ASSP Power Management Applications (General-Purpose DC/DC Converter)
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DS04-27262-2E
ASSP Power Management Applications (General-Purpose DC/DC Converter)
PFM/PWM DC/DC converter with synchronous rectification
MB39A136
DESCRIPTION
MB39A136 step-down DC/DC converter current mode N-ch/N-ch synchronous rectification method. contains enhanced protection features, supports symmetrical-phase method ceramic capacitor. MB39A136 realizes rapid response, high efficiency, ripple voltage, high-frequency operation enables miniaturization inductors capacitors.
FEATURES
High efficiency frequency setting external resistor Error threshold voltage 1.0% Minimum output voltage value Wide range power-supply voltage PFM/PWM auto switching mode fixed mode selectable Supports Symmetrical-Phase method With built-in over voltage protection function With built-in under voltage protection function With built-in over current protection function With built-in over-temperature protection function With built-in soft start/stop circuit without load dependence With built-in synchronous rectification type output steps N-ch Standby current [µA] Small package TSSOP-24
APPLICATION
Digital Photocopiers Surveillance cameras Set-top boxes (STB) players, recorders Projectors phones Vending machine Consoles other non-portable devices
Copyright©2008 FUJITSU MICROELECTRONICS LIMITED rights reserved 2008.12
MB39A136
ASSIGNMENT
(TOP VIEW)
CTL1 COMP1 ILIM1 VREF CTL2 ILIM2 COMP2
DRVH1 DRVL1 DRVL2 DRVH2 MODE
(FPT-24P-M09)
DS04-27262-2E
MB39A136
DESCRIPTION
Symbol CTL1 COMP1 ILIM1 VREF CTL2 ILIM2 COMP2 MODE DRVH2 DRVL2 DRVL1 DRVH1 control pin. soft-start time setting capacitor connection pin. Error amplifier inverted input pin. error amplifier output pin. over current detection level setting voltage input pin. Oscillation frequency setting resistor connection pin. Reference voltage output pin. control pin. over current detection level setting voltage input pin. error amplifier output pin. Error amplifier inverted input pin. soft-start time setting capacitor connection pin. PFM/PWM switch pin. (CH1 commonness) becomes fixed operation with VREF connection, becomes PFM/PWM operation with connection. connection boot strap capacitor. output external high-side gate drive. inductor external high-side source connection pin. output external low-side gate drive. Ground pin. Bias voltage output pin. Power supply reference voltage control circuit. output external low-side gate drive. inductor external high-side source connection pin. output external high-side gate drive. connection boot strap capacitor. Description
DS04-27262-2E
MB39A136
BLOCK DIAGRAM
MODE <CH1>
<Soft-Start, Soft-Stop>
VREF <PFM Comp. pfm1
ctl1 /uvp_out /otp_out /uvlo ovp_out
Clock generator pfm2
Bias Reg.
ch.1 ch.2 180° phase DRVH1
COMP1
<Error Amp>
Hi-side Drive
Comp.>
RS-FF
intref ILIM1 <OVP Comp.>
Drive Logic
Lo-side Drive Comp.> Level Converter
DRVL1
<UVP Comp.>
intref 1.15 ovp1 ovp1 ovp2 uvp1 uvp2 delay 512/fOSC delay
intref uvp1 <UVLO> uvp_out ovp_out uvlo H:UVLO release otp_out UVLO VREF UVLO
DRVH2
<CH2> configuration control circuit same that CH1.
COMP2
ctl1, ctl2
DRVL2
ILIM2
<REF> <CTL> intref (3.3 VREF
ON/OFF
CTL1 CTL2
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MB39A136
ABSOLUTE MAXIMUM RATINGS
Parameter Power-supply voltage input voltage input voltage Voltage between Control input voltage Symbol VVCC VCBLX Input voltage VILIM VCSx VMODE Output current Power dissipation Storage temperature IOUT TSTG FB1, pins ILIM1, ILIM2 pins CS1, pins MODE DRVL1, DRVL2 pins, DRVH1, DRVH2 pins CB1, pins LX1, pins CTL1, CTL2 pins Conditions Rating VVREF VVREF VVREF 1644 Unit
WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings.
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MB39A136
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage input voltage Reference voltage output current Bias output current input voltage Symbol VVCC IVREF Input voltage VILIM VMODE Peak output current Operation frequency range Timing resistor Soft start capacitor capacitor Reference voltage output capacitor Bias voltage output capacitor Operating ambient temperature IOUT fOSC CVREF CS1, pins CB1, pins VREF Conditions CTL1, CTL2 pins FB1, pins ILIM1, ILIM2 pins CS1, pins MODE DRVH1, DRVH2 pins DRVL1, DRVL2 pins Duty 1/fOSC Duty) Value 1200 0.0075 0.0180 25.0 VVREF 1.94 VVREF VVREF 1200 1000 Unit
WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their representatives beforehand.
DS04-27262-2E
MB39A136
ELECTRICAL CHARACTERISTICS
VREF Parameter Output voltage Reference Voltage Block [REF] Input stability Load stability Short-circuit output current Output voltage Bias Voltage Block Load stability Reg.] Input stability Symbol VVREF VREF LINE VREF LOAD VREF LINE LOAD VTLH1 VTHL1 VTLH2 VTHL2 Conditions VREF VREF VREF VREF VREF CTL1, CTL2 pins CS1, pins Value 3.24 14.5 4.85 3.30 10.0 5.00 0.6* 0.2* 3.36 5.15 Unit
Short-circuit output current Threshold voltage Under voltage Lockout Hysteresis width Protection Circuit Block Threshold voltage [UVLO] Hysteresis width Charge current Soft-start Soft-stop Block [Soft-Start, Soft-Stop] Soft-start voltage Electrical discharge resistance soft-stop Soft-stop voltage Oscillation frequency Clock Generator Block [OSC] Oscillation frequency when under voltage detected Frequency Temperature variation
CTL1, CTL2 pins CTL1, CTL2 pins CS1, pins
RDISCG
VDISCG fOSC
CTL1, CTL2 pins
0.1*
fSHORT
62.5
df/dT
(Continued) DS04-27262-2E
MB39A136
VREF Parameter Threshold voltage Input current Symbol EVTH EVTHT ISOURCE Error Block [Error Amp1, Error Amp2] Output current ISINK Conditions Value 0.693 0.689* 0.700 0.700* 0.707 0.711* Unit
FB1, pins FB1, pins COMP1, COMP2 pins FB1, pins VREF pin, COMP1, COMP2 pins FB1, pins ILIM1, ILIM2 pins FB1, pins ILIM1, ILIM2 pins
12.0
16.8
Output clamp voltage ILIM input current Over-voltage Protection Circuit Block [OVP Comp.] Over-voltage detecting voltage Over-voltage detection time
VILIM IILIM
1.35 0.776
1.50
1.65 0.835
VOVP
FB1, pins
0.805
tOVP
Under-voltage Under-voltage detecting Protection voltage Circuit Block [UVP Comp.] Under-voltage detection time Over-temperature Protection Detection Circuit Block temperature [OTP] Synchronous rectification stop voltage Control Circuit Block (MODE) PFM/PWM mode condition Fixed mode condition MODE input current
VUVP
FB1, pins Junction temperature Junction temperature
0.450
0.490 512/ fOSC 160* 135*
0.531
tUVP TOTPH TOTPL
VTHLX
LX1, pins
VPFM
MODE
VPWM
MODE MODE
VVREF
IMODE
(Continued)
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VREF Parameter High-side output on-resistance Low-side output on-resistance Symbol RON_MH RON_ML RON_SH RON_SL Conditions DRVH1, DRVH2 pins DRVH1, DRVH2 pins DRVL1, DRVL2 pins DRVL1, DRVL2 pins Value 0.75 1.70 Unit
Output source current Output Block [DRV]
ISOURCE
LX1, pins CB1, pins DRVH1, DRVH2 pins, DRVL1, DRVL2 pins Duty LX1, pins CB1, pins DRVH1, DRVH2 pins Duty LX1, pins CB1, pins DRVL1, DRVL2 pins Duty COMP1, COMP2 pins FB1, pins LX1, pins CB1, pins LX1, pins
0.5*
0.9*
Output sink current
ISINK
1.2*
Minimum time Maximum on-duty Dead time Maximum current sense voltage Voltage conversion gain Offset voltage voltage conversion Slope compensation inclination input current
DMAX
250*
VRANGE
220*
Level Converter Block [LVCNV]
SLOPE
LX1, pins
(Continued)
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MB39A136
(Continued) VREF Symbol VOFF ICTLH ICTLL ICCS Conditions CTL1, CTL2 pins CTL1, CTL2 pins CTL1, CTL2 pins CTL1, CTL2 pins CTL1, CTL2 pins CTL1, CTL2 pins LX1, pins FB1, pins MODE VREF Value 0.4* Unit
Parameter condition condition Control Block Hysteresis [CTL1, CTL2] width Input current Standby current General Power-supply current
This value specified. This should used reference support designing circuits.
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MB39A136
TYPICAL CHARACTERISTICS
Typical data Power dissipation Power dissipation Operating ambient temperature
2000 1800 1644
Power dissipation (mW)
1600 1400 1200 1000 +100 +125
Operating ambient temperature
VREF bias voltage Operating ambient temperature
3.36
Error threshold voltage Operating ambient temperature Error threshold voltage EVTH
0.71
VREF bias voltage VVREF
3.34 3.32 3.28 3.26 3.24
0.705 0.695 fosc
fosc
+100
0.69
+100
Operating ambient temperature
Operating ambient temperature (Continued)
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(Continued) Oscillation frequency Operating ambient temperature Oscillation frequency fOSC (kHz)
fosc
Dead time Operating ambient temperature
Dead time (ns)
+100
+100
Operating ambient temperature
Oscillation frequency Timing resistor value Oscillation frequency fOSC (kHz)
1000
Operating ambient temperature period from DRVL DRVH period from DRVH DRVL bias voltage bias output current
bias voltage
-0.025 -0.02 -0.015 fosc 25°C
25°C
1000
-0.01
-0.005
Timing resistor value Maximum duty cycle Power supply voltage Maximum duty cycle DMAX Maximum duty cycle DMAX
fosc 25°C
bias output current Maximum duty cycle Operating ambient temperature
fosc
+100
Power supply voltage VVCC
Operating ambient temperature DS04-27262-2E
MB39A136
FUNCTION DESCRIPTION
Current Mode
uses current waveform from switching (Q1) control waveform control output voltage, described below: clock (CK) from internal clock generator (OSC) sets RS-FF turns high-side FET. Turning high-side causes inductor current (IL) rise. Generate that converts this current into voltage. current comparator Comp.) compares this with output (COMP) from error amplifier (Error Amp) that negative-feedback from output voltage (Vo). When Comp. detects that exceeds COMP, resets RS-FF turns high-side FET. clock (CK) from clock generator (OSC) turns high-side again. Thus, switching repeated. Operate that electrical potential become INTREF electrical potential, stabilize output voltage feedback control.
<Error Amp>
Comp.>
DRVH RS-FF Drive Logic Current Sense DRVL
COMP
INTREF
OSC(CK)
COMP DRVH
toff
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MB39A136
Reference Voltage Block (REF) reference voltage circuit (REF) generates temperature-compensated reference voltage (3.3 Typ) using voltage supplied from pin. voltage used reference voltage IC's internal circuit. reference voltage used supply load current external device through VREF pin. Bias Voltage Block Reg.) Bias Voltage Block Reg.) generates reference voltage used IC's internal circuit, using voltage supplied from pin. reference voltage temperature-compensated stable voltage Typ) supply current through pin. Under Voltage Lockout Protection Circuit Block (UVLO) circuit protects against malfunction system destruction/deterioration transitional state momentary drop when bias voltage (VB) internal reference voltage (VREF) starts. detects voltage drop VREF stops operation. When voltages VREF exceed threshold voltage under voltage lockout protection circuit, system restored. Soft-start/Soft-stop Block (Soft-Start, Soft-Stop) Soft-start protects rush current output voltage (VOx) from overshooting output start. Since lamp voltage generated charging capacitor connecting used reference voltage error amplifier (Error Amp), soft-start time independent load output (VOx). When starts with level CTLx pin, capacitor (CS) starts charged output voltage (VOx) during soft-start period rises proportion voltage generated charging capacitor pin. During soft-start with voltage pins, operations follows: Fixed operation only (fixed even MODE "L") Over-voltage protection function under-voltage protection function invalid.
Soft-stop discharges electrical charges stored smoothing capacitor output stop. Setting CTLx level starts soft-stop function independent load output (Vox). Since capacitor connecting starts discharge through IC-built-in soft-stop discharging resistance Typ) when CTLx sets level enters lamp voltage into error amplifier (Error Amp), soft-stop time independent load output (VOx). When discharging causes voltage drop below (Typ), shuts down changes stand-by state. addition, soft-stop function operates after under-voltage protection circuit block (UVP Comp.) latched after over-temperature protection circuit block (OTP) detects over-temperature. During soft-stop with, voltage pins, operations follows: Fixed operation only (fixed even MODE "L") Over-voltage protection function under-voltage protection function invalid.
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MB39A136
Clock Generator Block (OSC) clock generator built-in oscillation frequency setting capacitor generates clock that 180°phase shifted from each channel connecting oscillation frequency setting resistor (SymmetricalPhase method). (6-1) Error Block (Error Amp1, Error Amp2) error amplifiers (Error Amp1 Error Amp2) detect output voltage from DC/DC converter output current comparators Comp.1 Comp.2). output voltage setting resistor externally connected pins allows arbitrary output voltage set. addition, since external resistor external capacitor serially connected between COMP1 pins between COMP2 pins allow arbitrary loop gain set, possible system compensate phase stably. (6-2) Over Current Detection (Protection) Block (ILIM) current detection circuit restrict output current (IOX). over current detection block (ILIM) compares output waveform level converter each channel (see "(12) Level Converter Block (LVCNV)") with ILIMx voltage every cycle. load resistance (ROX) drops, load current (IOX) increases. Therefore, output waveform level converter exceeds ILIM voltage each channel. this time, output current restricted turning high-side suppressing peak value inductor current. result, output voltage (VOX) should drop. Furthermore, output voltage drops electrical potential drops below oscillation frequency (fOSC) drops 1/8. Over-voltage Protection Circuit Block (OVP Comp.) circuit protects device connecting output when output voltage (VOx) rises. compares 1.15 times (Typ) internal reference voltage (INTREF) (0.7 that non-inverting-entered into error amplifier with feedback voltage that inverting-entered into error amplifier detects state where latter higher than former (Typ). stops voltage output setting latch, setting DRVHx level, setting DRVLx level, turning high-side FETs, turning low-side FETs. conditions below cancel protection function: Setting CTL1 CTL2 "L". Setting power supply voltage below UVLO threshold voltage (VTHL1 VTHL2). Under-voltage Protection Circuit Block (UVP Comp.) protects device connecting output stopping output when output voltage (VOX) drops. compares times (Typ) internal reference voltage (INTREF) (0.7 that non-inverting-entered into error amplifier with feedback voltage that inverting-entered into error amplifier detects state where latter lower than former 512/fosc [s](Typ), stops voltage output both channels setting latch. conditions below cancel protection function: Setting CTL1 CTL2 "L". Setting power supply voltage below UVLO threshold voltage (VTHL1 VTHL2).
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MB39A136
Over temperature Protection Circuit Block (OTP) circuit protects from heat-destruction. temperature joint part reaches +160 circuit stops voltage output both channels discharging capacitor connecting through soft-stop discharging resistance Typ) addition, temperature joint part drops +135 output restarts again through soft-start function. Make sure design DC/DC power supply system that over temperature protection does start frequently. (10) Control Circuit Block (MODE) sets control mode makes control automatic PFM/PWM switching. MODE connection Control mode Features (GND) Automatic PFM/PWM Highly-efficient light load switching Fixed Stable oscillation frequency Stable switching ripple voltage Excellent rapid load change characteristic heavy load light load
(VREF)
Automatic PFM/PWM switching mode operation compares voltages with electrical potential Comp. comparison, negative voltage causes low-side positive voltage causes Comp. method) result, method restricts back flow inductor current light load makes switching inductor current discontinuous (DCM) Such operation allows oscillation frequency drop, resulting high efficiency light load. (11) Output Block (DRV) output circuit configured CMOS type both high-side low-side, allowing external N-ch drive. (12) Level Converter Block (LVCNV) circuit detects converts current when high-side turns converts voltage waveform between drain side (VCC voltage) source side (LX1 voltage) high-side into voltage waveform reference. Note: Each channel number (13) Control Block (CTL1, CTL2) circuit controls on/off output from Control function table DC/DC converter CTL1 CTL2 (VO1)
DC/DC converter (VO2)
Remarks Standby DS04-27262-2E
MB39A136
PROTECTION FUNCTION TABLE
following table shows state each when each protection function operates. Output each after detection Detection DC/DC output Protection Function condition dropping operation VREF DRVHx DRVLx Under Voltage Lock Protection (UVLO) Under Voltage Protection (UVP) Over Voltage Protection (OVP) Over Current Protection (ILIM) Over Temperature Protection (OTP) CONTROL (CTL) VREF 0.49 0.805 COMPx ILIMx Self-discharge load Electrical discharge soft-stop function clamping
output voltage switching switching dropping keep constant output current.
CTLx (CSx
Electrical discharge soft-stop function
Note: each channel number
DS04-27262-2E
MB39A136
EQUIVALENT CIRCUIT DIAGRAM
VREF
CTL1, CTL2 pins
CTL1,CTL2 VREF
protection element
CS1, pins
VREF
CS1,CS2
FB1, pins
VREF
COMP1, COMP2 pins
VREF
FB1,FB2 COMP1, COMP2
(Continued) DS04-27262-2E
MB39A136
(Continued) ILM1, ILM2 pins
VREF
VREF
ILIM1,ILIM2 ILIM1,ILIM2
MODE
VREF
CB1, CB2, DRVH1, DRVH2, LX1, pins
CB1,CB2 CB1,CB2
VREF VREF DRVH1, DRVH1, DRVH2 DRVH2 MODE LX1,LX2 LX1,LX2
DRVL1, DRVL2 pins
DRVL1,DRVL2
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EXAMPLE APPLICATION CIRCUIT
(4.5 VREF MODE
MB39A136
COMP1 R8-1 R8-2 ILIM1 DRVH1
<CH1>
DRVL1
C2-1 C2-2 C2-3
<CH2>
DRVH2
COMP2 R14-1 R14-2
DRVL2
C3-1 C3-2
C4-1 C4-2 C4-3
ILIM2
CTL1 CTL2 VREF
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MB39A136
PARTS LIST
Component Item N-ch Specification 0.35 (6.2 (9.7 0.022 0.022 1000 0.01 Vendor Package SO-8 Parts Name µPA2755 Remark Dual type elements) Dual type elements) Dual type
N-ch
SO-8
µPA2755
C2-1 C2-2 C2-3 C3-1 C3-2 C4-1 C4-2 C4-3 R8-1 R8-2 R14-1 R14-2
Diode Inductor Inductor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Resistor Resistor Resistor Resistor Resistor Resistor
Onsemi
SOT-323 BAT54AWT1 3225 3216 3216 3216 3225 3225 3216 3216 3216 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 VLF10040T-1R5N VLF10045T-3R3N C3225JC1E226M C3216JB1A226M C3216JB1A226M C3216JB1A226M C3225JC1E226M C3225JC1E226M C3216JB1A226M C3216JB1A226M C3216JB1A226M C1608JB1H104K C1608JB1H104K C1608JB1H223K C1608JB1H223K C1608CH1H821J C1608CH1H102J C1608JB1H103K C1608JB1C225K C1608JB1H104K RR0816P162D RR0816P912D RR0816P153D RR0816P563D RR0816P473D RR0816P182D RR0816P393D RR0816P113D
capacitors parallel capacitors parallel capacitors parallel
capacitors series
capacitors series
(Continued)
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MB39A136
(Continued) Component Onsemi Item Resistor Resistor Resistor Resistor Resistor Specification Vendor Package 1608 1608 1608 1608 1608 Parts Name RR0816P563D RR0816P563D RR0816P823D RR0816P223D RR0816P563D Remark
Electronics Corporation Semiconductor Corporation Corporation SUSUMU Co.,
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APPLICATION NOTE
Setting method PFM/PWM fixed modes setting method each mode, see" FUNCTION DESCRIPTION (10) Control Circuit Block (MODE)". Cautions PFM/PWM mode load current drops rapidly because rapid load change others, tends take time restore overshooting output voltage. result, over-voltage protection operate. this case, solution possible addition load resistance value able restore output voltage over-voltage detection time. Setting method output voltage adjusting output voltage setting zero-power resistance ratio.
Output setting voltage Output setting resistor value
Make sure that setting does exceed maximum on-duty. Calculate on-duty following formula: DMAX_Min RON_Sync IOMAX RON_Main IOMAX RON_Sync IOMAX Minimum value maximum on-duty cycle Power supply voltage switching system Output setting voltage High-side resistance Low-side resistance Maximum load current[A]
DMAX_Min RON_Main RON_Sync IOMAX DS04-27262-2E
MB39A136
Oscillation frequency setting method adjusting resistor value. fOSC 1.09 fOSC resistor value Oscillation frequency [Hz]
oscillation frequency must on-time (tON) become 300ns more. Calculate on-time following formula. fOSC fOSC On-time Power supply voltage switching system Output setting voltage Oscillation frequency [Hz]
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Setting method soft-start time Calculate soft-start time following formula. Soft-start time[s] (Time becoming output 100%) capacitor value
Calculate delay time until soft-start beginning following formula. CVREF 1.455 CVREF Delay time including voltage VREF voltage starts capacitor value capacitor value VREF capacitor value (0.1 [µF] Typ)
Calculate delay time starting while channel already started (UVLO released VREF output before) following formula. 1.455 Delay time starting while channel already started capacitor value Calculate discharge time soft-stop following formula. tdis 1.44 Discharge time tdis capacitor value addition, calculate delay time discharge starting following formula. 7.87 Delay time until discharge start capacitor value
tdis
CTL1
CTL2
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MB39A136
Simultaneous operation plural channels Soft-start/soft-stop operation according same timing channels achieved even connecting shown figure below power supply on/off. <Connection example When adjust soft-start time Make capacitor common. Connect CTL1 CTL2. Note: this case, soft-start time (ts), discharge time (tdis), delay time (td1, td2, td3) decrease half value compared with when capacitor connected each channel.
DC/DC setting
DC/DC DC/DC
MB39A136 CTL1 CTL2
capacitor DC/DC setting
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MB39A136
Setting method over current detection value possible over-current detection value (ILIM) adjusting over-current detection setting resistor value ratio. Calculate over current detection setting resistor value following formula.
ILIM
(200
fOSC
ILIM fOSC Over current detection value ILIM setting resistor value Inductor value Power supply voltage switching system Output setting voltage Oscillation frequency [Hz] High-side resistance
Since over current detection value depends on-resistance FET, over current detection setting resistor value ratio should adjusted consideration temperature characteristics on-resistance. When temperature joint part rises on-resistance increases about times.
Inductor current
VREF
Over-current detection value
ILIM ILIM*
Time
over current detection function used, connect ILIM (ILIM1 ILIM2) VREF pin.
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Selection smoothing inductor inductor value selects value that ripple current peak-to-peak value becomes less maximum load current rough standard. Calculate inductor value this case following formula. IOMAX fOSC IOMAX fOSC Inductor value Maximum load current Ripple current peak-to-peak value Maximum load current ratio (=0.5) Power supply voltage switching system Output setting voltage Oscillation frequency [Hz]
inductor ripple current value limited principle operation necessary this device. However, when uses high-side resistance, switching ripple voltage become small, inductor ripple current value become insufficient. This should solved oscillation frequency reducing inductor value. Select inductor value that meets requirement listed below. VRON fOSC fOSC VRON Inductor value Power supply voltage switching system Output setting voltage Oscillation frequency [Hz] Ripple voltage more recommended) High-side resistance
necessary calculate maximum current value that flows inductor judge whether electric current that flows inductor rated value less. Calculate maximum current value inductor following formula. ILMAX IoMAX fOSC ILMAX IoMAX fOSC Maximum current value inductor Maximum load current Ripple current peak-to-peak value inductor Inductor value Power supply voltage switching system Output setting voltage Oscillation frequency [Hz] Inductor current
ILMAX IoMAX
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Selection SWFET switching ripple voltage generated between drain sources high-side necessary this device operation. Select SWFET on-resistance that satisfies following formula. RON_Main VRON_Main RON_Main VRONMAX ILIM
RON_Main VRON_Main ILIM VRONMAX
High-side resistance Ripple current peak-to-peak value inductor High-side ripple voltage (20mV more recommended) Over current detection value Maximum current sense voltage (240mV less recommended)
Select ratings with margin enough input voltage load current. Ratings with over-current detection setting value more recommended. Calculate necessary rated value high-side low-side following formula. IoMAX IoMAX Rated voltage between gate source voltage Rated voltage between drain source Power supply voltage switching system Rated drain current Maximum load current Ripple current peak-to-peak value inductor
Moreover, necessary calculate loss SWFET judge whether permissible loss SWFET rated value less. Calculate loss high-side following formula. PMainFET PRON_Main PSW_Main PMainFET High-side loss PRON_Main High-side conduction loss PSW_Main High-side loss
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High-side conduction loss PRON_Main IoMAX2 RON_Main
PRON_Main IOMAX RON_Main
High-side conduction loss Maximum load current Power supply voltage switching system Output voltage High-side resistance
High-side loss PSW_Main fOSC (Ibtm Itop High-side loss Power supply voltage switching system Oscillation frequency [Hz] Ripple current bottom value inductor Ripple current value inductor Turn-on time high-side Turn-off time high-side FET[s]
PSW_Main fOSC Ibtm Itop
Calculate Ibtm, Itop, simply following formula. Ibtm IOMAX (on)
Itop IOMAX
(on) IOMAX (on)
Maximum load current Ripple current peak-to-peak value inductor Quantity charge between gate drain high-side Voltage between gate source high-side
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Calculate loss low-side following formula. PSyncFET PRon_Sync* IoMAX2 PSyncFET PRon_Sync IOMAX Ron_Sync Ron_Sync
Low-side loss Low-side conduction loss Maximum load current Power supply voltage switching system Output voltage Low-side on-resistance
transition voltage voltage between drain source low-side generally small, switching loss omitted here small possible disregard gate drive power SWFET supplied therefore SWFET allowable maximum total charge (QgTotalMax) determined following formula. QgTotalMax 0.095 fOSC SWFET allowable maximum total charge Oscillation frequency [Hz]
QgTotalMax fOSC Selection fly-back diode
When conversion efficiency valued, improved property conversion efficiency possible addition fly-back diode. Thought usually unnecessary. effect achieved condition where oscillation frequency high output voltage lower. Select schottky barrier diode (SBD) that forward current small possible. this DC/DC control period electric current flows back diode limited synchronous rectification period because using synchronous rectification method. Therefore, select that electric current back diode doesn't exceed ratings forward current surge peak (IFSM).Calculate forward current surge peak ratings back diode following formula. IFSM IoMAX IFSM IoMAX Forward current surge peak ratings back diode Maximum load current Ripple current peak-to-peak value inductor
Calculate ratings fly-back diode following formula: VR_Fly VR_Fly DS04-27262-2E Reverse voltage fly-back diode direct current Power supply voltage switching system
MB39A136
Selection output capacitor This device supports small ceramic capacitor ESR. ceramic capacitor that ideal reduce ripple voltage compared with other capacitor. tantalum capacitor polymer capacitor when mass capacitor needed ceramic capacitor support. output voltage, ripple voltage switching operation DC/DC generated. Discuss lower bound output capacitor value according allowable ripple voltage. Calculate output ripple voltage from following formula. fOSC ESR)
fOSC
Switching ripple voltage Series resistance component output capacitor Ripple current peak-to-peak value inductor Output capacitor value Oscillation frequency [Hz]
Notes: ripple voltage reduced raising oscillation frequency inductor value besides capacitor. Capacitor frequency characteristic, temperature characteristic, electrode bias characteristic, etc. effective capacitor value might become extremely small depending condition. Note effective capacitor value condition. Calculate ratings output capacitor following formula: Withstand voltage output capacitor Output voltage
Note: Select capacitor rating with withstand voltage allowing margin enough output voltage. addition, allowable ripple current with enough margin, rating. Calculate allowable ripple current output capacitor following formula: Irms Allowable ripple current (effective value) Ripple current peak-to-peak value inductor
Irms
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Selection input capacitor Select input capacitor whose small possible. ceramic capacitor ideal. tantalum capacitor polymer capacitor when mass capacitor needed ceramic capacitor support. power supply voltage, ripple voltage switching operation DC/DC generated. Discuss lower bound input capacitor according allowable ripple voltage. Calculate ripple voltage power supply from following formula. IOMAX fOSC IOMAX fOSC (IOMAX
Switching system power supply ripple voltage peak-to-peak value Maximum load current value Input capacitor value Power supply voltage switching system Output setting voltage Oscillation frequency [Hz] Series resistance component input capacitor Ripple current peak-to-peak value inductor
Notes: ripple voltage power supply reduced raising oscillation frequency besides capacitor. Capacitor frequency characteristic, temperature characteristic, electrode bias characteristic, etc. effective capacitor value might become extremely small depending condition. Note effective capacitor value condition. Calculate ratings input capacitor following formula: VCIN VCIN Withstand voltage input capacitor Power supply voltage switching system
Note: Select capacitor rating with withstand voltage with margin enough input voltage. addition, allowable ripple current with enough margin, rating. Calculate allowable ripple current following formula: Irms IOMAX Irms IOMAX (VIN Allowable ripple current (effective value) Maximum load current value Power supply voltage switching system Output voltage
DS04-27262-2E
MB39A136
Selection boot strap diode Select Schottky barrier diode (SBD), that forward current small possible. electric current that drives gate high-side flows bootstrap circuit. Calculate mean current following formula. Select exceed electric current ratings. fOSC fOSC Forward current Total quantity charge gate high-side Oscillation frequency [Hz]
Calculate ratings boot strap diode following formula: VR_BOOT VR_BOOT Reverse voltage boot strap diode direct current Power supply voltage switching system
Selection boot strap capacitor drive gate high-side FET, bootstrap capacitor must have enough stored charge. Therefore, minimum value target assumed capacitor which store electric charge times that high-side FET. select boot strap capacitor. CBOOT Boot strap capacitor Amount gate charge high-side voltage
CBOOT
Calculate ratings boot strap capacitor following formula: VCBOOT VCBOOT Withstand voltage boot strap capacitor voltage
DS04-27262-2E
MB39A136
Design phase compensation circuit Assume phase compensation circuit 1pole-1zero standard this device. 1pole-1zero phase compensation circuit
Error
Comp.
COMP
INTREF
crossover frequency (fCO) that shows band width control loop DC/DC. higher more excellent rapid response becomes, however, possibility causing oscillation phase margin shortage increases. Though this crossover frequency (fCO) arbitrarily set, make 1/10 oscillation frequencies (fosc) standard, upper limit. Moreover, phase margin least more possible reference. constants phase compensation circuit using following formula target. (VIN ALVCNV RON_Main fOSC IOMAX IOMAX fOSC IOMAX RON_Main ALVCNV Phase compensation resistor value Phase compensation capacitor value Power supply voltage switching system Output setting voltage Oscillation frequency [Hz] Maximum load current value Inductor value Output capacitor value High-side resistance[] Output setting resistor value Level converter voltage gain [V/V] On-duty ALVCNV On-duty ALVCNV 13.6 Cross-over frequency (arbitrary setting) [Hz]
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capacitor assumed standard, when SWFET used large, necessary adjust drive gate high-side FET, bootstrap capacitor must have enough stored charge. Therefore, minimum value target assumed capacitor, which store electric charge times that SWFET. select capacitor value Total amount gate charge respectively: high-side low-side voltage
Calculate ratings capacitor following formula: VCVB VCVB Withstand voltage capacitor voltage
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MB39A136
regulator condition which potential difference between insufficient, decrease voltage happens because power output on-resistance load current (mean current external gate driving current load current internal regulator. Stop switching operation when voltage decreases reaches threshold voltage (VTHL1) under voltage lockout protection circuit. Therefore, oscillation frequency external potential difference regulator using following formula target when this (VTHL1) fOSC ICC) (VTHL1) fOSC Power supply voltage (VIN) Threshold voltage under-voltage lockout protection circuit (3.8 Total amount gate charge respectively: high-side low-side Oscillation frequency [Hz] Power supply current (4.7 10-3[A] Load current (LDO) output on-resistance (100 (The reference value
potential difference small, problem solved connecting pin. conditions input voltage range follows:
input voltage ranges:
Connect VCC. When input voltage range steps over Normal (VCC connected) Normal (VCC connected)
Note that potential difference enough when used, actual machine check carefully operations normal operation, start operation, stop operation. particular, care needed when input voltage range over
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MB39A136
Power dissipation thermal design this considerations power dissipation thermal design necessary most cases because high efficiency. However, they necessary conditions high power supply voltage, high oscillation frequency, high load, high temperature. Calculate internal loss (PIC) following formula. (ICC fOSC) fOSC internal loss Power supply voltage (VIN) Power supply current (4.7 [mA] Max) SWFET total quantity charge (Total with Oscillation frequency[Hz]
Calculate junction temperature (Tj) following formula. Junction temperature (+150 Max) Ambient temperature TSSOP-24 Package thermal resistance °C/W) internal loss
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Board layout Consider points listed below layout design. Provide ground plane much possible mounted face. Connect bypass capacitor connected with pins, switching system parts with switching system (PGND). Connect other connection pins with control system (AGND), separate each GND, pass heavy current path through control system (AGND) much possible. that case, connect control system (AGND) switching system (PGND) right under Connect switching system parts much possible surface. Avoid connection through through-hole much possible. pins switching system parts, provide through hole proximal place, connect with internal layer. most attention loop composed input capacitor (CIN), SWFET, fly-back diode (SBD). Consider making current loop small possible. Place boot strap capacitor (CBOOT1, CBOOT2) proximal pins much possible. This device monitors voltage between drain source high-side voltage between pins. Place input capacitor (CIN) high-side each proximally much possible. Draw wiring from proximal place input capacitor CH2. pin, draw from proximal place source high-side FET. Moreover, large electric current flows momentary pin. Wire linewidth about 0.8mm standard, short possible. Large electric current flows momentary DRVHx DRVLx pins connected with gate SWFET. Wire linewidth about 0.8mm standard, short possible. By-pass capacitor (CVCC, CVREF, CVB) connected with VREF, VCC, resistor (RRT) connected with should placed close much possible. Also connect bypass capacitor with internal layer proximal through-hole. Consider connected with FBx, COMPx pins keep away from Switching system parts much possible because sensitive noise. Moreover, place output voltage setting resistor phase compensation circuit element connected with this close much possible, make short possible. addition, internal layer right under installing part, provide control system (AGND) ripple spike noises, provide ground plane power supply voltage much possible. Switching system parts Input capacitor (CIN), SWFET, Fly-back diode (SBD), Inductor (L), Output capacitor (CO) Note: Each channel number
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Layout example
1pin AGND CBOOT1 CVCC
Layout example switching components High-side Through-hole
Through-hole High-side
Low-side
PGND CVREF
Low-side
PGND (option) (option) PGND
CBOOT2 AGND
AGND PGND connected right under
Surface Internal layer
Output voltage feedback
Output voltage feedback
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REFERENCE DATA
Conversion Efficiency
Conversion Efficiency Load Current
fosc 25°C
Conversion Efficiency
Conversion Efficiency Load Current
fosc 25°C PFM/PWM 0.01
Fixed
Conversion Efficiency
Conversion Efficiency
PFM/PWM 0.01
Fixed
Load Current IO1(A) Load Regulation Output Voltage Load Current
1.30 1.28 MODE VREF fosc 25°C
Load Current Load Regulation Output Voltage Load Current
3.60 3.50 MODE VREF fosc 25°C
Output Voltage
1.24 1.22 1.20 1.18 1.16 1.14 1.12 1.10
Output Voltage VO2(V)
1.26
3.40 3.30 3.20 3.10 3.00
Load Current IO1(A)
Load Current
(Continued)
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(Continued) Load Sudden Change Waveform
A/div
Load Sudden Change Waveform
A/div
µs/div
µs/div
mV/div (1.2 offset)
mV/div (3.3 offset)
fOSC kHz,
fOSC kHz,
Startup Waveform
Stop Waveform
CTL1, V/div
CTL1, V/div
VO2: V/div
VO2: V/div
VO1: V/div ms/div
VO1: V/div ms/div
fOSC kHz, Soft-start setting time (0.24 (0.66 Normal operation Over current protection Under voltage protection operation waveform
V/div
V/div
fOSC
V/div
A/div
µs/div
Normal operation
Over current protection operation
Under voltage protection operation
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USAGE PRECAUTION
configure over maximum ratings.
used over maximum ratings, permanently damaged. preferable device normally operated within recommended usage conditions. Usage outside these conditions have adverse effect reliability LSI.
device within recommended operating conditions.
recommended values guarantee normal operation under recommended operating conditions. electrical ratings guaranteed when device used within recommended operating conditions under conditions stated each item.
Printed circuit board ground lines should with consideration common impedance. Take appropriate measures against static electricity.
Containers semiconductor materials should have anti-static protection made conductive material. After mounting, printed circuit boards should stored shipped conductive bags containers. Work platforms, tools, instruments should properly grounded. Working personnel should grounded with resistance series between body ground.
apply negative voltages.
negative voltages below make parasitic transistor activated, cause malfunctions.
ORDERING INFORMATION
Part number MB39A136PFT-E1 Package 24-pin plastic TSSOP (FPT-24P-M09) Remarks Lead Free version
BOARD ORDERING INFORMATION
Part number MB39A136EVB-01 board version MB39A136EVB-01 Rev2.0 Remarks TSSOP-24
RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION
products Fujitsu Microelectronics with "E1" compliant with RoHS Directive, observed standard lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE). product whose part number trailing characters "E1" RoHS compliant.
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MB39A136
MARKING FORMAT (Lead Free version)
39A136
XXXX
INDEX
Lead Free version
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MB39A136
LABELING SAMPLE (Lead free version)
Lead free mark JEITA logo JEDEC logo
MB123456P
(3N) 1MB123456P-789-GE1 1000
(3N)2 1561190005 107210
PASS
1,000 MB123456P
2006/03/01
ASSEMBLED JAPAN
MB123456P
0605 Z01A 1000
1561190005
part number lead-free product trailing characters "E1".
DS04-27262-2E
MB39A136
MB39A136PFT- RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL
[Fujitsu Microelectronics Recommended Mounting Conditions] Item Condition Mounting Method Mounting times Before opening Storage period From opening reflow When storage period after opening exceeded Storage conditions [Mounting Conditions] (infrared reflow)
260°C 255°C
(infrared reflow) Manual soldering (partial heating method) times Please within years after Manufacture. Less than days Please process within days after baking (125 24h)
70%RH less (the lowest possible humidity)
Main heating
(d')
level Temperature increase gradient Preliminary heating Temperature increase gradient Peak temperature (d') Main heating
Cooling
Average °C/s °C/s Temperature Average °C/s °C/s Temperature Max; more, less Temperature more, less Temperature more, less Temperature more, less Natural cooling forced cooling
Note: Temperature package body Manual soldering (partial heating method) Temperature soldering iron: Time: Five seconds below DS04-27262-2E
MB39A136
PACKAGE DIMENSIONS
24-pin plastic TSSOP Lead pitch Package width package length Lead shape Sealing method Mounting height Weight 0.50 4.40 6.50 Gullwing Plastic mold 1.20 0.08
(FPT-24P-M09)
24-pin plastic TSSOP (FPT-24P-M09)
6.50±0.10(.256±.004)
Note Pins width pins thickness include plating thickness. Note Pins width pins thickness include plating thickness. Note These dimensions include resin protrusion.
0.145±0.045 (.0057±.0018)
BE-MARK 4.40±0.10 6.40±0.20 (.173±.004) (.252±.008)
INDEX
Details part
1.10 -0.15
+0.10 +.004
(Mounting height)
.043 -.006
0.50(.020)
0.20 -0.02 .008
+0.07 +.003 -.001
0.13(.005)
0~8°
0.60±0.15 (.024±.006)
0.10±0.05 (Stand off) (.004±.002)
0.10(.004)
2007-2008 FUJITSU MICROELECTRONICS LIMITED F24032S-c-2-3
Dimensions (inches). Note: values parentheses reference values.
Please confirm latest Package dimension following URL.
DS04-27262-2E
MB39A136
CONTENTS
page DESCRIPTION FEATURES APPLICATION ASSIGNMENT DESCRIPTION BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FUNCTION DESCRIPTION PROTECTION FUNCTION TABLE EQUIVALENT CIRCUIT DIAGRAM EXAMPLE APPLICATION CIRCUIT PARTS LIST APPLICATION NOTE REFERENCE DATA USAGE PRECAUTION ORDERING INFORMATION BOARD ORDERING INFORMATION RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION MARKING FORMAT (Lead Free version) LABELING SAMPLE (Lead free version) MB39A136PFT- RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL PACKAGE DIMENSIONS
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MEMO
DS04-27262-2E
MB39A136
MEMO
DS04-27262-2E
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MEMO
DS04-27262-2E
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FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ further information please contact: North South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 Arques Avenue, Sunnyvale, 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 Korea FUJITSU MICROELECTRONICS KOREA LTD. Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://kr.fujitsu.com/fmk/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. Lorong Chuan, #05-08 Tech Park 556741 Singapore +65-6281-0770 +65-6281-0220 http://www.fmal.fujitsu.com/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. 3102, Bund Center, No.222 Road (E), Shanghai 200002, China +86-21-6146-3688 +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, Canton Road, Tsimshatsui, Kowloon, Hong Kong +852-2377-0226 +852-2376-3269 http://cn.fujitsu.com/fmc/en/
Specifications subject change without notice. further information please contact each office. Rights Reserved. contents this document subject change without notice. Customers advised consult with sales representatives before ordering. information, such descriptions function application circuit examples, this document presented solely purpose reference show examples operations uses FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does warrant proper operation device with respect based such information. When develop equipment incorporating device based such information, must assume responsibility arising such information. FUJITSU MICROELECTRONICS assumes liability damages whatsoever arising information. information this document, including descriptions function schematic diagrams, shall construed license exercise intellectual property right, such patent right copyright, other right FUJITSU MICROELECTRONICS third party does FUJITSU MICROELECTRONICS warrant non-infringement third-party's intellectual property right other right using such information. FUJITSU MICROELECTRONICS assumes liability infringement intellectual property rights other rights third parties which would result from information contained herein. products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated accompanying fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), requiring extremely high reliability (i.e., submersible repeater artificial satellite). Please note that FUJITSU MICROELECTRONICS will liable against and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. Exportation/release products described this document require necessary procedures accordance with regulations Foreign Exchange Foreign Trade Control Japan and/or export control laws. company names brand names herein trademarks registered trademarks their respective owners. Edited: Sales Promotion Department
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