ASSP Power Management Applications DC/DC Converter Built-in Switc

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ASSP Power Management Applications DC/DC Converter Built-in Switc

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DS04-27254-2E
ASSP Power Management Applications
DC/DC Converter Built-in Switching FET, Synchronous Rectification, Down Conversion Support
MB39C015
DESCRIPTION
MB39C015 current mode type 2-channel DC/DC converter built-in voltage detection, synchronous rectifier, down conversion support. device integrated with switching FET, oscillator, error amplifier, control circuit, reference voltage source, voltage detection circuit. External inductor decoupling capacitor needed only external component. combining with external parts enables DC/DC converter with compact high load response characteristic, this suitable built-in power supply such mobile phone/PDA, DVDs, HDDs.
FEATURES
High efficiency (Max) Output current (DC/DC) mA/ch (Max) Input voltage range Operating frequency (Typ) flyback diode needed dropout operation 100% duty Built-in high-precision reference voltage generator 1.30 Consumption current shutdown mode less Built-in switching P-ch (Typ) N-ch (Typ) High speed input load transient response current mode Over temperature protection Packaged compact package QFN-24
APPLICATIONS
Flash ROMs players Electronic dictionary devices Surveillance cameras Portable navigators drives phones Network hubs Mobile phones etc.
Copyright©2008 FUJITSU MICROELECTRONICS LIMITED rights reserved 2008.8
MB39C015
ASSIGNMENT
(Top View)
DGND2 DGND2 DGND1 DGND1 DVDD2 DVDD1
DVDD2
DVDD1
OUT2
OUT1
MODE2
MODE1
VREFIN2
VREFIN1
XPOR
CTLP CTL2 CTL1 AGND AVDD VREF
VDET
(LCC-24P-M09)
DS04-27254-2E
MB39C015
DESCRIPTIONS
8/23 9/22 10/21 13/18 Name CTLP CTL2/CTL1 AGND AVDD VREF VDET VREFIN1/VREFIN2 MODE1/MODE2 OUT1/OUT2 DVDD1/DVDD2 LX1/LX2 DGND1/DGND2 XPOR Description Voltage detection circuit block control input pin. Voltage detection function stop Normal operation) DC/DC converter block control input pin. Shut down Normal operation) Control block ground pin. Control block power supply pin. Reference voltage output pin. Voltage detection input pin. Error amplifier (Error Amp) non-inverted input pin. level leave open. Output voltage feedback pin. Drive block power supply pin. Inductor connection output pin. High impedance durng shut down. Drive block ground pin. VDET circuit output pin. Connected N-ch open drain circuit.
DS04-27254-2E
MB39C015
EQUIVALENT CIRCUIT DIAGRAM
LX1,
VREF
VREFIN1, VREFIN2, VDET
OUT1, OUT2
CTL1, CTL2, CTLP
XPOR
MODE1, MODE2
Protection device
DS04-27254-2E
MB39C015
BLOCK DIAGRAM
AVDD CTL1 ON/OFF OUT1 Amplifier DVDD1 DVDD1 DVDD2
IOUT Comparator VREFIN1 Logic Control MODE1 CTLP VDET VREF CTL2 1.30 VREF ON/OFF Amplifier DVDD2 ON/OFF XPOR VOUT1
OUT2
IOUT Comparator VREFIN2 Logic MODE2 Control VOUT2
AGND
DGND1
DGND2
DS04-27254-2E
MB39C015
Current mode Original voltage mode type Stabilize output voltage comparing items below on-duty control. Voltage (VC) obtained through negative feedback output voltage Error Reference triangular wave (VTRI) Current mode type Instead triangular wave (VTRI), voltage (VIDET) obtained through conversion currents that flow oscillator (rectangular wave generation circuit) used. Stabilize output voltage comparing items below on-duty control. Voltage (VC) obtained through negative feedback output voltage Error Voltage (VIDET) obtained through conversion current that flow oscillator (rectangular wave generation circuit)
Voltage mode type model
Current mode type model
Oscillator
VTRI
VIDET
SR-FF
VTRI
VIDET toff
toff
Note above models illustrate general operation actual operation will preferred
DS04-27254-2E
MB39C015
FUNCTION EACH BLOCK
Logic control circuit built-in P-ch N-ch FETs controlled synchronization rectification according frequency (2.0 MHz) oscillated from built-in oscillator (square wave oscillation circuit). IOUT Comparator circuit This circuit detects current (ILX) which flows external inductor from built-in P-ch FET. comparing VIDET obtained through conversion peak current with Error output, builtin P-ch turned Logic Control circuit. Error phase compensation circuit This circuit compares output voltage reference voltages such VREF. This built-in phase compensation circuit that designed optimize operation this This needs neither considered addition phase compensation circuit external phase compensation device. VREF circuit high accuracy reference voltage generated with (bandgap reference) circuit. output voltage 1.30 (Typ). Voltage Detection (VDET) circuit voltage detection circuit monitors voltage VDET pin. Normally, XPOR through pull-up with external resistor. When VDET voltage reaches reaches level. Timing chart example (XPOR pulled VIN)
VUVLO
CTLP
VDET
VTHHPR VTHLPR
XPOR
VUVLO UVLO threshold voltage VTHHPR, VTHLPR XPOR threshold voltage Protection circuit This built-in over-temperature protection circuit. over-temperature protection circuit turns both N-ch P-ch switching FETs when junction temperature reaches When junction temperature comes down switching returned normal operation. Since control circuit this control method current mode, current peak value also monitored controlled required. DS04-27254-2E
MB39C015
Function table Input MODE Shutdown mode Operating mode CTL1 CTL2 Functional Stopped Stopped Functional Stopped Functional CTLP Output function function VDET function Stopped Stopped Functional Stopped Functional Functional Outputs VREF function
Stopped Stopped Functional Stopped Functional Functional Stopped Functional
DS04-27254-2E
MB39C015
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Symbol Condition AVDD DVDD1 DVDD2 OUT1/OUT2 pins Signal input voltage VISIG CTLP, CTL1/CTL2, MODE1/MODE2 pins VREFIN1/VREFIN2 pins VDET XPOR pull-up voltage voltage Peak current VIXPOR XPOR LX1/LX2 pins ILX1/ILX2 Power dissipation Operating ambient temperature Storage temperature TSTG Rating -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 +6.0 +6.0 3125*1, 1563*1, 1250*1, 625*1, +125 Unit
Power dissipation value between obtained connecting these points with straight line. When mounted four-layer epoxy board 11.7 Connection exposure with thermal via. (Thermal holes) Connection exposure pad, without thermal via. Notes: negative voltages below AGND, DGND1, DGND2 create parasitic transistors lines, which cause abnormal operation. This device damaged pins short-circuited AVDD DVDD1/DVDD2, AGND DGND1/DGND2. WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings.
DS04-27254-2E
MB39C015
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage VREFIN voltage voltage current Symbol VREFIN VCTL ILX1/ILX2 AVDD DVDD1 DVDD2 AVDD DVDD1 DVDD2 Condition AVDD DVDD1 DVDD2 CTLP, CTL1, CTL2 Value 0.15 1.30 Unit
VREF output current
IROUT
XPOR current Inductor value
IPOR
Note output current from this device situation decrease power supply voltage (VIN) DC/DC converter output voltage (VOUT) differ only small amount. This result slope compensation will damage this device. WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their representatives beforehand.
DS04-27254-2E
MB39C015
ELECTRICAL CHARACTERISTICS
AVDD DVDD1 DVDD2 VOUT1/VOUT2 setting value MODE1/MODE2 Parameter Input current Output voltage Input stability Load stability input impedance Peak current DC/DC converter block Oscillation frequency Rise delay time NMOS-FET voltage PMOS-FET resistance NMOS-FET resistance leak current Overheating protection (Junction Temp.) SymPin IREFIN VOUT LINE LOAD ROUT fosc VNOFF RONP RONN ILEAKM ILEAKH TOTPH TOTPL VTHHUV VTHLUV VHYSUV LX1/LX2 -100 VDD*2 VDD*2 XPOR XPOR 120* 2.17 2.03 0.08 0.20 135* 110* 2.30 2.15 0.15 0.42 16.0 160* 125* 2.43 2.27 0.25 Condition VREFIN 0.15 VREFIN 0.833 -100 AVDD DVDD1 DVDD2 -100 -800 Output shorted C1/C2 OUT1/OUT2 VOUT LX1/LX2 -100 Value 2.45 2.50 0.30 2.55 0.48 Unit
Protection UVLO threshold circuit voltage block UVLO hysteresis width
XPOR threshold VTHHPR voltage VTHLPR
Voltage detection circuit block
XPOR hysteresis width XPOR output voltage XPOR output current
VHYSPR
Standard design value (Continued) DS04-27254-2E
MB39C015
(Continued) AVDD DVDD1 DVDD2 VOUT1/VOUT2 setting value MODE1/MODE2 Parameter threshold voltage input current Symbol VTHHCT VTHLCT IICTL VREF LOADREF IVDD1 Condition CTLP/CTL1/CTL2/ VREF VREF -1.0 CTLP/CTL1/CTL2 State circuits OFF*3 CTLP/CTL1/CTL2 State circuits OFF*3 CTLP CTL1 CTL2 CTLP CTL1 CTL2 Value 0.55 0.40 1.274 0.95 0.80 1.300 1.45 1.30 1.326 Unit
Control block
Reference VREF voltage voltage VREF Load block stability
Shut down power supply current
IVDD1H
General
Power supply current (DC/DC mode)
IVDD31
IVDD32 Power supply current (voltage detection mode) Power-on invalid current
CTLP CTL1/CTL2 CTLP CTL1/CTL2
20.0
IVDD5
IVDD
CTL1 CTL2 CTL1 CTL2 VOUT1/VOUT2
1000
2000
minimum value AVDD DVDD1 DVDD2 VOUT setting value whichever higher. leak includes current internal circuit. current flowing into AVDD, DVDD1, DVDD2 pins. Current consumption based 100% ON-duty (High side full state). gate drive current included because device full state switching operation). Also load current included.
DS04-27254-2E
MB39C015
TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS
CTL1/CTL2 AVDD MODE1/MODE2 R3-1 R3-2 VREF VDET LX1/LX2 OUT1/OUT2 IOUT VOUT1/ VOUT2 DVDD1/DVDD2 MB39C015
DGND1/DGND2 VREFIN1/VREFIN2 AGND
Output voltage VREFIN 3.01
Component R3-1 R3-2
Specification
Vendor
Part Number RK73G1JTTD RR0816-203-D RR0816-154-D RR0816-304-D RK73G1JTTD RR0816-104-D C2012JB1A475K C2012JB1A475K C1608JB1E104K C1608JB1H104K VLF4012AT-2R2M
Remarks
VOUT1/VOUT2 Setting
adjusting slow start time
Note These components recommended based operating tests authorized. Corporation SUSUMU Co., Corporation
DS04-27254-2E
MB39C015
APPLICATION NOTES
Selection components Selection external inductor Basically dose need design inductor. This designed operate efficiently with inductor. inductor should rated saturation current higher than peak current value during normal operating conditions, should have minimal resistance. (100 less recommended.) peak current value obtained following formula. IOUT VOUT fosc IOUT (VIN VOUT) VOUT fosc
IOUT VOUT fosc
External inductor value Load current Power supply voltage Output setting voltage ON-duty switched VOUT/VIN) Switching frequency MHz)
When VOUT IOUT fosc maximum peak current value IPK; IOUT (VIN VOUT) VOUT fosc (3.7
0.89
capacitor selection Select equivalent series resistance (ESR) input capacitor suppress dissipation from ripple currents. Also select equivalent series resistance (ESR) output capacitor. variation inductor current causes ripple currents output capacitor which, turn, causes ripple voltages output equal amount variation multiplied value. output capacitor value significant impact operating stability device when used DC/DC converter. Therefore, FUJITSU MICROELECTRONICS generally recommends capacitor, larger capacitor value used ripple voltages suitable. VIN/VOUT voltage difference within output capacitor value recommended. Types capacitors Ceramic capacitors effective reducing afford smaller DC/DC converter circuit. However, power supply functions heat generator, therefore avoid capacitor with F-temperature rating 20%) FUJITSU MICROELECTRONICS recommends capacitors with B-temperature rating 20%). Normal electrolytic capacitors recommended their high ESR. Tantalum capacitor will reduce ESR, however, dangerous because turns into short mode when damaged. insist using tantalum capacitor, FUJITSU MICROELECTRONICS recommends type with internal fuse. DS04-27254-2E
MB39C015
Output voltage setting output voltage VOUT (VOUT1 VOUT2) this defined voltage input VREFIN (VREFIN1 VREFIN2) Supply voltage inputting VREFIN from external power supply, VREF output dividing with resistors. output voltage when VREFIN voltage dividing VREF voltage with resistors shown following formula. VOUT 3.01 VREFIN, (VREF 1.30 VREFIN VREF
MB39C015
VREF
VREF
VREFIN
VREFIN
Note Refer APPLICATION CIRCUIT EXAMPLES" example this circuit. Although output voltage defined according dividing ratio resistance, select resistance value that current flowing through resistance does exceed VREF current rating About conversion efficiency conversion efficiency improved reducing loss DC/DC converter circuit. total loss (PLOSS) DC/DC converter roughly divided follows PLOSS PCONT PCONT Control system circuit loss (The power used this operate, including gate driving power internal FETs) Switching loss (The loss caused during switching IC's internal FETs) Continuity loss (The loss caused when currents flow through IC's internal FETs external circuits
IC's control circuit loss (PCONT) extremely small, less than (with load). contains FETs which switch faster with less power, continuity loss (PC) more predominant loss during heavy-load operation than control circuit loss (PCONT) switching loss (PSW) Furthermore, continuity loss (PC) divided roughly into loss internal ON-resistance external inductor series resistance. DS04-27254-2E
MB39C015
IOUT2 (RDC RONP RONN) RONP RONN IOUT Switching ON-duty cycle VOUT VIN) Internal P-ch resistance Internal N-ch resistance External inductor series resistance Load current
above formula indicates that important reduce much possible improve efficiency selecting components. Power dissipation heat considerations efficient that consideration required most cases. However, used power supply voltage, heavy load, high output voltage, high temperature, requires further consideration higher efficiency. internal loss roughly obtained from following formula IOUT2 RONP RONN) RONP RONN IOUT Switching ON-duty cycle VOUT VIN) Internal P-ch resistance Internal N-ch resistance Output current
loss expressed above formula mainly continuity loss. internal loss includes switching loss control circuit loss well they small compared continuity loss they ignored. this with RONP greater than RONN, larger on-duty cycle, greater loss. When assuming example, RONP 0.36 RONN 0.30 according graph "MOS resistance Operating ambient temperature". IC's internal loss VOUT IOUT According graph "Power dissipation Operating ambient temperature", power dissipation operating ambient temperature internal loss smaller than power dissipation.
DS04-27254-2E
MB39C015
XPOR threshold voltage setting [VPORH, VPORL] detection voltage applying voltage VDET external resistor calculated according this formula. VPORH VPORL VTHHPR VTHLPR
VTHHPR 0.600 VTHLPR 0.583 Example setting detection voltage VPORH VPORL 0.600 3.66 0.583 3.56
MB39C015 AVDD VDET XPOR XPOR
DS04-27254-2E
MB39C015
Transient response Normally, IOUT suddenly changed while VOUT maintained constant, responsiveness including response time overshoot/undershoot voltage checked. this built-in Error with optimized design, shows good transient response characteristics. However, ringing upon sudden change load high operating conditions, capacitor (e.g. µF). (Since this capacitor changes start time, check start waveform well.) This action required input.
MB39C015
VREF
VREF
VREFIN
VREFIN1/ VREFIN2
DS04-27254-2E
MB39C015
Board layout, design example board layout needs designed ensure stable operation this Follow procedure below designing layout. Arrange input capacitor (Cin) close possible both pins. Make thru-hole (TH) near pins this capacitor board planes power GND. Large currents flow between this input capacitor (Cin), output capacitor (Co), external inductor (L). Group these components close possible this reduce overall loop area occupied this group. Also mount these components same surface arrange wiring without thru-hole wiring. thick, short, straight routes wire (The layout planes recommended.). Arrange bypass capacitor AVDD close possible both ADVV AGND pins. Make thru-hole (TH) near pins this capacitor board planes power GND. feedback wiring should wired from voltage output closest output capacitor (Co). extremely sensitive should thus kept wired away from this possible. applying voltage VREFIN1/VREFIN2 pins through dividing resistors, arrange resistors that wiring kept short possible. Also arrange them that VREFIN1/VREFIN2 resistor close IC's AGND pin. Further, provide exclusively control line that resistor connected path that does carry current. installing bypass capacitor VREFIN, close VREFIN pin. applying voltage VDET through dividing resistors, arrange resistors that wiring kept short possible. Also arrange that VDET resistor close IC's AGND pin. Further, provide exclusively control line that resistor connected path that does carry current. make plane surface which this will mounted. efficient heat dissipation when using QFN-24 package, FUJITSU MICROELECTRONICS recommends providing thermal footprint thermal pad. Example arranging system parts
Feedback line
Feedback line
1pin
AVDD bypass capacitor
DS04-27254-2E
MB39C015
Notes circuit design switching operation this works monitoring controlling peak current which, incidentally, serves form short-circuit protection. However, leave output short-circuited long periods time. output short-circuited where current limit value (peak current inductor) tends rise. Leaving short-circuit state, temperature this will continue rising activate thermal protection. Once thermal protection stops output, temperature will down operation will restarted, after which output will repeat starting stopping. Although this effect will destroy thermal exposure over prolonged hours affect peripherals surrounding
DS04-27254-2E
MB39C015
EXAMPLE STANDARD OPERATION CHARACTERISTICS
(Shown below example characteristics connection according TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS".) Characteristics Conversion efficiency Load current
Conversion efficiency Load current
Conversion efficiency
Conversion efficiency
VOUT
VOUT
1000
1000
Load current IOUT (mA) Conversion efficiency Load current
Load current IOUT (mA) Conversion efficiency Load current
Conversion efficiency
Conversion efficiency
VOUT
VOUT
1000
1000
Load current IOUT (mA)
Load current IOUT (mA) (Continued)
DS04-27254-2E
MB39C015
Output voltage Input voltage
2.60 2.58 2.60
Output voltage Load current VOUT setting
Output voltage VOUT
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40 IOUT
Output voltage VOUT
VOUT setting
2.58 2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40
IOUT
Input voltage
Load current IOUT (mA)
Reference voltage Input voltage
1.40 1.38 1.40
Reference voltage Operating ambient temperature
1.38 VOUT IOUT
Reference voltage VREF
Reference voltage VREF
1.36 1.34 1.32 1.30 1.28 1.26 1.24 1.22 1.20 IOUT IOUT
VOUT
1.36 1.34 1.32 1.30 1.28 1.26 1.24 1.22 1.20
+100
Input voltage
Operating ambient temperature
(Continued)
DS04-27254-2E
MB39C015
Input current Input voltage
Input current Operating ambient temperature
Input current (mA)
VOUT
Input current (mA)
VOUT
+100
Input voltage Oscillation frequency Input voltage Oscillation frequency fOSC (MHz) Oscillation frequency fOSC (MHz)
VOUT IOUT
Operating ambient temperature Oscillation frequency Operating ambient temperature
VOUT IOUT
+100
Input voltage
Operating ambient temperature
(Continued)
DS04-27254-2E
MB39C015
resistance Input voltage resistance
P-ch
N-ch
Input voltage P-ch resistance Operating ambient temperature P-ch resistance RONP
N-ch resistance Operating ambient temperature N-ch resistance RONN
+100
Operating ambient temperature
+100
Operating ambient temperature
(Continued)
DS04-27254-2E
MB39C015
(Continued) threshold voltage Input voltage
XPOR output voltage VXPOR Input voltage
XPOR output voltage VXPOR
threshold voltage
VTHHCT VTHLCT
VPORH setting
VOUT
VXPORL
VXPORH
VTHHCT Circuit VTHLCT Circuit
Input voltage
Input voltage
Power dissipation Operating ambient temperature (with thermal via)
3500 3500 3125 3000 2500 2000 1500 1000
Power dissipation Operating ambient temperature (without thermal via) Power dissipation (mW)
Power dissipation (mW)
3000 2500 2000 1563 1500 1000
1250
+100
+100
Operating ambient temperature
Operating ambient temperature
DS04-27254-2E
MB39C015
Switching waveforms
VOUT mV/div
V/div
mA/div VOUT IOUT
µs/div
DS04-27254-2E
MB39C015
Startup waveform
VCTL V/div
mA/div
VOUT IOUT VOUT V/div ms/div
VREFIN capacitor value
VCTL V/div
mA/div
VOUT V/div µs/div
VOUT IOUT
VREFIN capacitor
DS04-27254-2E
MB39C015
Output waveforms sudden load changes
IOUT
IOUT
IOUT
VOUT mV/div VOUT
µs/div
VREFIN capacitor value
Output waveforms sudden load changes (100
IOUT
IOUT
IOUT
VOUT mV/div
VOUT µs/div
VREFIN capacitor value
DS04-27254-2E
MB39C015
APPLICATION CIRCUIT EXAMPLES
APPLICATION CIRCUIT EXAMPLE external voltage input reference voltage external input (VREFIN1, VREFIN2) VOUT voltage 3.01 times VOUT setting gain.
CTL1
DVDD1 DGND1 DVDD2
DAC1
VREFIN1
DGND2 AVDD AGND
CTL2 MB39C015
DAC2
VREFIN2
VOUT1
MODE1
OUT1
APLI1
MODE2 VREF OUT2 VDET
VOUT2
APLI2
CTLP
XPOR
VOUT 3.01 VREFIN
DS04-27254-2E
MB39C015
APPLICATION CIRCUIT EXAMPLE voltage VREF input reference voltage external input (VREFIN1, VREFIN2) dividing resistors. VOUT1 voltage VOUT2 voltage
CTL1
DVDD1 DGND1 DVDD2
VREFIN1
DGND2 AVDD
CTL2
AGND MB39C015
VOUT1
VREFIN2 VREF
OUT1
APLI1
VOUT2
MODE1 MODE2
OUT2
APLI2
CTLP
XPOR VOUT1 3.01 VREFIN1 VREFIN1 VREF 1.30 1.30
(VREF 1.30 VOUT1 3.01
VOUT12 3.01
DS04-27254-2E
MB39C015
APPLICATION CIRCUIT EXAMPLE COMPONENTS LIST Component Item Part Number Inductor Inductor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Resister Resister Resister Resister Resister Resister VLF4012AT-2R2M MIPW3226D2R2M VLF4012AT-2R2M MIPW3226D2R2M C2012JB1A475K C2012JB1A475K C2012JB1A475K C2012JB1A475K C1608JB1E104K
Specification
Package 2012 2012 2012 2012 2012 1608 1608 1608 1608 1608 1608 1608 1608
Vendor
RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD 0.5% 0.5%
Corporation Corporation Corporation
DS04-27254-2E
MB39C015
USAGE PRECAUTIONS
configure over maximum ratings
used over maximum ratings, permanently damaged. preferable device normally operate within recommended usage conditions. Usage outside these conditions adversely affect reliability LSI.
devices within recommended operating conditions
recommended operating conditions conditions under which guaranteed operate. electrical ratings guaranteed when device used within recommended operating conditions under conditions stated each item.
Printed circuit board ground lines should with consideration common impedance Take appropriate static electricity measures
Containers semiconductor materials should have anti-static protection made conductive material. After mounting, printed circuit boards should stored shipped conductive bags containers. Work platforms, tools, instruments should properly grounded. Working personnel should grounded with resistance between body ground.
apply negative voltages
negative voltages below -0.3 create parasitic transistors lines, which cause abnormal operation.
ORDERING INFORMATION
Part number MB39C015QN-E1 Package 24-pin plastic (LCC-24P-M09) Remarks Lead-free version
RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION
products FUJITSU MICROELECTRONICS with "E1" compliant with RoHS Directive, observed standard lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB) polybrominated diphenyl ethers (PBDE). product whose part number trailing characters "E1" RoHS compliant.
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MB39C015
MARKING FORMAT (LEAD FREE VERSION)
Lead-free version
XXXXX
INDEX
LABELING SAMPLE (LEAD FREE VERSION)
Lead-free mark JEITA logo JEDEC logo
part number lead-free product trailing characters "E1".
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MB39C015
MB39C015QN-E1 RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL
[FUJITSU MICROELECTRONICS Recommended Mounting Conditions] Item Condition Mounting Method Mounting times Before opening Storage period Storage conditions From opening reflow (infrared reflow) times Please within years after Manufacture.
70%RH less (the lowest possible humidity)
[Parameters Each Mounting Method] (infrared reflow)
rank Temperature Increase gradient Preliminary heating Temperature Increase gradient Actual heating (d')
(d')
Cooling
Average °C/s °C/s Temperature 180s Average °C/s °C/s Temperature Max; more, less Temperature more, less Temperature more, less Temperature more, less Natural cooling forced cooling
Note Temperature package body
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MB39C015
EVALUATION BOARD SPECIFICATION
MB39C015 Evaluation Board provides proper evaluating efficiency other characteristics MB39C015. Terminal information Symbol Power supply terminal standard condition When VIN/VOUT difference held within less, such devices with standard output voltage (VOUT1 when FUJITSU MICROELECTRONICS recommends changing output capacity (C1, Output terminals (VOUT1: CH1, VOUT2: CH2) Power supply terminal setting CTL1, CTL2 CTLP terminals. connecting with CTL1,CTL2 CTLP. Direct supply terminal (CTL1 CH1, CTL2 CH2) CTL1, CTL2 (Typ.) Shutdown CTL1, CTL2 0.95 (Typ.) Max) Normal operation TEST terminal MODE1, MODE2 OPEN Reference voltage output terminal VREF 1.30 (Typ.) External reference voltage input terminals (VREFIN1 CH1, VREFIN2 CH2) When external reference voltage supplied, connect terminal each channel. Voltage input terminal voltage detection Voltage detection circuit block control terminal CTLP Voltage detection circuit block stop CTLP Normal operation Voltage detection circuit output terminal N-ch open drain circuit connected. Pull-up voltage terminal XPOR terminal Ground terminal Connect power supply PGND terminal next terminal. Connect output (load) PGND terminal between VOUT1 terminal VOUT2 terminal. Ground terminal
Functions
VOUT1, VOUT2 VCTL
CTL1, CTL2
MODE1, MODE2 VREF
VREFIN1, VREFIN2
VDET CTLP
XPOR VXPOR
PGND
AGND
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MB39C015
Startup terminal information Terminal name Condition CTL1 Open Connect VCTL Open Connect VCTL Open Connect VCTL ON/OFF switch Shutdown Normal operation. ON/OFF switch Shutdown Normal operation. ON/OFF switch voltage detection block Stops voltage detection circuit Normal operation.
Functions
CTL2
CTLP
Jumper information
Functions Short-circuited layout pattern board (normally used shorted). Short-circuited layout pattern board (normally used shorted). Normally used shorted Normally used shorted
Setup checkup
Setup Connect CTL1 terminal CTL2 terminal VCTL terminal. into state connecting CTLP terminal AGND pad. Connect power supply terminal terminal, power supply terminal PGND terminal. Make sure PGND connected PGND terminal next terminal. (Example setting power-supply voltage Checkup Supply power VIN. operating normally VOUT1 (Typ) VOUT2 (Typ).
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MB39C015
Component layout evaluation board (Top View)
VOUT2 MODE2
PGND
VOUT1 PGND
VREFIN2 MODE2 MODE1 XPOR VXPOR
VREF VCTL
CTL1 CTLP AGND
MODE1
CTL2
Short
Open
VREFIN1
MB39C015EVB-06 Rev.1.0
CTL2 CTL1 CTLP VDET
Side (Component side)
Bottom Side (Soldering side)
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MB39C015
Evaluation board layout (Top View)
Side (Layer1)
Inside (Layer2)
Inside (Layer3)
Bottom Side (Layer4)
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MB39C015
Connection diagram
PGND VCTL CTL1 SW1* MODE1 DVDD2 MODE1 VREF R6-1 R6-2 VREFIN1 MB39C015 SW1* CTL2 CTL2 SW1* MODE2 OUT1 MODE2 VREF R4-1 R4-2 VREFIN2 VREF VREF R1-3 VDET R1-1 SW1* CTLP CTLP R1-2 XPOR VDET XPOR VXPOR VREF OUT2 VREFIN2 IOUT VOUT2 PGND VOUT1 IOUT VREFIN1 AGND DGND2 AVDD AGND SW1* CTL1 DVDD1 DGND1
mounted
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MB39C015
Component list COMPOPart Name NENT R1-1 R1-2 R1-3 R4-1 R4-2 R6-1 R6-2 Inductor Inductor
MODEL NUMBER MB39C015QN VLF4012AT-2R2M VLF4012AT-2R2M
SPECIFICATION Max, 0.5% Max, 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5%
PACKAGE VENDOR QFN-24 2012 2012 2012 2012 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608
REMARK
Ceramic capacitor C2012JB1A475K Ceramic capacitor C2012JB1A475K Ceramic capacitor C2012JB1A475K Ceramic capacitor C2012JB1A475K Ceramic capacitor C1608JB1H104K Ceramic capacitor C1608JB1H104K Ceramic capacitor C1608JB1H104K Jumper Resister Jumper Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Switch Jumper Jumper Jumper Jumper RK73Z1J RK73Z1J RK73Z1J RR0816P-304-D RK73Z1J RR0816P-753-D RR0816P-223-D RR0816P-334-D RR0816P-304-D RR0816P-203-D RR0816P-154-D RR0816P-304-D
RK73G1JTTD 0.5%
RK73G1JTTD 0.5% RK73G1JTTD 0.5% RK73G1JTTD 0.5% Max, Max,
mounted Patternshorted Patternshorted
Note These components recommended based operating tests authorized. FUJITSU MICROELECTRONICS LIMITED Corporation Corporation SUSUMU Co., DS04-27254-2E
MB39C015
BOARD ORDERING INFORMATION
Board Part MB39C015EVB-06 Board Version MB39C015EVB-06 Rev.1.0 Remarks QFN-24
DS04-27254-2E
MB39C015
PACKAGE DIMENSION
24-pin plastic Lead pitch Sealing method 0.50 Plastic mold
(LCC-24P-M09)
24-pin plastic (LCC-24P-M09)
4.00±0.10 (.157±.004)
2.70±0.10 (.106±.004)
INDEX AREA
4.00±0.10 (.157±.004)
2.70±0.10 (.106±.004)
0.25±0.05 (.010±.002)
3-R0.20 (3-R.008) 0.50(.020)
0.40±0.10 (.016±.004) 1PIN CORNER (C0.25(C.010))
0.08(.003) 0.00(.000)
0.85(.033) 0.20(.008)
2006-2008 FUJITSU MICROELECTRONICS LIMITED C24059S-c-2-3
Dimensions (inches). Note: values parentheses reference values.
DS04-27254-2E
MB39C015
CONTENTS
page DESCRIPTION FEATURES APPLICATIONS ASSIGNMENT DESCRIPTIONS EQUIVALENT CIRCUIT DIAGRAM BLOCK DIAGRAM FUNCTION EACH BLOCK ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS APPLICATION NOTES EXAMPLE STANDARD OPERATION CHARACTERISTICS APPLICATION CIRCUIT EXAMPLES USAGE PRECAUTIONS ORDERING INFORMATION RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION MARKING FORMAT (LEAD FREE VERSION) LABELING SAMPLE (LEAD FREE VERSION) MB39C015QN-E1 RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL EVALUATION BOARD SPECIFICATION BOARD ORDERING INFORMATION PACKAGE DIMENSION
DS04-27254-2E
MB39C015
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ further information please contact: North South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 Arques Avenue, Sunnyvale, 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 Korea FUJITSU MICROELECTRONICS KOREA LTD. KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA LTD. Lorong Chuan, #05-08 Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw
Rights Reserved. contents this document subject change without notice. Customers advised consult with sales representatives before ordering. information, such descriptions function application circuit examples, this document presented solely purpose reference show examples operations uses FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does warrant proper operation device with respect based such information. When develop equipment incorporating device based such information, must assume responsibility arising such information. FUJITSU MICROELECTRONICS assumes liability damages whatsoever arising information. information this document, including descriptions function schematic diagrams, shall construed license exercise intellectual property right, such patent right copyright, other right FUJITSU MICROELECTRONICS third party does FUJITSU MICROELECTRONICS warrant non-infringement third-party's intellectual property right other right using such information. FUJITSU MICROELECTRONICS assumes liability infringement intellectual property rights other rights third parties which would result from information contained herein. products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated accompanying fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), requiring extremely high reliability (i.e., submersible repeater artificial satellite). Please note that FUJITSU MICROELECTRONICS will liable against and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. Exportation/release products described this document require necessary procedures accordance with regulations Foreign Exchange Foreign Trade Control Japan and/or export control laws. company names brand names herein trademarks registered trademarks their respective owners.
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