UN0361B module Bluetooth. using flip-chip packaging technology ceramic

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UN0361B module Bluetooth. using flip-chip packaging technology ceramic

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Bluetooth Module UN0361B
UN0361B module Bluetooth. using flip-chip packaging technology ceramic multi-layer substrate technology, smallest module been achieved. When used with Baseband controller MN102H9200 MN2CS0023 Protocol software, provides fully compliant Bluetooth system data voice communications.
Features
Smallest size single supply voltage Class Class compliant Bluetooth specification Ver.1.1 compliant
Applications
Mobile Phones, PCs,PDAs, Terminal Adapters, Digital Cameras, Printers, other Audio-video Equipment Peripheral Devices
Specifications
UN0361B Item Frequency
Contents GFSK (BER 0.1%) (with level control)
Modulation method Channel spacing Channel number Sensitivity Output power Supply voltage Dimensions
Products specifications subject change without notice. Please latest Product Standards guarantee satisfaction your product requirements.
Kotari-yakemachi, Nagaokakyo, Kyoto 617-8520, Japan
M00556AE
Tel. +81-75-951-8151
publication, effective from Aug. 2002
Block diagram
UN0361B Module> <RF-IC>
IFFIL
RSSI
RSSI RXDATA
DEMOD COMP AFIL
TXDATA Control
XTALOSC
RF-BB
Serial Interface

UN0361B module Bluetooth. using flip-chip packaging technology ceramic

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