ASSP Power Management Applications DC/DC Converter Built-in Switching
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DS04-27253-3E
ASSP Power Management Applications DC/DC Converter Built-in Switching FET, Synchronous Rectification, Down Conversion Support
MB39C014
DESCRIPTION
MB39C014 current mode type 1-channel DC/DC converter built-in switching FET, synchronous rectification, down conversion support. device integrated with switching FET, oscillator, error amplifier, control circuit, reference voltage source, POWERGOOD circuit. External inductor decoupling capacitor needed only external component. combining with external parts enables DC/DC converter with compact high load response characteristic, this suitable built-in power supply such mobile phone/PDA, DVDs, HDDs.
FEATURES
High efficiency (Max) Output current (DC/DC) (Max) Input voltage range Operating frequency 2.0/3.2 (Typ) flyback diode needed dropout operation 100% duty Built-in high-precision reference voltage generator 1.20 Consumption current shutdown mode less Built-in switching P-ch (Typ) N-ch (Typ) High speed input load transient response current mode Over temperature protection Packaged compact package SON10
APPLICATIONS
Flash ROMs players Electronic dictionary devices Surveillance cameras Portable navigators Mobile phones etc.
Copyright©2008 FUJITSU MICROELECTRONICS LIMITED rights reserved 2008.11
MB39C014
ASSIGNMENT
(Top View)
MODE VREFIN FSEL
VREF
POWERGOOD
(LCC-10P-M04)
DESCRIPTIONS
name VREF POWERGOOD FSEL VREFIN MODE Ground pin. Control input pin. Shut down Normal operation) Reference voltage output pin. POWERGOOD circuit output pin. Internally connected N-ch open drain circuit. Frequency switch pin. (open) MHz, MHz) Error amplifier (Error Amp) non-inverted input pin. level leave open. Output voltage feedback pin. Power supply pin. Description Inductor connection output pin. High impedance during shut down.
DS04-27253-3E
MB39C014
EQUIVALENT CIRCUIT DIAGRAM
VREF
VREFIN
FSEL
POWER
GOOD
MODE
Protection device
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MB39C014
BLOCK DIAGRAM
ON/OFF
Amplifier
POWERGOOD POWER GOOD IOUT Comparator VREF 1.20 VREF Logic VREFIN Control VOUT
MODE
FSEL
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MB39C014
Current mode Original voltage mode type: Stabilize output voltage comparing items below on-duty control. Voltage (VC) obtained through negative feedback output voltage Error Reference triangular wave (VTRI) Current mode type: Instead triangular wave (VTRI), voltage (VIDET) obtained through conversion currents that flow oscillator (rectangular wave generation circuit) used. Stabilize output voltage comparing items below on-duty control. Voltage (VC) obtained through negative feedback output voltage Error Voltage (VIDET) obtained through conversion current that flow oscillator (rectangular wave generation circuit)
Voltage mode type model
Current mode type model
Oscillator
VTRI VIDET
SR-FF
VTRI
VIDET toff
toff
Note above models illustrate general operation actual operation will preferred
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MB39C014
FUNCTION EACH BLOCK
Logic control circuit built-in P-ch N-ch FETs controlled synchronization rectification according frequency (2.0 MHz/3.2 MHz) oscillated from built-in oscillator (square wave oscillation circuit). IOUT comparator circuit This circuit detects current (ILX) which flows external inductor from built-in P-ch FET. comparing VIDET obtained through conversion peak current with Error output, builtin P-ch turned Logic Control circuit. Error phase compensation circuit This circuit compares output voltage reference voltages such VREF. This built-in phase compensation circuit that designed optimize operation this This needs neither considered addition phase compensation circuit external phase compensation device. VREF circuit high accuracy reference voltage generated with (bandgap reference) circuit. output voltage 1.20 (Typ). POWERGOOD circuit POWERGOOD circuit monitors voltage pin. POWERGOOD open drain output. with pull-up using external resistor normal operation. When level, POWERGOOD becomes level. However, output voltage drops because over current etc, POWERGOOD becomes level. Timing chart example (POWERGOOD pulled VIN)
VUVLO
VOUT
VOUT
POWERGOOD (pull VIN) tDLYPG less tDLYPG tDLYPG
VUVLO UVLO threshold voltage tDLYPG POWERGOOD delay time
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Protection circuit This built-in over-temperature protection circuit. over-temperature protection circuit turns both N-ch P-ch switching FETs when junction temperature reaches +135 When junction temperature comes down switching returned normal operation. Since control circuit this control method current mode, current peak value also monitored controlled required. FUNCTION TABLE Input Output MODE Switching OUTPUT FSEL VREF POWERGOOD frequency voltage Shutdown mode Operation mode Don't care Output stop VOUT voltage output Output stop Function stop Operation
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MB39C014
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Signal input voltage POWERGOOD pull-up voltage voltage peak current Symbol VISIG Condition CTL, MODE, FSEL pins VREFIN POWERGOOD Power dissipation Operating ambient temperature Storage temperature TSTG Rating 2632*1, 980*1, 1053*1, 392*1, Unit
VIPG
Power dissipation value between obtained connecting these points with straight line When mounted four- layer epoxy board 11.7 Connection exposure with thermal via. (Thermal holes) Connection exposure pad, without thermal via. Notes negative voltages below create parasitic transistors lines, which cause abnormal operation. This device damaged short-circuited GND. Take measures keep FSEL falling below potential this much possible. addition erroneous operation, latch destroy itself more current flows from this pin. WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings.
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RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage VREFIN voltage voltage current POWERGOOD current VREF output current Inductor value Symbol VREFIN VCTL IROUT Condition (FSEL (FSEL Value 0.15 1.20 Unit
Note output current from this device situation decrease power supply voltage (VIN) DC/DC converter output voltage (VOUT) differ only small amount. This result slope compensation will damage this device. WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their representatives beforehand.
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ELECTRICAL CHARACTERISTICS
VOUT setting value MODE Parameter Symbol IREFINM Input current IREFINL IREFINH Output voltage Input stability Load stability input impedance VOUT LINE LOAD ROUT fOSC1 fOSC2 VNOFF RONP RONN ILEAKM ILEAKH TOTPH TOTPL VTHH VTHL VHYS -100 VDD*2 VDD*2 -1.0 -2.0 2.07 1.92 0.08 0.20 0.36 16.0 Condition VREFIN 0.833 VREFIN 0.15 VREFIN 1.20 VREFIN 0.833 -100 Output shorted FSEL FSEL VOUT -100 Value -100 -100 -100 2.45 2.56 -40* 2.50 3.20 -20* 0.30 2.55 3.84 0.47 Unit
DC/DC converter block
peak current Oscillation frequency Rise delay time NMOS voltage PMOS resistance NMOS resistance leak current Over temperature protection (Junction Temp.)
120* 135* 155* 110* 130* 2.20 2.05 0.15 2.33 2.18 0.25
Protection UVLO threshold circuit block voltage UVLO hysteresis width Standard design value
(Continued)
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(Continued) VOUT setting value MODE Parameter POWERGOOD threshold voltage POWERGOOD block POWERGOOD delay time POWERGOOD output voltage POWERGOOD output current threshold voltage Control block input current FSEL threshold voltage Reference voltage block VREF voltage VREF load stability Shut down power supply current General Standby power supply current (DC/DC) Power-on invalid current Symbol FSEL FSEL POWERGOOD POWERGOOD VREF -2.7 -100 VREF -1.0 circuits state FSEL VOUT 90%*4 Condition Value VREFIN 0.93 0.55 0.40 2.96 1.176 VREFIN 0.97 0.95 0.80 1.200 VREFIN 0.99 1.45 1.30 0.74 1.224 Unit
VTHPG tDLYPG1 tDLYPG2 VTHHCT VTHLCT IICTL VTHHFS VTHLFS VREF LOADREF IVDD1 IVDD1H IVDD2
IVDD
1500
minimum value VOUT setting value whichever higher. leak includes current internal circuit. Detected with respect output voltage setting value VREFIN Current consumption based 100% ON-duty (High side full state). gate drive current included because device full state switching operation). Also load current included.
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TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS
MODE R3-1 R3-2 VREFIN FSEL VREF POWER GOOD VOUT MB39C014
IOUT
Output voltage VREFIN 2.97
Component R3-1 R3-2
Specification
Vendor
Part Number RK73G1JTTD RR0816-752-D RR0816-124-D RR0816-304-D RK73G1JTTD C2012JB1A475K C2012JB1A475K C1608JB1H104K VLF4012AT-2R2M VLF4012AT-1R5M
Remark
VOUT setting
adjusting slow start time operation operation
Note These components recommended based operating tests authorized. Corporation SUSUMU Co., Corporation
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APPLICATION NOTES
Selection components Selection external inductor Basically dose need design inductor. This designed operate efficiently with (2.0 operation) (3.2 operation) inductor. inductor should rated saturation current higher than peak current value during normal operating conditions, should have minimal resistance. (100 less recommended.) peak current value obtained following formula. IOUT VOUT fosc IOUT (VIN VOUT) VOUT fosc
IOUT
External inductor value Load current Power supply voltage duty switched( VOUT/VIN)
VOUT Output setting voltage fosc Switching frequency (2.0 MHz) VOUT IOUT fosc maximum peak current value IPK; IOUT (VIN VOUT) VOUT fosc (3.7
0.89
capacitor selection Select equivalent series resistance (ESR) input capacitor suppress dissipation from ripple currents. Also select equivalent series resistance (ESR) output capacitor. variation inductor current causes ripple currents output capacitor which, turn, causes ripple voltages output equal amount variation multiplied value. output capacitor value significant impact operating stability device when used DC/DC converter. Therefore, FUJITSU MICROELECTRONICS generally recommends capacitor, larger capacitor value used ripple voltages suitable. VIN/VOUT voltage difference within output capacitor value recommended. Types capacitors Ceramic capacitors effective reducing afford smaller DC/DC converter circuit. However, power supply functions heat generator, therefore avoid capacitor with F-temperature rating 20%) FUJITSU MICROELECTRONICS recommends capacitors with B-temperature rating 20%). Normal electrolytic capacitors recommended their high ESR. Tantalum capacitor will reduce ESR, however, dangerous because turns into short mode when damaged. insist using tantalum capacitor, FUJITSU MICROELECTRONICS recommends type with internal fuse. DS04-27253-3E
MB39C014
Output voltage setting output voltage VOUT this defined voltage input VREFIN. Supply voltage inputting VREFIN from external power supply, VREF output dividing with resistors. output voltage when VREFIN voltage dividing VREF voltage with resistors shown following formula.
VOUT 2.97 VREFIN, (VREF 1.20
VREFIN
VREF
MB39C014
VREF
VREF
VREFIN
VREFIN
Note Refer APPLICATIN CIRCUIT EXAMPLES" example this circuit. Although output voltage defined according dividing ratio resistance, select resistance value that current flowing through resistance does exceed VREF current rating About conversion efficiency conversion efficiency improved reducing loss DC/DC converter circuit. total loss (PLOSS) DC/DC converter roughly divided follows PLOSS PCONT PCONT Control system circuit loss (The power used this operate, including gate driving power internal FETs) Switching loss (The loss caused during switching IC's internal FETs) Continuity loss (The loss caused when currents flow through IC's internal FETs external circuits
IC's control circuit loss (PCONT) extremely small, less than with load. contains FETs which switch faster with less power, continuity loss (PC) more predominant loss during heavy-load operation than control circuit loss (PCONT) switching loss (PSW) DS04-27253-3E
MB39C014
Furthermore, continuity loss (PC) divided roughly into loss internal ON-resistance external inductor series resistance. IOUT2 (RDC RONP RONN) RONP RONN IOUT Switching ON-duty cycle VOUT VIN) Internal P-ch resistance Internal N-ch resistance External inductor series resistance Load current
above formula indicates that important reduce much possible improve efficiency selecting components. Power dissipation heat considerations efficient that consideration required most cases. However, used power supply voltage, heavy load, high output voltage, high temperature, requires further consideration higher efficiency. internal loss roughly obtained from following formula IOUT2 RONP RONN) RONP RONN IOUT Switching ON-duty cycle VOUT VIN) Internal P-ch resistance Internal N-ch resistance Output current
loss expressed above formula mainly continuity loss. internal loss includes switching loss control circuit loss well they small compared continuity loss they ignored. this with RONP greater than RONN, larger on-duty cycle, greater loss. When assuming example, RONP 0.42 RONN 0.36 according graph "MOS resistance Operating ambient temperature". IC's internal loss VOUT IOUT According graph "Power dissipation Operating ambient temperature", power dissipation operating ambient temperature internal loss smaller than power dissipation.
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Transient response Normally, IOUT suddenly changed while VOUT maintained constant, responsiveness including response time overshoot/undershoot voltage checked. this built-in Error with optimized design, shows good transient response characteristics. However, ringing upon sudden change load high operating conditions, capacitor (e.g. µF). (Since this capacitor changes start time, check start waveform well.) This action required input.
MB39C014
VREF
VREF
VREFIN
VREFIN
Board layout, design example board layout needs designed ensure stable operation this Follow procedure below designing layout. Arrange input capacitor (Cin) close possible both pins. Make thru-hole (TH) near pins this capacitor board planes power GND. Large currents flow between this input capacitor (Cin), output capacitor (CO), external inductor (L). Group these components close possible this reduce overall loop area occupied this group. Also mount these components same surface arrange wiring without thru-hole wiring. thick, short, straight routes wire (The layout planes recommended.). feedback wiring should wired from voltage output closest output capacitor (CO). extremely sensitive should thus kept wired away from this possible. applying voltage VREFIN through dividing resistors, arrange resistors that wiring kept short possible. Also arrange them that VREFIN resistor close IC's pin. Further, provide exclusively control line that resistor connected path that does carry current. installing bypass capacitor VREFIN, close VREFIN pin. make plane surface which this will mounted. efficient heat dissipation when using SON-10 package, FUJITSU MICROELECTRONICS recommends providing thermal footprint thermal pad. Layout Example components
Feedback line
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Notes Circuit Design switching operation this works monitoring controlling peak current which, incidentally, serves form short-circuit protection. However, leave output short-circuited long periods time. output short-circuited where current limit value (peak current inductor) tends rise. Leaving short-circuit state, temperature this will continue rising activate thermal protection. Once thermal protection stops output, temperature will down operation will resume, after which output will repeat starting stopping. Although this effect will destroy thermal exposure over prolonged hours affect peripherals surrounding
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EXAMPLE STANDARD OPERATION CHARACTERISTICS
(Shown below example characteristics connection according TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS".) Conversion efficiency Load current (2.0 MHz)
Conversion efficiency Load current (2.0 MHz)
Conversion efficiency
Conversion efficiency
VOUT FSEL
VOUT FSEL
1000
1000
Load current IOUT (mA) Conversion efficiency Load current (2.0 MHz)
Load current IOUT (mA) Conversion efficiency Load current (2.0 MHz)
Conversion efficiency
Conversion efficiency
VOUT FSEL
VOUT FSEL
1000
1000
Load current IOUT (mA)
Load current IOUT (mA) (Continued)
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Conversion efficiency Load current (3.2 MHz)
Conversion efficiency Load current (3.2 MHz)
Conversion efficiency
Conversion efficiency
VOUT FSEL
VOUT FSEL
1000
1000
Load current IOUT (mA) Conversion efficiency Load current (3.2 MHz)
Load current IOUT (mA) Conversion efficiency Load current (3.2 MHz)
Conversion efficiency
Conversion efficiency
VOUT FSEL
VOUT FSEL
1000
1000
Load current IOUT (mA)
Load current IOUT (mA) (Continued)
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Output voltage Input voltage (2.0 MHz)
2.60 2.58 2.60
Output voltage Input voltage (3.2 MHz)
2.58
Output voltage VOUT
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40 IOUT
Output voltage VOUT
VOUT setting FSEL
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40 IOUT IOUT
VOUT setting FSEL
IOUT
Input voltage Output voltage Load current (2.0 MHz)
2.60 2.58 2.60
Input voltage Output voltage Load current (3.2 MHz) VOUT setting FSEL
Output voltage VOUT
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40
Output voltage VOUT
VOUT setting FSEL
2.58 2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40
Load current IOUT (mA)
Load current IOUT (mA)
(Continued)
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Reference voltage Input voltage
VOUT
Reference voltage Operating ambient temperature
1.28 1.26 1.24 1.22 1.18 1.16 1.14 1.12 +100
VOUT
Reference voltage VREF
1.26 1.24 1.22 1.18 1.16 1.14 1.12
Reference voltage VREF
1.28
Input voltage Input current Input voltage
Operating ambient temperature Input current Operating ambient temperature
Input current (mA)
Input current (mA)
VOUT
+100
VOUT
Input voltage
Operating ambient temperature (Continued)
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Oscillation frequency Input voltage (2.0 MHz) Oscillation frequency fOSC1 (MHz)
VOUT IOUT FSEL
Oscillation frequency Input voltage (3.2 MHz) Oscillation frequency fOSC2 (MHz)
VOUT IOUT FSEL
Input voltage Oscillation frequency Operating ambient temperature (2.0 MHz) Oscillation frequency fOSC1 (MHz) Oscillation frequency fOSC2 (MHz)
VOUT IOUT FSEL
Input voltage Oscillation frequency Operating ambient temperature (3.2 MHz)
VOUT IOUT FSEL
+100
Operating ambient temperature
Operating ambient temperature
+100
(Continued)
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resistance Input voltage P-ch resistance RONP resistance
P-ch resistance Operating ambient temperature
P-ch
N-ch
Input voltage N-ch resistance Operating ambient temperature N-ch resistance RONN threshold voltage
Operating ambient temperature threshold voltage Input voltage
VTHHCT VTHLCT
VOUT
+100
VTHHCT VTHLCT
Operating ambient temperature
+100
Input voltage (Continued)
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(Continued) Power dissipation Operating ambient temperature (With thermal via)
3000 3000 2632 2500
Power dissipation Operating ambient temperature (without thermal via) Power dissipation (mW)
Power dissipation (mW)
2500
2000
2000
1500 1053 1000
1500
1000
+100
+100
Operating ambient temperature
Operating ambient temperature
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Switching waveforms
VOUT mV/div
V/div
mA/div
VOUT IOUT µs/div
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Startup waveform
VCTL V/div
mA/div
VOUT VOUT V/div ms/div IOUT
VREFIN Capacitor value
VCTL V/div
mA/div
VOUT V/div
VOUT IOUT µs/div
VREFIN Capacitor
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Output waveforms sudden load changes
IOUT
IOUT
IOUT
VOUT mV/div VOUT µs/div
VREFIN Capacitor value
Output waveforms sudden load changes (100
IOUT
IOUT
IOUT
VOUT mV/div +25°C VOUT µs/div
VREFIN Capacitor value
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APPLICATION CIRCUIT EXAMPLES
APPLICATION CIRCUIT EXAMPLE external voltage input reference voltage external input (VREFIN) VOUT voltage 2.97 times VOUT setting gain.
VOUT
MODE POWER GOOD (OPEN) FSEL VREF VREFIN
APLI
VOUT 2.97 VREFIN
APPLICATION CIRCUIT EXAMPLE voltage VREF input reference voltage external input (VREFIN) dividing resistors. VOUT voltage
MODE POWER GOOD FSEL
VOUT
APLI
(OPEN) 127.5 (120
VREF VREFIN
VOUT 2.97 VREFIN VREFIN VREF (VREF 1.20 VOUT 2.97 1.20 127.5
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Application Circuit Example Components List Component Item Part Number Inductor Ceramic capacitor Ceramic capacitor Resistor Resistor Resistor VLF4012AT-2R2M MIPW3226D2R2M C2012JB1A475K C2012JB1A475K RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD
Specification 0.5%
Package 2012 2012 1608 1608 1608 1608
Vendor
Corporation Corporation Corporation
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USAGE PRECAUTIONS
configure over maximum ratings
used over maximum ratings, permanently damaged. preferable device normally operate within recommended usage conditions. Usage outside these conditions adversely affect reliability LSI.
devices within recommended operating conditions
recommended operating conditions conditions under which guaranteed operate. electrical ratings guaranteed when device used within recommended operating conditions under conditions stated each item.
Printed circuit board ground lines should with consideration common impedance Take appropriate static electricity measures.
Containers semiconductor materials should have anti-static protection made conductive material. After mounting, printed circuit boards should stored shipped conductive bags containers. Work platforms, tools, instruments should properly grounded. Working personnel should grounded with resistance between body ground.
apply negative voltages.
negative voltages below create parasitic transistors lines, which cause abnormal operation.
ORDERING INFORMATION
Part number MB39C014PN-E1 Package 10-pin plastic (LCC-10P-M04) Remarks Lead-free version
RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION
products FUJITSU MICROELECTRONICS with "E1" compliant with RoHS Directive, observed standard lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenylethers (PBDE). product whose part number trailing characters "E1" RoHS compliant.
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MARKING FORMAT (LEAD FREE VERSION)
XXXXX
INDEX
Lead-free version
LABELING SAMPLE (LEAD FREE VERSION)
Lead-free mark JEITA logo JEDEC logo
part number lead-free product trailing characters "E1".
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EVALUATION BOARD SPECIFICATION
MB39C014 Evaluation Board provides proper environment evaluating efficiency other characteristics MB39C014. Terminal information Symbol
Functions Power supply terminal. standard condition When VIN/VOUT difference held within less, such devices with standard output voltage (VOUT when FUJITSU MICROELECTRONICS recommends changing output capacity (C1) Output terminal. Power supply terminal setting terminal. this terminal connecting with CTL. Direct supply terminal CTL. 0.80 (Typ.) Shutdown 0.95 (Typ.) Normal operation TEST terminal OPEN Reference voltage output terminal. VREF 1.20 (Typ.) External reference voltage input terminal. When external reference voltage supplied, connect this terminal. Operating frequency range setting terminal. FSEL operation FSEL operation* FUJITSU MICROELECTRONICS recommends changing inductor POWERGOOD output terminal. "High" level output when voltage reaches more output setting voltage. Ground terminal. Connect power supply PGND terminal next VOUT terminal. Ground terminal.
VOUT VCTL MODE VREF VREFIN
FSEL
POWERGOOD PGND AGND
Startup terminal information Terminal name Condition Open Connect VCTL Open Connect VCTL
Functions ON/OFF switch Shutdown Normal operation Setting switch FSEL terminal. operation operation.
FSEL
Jumper information Normally used shorted
Functions
Short-circuited layout pattern board (normally used shorted).
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Setup checkup Setup Connect terminal VCTL terminal. Connect power supply terminal terminal, power supply terminal PGND terminal. (Example setting power supply voltage Checkup Supply power VIN. operating normally VOUT (Typ).
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Component layout evaluation board (Top View)
PGND VOUT Open Short R3-2 VREF AGND POWER_GOOD R3-1
VCTL
FSEL MODE
MODE
MB39C014EVB-06 Rev.1.0
VREFIN FSEL
Side (Component side
Bottom Side (Soldering side)
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Evaluation board layout (Top View)
Side(Layer1)
Inside GND(Layer2)
Inside GND(Layer3)
Bottom Side(Layer4)
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Connection diagram
VCTL MODE
FSEL MODE
MB39C014
IOUT
VOUT
POWER GOOD
POWER GOOD
FSEL VREF R3-1 R3-2 VREFIN
VREFIN VREF PGND
AGND
mounted
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Component list Component Part Name R3-1 R3-2 Inductor Ceramic capacitor Ceramic capacitor Ceramic capacitor Resister Resister Resister Resister Resister Switch Jumper Jumper
Model Number MB39C014PN VLF4012AT-2R2M C2012JB1A475K C2012JB1A475K C1608JB1H104K RK73G1JTTD RR0816P-752-D RR0816P-124-D RR0816P-304-D RK73G1JTTD RK73Z1J
Specification 0.5% 0.5% 0.5% 0.5% 0.5% Max)
Package SON10 2012 2012 1608 1608 1608 1608 1608 1608 1608
Vendor
Remark
mounted Patternshorted
Note These components recommended based operating tests authorized. FUJITSU MICROELECTRONICS LIMITED Corporation Corporation SUSUMU Co.,
BOARD ORDERING INFORMATION
Board Part MB39C014EVB-06 Board Version MB39C014EVB-06 Rev.1.0 Remarks SON10
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PACKAGE DIMENSION
10-pin plastic Lead pitch Package width package length Sealing method Mounting height Weight 0.50 3.00 3.00 Plastic mold 0.75 0.018
(LCC-10P-M04)
10-pin plastic (LCC-10P-M04)
3.00±0.10 (.118±.004)
2.40±0.10 (.094±.004)
INDEX AREA 3.00±0.10 (.118±.004) 1.70±0.10 (.067±.004) 0.40±0.10 (.016±.004)
1PIN CORNER (C0.30(C.012)) 0.50(.020) 0.25±0.03 (.010±.001)
0.05(.002) 0.00 (.000
+0.05 -0.00 +.002 -.000
0.75(.030) 0.15(.006)
2008 FUJITSU MICROELECTRONICS LIMITED C10004S-c-1-2
Dimensions (inches). Note: values parentheses reference values.
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CONTENTS
page DESCRIPTION FEATURES APPLICATIONS ASSIGNMENT DESCRIPTIONS EQUIVALENT CIRCUIT DIAGRAM BLOCK DIAGRAM FUNCTION EACH BLOCK ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS APPLICATION NOTES EXAMPLE STANDARD OPERATION CHARACTERISTICS APPLICATION CIRCUIT EXAMPLES USAGE PRECAUTIONS ORDERING INFORMATION RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION MARKING FORMAT (LEAD FREE VERSION) LABELING SAMPLE (LEAD FREE VERSION) EVALUATION BOARD SPECIFICATION BOARD ORDERING INFORMATION PACKAGE DIMENSION
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FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ further information please contact: North South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 Arques Avenue, Sunnyvale, 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 Korea FUJITSU MICROELECTRONICS KOREA LTD. Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://kr.fujitsu.com/fmk/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. Lorong Chuan, #05-08 Tech Park 556741 Singapore +65-6281-0770 +65-6281-0220 http://www.fmal.fujitsu.com/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. 3102, Bund Center, No.222 Road (E), Shanghai 200002, China +86-21-6146-3688 +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, Canton Road, Tsimshatsui, Kowloon, Hong Kong +852-2377-0226 +852-2376-3269 http://cn.fujitsu.com/fmc/en/
Specifications subject change without notice. further information please contact each office. Rights Reserved. contents this document subject change without notice. Customers advised consult with sales representatives before ordering. information, such descriptions function application circuit examples, this document presented solely purpose reference show examples operations uses FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does warrant proper operation device with respect based such information. When develop equipment incorporating device based such information, must assume responsibility arising such information. FUJITSU MICROELECTRONICS assumes liability damages whatsoever arising information. information this document, including descriptions function schematic diagrams, shall construed license exercise intellectual property right, such patent right copyright, other right FUJITSU MICROELECTRONICS third party does FUJITSU MICROELECTRONICS warrant non-infringement third-party's intellectual property right other right using such information. FUJITSU MICROELECTRONICS assumes liability infringement intellectual property rights other rights third parties which would result from information contained herein. products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated accompanying fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), requiring extremely high reliability (i.e., submersible repeater artificial satellite). Please note that FUJITSU MICROELECTRONICS will liable against and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. Exportation/release products described this document require necessary procedures accordance with regulations Foreign Exchange Foreign Trade Control Japan and/or export control laws. company names brand names herein trademarks registered trademarks their respective owners. Edited: Sales Promotion Department
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