ASSP Power Management Applications (General Purpose DC/DC Converter)
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DS04-27260-2E
ASSP Power Management Applications (General Purpose DC/DC Converter)
DC/DC Converter with Synchronous Rectification
MB39C011A
DESCRIPTION
MB39C011A two-channel DC/DC converter suitable down-conversion that utilizes synchronous rectification pulse width modulation (PWM). MB39C011A operate over wide range power supply voltages (4.5 making optimal built-in power supply digital audio visual equipment various other electronic devices.
FEATURES
Wide range power supply voltages Supports high frequency operation (Max) Supports synchronous rectification method (CH1,CH2) arbitrary output voltage configured using external resistance. Built-in standby function (Typ) current consumption (Typ, quiescence) Built-in soft-start circuit that control each channel separately independent load Built-in timer latch type short-circuit protection circuit (shares soft-start capacitor). Built-in totem pole type output stage external P-ch/N-ch devices Package TSSOP-16-pin
APPLICATIONS
Digital Photocopiers Surveillance cameras Set-top boxes (STB) players, recorders Projectors phones Vending machines Consoles other non-portable devices
Copyright©2007-2008 FUJITSU MICROELECTRONICS LIMITED rights reserved 2008.8
MB39C011A
ASSIGNMENT
(TOP VIEW)
OUT1-1 OUT1-2 -INE1 CSCP1
OUT2-1 OUT2-2 -INE2 CSCP2
(FPT-16P-M07)
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MB39C011A
DESCRIPTIONS
Name OUT1-1 OUT1-2 -INE1 CSCP1 CSCP2 -INE2 OUT2-2 OUT2-1 Description Power supply reference voltage circuit control circuit. Output P-ch drive (drives gate external High side FET). Output N-ch drive (drives gate external side FET). Power supply N-ch drive circuit Triangular-wave oscillation frequency setting resistor connection pin. Error amplifier (Error Amp1) output pin. Error amplifier (Error Amp1) inverted input pin. Timer-latch short-circuit protection circuit capacitor connection pin. Timer-latch short-circuit protection circuit capacitor connection pin. Error amplifier (Error Amp2) inverted input pin. Error amplifier (Error Amp2) output pin. Ground reference voltage circuit, control circuit, output circuit. Power supply control pin. becomes stand-by mode setting level. Output N-ch drive (drives gate external side FET). Output P-ch drive (drives gate external High side FET). Power supply N-ch drive circuit
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MB39C011A
BLOCK DIAGRAM
-INE1
step-down
Error Amp1 Comp.1 Drive1-1 P-ch (1.0
(1.8
(2.3u) (1.0u)
(2.3u) (1.0u)
OUT1-1
Drive1-2 N-ch
OUT1-2
step-down -INE2
Error Amp2 Comp.2 Drive2-1
(3.3
P-ch (1.0
OUT2-1
Drive2-2 N-ch
OUT2-2
Comp.2 (1.7 (0.7 (1.7 (0.7 Comp.1
CSCP2
(1.9 (2.0
(Vcc-5
(1.9 CSCP1
Bias Voltage
Latch Reset UVLO
(2.0
ErrorAmp Ref. (1.0 Power ON/OFF
bias
Bias Voltage
H:ON (Power L:OFF(Standbymode) VTH=1.4
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MB39C011A
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Symbol Input voltage VINE VCTL Output current Peak output current Power dissipation Storage temperature TSTG (When connected pin) -INE1, -INE2 pins OUT1-1, OUT1-2, OUT2-1, OUT2-2 pins Duty 1/fosc Duty) Condition Rating 1060* Unit
When mounted square double-sided epoxy circuit board. WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings.
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MB39C011A
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage output current output current input voltage Input voltage input voltage Output current Oscillation frequency Timing resistor capacitor capacitor CSCP1, CSCP2 capacitor Operating ambient temperature Symbol VINE VCTL IOUT fOSC CSCP1, CSCP2 (When connected pin) -INE1, -INE2 pins OUT1-1, OUT1-2, OUT2-1, OUT2-2 pins CSCP1, CSCP2 pins Condition Value 0.047 2000 Unit
WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their representatives beforehand.
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MB39C011A
ELECTRICAL CHARACTERISTICS
Parameter Under Voltage Lockout Protection Circuit Block [UVLO] Short-circuit protection circuit Block [SCP] Triangular Wave Oscillator Block [OSC] Soft-Start Block [CS] Threshold voltage Hysteresis width Threshold voltage Input source current Reset voltage Oscillation frequency Charge current Threshold voltage Input bias current Voltage gain Error Block [Error Amp1, Error Amp2] Frequency bandwidth Output voltage Output source current Output sink current Comparator Block Threshold [PWM Comp.1, voltage Comp.2] Bias Voltage Block [VH] Bias Voltage Block [VB] Output voltage Output voltage Symbol VTLH VTHL ICSCP VRST fosc CSCP1, -INE1 -INE2 Duty cycle Duty cycle Condition Value 0.99 0.2* 1.00 5.0* 1.01 Unit
ISOURCE ISINK VT100
(Continued)
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(Continued) Parameter Symbol Condition OUT1-1 OUT2-1 Duty OUT1-2 OUT2-2 Duty connect VH-GND OUT1-1 OUT2-1 Duty OUT1-2 OUT2-2 Duty 500* Value Unit
Output source current ISOURCE
Output sink current ISINK Output Block [Drive1 Output resistor
500*
OUT1-1, OUT1-2, OUT2-1, OUT2-2 OUT1-1, OUT2-1 OUT1-2, OUT2-2 OUT1-1, OUT2-1 OUT1-2, OUT2-2
Dead time
OUT1-1, OUT2-1 OUT1-2, OUT2-2 active mode standby mode
input voltage Control Block Input current Standby current General Power supply current
ICTLH ICTLL ICCS
Standard design value
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MB39C011A
TYPICAL CHARACTERISTICS
Power supply current Power supply voltage Power supply current (mA)
bias voltage Power supply voltage
bias voltage VB(V)
Power supply voltage bias voltage bias output current
Power supply voltage bias voltage Operating ambient temperature
bias voltage
-100
bias voltage
+100
bias output current (mA) Voltage between Power supply voltage Voltage between Voltage between
Operating ambient temperature Voltage between bias output current
Power supply voltage
bias output current (mA) (Continued)
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(Continued) Voltage between Operating ambient temperature Voltage between
Triangular-wave generator frequency fosc (kHz)
+100
Triangular-wave generator frequency Timing resistance
10000
1000
Operating ambient temperature Triangular-wave generator frequency Power supply voltage
Timing resistance Triangular-wave generator frequency Operating ambient temperature
Triangular-wave generator frequency fosc (kHz)
Triangular-wave generator frequency fosc (kHz)
fosc
fosc
+100
Power supply voltage Error threshold voltage Operating ambient temperature Error threshold voltage VTH(V)
1.05 1.04 1.03 1.02 1.01 1.00 0.99 0.98 0.97 0.96 0.95 +100
Operating ambient temperature Power dissipation Operating ambient temperature
1200
Power dissipation PD(mW)
1060 1000 +100 +125
Operating ambient temperature
Operating ambient temperature DS04-27260-2E
MB39C011A
FUNCTIONAL DESCRIPTION
DC/DC Converter Block
Triangular Wave Oscillator Block (OSC) triangular wave oscillator block built-in capacitor setting oscillator frequency. triangular wave generated connecting resistor selecting frequency triangular wave (pin triangular wave input internally comparator Error Amplifier Block (Error Amp1, Error Amp2) error amplifiers (Error Amp1, Error Amp2) detect DC/DC converter output voltages output control signals. output voltages arbitrary level externally connecting output voltage setting resistors error amplifier inverted input pins. addition, arbitrary loop gain connecting feedback resistor capacitor from error amplifier output (FB1 (pin (pin 11)) inverted input terminal (-INE1 (pin -INE2 (pin 10)), enabling stable phase compensation system. Connecting soft-start capacitor CSCP1 CSCP2 pins (pins prevents rush currents when turned Using error amplifier soft-start detection makes soft-start time constant, independent output load DC/DC converter. Comparator Block (PWMComp.) comparator circuit voltage-pulse width converter controlling output duty error amplifiers (Error Amp1, Error Amp2) depending their output voltage. comparator circuit compares triangular wave generated triangular wave oscillator error amplifier output voltage turns external output transistor during interval which triangular wave voltage lower than error amplifier output voltage. Output Block (Drive1-1, 1-2, Drive2-1, 2-2) output circuit consists CMOS drivers both high side side, capable driving external P-ch high side external N-ch side. Power Supply Control Block (CTL) DC/DC converter into standby mode setting (pin level (the maximum power supply current standby mode µA), into operating mode setting (pin level. Control Function Table (Standby) (Operating)
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Protection Function
Soft-start Circuit prevent rush currents when turned soft-start performed connecting soft-start capacitors (CSCP1 CSCP2) CSCP1 CSCP2 pins (pins When (pin driven level begins operation (VCC UVLO threshold voltage), external soft-start capacitors (CSCP1 CSCP2) connected CSCP1 CSCP2 pins (pins charged charging current obtained from following formula. 10-5 Charge current Timing resistance
error amplifier output (FB1 (pin (pin 11)) determined comparing voltages non-inverted input pins (whichever internal reference voltage CSCP1 CSCP2 pins (pin lowest voltage) against inverted input voltages (-INE1 (pin voltage, -INE2 (pin voltage). During soft-start period, determined comparing internal reference voltage against voltages CSCP1 CSCP2 pins (pins DC/DC converter output voltages rise proportion voltages CSCP1 CSCP2 pins (pins soft-start capacitors (CSCP1 CSCP2) connected CSCP1 CSCP2 pins (pins charged. soft-start time found from following formula. 0.019 CSCP Soft-start time (time output voltage 100%) CSCP Capacitance CSCP [µF] Timing resistance
reference voltage
CSCP voltage
Error block -INE1 (-INE2) voltage
Soft start time
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Soft-start circuit
(-INE2) -INE1
Ic1[A] 10-5/RT Ic2[A] 10-5/RT Timing resistor
priority
Error
CSCP1
(1.0
CSCP
(CSCP2) (FB2)
UVLO
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Timer-Latch Short-Circuit Protection Circuit Each channel short-circuit detection comparator (SCP Comp1 Comp2) that constantly compares output level error amplifier against reference voltage. While DC/DC converter load conditions remain stable, error amplifier output does change short-circuit protection comparator remains equilibrium state. this time, CSCP1 CSCP2 pins (pins maintain voltage from when soft-start finished (about output voltage DC/DC converter falls drastically short-circuit other load conditions, output voltage error amplifier rises more, external CSCP1 CSCP2 capacitors further charged. When CSCP1 CSCP2 capacitors charged about latch that turns external P-ch/N-ch MOSFETs (dead time 100%). this time, latch input closed CSCP1 CSCP2 pins (pins held level. Once protection circuit been activated, reset allowing (pin voltage (minimum) loss turning power again. tCSCP 0.019 CSCP tCSCP CSCP Short-circuit detection time Capacitance CSCP [µF] Timing resistance
Timer-latch short-circuit protection circuit
(FB2) Error Amp1
-INE1 (-INE2)
(1.0
Comp.
(1.9 Drive CSCP1
(CSCP2) (2.0 Latch
UVLO
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MB39C011A
Soft-start short-circuit protection timing chart
CSCP voltage
Soft-start time
Short-circuit detection time
tcscp
Output short
Output short
When (pin level becomes active, voltages CSCP1 CSCP2 pins (pins rise capacitors attached externally CSCP1 CSCP2 pins (pins being charged. During this time, Error Amp1 Error Amp2 controlled CSCP1 CSCP2 pins (pins -INE1 -INE2 pins (pins inputs, thus performing softstart. When CSCP1 CSCP2 pins (pins reach more, Error Amp1 Error Amp2 become controlled internal reference voltage -INE1 -INE2 (pins inputs, output voltage held constant level. CSCP1 CSCP2 pins (pins clamped about When there short circuit load error amplifier output becomes more, shortcircuit protection comparator (SCP Comp.) activated CSCP1 CSCP2 capacitors charged further. short-circuit load cleared within short-circuit detection time tCSCP, CSCP1 CSCP2 pins (pins return clamping voltage about When there short-circuit load error amplifier output becomes more, shortcircuit protection comparator (SCP Comp.) activated CSCP1 CSCP2 capacitors charged further. latch when load short-circuit released even short-circuit detection time tCSCP passes, external P-ch/N-ch turned off, CSCP1,CSCP2 pins (pins hold level.
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MB39C011A
Notes output stopped short-circuit protection (SCP) function when DC/DC output shortcircuited etc. However, care needs taken because short-circuit protection (SCP) function will stop output when half short-circuit occurs. Measures such placing fuse input used this situation. Half short-circuit refers short-circuit condition where overcurrent flows, sufficient reduce output voltage.] event that output short current flows that exceeds capacity input power supply, power supply voltage drop. power supply voltage this time drops below output stopped under voltage lockout protection circuit (UVLO). However, once input power supply voltage recovers after output been stopped, output will begin again. Care needs taken because this situation result repeating cycle "short-circuit power-supply voltage drop output stop power-supply voltage recovery output start short-circuit". There putting fuse input etc. measures. Notes short-circuit protection (SCP) function when DC/DC converter started/stopped. output also stopped short-circuit protection (SCP) function under following conditions. Operations that input power supply (for example, shorting input power supply pin). During transition period when input power supply voltage (VIN) changing (such when input power supply turned turned off), condition that input power supply voltage (VIN) output setting voltage (VO). Although this normal operation, example startup output stopped following process. DC/DC converter output begins when UVLO threshold voltage. period time occurs where input power supply voltage (VIN) output voltage setting (VO), duty cycle becomes 100% error amplifier output rises above feedback control. output stopped after short-circuit detection time elapsed.
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Example where output stops when DC/DC converter activated input power supply (example output stopped during startup) Voltage Input power supply voltage CTL) Output voltage setting Output voltage (VO) Time
this case, output prevented from being stopped function during startup controlling independently. Example DC/DC converter being started Voltage
Input power supply voltage Output voltage setting
Output voltage (VO)
Time
Furthermore, when turning input power supply, before turning input power supply.
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MB39C011A
Under Voltage Lockout Protection Circuit (UVLO) drop power supply voltage cause malfunction, resulting breakdown degradation system. prevent such malfunctions, under voltage lockout protection circuit detects decreases voltage power supply voltage, locks, OUT1-1 (pin OUT2-1 (pin level OUT1-2 (pin OUT2-2 (pin level. system restored voltage rises above threshold voltage under voltage lockout protection circuit. Function Table When Protection Circuit (UVLO) Operating When UVLO circuit operating (the voltage below UVLO threshold voltage), following pins fixed following logic levels. OUT1-1 OUT1-2 OUT2-1 OUT2-2 CSCP1 CSCP2
Operation When Turned When turned internal reference voltages begin rise. When exceeds threshold voltage (VTH) UVLO (under voltage lockout protection circuit), UVLO released, output drive circuits each channel allowed operate. When off, output drive circuit each channel locked full state CSCP1 CSCP2 pins (pins fixed level, even UVLO circuit clear state. When internal reference voltages begin fall when falls below threshold voltage UVLO (under voltage lockout protection circuit), UVLO circuit activated. Independent Control Each Channel on/off state each output voltage controlled independently externally connecting CSCP1 CSCP2 pins (pins drain NMOS transistor NMOS open drain microcontroller, etc. When CSCP1 CSCP2 pins (pins level turning external NMOS transistor, output voltage turns off. Furthermore, when external NMOS transistor turned off, soft-start function begins output voltage turns Note that internal operation continues when output voltages turned using CSCP1 CSCP2 pins (pins (pin level enter standby mode (the maximum power supply current standby mode µA).
MB39C011A
CSCP1 CTL1 CSCP2 CTL2
CTL1 CTL2
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MB39C011A
SWITCHING SCHEME SELECTION
This device operate even synchronous rectification asynchronous rectification. There superiority inferiority respectively. Select switching type considering features guide. Switching type Asynchronous rectification Parts Feature
Superior cost advantages Under large load currents output voltages, P-ch Fly-back diode inefficient because generation heat Fly-back diode (SBD) large. P-ch N-ch Offers balance between cost efficiency. Supports large load currents output voltages Emphasis efficiency (particularly effective high oscillator frequencies) Supports large load currents output voltages Because increased number parts, cost disadvantage.
Synchronous rectification
P-ch N-ch Fly-back diode
SETTING OUTPUT VOLTAGE
output voltage arbitrary value ratio feedback resistance -INE1 (-INE2). output voltage value higher than reference voltage Error Amp. Under usage conditions where duty cycle less, much possible.
Duty cycle Power supply voltage switching system Output setting voltage Output voltage setting resistors
Vo1,2
(-INE2) -INE1
Error
(R1+R2)
(CSCP2) CSCP1
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MB39C011A
SETTING TRIANGULAR OSCILLATION FREQUENCY
triangular oscillation frequency determined timing resistor (RT) connected (pin fosc 0.001
122.4
fosc Triangular oscillation frequency [kHz] Timing resistance upper limit oscillation frequency that depends junction temperature duty cycle. recommended that device used within range shown following graph. Oscillation frequency Junction temperature
2100
Oscillation frequency fosc (kHz)
1900 1700 1500 1300 1100
Junction temperature
+120
Note Refer "Power dissipation thermal design" details calculating junction temperature. Power dissipation thermal design necessary examine high power-supply voltage, high oscillation frequency, high temperature. Also within range "Oscillation frequency Junction temperature". junction temperature investigated from internal power dissipation internal power dissipation (PIC) given following formula. (ICC fosc) fosc Internal power dissipation Power supply voltage (VIN [V]) Power supply current (3.3 Max) Total electric charge (Vgs Oscillation frequency [Hz]
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MB39C011A
junction temperature given following formula. Junction temperature Max) Ambient temperature TSSOP-16 package thermal resistance °C/W) Internal power dissipation
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Synchronous rectification, (VCC Duty cycle Oscillation frequency
Synchronous rectification, V(VB Duty cycle Oscillation frequency
Duty cycle D(%)
Duty cycle D(%)
Applicability
Applicability
1000
1500
2000
1000
1500
2000
Oscillation frequency fosc(kHz) Asynchronous rectification, V(VCC Duty cycle Oscillation frequency
Oscillation frequency fosc(kHz) Asynchronous rectification, V(VB Duty cycle Oscillation frequency
Duty cycle D(%)
Duty cycle D(%)
Applicability
Applicability
1000
1500
2000
1000
1500
2000
Oscillation frequency fosc(kHz)
Oscillation frequency fosc(kHz)
Notes Refer SETTING OUTPUT VOLTAGE" details calculating duty cycle. When using outside ranges shown above graphs, check jitter other adverse effects output voltage before use.
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MB39C011A
SETTING SOFT-START SHORT-CIRCUIT DETECTION TIMES
soft-start time short-circuit detection time using CSCP pins. Both become same time. tCSCP 0.019 CSCP tCSCP CSCP Soft-start time (time output voltage 100%) Short-circuit detection time CSCP capacitor [µF] Timing resistance
CONNECTIONS CONDITION VOLTAGE
range there chance that voltage*1 voltage*2 drop internal regulator saturating. result, there drive voltage shortage bird clapper FET. therefore recommended that (pin (pin connected shown connection table". Voltage between (pin (pin Voltage between (pin (pin connection table condition Used with crossing (ex.
Connected capacitor connection*4 capacitor connection*4
Connected capacitor connection*4 capacitor connection*4
Check that switching operation functioning normally. Refer connection (pin (pin BLOCK DIAGRAM".
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MB39C011A
Transition diagram voltage voltage pin: capacitor connection, pin: capacitor connection)
Voltage
voltage voltage
voltage
voltage
Power supply voltage
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DESIGN PHASE COMPENSATION CIRCUIT
Phase compensation circuit when capacitor used output capacitor
When low-ESR capacitor such ceramic capacitor used output capacitor, becomes easy vibrate phase delay 180° generated resonant frequency this case, common phase compensation circuit that advance phase, such 2-pole/2-zero circuit. 2-pole/2-zero phase compensation circuit
VO1,VO2
-INE1,-INE2 Vref
FB1,FB2 Error Amp1,Amp2
Comp.1,2
constants phase compensation circuit using following formula guide. frequency (fCO) crossover, which band width control loop DC/DC shown, height excellent rapid response. However, vibration generated insufficient phase margin. Although crossover frequency (fCO) value, maximum value must oscillation frequency (fOSC), oscillation frequency (fOSC) preferable. Furthermore, crossover frequency (fCO) should such that phase margin minimum 30°, more than preferable. fESR Resonant frequency [Hz] coil output capacitor Resonant frequency [Hz] output capacitor
fESR
fESR (R1//R3) fESR fLC2
Crossover frequency (arbitrary setting) [Hz] Switching system power supply voltage
R1//R3 Resistance connected parallel
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Notes phase compensation circuit constants
Select constants following three points select constant design phase compensation circuit when large load sudden change, capacitor connected DC/DC converter operating. particular, capacitance much larger than output capacitance DC/DC converter connected hard-switching while DC/DC converter operating, output voltage begin vibrating protection function activated, sudden response. Note following points. Error output (FB1 pins) current capacity resistance constants phase compensation circuit need designed considering current capacities Error outputs (FB1 pins (pins 11)). Take output source current Max) Error threshold voltage VT100 (1.7 Typ) Comp into consideration, select resistance values such that following formula satisfied. [µA] R1//R2//R3 R1//R2//R3 Resistance connected parallel
Although resistance values desired improve noise immunity, above formula satisfied result. While ideal each resistance values satisfy above formula, this situation values used after confirming that there problems when used under rapidly varying load conditions. Phase margin output load changes Select phase compensation constants that ensure phase margin when output load (resistive load, capacitative load, inductive load) connected. Phase margin reverse current flow from output Under usage conditions where current from DC/DC converter output (VO) flows load sudden change, select phase compensation constants that ensure phase margin even when reverse current flow occurs. Example measuring phase margin during reverse current flow
DC/DC
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HANDLING UNUSED CHANNEL PINS WHEN USING SINGLE CHANNEL
Although this device 2-channel DC/DC converter control also able used 1-channel DC/DC converter handling pins unused channel shown following diagram. Connection when used
"Open" "Open" "Open"
OUT1-1 OUT1-2
-INE1 CSCP1
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MB39C011A
Connection when used
OUT2-1 OUT2-2
"Open" "Open" "Open"
-INE2 CSCP2
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EQUIVALENT CIRCUIT
bias voltage block>
<CTL block>
<Triangular wave oscillator block>
<PWM comparator block>
Each channel (Continued)
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MB39C011A
(Continued) <Soft-start block, Error block>
CSCPx
-INEx
<Output block(OUTx-1)>
bias voltage block>
OUTx-1
<Output block (OUTx-2)>
OUTx-2
Each channel
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EXAMPLE APPLICATION CIRCUIT
MB39C011A -INE2 OUT2-2 CSCP1 CSCP2 OUT2-1 GND2 OUT1-2 -INE1 OUT1-1 GND1
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PARTS LIST
Component Item P-ch N-ch P-ch N-ch Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Resistor Inductor Inductor Specification (Max) (Max) (Max) (Max) (IDC (IDC Component Item Specification Ceramic condenser 0.015 Ceramic condenser 0.015 Ceramic condenser Ceramic condenser Ceramic condenser Ceramic condenser 2200 Ceramic condenser Ceramic condenser Ceramic condenser Ceramic condenser Ceramic condenser (6.3 Ceramic condenser Ceramic condenser (6.3
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PART SELECTION
Coil selection rough guide, choose inductance coil such that peak-to-peak ripple current coil less than maximum load current. inductance this case given following formula. IOMAX fosc
IOMAX fosc
Coil inductance Maximum load current Switching system power-supply voltage Output voltage setting Oscillation frequency [Hz]
When used with asynchronous rectification, recommended that used load current range where coil current continuous order ensure responsiveness load. asynchronous rectification therefore recommended that minimum value load current used basis setting inductance value. IOMIN fosc IOMIN fosc
Coil inductance Minimum load current Switching system power-supply voltage Output voltage setting Oscillation frequency [Hz]
maximum value current flowing through coil needs found order determine whether current flowing through coil within rated value. maximum current flowing through coil given following formula. ILMAX IOMAX fosc
Coil current
ILMAX IOMAX
coil current changes according load current.
IOMIN
Time
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ILMAX IOMAX fosc
Maximum coil current Maximum load current Coil ripple current peak peak value Coil inductance Switching system power-supply voltage Output setting voltage Oscillation frequency [Hz]
selection maximum value current flowing through needs found order determine whether current flowing through within rated value. maximum current flowing through given following formula. IDMAX IOMAX IDMAX IOMAX
Maximum drain current Maximum load current Coil ripple current peak peak value
Furthermore, power dissipation needs found order determine whether power dissipation within rated value. power dissipation given following formula. High side (P-ch FET) power dissipation PHiSideFET PRon PRon High side (P-ch FET) conduction loss PRon IOMAX2 IOMAX Maximum load current Switching system power supply voltage Output voltage High side resistance fOSC (Ibtm Itop
High side (P-ch FET) switching loss fosc Ibtm Switching system power supply voltage Oscillation frequency [Hz] Bottom value ripple current coil Ibtm IOMAX Itop
value ripple current coil
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Itop IOMAX
Coil ripple current peak peak value Turn-on time High side Turn-off time High side
simply obtained following formula. (on) (on)
Quantity charge between gate drain High side Absolute value voltage difference between gate source High side Vgs(on) side FET(N-ch FET) PLoSideFET PRon IOMAX2 conduction loss PRon IOMAX side conduction loss Maximum load current Switching system power supply voltage Output voltage side resistance
select FETs that offer good conversion efficiency, High side particular should select such that switching loss small (the power dissipated when changes between OFF). However, because there generally trade-off between switching loss conduction loss, this balance needs considered when making selection. guide, select FETs such that total FETs follows. QgHiSideFET< 0.04 fosc QgLoSideFET< 0.04 fosc
QgHiSideFET total electric charge High side FETs QgLoSideFET total electric charge side FETs fosc Oscillation frequency [Hz] FETs used with this device typically have drive voltage Although there FETs that support drive voltage less than drive voltage FETs generally have larger even equal value Ron, efficiency lowers. with drive voltage used, check that side does self turnon that dead-time secured under usage conditions.
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Fly-back diode selection Select Schottky barrier diode (SBD) that small forward voltage drop. peak current flowing through Fly-back diode needs found order determine whether current flowing through Fly-back diode within rated value. When DC/DC converter used with asynchronous rectification, maximum current through Fly-back diode given following formula. IOMAX IOMAX Forward current Maximum load current Coil ripple current peak peak value
Furthermore, power dissipation Fly-back diode needs found order determine whether power dissipation Fly-back diode within rated value. power dissipation Fly-back diode given following formula. PSBD IOMAX PSBD IOMAX
Fly-back diode power dissipation Maximum load current Switching system power supply voltage Output voltage Forward voltage
When DC/DC converter used with synchronous rectification, length time that current flows through Fly-back diode limited synchronous rectification period (dead time). example, oscillating frequency kHz, proportion time that current flows less than Therefore, select that Fly-back diode current does exceed peak forward surge current (IFSM) rated value. peak forward surge current value given following formula. IFSM IOMAX IFSM IOMAX
Peak forward surge current value Fly-back diode Maximum load current Coil ripple current peak peak value
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Output capacitor selection Because ripple voltage increases large, capacitor needs used order reduce ripple voltage. However, using capacitor with large effect phase characteristics loop, care needs taken prevent system from losing stability. Furthermore, capacitor that used should have sufficient tolerance ripple current. taking into account switching ripple voltage, minimum necessary capacitance given following formula. fosc (VO/IL ESR) Series resistance element output capacitance Switching ripple voltage Coil ripple current peak peak value Output capacitance Oscillation frequency [Hz]
fosc
When capacitive load connected, recommended that DC/DC converter output capacitor have same capacitance load capacitance. allowable ripple current output capacitor given following formula. Irms Irms Allowable ripple current (Root-mean-square value) Coil ripple current peak peak value
Input capacitor selection Select input capacitor that small possible. Ceramic capacitors ideal. large capacitance required that cannot provided ceramic capacitor, polymer capacitor tantalum capacitor with ESR. Furthermore, capacitor that used should have sufficient tolerance ripple current. allowable ripple current given following formula. Irms IOMAX Irms IOMAX (VIN
Allowable ripple current (Root-mean-square value) Maximum load current Switching system power supply voltage Output voltage
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capacitor Although capacitor typically capacitance this needs adjusted being used large following formula provides guide lower limit capacitor. this lower limit exceeds formula guide capacitance. CVBmin QgLoSideFET CVBmin QgLoSideFET Lower limit capacitor [µF] total electric charge side FETs [nC]
capacitor capacitor typically capacitance (when capacitor µF). However, this needs adjusted, capacitor exceeds being used large following formula provides guide lower limit capacitor. this lower limit exceeds formula guide capacitance. Large either CVHmin 0.01 QgHiSideFET CVHmin CVHmin QgHiSideFET Lower limit capacitor [µF] total electric charge high side FETs [nC] Capacitance capacitor [µF]
DS04-27260-2E
MB39C011A
LAYOUT
Consider following points when designing layout Make input capacitor (Cin), FET, Fly-back diode (SBD), coil (L), output capacitor (Cout) connections surface much possible, avoid making connections with through-holes. Take most care with loop consisting input capacitor (Cin), FET, Fly-back diode (SBD), make current loop small possible. Create through-hole directly next pins input capacitor (Cin), FET, Fly-back diode (SBD), output capacitor (Cout), connect these system inner layer. Large currents flow momentarily through wiring OUTx-x pins that connected gates. wiring width about guide, make wiring short possible. Arrange bypass capacitors that connected VCC, pins (pins near pins possible. Furthermore, connect by-pass capacitor with nearest (Create through-hole directly next (pin pins bypass capacitors reinforce connection inner ground layer). wiring -INE1, -INE2, FB1, FB2, pins (pins sensitive noise should made short possible. Furthermore, feedback line from output (VO) should kept away from system components possible. Create much ground plane side where mounted possible. prevent creating large current path control system GND, connect this PGND system GND) single point. Example arranging system parts
SWFET
wiring example
system
SWFET
system
Cout
system Feedback line -INE Control system
Control system Control system system connected point. Through-hole
Surface
(Layer1)
layer
(Layer2)
DS04-27260-2E
MB39C011A
REFERENCE DATA
Conversion Efficiency Load Current
Conversion Efficiency Load Current
Conversion Efficiency
Conversion Efficiency
fosc
fosc
Load Current
Load Current
Output Voltage Load Current
1.84 1.83
3.34 3.33
Output Voltage Load Current
Output Voltage
Output Voltage
1.82 1.81 1.80 1.79 1.78 1.77 1.76
3.32 3.31 3.30 3.29 3.28 3.27 3.26
VO1=1.8 setting fosc
setting fosc
Load Current
Load Current
(Continued)
DS04-27260-2E
MB39C011A
(Continued) Switching Wave Form Switching Wave Form
OUT-1 OUT-2
OUT-1 OUT-2
fosc
fosc
V/div, ns/div
Sudden Load Variation Waveform
V/div, ns/div
Sudden Load Variation Waveform
A/div
A/div
mV/div
mV/div
µs/div
fosc
µs/div
fosc
Startup Waveform
V/div
V/div
V/div
ms/div
VO1=1.8 fosc Soft start setting time
DS04-27260-2E
MB39C011A
USAGE PRECAUTION
configure over maximum ratings.
used over maximum ratings, permanently damaged. preferable device normally operate within recommended usage conditions. Usage outside these conditions have effect reliability LSI.
device within recommended operating conditions.
recommended operating conditions under which guaranteed operate. electrical ratings guaranteed when device used within recommended operating conditions under conditions stated each item.
Printed circuit board ground lines should with consideration common impedance. Take appropriate measures against static electricity.
Containers semiconductor materials should have anti-static protection made conductive material. After mounting, printed circuit boards should stored shipped conductive bags containers. Work platforms, tools, instruments should properly grounded. Working personnel should grounded with resistance between body ground.
apply negative voltages.
negative voltages below create parasitic transistors lines, which cause malfunctions.
ORDERING INFORMATION
Part number MB39C011APFT-E1 Package 16-pin plastic TSSOP (FPT-16P-M07) Remarks Lead-free version
BOARD ORDERING INFORMATION
Part number MB39C011AEVB-01 board version Board rev.1.0 Remarks TSSOP-16-pin
RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION
products Fujitsu Microelectronics with "E1" compliant with RoHS Directive, observed standard lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE). Products that complied with this standard have "E1" appended part number.
DS04-27260-2E
MB39C011A
MARKING FORMAT (Lead free version)
Lead-free version
INDEX
XXXX
DS04-27260-2E
MB39C011A
LABELING SAMPLE (Lead free version)
Lead-free mark JEITA logo JEDEC logo
MB123456P
(3N) 1MB123456P-789-GE1 1000
(3N)2 1561190005 107210
PASS
1,000 MB123456P
2006/03/01
ASSEMBLED JAPAN
MB123456P
0605 Z01A 1000
1561190005
part number lead-free product trailing characters "E1".
DS04-27260-2E
MB39C011A
MB39C011APFT-E1 RECOMMENDED MOUNTING CONDITIONS
[Fujitsu Microelectronics Recommended Mounting Conditions] Item Condition Mounting Method Mounting times Before opening Storage period From opening reflow When storage period after opening exceeded Storage conditions (infrared reflow), Manual soldering (partial heating method) times Please within years after Manufacture. Less than days Please processes within days after baking (125 24H)
70%RH less (the lowest possible humidity)
[Parameters Each Mounting Method] (infrared reflow) rank
(d')
Temperature Increase gradient Preliminary heating Temperature Increase gradient Actual heating (d')
Cooling
Average °C/s °C/s Temperature 180s Average °C/s °C/s Temperature Max; more, less Temperature more, less Temperature more, less Temperature more, less Natural cooling forced cooling
Note Temperature package body Manual soldering (partial heating method) Conditions Temperature Times max/pin
DS04-27260-2E
MB39C011A
PACKAGE DIMENSIONS
16-pin plastic TSSOP Lead pitch Package width package length Lead shape Sealing method Mounting height Weight 0.65 4.40 5.00 Gullwing Plastic mold 1.10mm 0.06g
(FPT-16P-M07)
Code (Reference)
16-pin plastic TSSOP (FPT-16P-M07)
5.00±0.10(.197±.004)
Note Resin protrusion. (Each side +0.15 (.006) Max). Note These dimensions include resin protrusion. Note Pins width pins thickness include plating thickness. Note Pins width include cutting remainder.
0.17±0.05 (.007±.002)
INDEX
4.40±0.10 6.40±0.20 (.173±.004) (.252±.008)
Details part 1.05±0.05 (Mounting height) (.041±.002) LEAD
0.65(.026)
0.24±0.08 (.009±.003) 0.13(.005)
0~8°
+0.03 +.001
(0.50(.020)) 0.60±0.15 (.024±.006)
0.07 -0.07 .003 -.003 (Stand off) 0.25(.010)
0.10(.004)
©2003-2008 FUJITSU MICROELECTRONICS LIMITED F16020S-c-3-4
2003 FUJITSU LIMITED F16020S-c-3-3
Dimensions (inches). Note: values parentheses reference values.
Please confirm latest Package dimension following URL.
DS04-27260-2E
MB39C011A
CONTENTS
page DESCRIPTION FEATURES APPLICATIONS ASSIGNMENT DESCRIPTIONS BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FUNCTIONAL DESCRIPTION SWITCHING SCHEME SELECTION SETTING OUTPUT VOLTAGE SETTING TRIANGULAR OSCILLATION FREQUENCY SETTING SOFT-START SHORT-CIRCUIT DETECTION TIMES CONNECTIONS CONDITION VOLTAGE DESIGN PHASE COMPENSATION CIRCUIT HANDLING UNUSED CHANNEL PINS WHEN USING SINGLE CHANNEL EQUIVALENT CIRCUIT EXAMPLE APPLICATION CIRCUIT PARTS LIST PART SELECTION LAYOUT REFERENCE DATA USAGE PRECAUTION ORDERING INFORMATION BOARD ORDERING INFORMATION RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION MARKING FORMAT (Lead free version) LABELING SAMPLE (Lead free version) MB39C011APFT-E1 RECOMMENDED MOUNTING CONDITIONS PACKAGE DIMENSIONS
DS04-27260-2E
MB39C011A
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ further information please contact: North South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 Arques Avenue, Sunnyvale, 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 Korea FUJITSU MICROELECTRONICS KOREA LTD. KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA LTD. Lorong Chuan, #05-08 Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw
Rights Reserved. contents this document subject change without notice. Customers advised consult with sales representatives before ordering. information, such descriptions function application circuit examples, this document presented solely purpose reference show examples operations uses FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does warrant proper operation device with respect based such information. When develop equipment incorporating device based such information, must assume responsibility arising such information. FUJITSU MICROELECTRONICS assumes liability damages whatsoever arising information. information this document, including descriptions function schematic diagrams, shall construed license exercise intellectual property right, such patent right copyright, other right FUJITSU MICROELECTRONICS third party does FUJITSU MICROELECTRONICS warrant non-infringement third-party's intellectual property right other right using such information. FUJITSU MICROELECTRONICS assumes liability infringement intellectual property rights other rights third parties which would result from information contained herein. products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated accompanying fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), requiring extremely high reliability (i.e., submersible repeater artificial satellite). Please note that FUJITSU MICROELECTRONICS will liable against and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. Exportation/release products described this document require necessary procedures accordance with regulations Foreign Exchange Foreign Trade Control Japan and/or export control laws. company names brand names herein trademarks registered trademarks their respective owners.
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