J C1608JB1H104K C1608JB1H102J C1608JB1H224K C1608JB1H104K (Continued) mounted mounted mounted mounted mounted mounted mounted mounted mounted
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Component
Item Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor
Specification
Vendor Mac-Eight
Package 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608
Parts MJP-0.2 SL1TTE20L0D RR0816P102D RR0816P563D RR0816P104D RR0816P103D RR0816P103D RR0816P104D RR0816P103D RR0816P104D RK73Z1J RR0816P622D RR0816P913D RR0816P103D RR0816P204D RR0816P104D RR0816P473D RR0816P103D RR0816P113D RR0816P244D RR0816P104D RK73Z1J
Remarks Wire short
Pattern short Pattern
Pattern Pattern short mounted
mounted mounted
Pattern short
Pattern short Pattern short Pattern short mounted Pattern short
(Continued) DS04-27264-2E
MB39A134
(Continued) Component
Item Resistor Wiring
Specification WT-2-1
Vendor MATSUKYU Mac-Eight
Package 1608
Parts RR0816P104D DMS-2H WT-2-1
Remarks
mounted 11-pin
Note These components recommended based operating tests authorized. TOSHIBA Semi SUMIDA Mac-Eight MATSUKYU Fujitsu Microelectronics Limited Corporation TOSHIBA Corporation Semiconductor Corporation SUMIDA Corporation Corporation Mac-Eight Co.,Ltd Corporation SUSUMU Co.,Ltd Matsukyu Co.,Ltd
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MB39A134
APPLICATION NOTE
Inductor selection inductance value should selected, reference, that peak-to-peal value inductor ripple current less maximum charge current. such case, inductance value obtained follows IOMAX fOSC
Inductance value
IOMAX Max. charge current Peak-to-peak value inductor ripple current max. charge current ratio (0.5) Switching system power supply voltage Charge voltage fosc Switching frequency [Hz] minimum charge current value (critical current value) without backward inductor current obtained follow fOSC
Critical current Inductance value Charge voltage
Switching system power supply voltage fosc Switching frequency [Hz] judge that current passing through inductor below rated value, necessary obtain maximum current value passing through inductor. maximum inductor current value obtained follows
ILMAX IoMAX
ILMAX Max. inductor current IoMAX Max. charge current Peak-to-peak value inductor ripple current
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fOSC Inductor current
ILMAX IoMAX
Varies depending load current.
Time
Switching selection MB39A134 used charger notebook since output voltage adapter, which input voltage switching FET, less, general, class used switching FET. Obtain maximum value current flowing through switching order determine whether current flowing through switching within rated value. maximum current flowing through switching found following formula.
IDMAX IoMAX
IDMAX Max. switching drain current IOMAX Max. charge current Peak-to-peak value inductor ripple current addition, judge that permissible switching loss below rated value, necessary obtain switching loss. reduce switching loss much possible. when selecting switching FET, take into consideration that continuity loss equal switching loss. switching continuity loss obtained following formula:
PRon
PRon Switching continuity loss Charge current Charge voltage Switching system power supply voltage Switching resistance
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switching switching loss obtained simply follows
ILMIN fosc
ILMAX fosc
Switching switching loss ILMIN Iomax Lower value inductor current ILMAX Iomax Upper value inductor current Switching system power supply voltage fosc Switching frequency [Hz] Switching turn-on time Switching turn-off time
Flyback diode selection Select shot-key barrier diode (Flyback diode) with small forward voltage much possible. judge that current passing through flyback diode below rated value, necessary obtain value peak current passing through flyback diode. maximum current value flyback diode obtained follows
IoMAX
Forward current
IOMAX Max. charge current Peak-to-peak value inductor ripple current Furthermore, judge that permissible flyback diode loss below rated value, necessary obtain flyback diode loss. flyback diode loss obtained follows
PSBD IoMAX
PSBD Flyback diode loss IOMAX Max. charge current Switching system power supply voltage Charge voltage Forward voltage
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Output capacitor selection Since high causes output ripple voltage increase, low-ESR capacitor needs used order reduce output ripple voltage. capacitor that sufficient ratings surge current generated when battery inserted removed. Generally, ceramic capacitor used output capacitor. With switching ripple voltage taken into consideration, minimum capacitance required found following formula. fosc ESR)
Output capacitor
Serial resistance output capacitor Switching ripple voltage Peak-to-peak value inductor ripple current fosc Switching frequency [Hz] Since overshoot occurs DC/DC converter output voltage when battery being charged removed, capacitor having sufficient withstand voltage. Generally, capacitor having rated withstand voltage higher than maximum input voltage sued. Moreover, capacitor having sufficient tolerance allowable ripple current. allowable ripple current required found following formula.
Irms
Irms Acceptable ripple current (effective value) Peak-to-peak value inductor ripple current
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MB39A134
Input capacitor selection Select input capacitor that small possible. ceramic capacitor ideal. highcapacitance capacitor needed which there suitable ceramic capacitor polymer capacitor tantalum capacitor having ESR. ripple voltage switching operation DC/DC converter generated power supply voltage. Please consider lower limit value input capacitor according allowable ripple voltage. ripple voltage power supply easily found following formula. IOMAX fOSC
(IOMAX
Peak-to-peak value switching system power supply ripple voltage IOMAX Maximum charge current Input capacitor Switching system power supply voltage Charge voltage
fOSC Switching frequency [Hz] Series resistance component input capacitor Peak-to-peak value inductor ripple current
ripple voltage power supply decreased raising switching frequency besides using capacitor. capacitor features frequency, temperature bias voltage, that effect capacitance extremely small depending conditions. Please choose having enough margin input voltage ripple current ratings capacitor. acceptable ripple current given following formula. (VIN
Irms IOMAX
Irms Acceptable ripple current (effective value) IOMAX Maximum charge current Switching system power supply voltage Charge voltage
DS04-27264-2E
MB39A134
Designing phase compensation circuit Constant voltage (CV) mode phase compensation circuit common connect 1-pole-1-zero phase compensation circuit output (COMP3) error amplifier amplifier). When low-ESR capacitor, such ceramic capacitor, used output capacitor, easier DC/DC converter oscillate phase delay approaches degrees resonance frequency this situation, perform phase compensation connecting phase lead compensator COMP3 pin, between -INE3 BATT pin. 1pole-1zero phase compensation circuit
BATT
Vrefint1 Error Amp3 COMP3
Comp.
phase lead circuit obtained following formula. 10-6
Charge current Switching system power supply voltage Inductance value inductor Output capacitor value Charge voltage this situation, crossover frequency [Hz] obtained following formula.
fCO= 10-5
DS04-27264-2E
MB39A134
Constant current (CC) mode phase compensation circuit Since output capacitor impedance small influence loop response characteristics this mode, phase compensation circuit with 1pole-1zero normally connected output (COMP2) error amplifier amplifier) 1pole-1zero phase compensation circuit
BATT
Current Amp2 Error Amp2 Vrefint2 COMP2
Comp.
+INC2
phase lead circuit obtained following formula.
Resistance value charge current detection Switching system power supply voltage Inductance value Output capacitance value Crossover frequency [Hz]
DS04-27264-2E
MB39A134
Allowable loss, thermal design general, allowable loss thermal design this ignored because this highly effective. However, when this used with high power supply voltage, high switching frequency, high load, high temperature, necessary take account allowable loss thermal design while using this internal loss (PIC) found following formula. (ICC fOSC) IC's Internal loss Power supply voltage (VIN) Power supply current (4.0 Max) Total amount charges switching FETs (when
fOSC Switching frequency [Hz] temperature joint part (Tj) obtained follows Joint part temperature Ambient temperature
TSSOP-24 package thermal resistance IC's internal loss
DS04-27264-2E
MB39A134
Board layout When designing layout, consider points listed below. Take account following points when designing board layout. Place plane mounting surface whenever possible. Connect controller PGND only point PGND order prevent large current path from passing controller GND. Connect input capacitor (CIN) switching FET, flyback diode, inductor sense resistance (Rs) output capacitor (Co) surface layer. connect them through-hole. loop compased input capacitors (CIN), switching flyback diode, minimize current loop. When minimizing routing loops, give priority this loop over others. Connect pins input capacitor (CIN) flyback diode, output capacitor (Co) GNDs inner layer through holes making them close pins. Large currents momentarily flow through nets pin, which connected switching gate. wiring width about minimize length routing. Place bypass capacitor connected VCC, VIN, VREF, pins, resistance connected close respective pins possible. Moreover, connect bypass capacitor pins VCC, VIN, VREF fOSC:setting resistance close proximity (Strengthen connection internal layer making through-holes close proximity each terminals bypass capacitors, terminals fosc setting resistors.) Since nets -INC1, +INCx, BATT, COMPx, pins sensitive noise, make wiring them shortly possible, keep them away from switching system parts much possible. remote sensing (Kelvin connection) routing +INC2 BATT pins very sensitive noise. Therefore, make their routing close each other keep routing away from switching components possible. wiring example Surface layer
Switching system part arrangement example Switching
Flyback diode
PGND PGND
PGND
Inner layer
Inner layer +INC2
BATT Feedback line
VREF
Through hole connecting PGND single point Surface layer
DS04-27264-2E
MB39A134
REFERENCE DATA
Unless explained specially, measurement conditions 2.85 battery Cell, Conversion efficiency Charging current (Constant voltage mode) Charging voltage Charging current
Cells Cells Cells Cells
Conversion efficiency
Charging voltage
SW1-2 Cells Cells
Charging current Conversion efficiency Charging voltage (Constant current mode)
Charging current
Conversion efficiency
Charging voltage Switching waveform (Constant voltage mode)
VOUT VOUT µs/div VOUT µs/div
Switching waveform (Constant current mode)
VOUT
(Continued) DS04-27264-2E
MB39A134
(Continued) Start stop (Constant voltage mode)
IO(A) VCTL IO(A) VCTL
Start stop (Constant current mode)
VCTL
VCTL
ms/div
ms/div
Load-step response (Constant voltage mode) Battery insertion
Load-step response (Constant voltage mode) Battery removal
IO(A) IO(A) ms/div
ms/div
Load-step operation response (Constant current mode) Battery insertion
IO(A) ms/div
Load-step operation response (Constant current mode) Battery removal
IO(A) ms/div
DS04-27264-2E
MB39A134
USAGE PRECAUTION
configure over maximum ratings
used over maximum ratings, permanently damaged. preferable device normally operated within recommended usage conditions. Usage outside these conditions have effect reliability LSI.
devices within recommended operating conditions
recommended operating conditions recommended values that guarantee normal operations LSI. electrical ratings guaranteed when device used within recommended operating conditions under conditions stated each item.
Printed circuit board ground lines should with consideration common impedance Take appropriate measures against static electricity
Containers semiconductor materials should have anti-static protection made conductive material. After mounting, printed circuit boards should stored shipped conductive bags containers. Work platforms, tools, instruments should properly grounded. Working personnel should grounded with resistance series between body ground.
apply negative voltages
negative voltages below -0.3 cause parasitic transistor activated lines, which cause malfunctions.
ORDERING INFORMATION
Part number MB39A134PFT-E1 Package 24-pin plastic TSSOP (FPT-24P-M08) Remarks Lead Free version
BOARD ORDERING INFORMATION
board part MB39A134EVB-01D board version MB39A134EVB-01 Rev1.0 Remarks TSSOP-24
RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION
products Fujitsu microelectronics with "E1" compliant with RoHS Directive observed standard lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB) polybrominated diphenyl ethers (PBDE) products whose part number trailing characters "E1" RoHS compliant.
DS04-27264-2E
MB39A134
MARKING FORMAT (LEAD FREE VERSION)
XXXX
INDEX Lead Free version
DS04-27264-2E
MB39A134
LABELING SAMPLE (LEAD FREE VERSION)
Lead-free mark JEITA logo JEDEC logo
MB123456P
(3N) 1MB123456P-789-GE1 1000
(3N)2 1561190005 107210
PASS
1,000 MB123456P
2006/03/01
ASSEMBLED JAPAN
MB123456P
0605 Z01A 1000
1561190005
part number lead-free product trailing characters "E1".
DS04-27264-2E
MB39A134
MB39A134PFT-E1 RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL
Item Mounting Method Mounting times Before opening Storage period From opening reflow When storage period after opening exceeded Storage conditions [Mounting Conditions] (infrared reflow) rank
Main heating
Condition (infrared reflow) Manual soldering (partial heating method) times Please within years after Manufacture. Less than days Please process within days after baking (125 24H)
70%RH less (the lowest possible humidity)
(d')
level Temperature Increase gradient Preliminary heating Temperature Increase gradient Peak temperature (d') Main Heating
Cooling
Average °C/s °C/s Temperature Average °C/s °C/s Temperature Max; more, less Temperature more, less Temperature more, less Temperature more, less Natural cooling forced cooling
Note Temperature package body Manual soldering (partial heating method) Conditions Temperature Times max/pin
DS04-27264-2E
MB39A134
PACKAGE DIMENSION
24-pin plastic TSSOP Lead pitch Package width package length Lead shape Sealing method Mounting height Weight Code (Reference) 0.50 Gullwing Plastic mold 1.10 0.08
(FPT-24P-M08)
24-pin plastic TSSOP (FPT-24P-M08)
6.50±0.10(.256±.004)
Note These dimensions include resin protrusion. Note These dimensions include resin protrusion. Note Pins width pins thickness include plating thickness. Note Pins width include cutting remainder.
0.17±0.05 (.007±.002)
4.40±0.10
INDEX
6.40±0.20 (.173±.004) (.252±.008)
Details part 1.05±0.05 (Mounting height) (.041±.002)
0.50(.020)
0.22±0.05 (.009±.002) 0.10(.004)
0~8°
+0.03 +.001
0.50(.020) 0.60±0.15 (.024±.006) 0.08(.003)
0.07 -0.07
(Stand off)
.003 -.003 0.25(.010)
©2002-2008 FUJITSU MICROELECTRONICS LIMITED F24031S-c-1-2
2002 FUJITSU LIMITED F24031S-c-1-1
Dimensions (inches). Note: values parentheses reference values.
Please confirm latest Package dimension following URL.
DS04-27264-2E
MB39A134
CONTENTS
page DESCRIPTION FEATURES APPLICATIONS ASSIGNMENT DESCRIPTIONS BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FUNCTIONAL DESCRIPTION TRANSIT RESPONSE WHEN LOAD CHANGES SUDDENLY CONNECTION WITHOUT USING CURRENT AMP1, CURRENT AMP2 ERROR AMP1, ERROR AMP2 INPUT/OUTPUT EQUIVALENT CIRCUIT DIAGRAM TYPICAL APPLICATION CIRCUIT TYPICAL APPLICATION CIRCUIT APPLICATION NOTE REFERENCE DATA USAGE PRECAUTION ORDERING INFORMATION BOARD ORDERING INFORMATION RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION MARKING FORMAT (LEAD FREE VERSION) LABELING SAMPLE (LEAD FREE VERSION) MB39A134PFT-E1 RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL PACKAGE DIMENSION
DS04-27264-2E
MB39A134
MEMO
DS04-27264-2E
MB39A134
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ further information please contact: North South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 Arques Avenue, Sunnyvale, 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 Korea FUJITSU MICROELECTRONICS KOREA LTD. KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA LTD. Lorong Chuan, #05-08 Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw
Rights Reserved. contents this document subject change without notice. Customers advised consult with sales representatives before ordering. information, such descriptions function application circuit examples, this document presented solely purpose reference show examples operations uses FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does warrant proper operation device with respect based such information. When develop equipment incorporating device based such information, must assume responsibility arising such information. FUJITSU MICROELECTRONICS assumes liability damages whatsoever arising information. information this document, including descriptions function schematic diagrams, shall construed license exercise intellectual property right, such patent right copyright, other right FUJITSU MICROELECTRONICS third party does FUJITSU MICROELECTRONICS warrant non-infringement third-party's intellectual property right other right using such information. FUJITSU MICROELECTRONICS assumes liability infringement intellectual property rights other rights third parties which would result from information contained herein. products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated accompanying fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), requiring extremely high reliability (i.e., submersible repeater artificial satellite). Please note that FUJITSU MICROELECTRONICS will liable against and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. Exportation/release products described this document require necessary procedures accordance with regulations Foreign Exchange Foreign Trade Control Japan and/or export control laws. company names brand names herein trademarks registered trademarks their respective owners.
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