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Silicon n-channel junction (Tr1) Silicon epitaxial planar type (Tr2)
Top Searches for this datasheetXP08081 (XP8081) Silicon n-channel junction (Tr1) Silicon epitaxial planar type (Tr2) analog switching (Tr1)/switching (Tr2) Features elements incorporated into package Transistors with built-in resistor) Reduction mounting area assembly cost half (0.425) Unit: 0.12+0.05 -0.02 0.2±0.05 1.25±0.10 2.1±0.1 (0.65) (0.65) Basic Part Number 2SK1103 UNR2213 (UN2213) 1.3±0.1 2.0±0.1 0.9±0.1 Parameter Gate-drain surrender voltage Drain current Gate current Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector current Overall Total power dissipation Junction temperature Storage temperature Symbol VGDS VCBO VCEO Tstg Rating +150 Unit Drain (Tr1) Source (Tr1) Collector (Tr2) EIAJ: SC-88 Marking Symbol: Internal Connection 0.9+0.2 -0.1 Absolute Maximum Ratings 25°C Emitter (Tr2) Base (Tr2) Gate (Tr1) SMini6-G1 Package Note) part number parenthesis shows conventional part number. Publication date: March 2004 SJJ00218CED 0.2±0.1 XP08081 Electrical Characteristics 25°C Parameter Gate-drain surrender voltage Drain-source cutoff current Gate-source cutoff current Gate-source cutoff voltage Mutual conductance Drain-source resistance Short-circuit forward transfer capacitance (Common source) Reverse transfer capacitance (Common source) Short-circuit output capacitance (Common source) Symbol VGDS IDSS IGSS VGSC RDS(on) Ciss Crss Coss Conditions -1.0 Unit Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Emitter-base cutoff current (Collector open) Forward current transfer ratio Collector-emitter saturation voltage Output voltage high-level Output voltage low-level Input resistance Resistance ratio Transition frequency Symbol VCBO VCEO ICBO ICEO IEBO VCE(sat) Conditions -30% +30% 0.25 Unit Note) Measuring methods based JAPANESE INDUSTRIAL STANDARD 7030 measuring methods transistors. SJJ00218CED XP08081 Characteristics charts 25°C Total power dissipation (mW) Drain current (mA) Drain current (mA) -25°C 25°C 75°C -1.2 -1.0 Ambient temperature (°C) Drain-source voltage Gate-source voltage Ciss Crss Coss Short-circuit forward transfer capacitance (Common source) Ciss Reverse transfer capacitance (Common source) Crss Short-circuit output capacitance (Common source) Coss (pF) Forward transfer admittance (mS) Forward transfer admittance (mS) 25°C 25°C 25°C IDSS IDSS Ciss Coss Crss -1.6 -1.2 Gate-source voltage Drain current (mA) Drain-source voltage SJJ00218CED XP08081 Characteristics charts 25°C VCE(sat) Collector-emitter saturation voltage VCE(sat) Forward current transfer ratio Collector current (mA) 75°C 25°C -25°C 25°C -25°C 0.01 75°C Collector-emitter voltage Collector current (mA) Collector current (mA) Collector output capacitance (pF) (Common base, input open circuited) 25°C 25°C 25°C Output current (µA) Input voltage 0.01 Collector-base voltage Input voltage Output current (mA) SJJ00218CED Request your special attention precautions using technical information semiconductors described this material export permit needs obtained from competent authorities Japanese Government products technical information described this material controlled under "Foreign Exchange Foreign Trade Law" exported taken Japan. technical information described this material limited showing representative characteristics applied circuits examples products. neither warrants non-infringement intellectual property right other rights owned company third party, grants license. liable infringement rights owned third party arising technical information described this material. products described this material intended used standard applications general electronic equipment (such office equipment, communications equipment, measuring instruments household appliances). 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Even when products used within guaranteed values, take into consideration incidence break down failure mode, possible occur semiconductor products. Measures systems such redundant design, arresting spread fire preventing glitch recommended order prevent physical injury, fire, social damages, example, using products. When using products which damp-proof packing required, observe conditions (including shelf life amount time standing unsealed items) agreed upon when specification sheets individually exchanged. This material reprinted reproduced whether wholly partially, without prior written permission Matsushita Electric Industrial Co., Ltd. 2003 Other recent searchesYM2LUY11D - YM2LUY11D YM2LUY11D Datasheet REJ03D0585-0300 - REJ03D0585-0300 REJ03D0585-0300 Datasheet PMN34UN - PMN34UN PMN34UN Datasheet OP913WSL - OP913WSL OP913WSL Datasheet NL6448AC33-18 - NL6448AC33-18 NL6448AC33-18 Datasheet DT43-7022 - DT43-7022 DT43-7022 Datasheet A2753B - A2753B A2753B Datasheet S530-E2 - S530-E2 S530-E2 Datasheet 2SK1437 - 2SK1437 2SK1437 Datasheet
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