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1990's witnessing development leading worldwide cellular standard. Hav
Top Searches for this datasheetPower Flexibility Single Chip 1990's witnessing development leading worldwide cellular standard. Having achieved worldwide leadership position, evolving into multiband solutions into multi-mode systems combination with other wireless technologies. VLSI maintained leading market position since early days ASIC ASSP supplier major phone manufacturers. VLSI's major investment building knowledge resulted outstanding competence, keeping ahead competition leading edge technology provider wireless industry. VLSI's offerings beyond traditional silicon products, ranging from specifically developed FSBs(Functional System Blocks) code fully integrated, type-approved chipset. After more than seven years' activity market, developing technology well working with standards bodies, VLSI silicon every phones sold GSM. early stage, VLSI recognized importance integrating multiple future digital communication standards. this reason, parallel with development, have made significant investments DECT, CDMA technology. These strengths will allow VLSI continue play leading role evolution future communication platforms towards multi-band multi- standard technologies such UMTS FPLMTS. PROCESS TECHNOLOGY Keeping step ahead, VLSI already moved current products industry-leading 0.35µm process technology. Coupled with unmatched library optimized cells Functional System Blocks (FSB). This enables company meet harsh expectations overall cost reduction market percent annum. addition, migration latest silicon process, coupled with technical enhancements VLSI Communication Standard Platform reduction supply voltage 2.7V, typical idle-mode power consumption less than 2mA. VLSI's process technology will allow further supply voltage reductions 2.4V 1.8V optimize power consumption even more. VLSI's long-standing design process capabilities have allowed integrate full mixed-signal capabilities standard CMOS process. ASSPs incorporate mixed-signal technology implement voice band analog front (VBAFE) well front interface. Thanks this process advantage, have been able minimize component count. cutting back interfaces, providing dedicated power control each analog block, have been able reduce system power consumption significantly. same time, functional level, these circuits have enabled customers various awards best voice quality using integrated VBAFE. System-Level SiliconSystem-Level Silicon integrates increasingly complex system logic functions onto smaller smaller silicon footprint, reducing size, power consumption cost integrated circuits. market demands embedded processing power with Risc controllers engines. Wether ASSP ASIC, VLSI leads field with range embedded processors integrated analog interface cicuits, giving unrivaled system-level silicon. Design Methodology Common high-level hardware description languages (HDLs) used VLSI's device design only speed design cycle also permit rapid migration silicon process technologies, thus ensuring long-term competitiveness. Standardizing design approach over complete product range, have done with GSM, DECT, CDMA products, delivers still greater advantages, allowing fast reaction future evolution combinations these standards. Furthermore, this design approach eases design derivative products, allowing custom ASSPs ASICs produced modifying blocks code, combining standard design core blocks with customer-specified functions. skills well excellent support capability. Dedicated wireless cores optimized minimal power consumption available. full suite libraries design environments provided allow quick design integration customer products. Core Building success Technology's "Pine" digital signal processor core serving stepping-stone towards future cores, core rapidly becoming industry standard cellular applications. VLSI Technology implementation core, VVF3500, achieves 80MHz (typical operating conditions). When coupled with appropriate hardware accelerator circuits such Viterbi co-processor, this level processing power gives enough flexibility carry only standard-specific communication processing, also supplementary functions typically needed multimode phones well customerspecific applications such echo cancellation speech recognition. Multiprocessor System Design support application development around ARM7TDMI-RISC VVF3500 multi-core platform offer risk path system design VLSI offering integrated development package including: Multiprocessor Development Chip (MDC) Dual RISC/DSP cores running asynchronously chip provide chip solution system integration Multiprocessor Development Tools (MDT) Complete software simulation/emulation development PROCESSOR CORES ARM7TDMI Cores ARM7TDMI ("Thumb") includes real time instruction decompression circuit which combines advantages 32-bit RISC core with significantly increased code density improved performance systems based 8-bit 16-bit-wide memory. Supporting flexible system clocks, with ability reduce clock rates minimize power consumption battery-powered applications, core spans wide spectrum performance delivers sufficient processing power future communication standards evolution. core's processing power allows customer applications same processor communications protocol; these applications range from standard supplementary services full implementation. VLSI founders Ltd. widely recognized unmatched application-specific core optimization integration which allows test, analyze modify RISC/DSP code before hardware available Multiprocessor Development Platform (MDP) Flexible development board with JTAG port, prototyping area Logic Analyzer support Future Cores Complementing currently available processors, powerful cores-based VLSI-Hitachi licensing agreement-open horizons performance. Analog microphone loudspeaker interface power Dedicated mode: 10mA 30mA mode Idle Mode: 30µA VP22003 Kernel Processor Complete peripheral set, SIM, UART GPIOs Integrated FSC/CRC check data application Battery management charging control TQFP package Fully integrated phase data support (T/NT) 0.3-9.6Kbits/s power Dedicated: 20mA Idle: <2mA Software software Fully documented supported Software modules transparent/Non-transparent data support. Type Approved Chipset VLSI today produces fully typeapproved two-chip chipset, already integrated wide range mobile phones. chipset partitioned into "GSM Kernel" Vocoder (voice coding part). Kernel handles signalling protocol stack handling well external interface MMI. voice coding part responsible speech processing interface with microphone loudspeaker. VP22003 VP22003 kernel processor direct, fully software-compatible evolution type-approved VP22002 device. VP22003 uses VLSI's functional system block (FSB) technology with 32-bit RISC microcontroller. Even when operating frequency minimize power consumption, efficient microcontroller delivers enough MIPS full protocol stack, same time Chipset Offering VWS22030 Voice-Coprocessor FR/EFR Voice coding Custom echo noise suppression algorithm Asynchronous code decode DTX, VAD, test TwoC-EFR Solution sophisticated Man/Machine Interface full data functions. supports full Phase data features (transparent/non-transparent data) without needing expensive external PCMCIA cards other hardware coprocessors. kernel also offers asynchronous data port, serial EEPROM port, 25-key keypad scanner general-purpose I/O. Power management facilities permit low-power operation: standby mode consumption typically less than VWS22030 Operating ±10%, VWS22030 combines first-generation Full Rate (FR) Vocoder function with Enhanced Full Rate (EFR) speech coding providing enhanced voice quality. Support voice codec requirement mobile phones conform emerging PCS1900 standard based existing technology. chip complies with Phase series ETSI specification. integrated core provides sufficient processing power support integrated noise echo cancellation, eliminating expensive external coprocessors needed today's hands-free kits. VWS22030, like predecessor VP22020, integrates mixed-signal circuitry such VBAFE (voice band analog front end) with which VLSI's customers have already awards "Best Voice Quality" previous models mobile phones. VWS22030 also first standard product market allow customer such wide range customization capabilities product feature differentiation. Previously, customers could only benefit from such features investing significantly time technology ASIC solutions. Single Chip Communication Standard Platform OneC Wireless markets have shown significant growth, opening tremendous development opportunities. dynamics market have also intensely competitive environment similar consumer electronic marketplace. succeed these markets, companies need reliable, innovative supplier enables them implement their differentiation ideas, ensuring competitiveness profitability marketplace. Similarly, time market vital allow quick product iterations. OneC platform approach dedicated support future evolution standard well combinations future standards. allow customers differentiate OneC Platform Architecture succeed increasingly competitive market, OneC platform architecture allows high-volume ASIC-like customization/adaptations three levels: Customization based additional on-circuit into which custom code downloaded from system memory Metal-level programmability GSM-1C product, allowing easy modification on-circuit with custom code Implemented using high-level design language, product designed that custom hardware blocks easily added design existing blocks modified match customer specifications. OneC Platform Based evolving standards, clear trend visible towards single chip architecture based around microcontroller core. single chip architecture following advantages: Higher design flexibility customization First step full multi-mode integration Power consumption, fewer interfaces Reduced number components, easier manufacturing, cost reduction yield improvement OneC provides multi-standard platform. Common high-level hardware description languages (HDLs) used device design speed design cycle, also permit rapid migration silicon process technologies maintain long-term competitiveness. Still greater advantages occur design approach standardized over VLSI's complete product range, i.e. GSM, DECT, CDMA, allowing fast reaction future evolution combinations these standards. Such standardized design approach will allow easy customization standard products modifying blocks code will also permit later ASIC derivatives standard products combining core blocks standard design with customer-specified functions. Interprocessor Communication RISC cores work synergy make efficient particular strengths each processor. efficient split processing tasks over cores delivers cost optimized solution well ensuring maximum flexibility. Such optimization taken stage further common interface which significantly reduces count while intelligent memory access technologies allow real-time download different software algorithms into on-chip fast memory depending moment-by-moment needs user. Radio Module Based WARM chip WAVECOM Full specification Class radio module Designed easy manufacturing Only 0603 components WAVECOM Software Core Real time kernel memory requirements 64Kbytes 256Kbytes core Fully documented supported Performance Idle current consumption: 9-15mA 4.8V depending frequency paging frame occurrence Data services include transparent non-transparent data 0.39.6Kbit/s. ETSI compatible command used interfacing. VLSI-WAVECOM Cooperation VLSI Wavecom entered into cooperation with objective providing market-leading total solutions wireless market. total solution concept includes design integrated into type-approved system design ready manufacturing. relationship between companies allows continuous development portion deliver solution optimized terms cost, performance size. cooperation, which started field GSM, will evolve encompass other standards well multi-band multimode solutions. About WAVECOM WAVECOM S.A., located Issy-les-Moulineaux, France, established June 1993 provide wireless system designs, product systems VLSI-WAVECOM Partnership WM1-G900 Features System Licensed Module Size: Target Handset Weight: <160g Performance Talk Time: hours Standby Time: hours 550mAh batteries @4.8V Baseband VLSI TwoC chipset consisting VP22020 Vocoder VP22002 Kernel Embedded processor Analog voice radio interface Complete peripheral set, SIM, UART GPIOs Battery management charging control WISMO Module WISMO WISMO concept (WIreless Standard MOdule) generic concept fromWAVECOM developed order simplify design wireless terminals. Thefirst generation module developed GSM900 (referenced WM1-G900) already obtained several FTAs today volume production. module allows handset development times which unique market, highly competitive price level. finished-product approach completely eliminates widely known technical risk, WISMO-based phones typically obtain less than hours. WISMO's unique full data capability makes very attractive GSM-data-based services like PC/PDA mobility other applications. WAVECOM Offerings WAVECOM offering based around type-approved WISMO module. WISMO offering includes three type business models: Module supply module supplied fully tested tuned direct integration into product Manufacturing license necessary elements licensed manufacturing including test manufacturing support provided Technology license Full technology access provided system level Software architecture Wavecom product offering complemented wide range customerservices which include type-approval services engineering services full product design. Future Perspective current offering will complemented with offerings DCS1800 PCS1900 mid-1997. range offerings will extended cover multi-standard devices well multi-mode multi-band solutions built around basic solutions later stage. radio communication markets. WAVECOM's goal support equipment manufacturers order launch radio communication terminals market under best possible conditions cost delay. this end, WAVECOM developed technology cellular phones (GSM DCS1800, PCS1900), digital cordless telephones (CT2 DECT), paging receivers (ERMES) satellite mobile communication (ICO). brands, product names, company names trademarks registered trademarks their respective owners. With respect information this document, VLSI Technology, Inc. (VLSI) makes guarantee warranty accuracy that such information will infringe upon intellectual rights third parties. VLSI shall responsible loss damage whatever nature resulting from reliance upon patent other license implied hereby. This document does extend modify VLSI's warranty product beyond that forth standard terms conditions sale. VLSI reserves right make changes products specifications time without notice. LIFE SUPPORT APPLICATIONS: VLSI's products intended critical components life support appliances, devices, systems, which failure VLSI product perform could expected result personal injury. update information, please visit site: http://www.vlsi.com 1997 VLSI Technology, Inc. Printed Document Control: PB-GSM V1.0 October VLSI Technology, Inc. 1109 McKay Drive Jose, 95131 Other recent searchesUS100 - US100 US100 Datasheet ST16-19RFRDCS010 - ST16-19RFRDCS010 ST16-19RFRDCS010 Datasheet NII51001-7 - NII51001-7 NII51001-7 Datasheet MJD200 - MJD200 MJD200 Datasheet LXT6282 - LXT6282 LXT6282 Datasheet LXT380 - LXT380 LXT380 Datasheet LT1083HN - LT1083HN LT1083HN Datasheet TO258 - TO258 TO258 Datasheet ICS874003-05 - ICS874003-05 ICS874003-05 Datasheet HI-3584 - HI-3584 HI-3584 Datasheet
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