ASSP Power Management Applications DC/DC Converter Built-in Switc
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DS04-27246-1E
ASSP Power Management Applications
DC/DC Converter Built-in Switching voltage detection function, PFM/PWM Synchronous Rectification, Down Conversion Support
MB39C007
DESCRIPTION
MB39C007 current mode type 2-channel DC/DC converter built-in voltage detection, synchronous rectifier, down conversion support. device integrated with switching FET, oscillator, error amplifier, PFM/PWM control circuit, reference voltage source, voltage detection circuit. External inductor decoupling capacitor needed only external component. MB39C007 small, achieve highly effective DC/DC converter full load range, this suitable builtin power supply handheld equipment such mobile phone/PDA, DVDs, HDDs.
FEATURES
High efficiency (Max) current consumption PFM/ch) Output current (DC/DC) mA/ch (Max) Input voltage range Operating frequency (Typ) Built-in operation fixed function flyback diode needed dropout operation 100% duty Built-in high-precision reference voltage generator 1.30 Consumption current shutdown mode less Built-in switching P-ch (Typ) N-ch (Typ) High speed input load transient response current mode Over temperature protection Packaged compact package QFN-24
APPLICATIONS
Flash ROMs players Electronic dictionary devices Surveillance cameras Portable navigators drives phones Network hubs Mobile phones
Copyright©2008 FUJITSU MICROELECTRONICS LIMITED rights reserved 2008.11
MB39C007
ASSIGNMENT
(Top View)
DGND2 DGND2 DGND1 DGND1 DVDD2 DVDD1
DVDD2
DVDD1
OUT2
OUT1
MODE2
MODE1
VREFIN2
VREFIN1
XPOR
CTLP CTL2 CTL1 AGND AVDD VREF
VDET
(LCC-24P-M09)
DS04-27246-1E
MB39C007
DESCRIPTIONS
Name CTLP CTL2, CTL1 AGND AVDD VREF VDET VREFIN1, VREFIN2 MODE1, MODE2 OUT1, OUT2 DVDD1, DVDD2 LX1, DGND1, DGND2 XPOR Description Voltage detection circuit block control input pin. Voltage detection function stop Normal operation) DC/DC converter block control input pins. Shut down Normal operation) Control block ground pin. Control block power supply pin. Reference voltage output pin. Voltage detection input pin. Error amplifier (Error Amp) non-inverted input pins. Operation mode switch pins. PFM/PWM mode, OPEN mode) Output voltage feedback pins. Drive block power supply pins. Inductor connection output pins. High impedance during shut down. Drive block ground pins. VDET circuit output pin. Connected N-ch open drain circuit.
DS04-27246-1E
MB39C007
EQUIVALENT CIRCUIT DIAGRAM
LX1,
VREF
VREFIN1, VREFIN2, VDET
OUT1, OUT2
CTL1, CTL2, CTLP
XPOR
MODE1, MODE2
Protection device
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MB39C007
BLOCK DIAGRAM
AVDD CTL1 ON/OFF OUT1 Error DVDD1 DVDD1 DVDD2
IOUT Comp. VREFIN1 Lo:PFM/PWM OPEN:PWM MODE1 CTLP VDET VREF CTL2 1.30 VREF ON/OFF Error DVDD2 ON/OFF XPOR Mode Control PFM/PWM Logic Control VOUT1
OUT2
IOUT Comp. VREFIN2 Lo:PFM/PWM OPEN:PWM MODE2 Mode Control PFM/PWM Logic Control VOUT2
AGND
DGND1
DGND2
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MB39C007
Current mode Original voltage mode type Stabilize output voltage comparing items below on-duty control. Voltage (VC) obtained through negative feedback output voltage Error Reference triangular wave (VTRI) Current mode type Instead triangular wave (VTRI), voltage (VIDET) obtained through conversion currents that flow oscillator (rectangular wave generation circuit) used. Stabilize output voltage comparing items below on-duty control. Voltage (VC) obtained through negative feedback output voltage Error Voltage (VIDET) obtained through conversion current that flow oscillator (rectangular wave generation circuit)
Voltage mode type model
Current mode type model
Oscillator
VTRI
VIDET
SR-FF
VTRI
VIDET toff
toff
Note above models illustrate general operation actual operation will preferred
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MB39C007
FUNCTION EACH BLOCK
PFM/PWM Logic control circuit normal operation, frequency (2.0 MHz) which built-in oscillator (square wave oscillation circuit) controls built-in P-ch N-ch synchronous rectification operation. light load mode, intermittent (PWM) operation executed. This circuit protects against pass-through current caused synchronous rectification against reverse current caused non-successive operation mode. IOUT Comparator circuit This circuit detects current (ILX) which flows external inductor from built-in P-ch FET. comparing VIDET obtained through conversion peak current with Error output, builtin P-ch turned PFM/PWM Logic Control circuit. Error phase compensation circuit This circuit compares output voltage reference voltages such VREF. This built-in phase compensation circuit that designed optimize operation this This needs neither considered addition phase compensation circuit external phase compensation device. VREF circuit high accuracy reference voltage generated with (bandgap reference) circuit. output voltage 1.30 (Typ). Voltage Detection (VDET) circuit voltage detection circuit monitors VDET voltage. Normally, XPOR through pull-up with external resistor. When VDET voltage reaches reaches level. Timing chart example (XPOR pulled VIN)
VUVLO
CTLP
VDET
VTHHPR VTHLPR
XPOR
VUVLO UVLO threshold voltage VTHHPR, VTHLPR XPOR threshold voltage Protection circuit This built-in over-temperature protection circuit. over-temperature protection circuit turns both N-ch P-ch switching FETs when junction temperature reaches When junction temperature comes down switching returned normal operation. Since PFM/PWM control circuit this control method current mode, current peak value also monitored controlled required. DS04-27246-1E
MB39C007
Function table Input CTL1 CTL2 Don't care Open Operation Stopped CTLP MODE Operation Stopped Stopped Operation Stopped PFM/PWM mode Operation function function
Output VDET function VREF function Switching operation
Stopped
Operation Stopped Operation Stopped Stopped Operation Operation Stopped Operation Stopped fixed mode Operation output
Operation Stopped Operation Stopped Stopped Operation Operation
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MB39C007
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Symbol Condition AVDD DVDD1 DVDD2 OUT1, OUT2 pins Signal input voltage VISIG CTLP, CTL1, CTL2, MODE1, MODE2 pins VREFIN1, VREFIN2 pins VDET XPOR pull-up voltage voltage Peak current VIXPOR XPOR LX1, pins upper limit value ILX1 ILX2 Power dissipation Operating ambient temperature Storage temperature TSTG Rating -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 +6.0 +6.0 3125*1, 1563*1, 1250*1, 625*1, +125 Unit
diagram EXAMPLE STANDARD OPERATION CHARACTERISTICS. Power dissipation Operating ambient temperature" package power dissipation from When mounted four-layer epoxy board 11.7 mounted four-layer epoxy board, which thermal via, IC's thermal connected epoxy board (Thermal holes). mounted four-layer epoxy board, which thermal via, IC's thermal connected epoxy board. Notes: negative voltages below AGND, DGND1, DGND2 create parasitic transistors lines, which cause abnormal operation. This device damaged pins short-circuited AVDD DVDD1/DVDD2, AGND DGND1/DGND2. WARNING: Semiconductor devices permanently damaged application stress (voltage, current, temperature, etc.) excess absolute maximum ratings. exceed these ratings.
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RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage VREFIN voltage voltage current Symbol VREFIN VCTL ILX1, ILX2 AVDD DVDD1 DVDD2 AVDD DVDD1 DVDD2 Condition AVDD DVDD1 DVDD2 CTLP, CTL1, CTL2 pins Value 0.15 1.30 Unit
VREF output current
IROUT
XPOR current Inductor value
IPOR
Note output current from this device situation decrease power supply voltage (VIN) DC/DC converter output voltage (VOUT) differ only small amount. This result slope compensation will damage this device. WARNING: recommended operating conditions required order ensure normal operation semiconductor device. device's electrical characteristics warranted when device operated within these ranges. Always semiconductor devices within their recommended operating condition ranges. Operation outside these ranges adversely affect reliability could result device failure. warranty made with respect uses, operating conditions, combinations represented data sheet. Users considering application outside listed conditions advised contact their representatives beforehand.
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MB39C007
ELECTRICAL CHARACTERISTICS
AVDD DVDD1 DVDD2 VOUT1/VOUT2 setting value MODE1/MODE2 Parameter Input current Output voltage Input stability Load stability input impedance Peak current DC/DC converter block PFM/PWM switch current Oscillation frequency Rise delay time NMOS-FET voltage PMOS-FET resistance NMOS-FET resistance leak current Overheating protection (Junction Temp.) SymPin IREFIN VOUT LINE LOAD ROUT IMSW fosc VNOFF RONP RONN ILEAKM ILEAKH TOTPH TOTPL VTHHUV VTHLUV VHYSUV LX1/LX2 -100 VDD*2 VDD* XPOR XPOR
Condition VREFIN 0.15 VREFIN 0.833 -100
Value 2.45 120* 2.17 2.03 0.08 2.50 0.30 0.20 135* 110* 2.30 2.15 0.15 2.55 0.48 0.42 16.0 160* 125* 2.43 2.27 0.25
Unit
AVDD DVDD1 DVDD2 -100 -800 Output shorted
C1/C2 OUT1/OUT2 VOUT LX1/LX2 -100
Protection UVLO threshold circuit voltage block UVLO hysteresis width
XPOR threshold VTHHPR voltage VTHLPR
Voltage detection circuit block
XPOR hysteresis width XPOR output voltage XPOR output current
VHYSPR
This value specified. This should used reference support designing circuits. (Continued) DS04-27246-1E
MB39C007
(Continued) AVDD DVDD1 DVDD2 VOUT1/VOUT2 setting value MODE1/MODE2 Parameter threshold voltage input current Symbol VTHHCT VTHLCT IICTL VREF LOADREF IVDD1 IVDD1H Condition CTLP/CTL1/CTL2/ VREF VREF -1.0 CTLP/CTL1/CTL2 State circuits OFF*3 CTLP/CTL1/CTL2 State circuits OFF*3 CTLP V,CTL1 CTL2 CTLP CTL1 CTL2 CTLP CTL1/CTL2 CTLP CTL1 CTL2 MODE1/ MODE2 OPEN CTLP CTL1 CTL2 MODE1/ MODE2 OPEN, CTLP CTL1/CTL2 MODE1/MODE2 OPEN, CTLP CTL1/CTL2 CTL1 CTL2 CTL1 CTL2 VOUT1/VOUT2 90%, Value 0.55 0.40 1.274 0.95 0.80 1.300 1.45 1.30 1.326 Unit
Control block
Reference VREF voltage voltage VREF Load block stability
Shut down power supply current
Power supply current DC/DC operation (PFM mode)
IVDD21
IVDD22
General
Power supply current DC/DC operation (PWM mode)
IVDD31
10.0
IVDD32 Power supply current (voltage detection mode) Power-on invalid current
20.0
IVDD5
IVDD
1000
2000
minimum value AVDD DVDD1 DVDD2 VOUT setting value whichever higher. leak includes current internal circuit. current flowing into AVDD, DVDD1, DVDD2 pins. Current consumption based 100% ON-duty (High side full state). gate drive current included because device full state switching operation). Also load current included.
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MB39C007
TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS
CTL1/CTL2 MODE1/MODE2 AVDD DVDD1/DVDD2 MB39C007
R3-1 R3-2
VREF VDET
LX1/LX2 OUT1/OUT2 4.7µF
VOUT1/ VOUT2 IOUT
DGND1/DGND2 VREFIN1/VREFIN2 AGND
VOUT 3.01 VREFIN
Component R3-1 R3-2
Specification
Vendor
Part Number RK73G1JTTD RR0816-203-D RR0816-154-D RR0816-304-D RK73G1JTTD RR0816-104-D C2012JB1A475K C2012JB1A475K C1608JB1E104K C1608JB1H104K VLF4012AT-2R2M
Remarks
VOUT1/VOUT2 Setting
adjusting slow start time
Note These components recommended based operating tests authorized. Corporation SUSUMU Co., Corporation
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APPLICATION NOTES
Selection components Selection external inductor Basically dose need design inductor. This designed operate efficiently with external inductor. inductor should rated saturation current higher than peak current value during normal operating conditions, should have minimal resistance. (100 less recommended.) peak current value obtained following formula. IOUT VOUT fosc IOUT (VIN VOUT) VOUT fosc
IOUT VOUT fosc
External inductor value Load current Power supply voltage Output setting voltage ON-duty switched VOUT/VIN) Switching frequency MHz)
When VOUT IOUT fosc maximum peak current value obtained following formula. IOUT (VIN VOUT) VOUT fosc (3.7
0.89
capacitor selection Select equivalent series resistance (ESR) input capacitor suppress dissipation from ripple currents. Also select equivalent series resistance (ESR) output capacitor. variation inductor current causes ripple currents output capacitor which, turn, causes ripple voltages output equal amount variation multiplied value. output capacitor value significant impact operating stability device when used DC/DC converter. Therefore, FUJITSU MICROELECTRONICS generally recommends capacitor, larger capacitor value used ripple voltages suitable. VIN/VOUT voltage difference within output capacitor value recommended. Types capacitors Ceramic capacitors effective reducing afford smaller DC/DC converter circuit. However, power supply functions heat generator, therefore avoid capacitor with F-temperature rating 20%) FUJITSU MICROELECTRONICS recommends capacitors with B-temperature rating 20%). Normal electrolytic capacitors recommended their high ESR. Tantalum capacitor will reduce ESR, however, dangerous because turns into short mode when
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MB39C007
damaged. insist using tantalum capacitor, FUJITSU MICROELECTRONICS recommends type with internal fuse.
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Output voltage setting output voltage VOUT (VOUT1 VOUT2) this defined voltage input VREFIN (VREFIN1 VREFIN2) Supply voltage inputting VREFIN from external power supply, VREF output dividing with resistors. output voltage when VREFIN voltage dividing VREF voltage with resistors obtained following formula. VOUT 3.01 VREFIN, (VREF 1.30
MB39C007
VREFIN
VREF
VREF
VREF
VREFIN
VREFIN
Note Refer APPLICATION CIRCUIT EXAMPLES" example this circuit. Although output voltage defined according dividing ratio resistance, select resistance value that current flowing through resistance does exceed VREF current rating About conversion efficiency conversion efficiency improved reducing loss DC/DC converter circuit. total loss (PLOSS) DC/DC converter roughly divided follows PLOSS PCONT PCONT Control system circuit loss (The power used this operate, including gate driving power internal FETs) Switching loss (The loss caused during switching IC's internal FETs) Continuity loss (The loss caused when currents flow through IC's internal FETs external circuits
IC's control circuit loss (PCONT) extremely small, less than (with load). contains FETs which switch faster with less power, continuity loss (PC) more predominant loss during heavy-load operation than control circuit loss (PCONT) switching loss (PSW) Furthermore, continuity loss (PC) divided roughly into loss internal ON-resistance external inductor series resistance. loss successive operation mode. This suppresses loss order execute operation load mode (less than load mode). Mode changed current peak value which flows into switching FET. threshold value about DS04-27246-1E
MB39C007
IOUT2 (RDC RONP RONN) RONP RONN IOUT Switching ON-duty cycle VOUT VIN) Internal P-ch resistance Internal N-ch resistance External inductor series resistance Load current
above formula indicates that important reduce much possible improve efficiency selecting components. Power dissipation heat considerations efficient that consideration required most cases. However, used power supply voltage, heavy load, high output voltage, high temperature, requires further consideration higher efficiency. internal loss roughly obtained from following formula IOUT2 RONP RONN) RONP RONN IOUT Switching ON-duty cycle VOUT VIN) Internal P-ch resistance Internal N-ch resistance Output current
loss expressed above formula mainly continuity loss. internal loss includes switching loss control circuit loss well they small compared continuity loss they ignored. this with RONP greater than RONN, larger on-duty cycle, greater loss. When assuming example, RONP 0.36 RONN 0.30 according graph "MOS resistance Operating ambient temperature". IC's internal loss VOUT IOUT According graph "Power dissipation Operating ambient temperature", power dissipation operating ambient temperature internal loss smaller than power dissipation.
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XPOR threshold voltage setting [VPORH, VPORL] detection voltage applying voltage VDET external resistor calculated according this formula. VPORH VPORL VTHHPR VTHLPR
VTHHPR 0.600 VTHLPR 0.583 Example setting detection voltage VPORH VPORL 0.600 3.66 0.583 3.56
MB39C007
AVDD VDET XPOR XPOR
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MB39C007
Transient response Normally, IOUT suddenly changed while VOUT maintained constant, responsiveness including response time overshoot/undershoot voltage checked. this built-in Error with optimized design, shows good transient response characteristics. However, ringing upon sudden change load high operating conditions, capacitor (e.g. µF). (Since this capacitor changes start time, check start waveform well.) This action required input.
MB39C007
VREF
VREF
VREFIN
VREFIN1/ VREFIN2
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MB39C007
Board layout, design example board layout needs designed ensure stable operation this Follow procedure below designing layout. Arrange input capacitor (Cin) close possible both pins. Make through-hole (TH) near pins this capacitor board planes power GND. Large currents flow between this input capacitor (Cin), output capacitor (Co), external inductor (L). Group these components close possible this reduce overall loop area occupied this group. Also mount these components same surface arrange wiring without throughhole wiring. thick, short, straight routes wire (The layout planes recommended.). Arrange bypass capacitor AVDD close possible both ADVV AGND pins. Make through-hole (TH) near pins this capacitor board planes power GND. feedback wiring should wired from voltage output closest output capacitor (Co). extremely sensitive should thus kept wired away from this possible. applying voltage VREFIN1/VREFIN2 pins through dividing resistors, arrange resistors that wiring kept short possible. Also arrange them that VREFIN1/VREFIN2 resistor close IC's AGND pin. Further, provide exclusively control line that resistor connected path that does carry current. installing bypass capacitor VREFIN, close VREFIN pin. applying voltage VDET through dividing resistors, arrange resistors that wiring kept short possible. Also arrange that VDET resistor close IC's AGND pin. Further, provide exclusively control line that resistor connected path that does carry current. make plane surface which this will mounted. efficient heat dissipation when using QFN-24 package, FUJITSU MICROELECTRONICS recommends providing thermal footprint thermal pad. Example arranging system parts
Feedback line
Feedback line
1pin
AVDD bypass capacitor
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Notes circuit design switching operation this works monitoring controlling peak current which, incidentally, serves form short-circuit protection. However, leave output short-circuited long periods time. output short-circuited where current limit value (peak current inductor) tends rise. Leaving short-circuit state, temperature this will continue rising activate thermal protection. Once thermal protection stops output, temperature will down operation will restarted, after which output will repeat starting stopping. Although this effect will destroy thermal exposure over prolonged hours affect peripherals surrounding
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EXAMPLE STANDARD OPERATION CHARACTERISTICS
(Shown below example characteristics connection according TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS".) Characteristics Conversion efficiency Load current (PFM/PWM mode)
Conversion efficiency Load current (PFM/PWM mode)
Conversion efficiency
Conversion efficiency
+25°C VOUT MODE
+25°C VOUT MODE
1000
1000
Load current IOUT (mA)
Load current IOUT (mA)
Conversion efficiency Load current (PFM/PWM mode)
Conversion efficiency Load current (PFM/PWM mode)
Conversion efficiency
Conversion efficiency
+25°C
VOUT
+25°C
VOUT MODE
1000
1000
Load current IOUT (mA)
Load current IOUT (mA) (Continued)
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Conversion efficiency Load current (PWM fixed mode)
Conversion efficiency Load current (PWM fixed mode)
Conversion efficiency
Conversion efficiency
+25°C VOUT MODE OPEN
1000
+25°C
VOUT MODE OPEN
1000
Load current IOUT (mA)
Load current IOUT (mA)
Conversion efficiency Load current (PWM fixed mode)
Conversion efficiency Load current (PWM fixed mode)
1000
Conversion efficiency
Conversion efficiency
+25°C
+25°C VOUT MODE OPEN
VOUT MODE OPEN
1000
Load current IOUT (mA)
Load current IOUT (mA) (Continued)
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Output voltage Input voltage (PFM/PWM mode)
2.60 2.58 +25°C MODE IOUT 2.60 2.58
Output voltage Input voltage (PWM fixed mode)
+25°C MODE OPEN IOUT
Output voltage VOUT
Output voltage VOUT
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42
IOUT -100
IOUT -100
2.40
Input voltage
Input voltage
Output voltage Load current (PFM/PWM mode)
2.60 2.58 +25°C MODE
2.60 2.58
Output voltage Load current (PWM fixed mode)
+25°C
VOUT MODE OPEN
Output voltage VOUT
Output voltage VOUT
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42 2.40
2.56 2.54 2.52 2.50 2.48 2.46 2.44 2.42
2.40
Load current IOUT (mA)
Load current IOUT (mA)
(Continued)
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Reference voltage Input voltage
1.40 1.38 +25°C 1.40 1.38
Reference voltage Operating ambient temperature
VOUT IOUT
Reference voltage VREF
1.36 1.34 1.32 1.30 1.28 1.26 1.24 1.22 1.20
Reference voltage VREF
1.36 1.34 1.32 1.30 1.28 1.26 1.24 1.22 1.20
IOUT
IOUT -100
Input voltage Input current Input voltage (PFM/PWM mode)
Operating ambient temperature
+100
Input current Input voltage (PWM fixed mode)
Input current (µA)
Input current (mA)
+25°C VOUT MODE
+25°C MODE OPEN
Input voltage
Input voltage (Continued)
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Input current Operating ambient temperature
(PFM/PWM mode)
+100 VOUT MODE
Input current Operating ambient temperature (PWM fixed mode)
Input current (mA)
Input current (µA)
+100
VOUT MODE OPEN
Operating ambient temperature
Operating ambient temperature
Oscillation frequency Power supply voltage
Oscillation frequency Operating ambient temperature
Oscillation frequency fOSC (MHz)
Oscillation frequency fOSC (MHz)
+25°C VOUT IOUT -100
VOUT IOUT -100
+100
Power supply voltage
Operating ambient temperature
(Continued)
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resistor Input voltage
P-ch resistor Operating ambient temperature P-ch resistor RONP
resistor
N-ch +25°C P-ch
+100
Input voltage
Operating ambient temperature
N-ch resistor Operating ambient temperature
N-ch resistor RONN
+100
Operating ambient temperature (Continued)
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MODE Input voltage
Input voltage
VTHHCT VTHLCT
MODE
VTHMMD
VTHLMD +25°C
+25°C
VTHHCT Circuit OFFON VTHLCT Circuit ONOFF
Input voltage
Input voltage
VXPOR Input voltage
+25°C
VXPOR
VPORL VPORH
Input voltage
(Continued)
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(Continued) Power dissipation Operating ambient temperature (with thermal via)
3500
3125
Power dissipation Operating ambient temperature (without thermal via)
3500 3000
3000
Power dissipation (mW)
2500 2000 1500 1000
Power dissipation (mW)
2500 2000
1563
1250
1500 1000
+100
+100
Operating ambient temperature
Operating ambient temperature
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Switching waveforms PFM/PWM operation
VOUT mV/div
V/div
mA/div µs/div
VOUT IOUT MODE
operation
VOUT mV/div
V/div
mA/div VOUT IOUT -800 MODE
µs/div
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Output waveforms sudden load changes
IOUT
IOUT -800
IOUT
VOUT mV/div
µs/div
VOUT MODE
VREFIN capacitor value
IOUT
IOUT -800
IOUT
VOUT mV/div
µs/div
VOUT MODE
VREFIN capacitor value
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MB39C007
Output waveforms sudden load changes
IOUT -100
IOUT -800
IOUT -100
VOUT mV/div
µs/div
VOUT MODE VREFIN capacitor value
response characteristics
VCTL V/div
mA/div
VOUT V/div µs/div
VOUT IOUT VREFIN capacitor
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APPLICATION CIRCUIT EXAMPLES
APPLICATION CIRCUIT EXAMPLE external voltage input reference voltage external input (VREFIN1, VREFIN2) VOUT voltage 3.01 times VOUT setting gain.
MB39C007 DVDD1 DGND1 DVDD2 DAC1 VREFIN1 DGND2 AVDD CTL2 AGND
CTL1
DAC2
VREFIN2
VOUT1
MODE1 PFM/PWM OPEN MODE2
OUT1
APLI1
VOUT2
APLI2
VREF OUT2 VDET
CTLP
XPOR
VOUT 3.01 VREFIN
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APPLICATION CIRCUIT EXAMPLE voltage VREF input reference voltage external input (VREFIN1, VREFIN2) dividing resistors. VOUT1 voltage VOUT2 voltage
MB39C0007 DVDD1 DGND1 DVDD2 VREFIN1 DGND2 AVDD
CTL1
CTL2 VREFIN2 VREF APLI2 OUT1 VOUT1 APLI1 AGND
VOUT2
MODE1 PFM/PWM OPEN MODE2 VDET CTLP
OUT2
XPOR VOUT1 3.01 VREFIN1 VREFIN1 VREF 1.30 1.30
(VREF 1.30 VOUT1 3.01
VOUT12 3.01
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APPLICATION CIRCUIT EXAMPLE COMPONENTS LIST Component Item Part Number Inductor Inductor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Resister Resister Resister Resister Resister Resister VLF4012AT-2R2M MIPW3226D2R2M VLF4012AT-2R2M MIPW3226D2R2M C2012JB1A475K C2012JB1A475K C2012JB1A475K C2012JB1A475K C1608JB1E104K
Specification
Package 2012 2012 2012 2012 2012 1608 1608 1608 1608 1608 1608 1608 1608
Vendor
RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73G1JTTD 0.5% 0.5%
Corporation Corporation Corporation
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USAGE PRECAUTIONS
configure over maximum ratings
used over maximum ratings, permanently damaged. preferable device normally operate within recommended usage conditions. Usage outside these conditions adversely affect reliability LSI.
devices within recommended operating conditions
recommended operating conditions conditions under which guaranteed operate. electrical ratings guaranteed when device used within recommended operating conditions under conditions stated each item.
Printed circuit board ground lines should with consideration common impedance Take appropriate static electricity measures
Containers semiconductor materials should have anti-static protection made conductive material. After mounting, printed circuit boards should stored shipped conductive bags containers. Work platforms, tools, instruments should properly grounded. Working personnel should grounded with resistance between body ground.
apply negative voltages
negative voltages below -0.3 create parasitic transistors lines, which cause abnormal operation.
ORDERING INFORMATION
Part number MB39C007QN-E1 Package 24-pin plastic (LCC-24P-M09) Remarks Lead-free version
RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION
products FUJITSU MICROELECTRONICS with "E1" compliant with RoHS Directive, observed standard lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB) polybrominated diphenyl ethers (PBDE). product whose part number trailing characters "E1" RoHS compliant.
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LABELING SAMPLE (LEAD FREE VERSION)
Lead-free mark JEITA logo JEDEC logo
part number lead-free product trailing characters "E1".
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EVALUATION BOARD SPECIFICATION
MB39C007 Evaluation Board provides proper evaluating efficiency other characteristics MB39C007. Terminal information Symbol Power supply terminal standard condition When VIN/VOUT difference held within less, such devices with standard output voltage (VOUT1 when FUJITSU MICROELECTRONICS recommends changing output capacity (C1, Output terminals (VOUT1: CH1, VOUT2: CH2) Power supply terminal setting CTL1, CTL2 CTLP terminals. connecting with (When mounted). Direct supply terminal (CTL1 CH1, CTL2 CH2) CTL1, CTL2 (Typ.) Shutdown CTL1, CTL2 0.95 (Typ.) Max) Normal operation Direct supply terminal MODE (CH1 MODE1, MODE2) MODE1, MODE2 V(Max) PFM/PWM mode MODE1, MODE2 OPEN(Remove mode Reference voltage output terminal VREF 1.30 (Typ.) External reference voltage input terminals (VREFIN1 CH1, VREFIN2 CH2) When external reference voltage supplied, connect terminal each channel. Voltage input terminal voltage detection Voltage detection circuit block control terminal CTLP Voltage detection circuit block stop CTLP Normal operation Voltage detection circuit output terminal N-ch open drain circuit connected. Pull-up voltage terminal XPOR terminal Ground terminal Connect power supply PGND terminal next terminal. Connect output (load) PGND terminal between VOUT1 terminal VOUT2 terminal. Ground terminal
Functions
VOUT1, VOUT2 VCTL
CTL1, CTL2
MODE1, MODE2
VREF
VREFIN1, VREFIN2
VDET CTLP
XPOR VXPOR
PGND
AGND
DS04-27246-1E
MB39C007
Startup terminal information Terminal name Condition CTL1 Open Connect Open Connect Open Connect ON/OFF switch Shutdown Normal operation. ON/OFF switch Shutdown Normal operation. ON/OFF switch voltage detection block Stops voltage detection circuit Normal operation.
Functions
CTL2
CTLP
Jumper information
Functions Short-circuited layout pattern board (normally used shorted). Short-circuited layout pattern board (normally used shorted). mounted Normally used shorted
Setup checkup
Setup Connect CTL1 terminal CTL2 terminal terminal. into state connecting CTLP terminal AGND pad. Connect power supply terminal terminal, power supply terminal PGND terminal. Make sure PGND connected PGND terminal next terminal. (Example setting power-supply voltage Checkup Supply power VIN. operating normally VOUT1 (Typ) VOUT2 (Typ).
DS04-27246-1E
MB39C007
Component layout evaluation board (Top View)
MB39C007EVB-06Rev. VOUT2 PGMD MODE2 VREFIN2 R4-2 R1-1R1-2 R4-1 R6-2 R6-1 VDET VREF VREFIN1 MODE1 VOUT1
XPOR VXPOR
CTLP
CTL2
CTL1
AGND
CTL2
VCTL CTL1 CTLP
DS04-27246-1E
MB39C007
Evaluation board layout (Top View)
Side (Layer1)
Inside (Layer2)
Inside (Layer3)
Bottom Side (Layer4)
DS04-27246-1E
MB39C007
Connection diagram
MB39C007
VCTL CTL1 CTL1 DVDD1_2 DGND1_1 MODE1 VREF R6-1 R6-2
DVDD1_1
MODE1
DGND1_2
PGND
DVDD2_1 DVDD2_2 VREFIN1
VREFIN1
DGND2_1 DGND2_2
CTL2 CTL2 AGND AVDD AGND
MODE2 VREF R4-1 R4-2
MODE2
VOUT1
VREFIN2 OUT1
VREFIN2
VOUT2
VREF VREF VDET R1-1 R1-2
VREF OUT2
VDET CTLP XPOR
VXPOR
XPOR
CTLP
mounted
DS04-27246-1E
MB39C007
Component list CompoPart Name nent R1-1 R1-2 R4-1 R4-2 R6-1 R6-2 Inductor Inductor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister Resister switch Jumper Jumper Jumper Jumper
Model Number MB39C007QN VLF4012AT-2R2M VLF4012AT-2R2M C2012JB1A475K C2012JB1A475K C2012JB1A475K C2012JB1A475K C1608JB1E104K C1608JB1H104K C1608JB1H104K RK73Z1J RK73Z1J RR0816P-304-D RR0816P-753-D RK73G1JTTD RK73Z1J RR0816P-223-D RR0816P-334-D RR0816P-304-D RR0816P-203-D RR0816P-154-D RR0816P-304-D RK73G1JTTD RK73G1JTTD RK73G1JTTD RK73Z1J
Specification RDC=76 RDC=76 µF(10 µF(10 µF(10 µF(10 µF(50 µF(50 µF(50 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5%
Package Vendor QFN-24 2012 2012 2012 2012 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608 1608
Remark
mounted Patternshorted Patternshorted mounted
Note These components recommended based operating tests authorized. FUJITSU MICROELECTRONICS LIMITED Corporation Corporation SUSUMU Co.,
DS04-27246-1E
MB39C007
BOARD ORDERING INFORMATION
Board Part MB39C007EVB-06 Board Version MB39C007EVB-06 Rev.2.0 Remarks QFN-24
DS04-27246-1E
MB39C007
PACKAGE DIMENSION
24-pin plastic Lead pitch Sealing method 0.50 Plastic mold
(LCC-24P-M09)
24-pin plastic (LCC-24P-M09)
4.00±0.10 (.157±.004)
2.70±0.10 (.106±.004)
INDEX AREA
4.00±0.10 (.157±.004)
2.70±0.10 (.106±.004)
0.25±0.05 (.010±.002)
3-R0.20 (3-R.008) 0.50(.020)
0.40±0.10 (.016±.004) 1PIN CORNER (C0.25(C.010))
0.08(.003) 0.00(.000)
0.85(.033) 0.20(.008)
2006-2008 FUJITSU MICROELECTRONICS LIMITED C24059S-c-2-3
Dimensions (inches). Note: values parentheses reference values.
DS04-27246-1E
MB39C007
CONTENTS
page DESCRIPTION FEATURES APPLICATIONS ASSIGNMENT DESCRIPTIONS EQUIVALENT CIRCUIT DIAGRAM BLOCK DIAGRAM FUNCTION EACH BLOCK ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS ELECTRICAL CHARACTERISTICS TEST CIRCUIT MEASURING TYPICAL OPERATING CHARACTERISTICS APPLICATION NOTES EXAMPLE STANDARD OPERATION CHARACTERISTICS APPLICATION CIRCUIT EXAMPLES USAGE PRECAUTIONS ORDERING INFORMATION RoHS COMPLIANCE INFORMATION LEAD (Pb) FREE VERSION MARKING FORMAT (LEAD FREE VERSION) LABELING SAMPLE (LEAD FREE VERSION) MB39C007QN-E1 RECOMMENDED CONDITIONS MOISTURE SENSITIVITY LEVEL EVALUATION BOARD SPECIFICATION BOARD ORDERING INFORMATION PACKAGE DIMENSION
DS04-27246-1E
MB39C007
MEMO
DS04-27246-1E
MB39C007
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ further information please contact: North South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 Arques Avenue, Sunnyvale, 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 Korea FUJITSU MICROELECTRONICS KOREA LTD. Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://kr.fujitsu.com/fmk/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. Lorong Chuan, #05-08 Tech Park 556741 Singapore +65-6281-0770 +65-6281-0220 http://www.fmal.fujitsu.com/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. 3102, Bund Center, No.222 Road (E), Shanghai 200002, China +86-21-6146-3688 +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, Canton Road, Tsimshatsui, Kowloon, Hong Kong +852-2377-0226 +852-2376-3269 http://cn.fujitsu.com/fmc/en/
Specifications subject change without notice. further information please contact each office. Rights Reserved. contents this document subject change without notice. Customers advised consult with sales representatives before ordering. information, such descriptions function application circuit examples, this document presented solely purpose reference show examples operations uses FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does warrant proper operation device with respect based such information. When develop equipment incorporating device based such information, must assume responsibility arising such information. FUJITSU MICROELECTRONICS assumes liability damages whatsoever arising information. information this document, including descriptions function schematic diagrams, shall construed license exercise intellectual property right, such patent right copyright, other right FUJITSU MICROELECTRONICS third party does FUJITSU MICROELECTRONICS warrant non-infringement third-party's intellectual property right other right using such information. FUJITSU MICROELECTRONICS assumes liability infringement intellectual property rights other rights third parties which would result from information contained herein. products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated accompanying fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), requiring extremely high reliability (i.e., submersible repeater artificial satellite). Please note that FUJITSU MICROELECTRONICS will liable against and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. Exportation/release products described this document require necessary procedures accordance with regulations Foreign Exchange Foreign Trade Control Japan and/or export control laws. company names brand names herein trademarks registered trademarks their respective owners. Edited: Sales Promotion Department
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