MC74HC08A identical pinout LS08. device inputs compatible with Standar

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MC74HC08A identical pinout LS08. device inputs compatible with Standar

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MC74HC08A Quad 2-Input Gate
MC74HC08A identical pinout LS08. device inputs compatible with Standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs.
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Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance With JEDEC Standard Requirements Chip Complexity: FETs Equivalent Gates
LOGIC DIAGRAM
MARKING DIAGRAMS
PDIP-14 SUFFIX CASE MC74HC08AN AWLYYWW SOIC-14 SUFFIX CASE 751A TSSOP-14 SUFFIX CASE 948G Assembly Location Wafer Year Work Week ALYW HC08A AWLYWW
FUNCTION TABLE
Inputs Output
Pinout: 14-Lead Packages (Top View)
ORDERING INFORMATION
Device MC74HC08AN MC74HC08AD MC74HC08ADR2 MC74HC08ADT MC74HC08ADTR2 Package PDIP-14 SOIC-14 SOIC-14 TSSOP-14 TSSOP-14 Shipping 2000 Rail 2500 Reel Rail 2500 Reel
Semiconductor Components Industries, LLC, 2000
March, 2000 Rev.
Publication Order Number: MC74HC08A/D
MC74HC08A
MAXIMUM RATINGS*
Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature
This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open.
Lead Temperature, from Case Seconds Plastic DIP, SOIC TSSOP Package
*Maximum Ratings those values beyond which damage device occur. Functional operation should restricted Recommended Operating Conditions. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Unit Supply Voltage (Referenced GND) Vin, Vout Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000
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MC74HC08A
CHARACTERISTICS (Voltages Referenced GND)
|Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA |Iout| 2.4mA |Iout| 4.0mA |Iout| 5.2mA Guaranteed Limit 25°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.48 3.98 5.48 0.26 0.26 0.26 ±0.1 85°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.34 3.84 5.34 0.33 0.33 0.33 ±1.0 125°C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 2.20 3.70 5.20 0.40 0.40 0.40 ±1.0 Unit
Symbol
Parameter Minimum High-Level Input Voltage
Condition Vout 0.1V -0.1V |Iout| 20µA
Maximum Low-Level Input Voltage
Vout 0.1V 0.1V |Iout| 20µA
Minimum High-Level Output Voltage
|Iout| 20µA =VIH
Maximum Low-Level Output Voltage
|Iout| 20µA
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
Iout
NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
CHARACTERISTICS 50pF, Input 6ns)
Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input Output (Figures Guaranteed Limit 25°C 85°C 125°C Unit
tTLH, tTHL
Maximum Output Transition Time, Output (Figures
Maximum Input Capacitance
NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Buffer)* Used determine no-load dynamic power consumption: load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D).
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MC74HC08A
INPUT tPLH OUTPUT tTLH tTHL tPHL
Figure Switching Waveforms
TEST POINT OUTPUT DEVICE UNDER TEST
*Includes probe capacitance
Figure Test Circuit
Figure Expanded Logic Diagram (1/4 Device)
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MC74HC08A
PACKAGE DIMENSIONS
PDIP-14 SUFFIX CASE 646-06 ISSUE
NOTES: LEADS WITHIN 0.13 (0.005) RADIUS TRUE POSITION SEATING PLANE MAXIMUM MATERIAL CONDITION. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.300 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.62 0.39 1.01
SEATING PLANE
SOIC-14 SUFFIX CASE 751A-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION.
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50
INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019
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MC74HC08A
PACKAGE DIMENSIONS
TSSOP-14 SUFFIX CASE 948G-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
0.10 (0.004) 0.15 (0.006)
0.25 (0.010)
IDENT.
DETAIL
0.15 (0.006)
SECTION
0.10 (0.004) SEATING
PLANE
DETAIL
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MC74HC08A
Notes
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MC74HC08A
Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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MC74HC08A/D

MC74HC08A identical pinout LS08. device inputs compatible with Standar

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