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TC1300 300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function
with Integrated Microprocessor Reset Monitor Functionality Extremely Supply Current (80µA typ.) Longer Battery Life! Stable with Type Capacitor Very Dropout Voltage 10µsec (typ.) Wake Time from SHDN Guaranteed 300mA Output Current Standard Custom Output Detected Voltages Power-Saving Shutdown Mode Bypass Input Ultra-Quiet Operation Separate Input Detected Voltage 140msec Guaranteed Minimum RESET Output Duration Space-Saving MSOP Package
TC1300 combines Dropout Regulator Microprocessor Reset Monitor space-saving 8-Pin MSOP package. Total supply current 80µA (typical), times lower than bipolar regulators. TC1300 extremely precise output with typical accuracy ±0.5%. Other features include ultra noise operation, very dropout voltage internal feed-forward compensation fast response step changes load. TC1300 incorporates both over-temperature over-current protection. When shutdown control (SHDN) low, regulator output voltage falls zero, RESET output remains valid supply current reduced 30µA (typical). TC1300 stable with output capacitor only maximum output current 300mA. active RESET asserted when detected voltage (VDET) falls below reset voltage threshold. RESET output remains 300msec (typical) after VDET rises above reset threshold. TC1300 also fast wake response time (10µsec typically) when released from shutdown.
APPLICATIONS
Battery-Operated Systems Portable Computers Medical Instruments Pagers Cellular Phones
ORDERING INFORMATION
Part Number TC1300R-xxVUA Package 8-Pin MSOP Junction Temp. Range 40°C +125°C
RELATED LITERATURE
Application Notes: Article: "TelCom's CMOS LDOs Exhibit Excellent Stability While Offering Advantages LowValue Ceramic Capacitors"
NOTE: denotes suffix 2.63V VDET threshold
Available Output Voltages: 2.5, 2.8, 2.85, 3.0, indicates output voltages
Other output voltages threshold voltages available. Please contact Microchip Technology Inc. details.
TYPICAL APPLICATION
RESET RESET VDET VDET
VDET connected together
CONFIGURATION 8-Pin MSOP
RESET VOUT Bypass
TC1300
VOUT
TC1300VUA
VDET SHDN
Bypass 470pF CBypass (Optional)
SHDN
SHUTDOWN CONTROL
2001 Microchip Technology Inc.
DS21385A
TC1300-1 3/22/00
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
ABSOLUTE MAXIMUM RATINGS*
Input Voltage 6.5V Output Voltage (VSS 0.3) (VIN 0.3) Power Dissipation Internally Limited (Note Operating Temperature 40°C 125°C Storage Temperature 65°C +150°C Maximum Voltage +0.3V 0.3V Lead Temperature (Soldering, Sec.) +300°C
*Absolute Maximum Ratings indicate device operation limits beyond damage occur. Device operation beyond limits listed recommended.
ELECTRICAL CHARACTERISTICS: VOUT 0.1mA, 3.3µF, SHDN VIH, 25°C, unless otherwise noted.
BOLDFACE type specifications apply junction temperatures 40°C +125°C
Symbol
IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VOUT
Parameter
Input Operating Voltage Maximum Output Current Output Voltage
Test Conditions
0.5% 0.02 0.04
2.5% 0.35 1200
Units
ppm/°C
ISS1 ISS2 PSRR IOUTSC VOUTPD
THYS
Note 2.5% VOUT Temperature Coefficient Note Line Regulation Load Regulation 0.1mA IOUTMAX (Note Dropout Voltage (Note 0.1mA 100mA 300mA Supply Current SHDN Shutdown Supply Current SHDN Power Supply Rejection Ratio 1kHz Output Short Circuit Current VOUT Thermal Regulation Note Output Noise 1kHz, COUT 1µF, RLOAD Wake Time 1µF, COUT 4.7µF (from Shutdown Mode) 30mA, (See Fig. Settling Time 1µF, COUT 4.7µF (from Shutdown Mode) 30mA, (See Fig. Thermal Shutdown Temperature Thermal Shutdown Hysteresis
nV/Hz µsec
µsec
SHDN Input
SHDN Input High Threshold SHDN Input Threshold %VIN %VIN
TC1300-1
3/22/00
2001 Microchip Technology Inc.
DS21385A
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
ELECTRICAL CHARACTERISTICS: (CONT.) ELECTRICAL CHARACTERISTICS: VOUT 0.1mA, 3.3µF, SHDN VIH, 25°C, unless otherwise noted.
BOLDFACE type specifications apply junction temperatures 40°C +125°C
Symbol
VDET
Parameter
VDET Voltage Range Reset Threshold Reset Threshold Tempco VDET Reset Delay Reset Active Timeout Period RESET Output Voltage RESET Output Voltage High
Test Conditions
+70°C 40°C +125°C +25°C 40°C +125°C VDET (VTH 100mV) VDET min, ISINK 1.2mA VDET max, ISOURCE 500µA
2.59 2.55 VDET
2.63
2.66 2.70
Units
ppm/°C µsec msec
RESET Output
NOTES: regulator output voltage setting. VOUT (VOUTMAX VOUTMIN) VOUT Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX 10msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature, thermal resistance from junction-to-air (i.e. JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Thermal Considerations section this data sheet more details.
2001 Microchip Technology Inc.
DS21385A
TC1300-1 3/22/00
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
DETAILED DESCRIPTION
TC1300 combination fixed output, dropout regulator microprocessor monitor. Unlike bipolar regulators, TC1300 supply current does increase with load current. addition, VOUT remains stable within regulation very load currents important consideration CMOS battery back-up applications) well with type capacitor (see below). TC1300 functions detailed below:
RESET RESET VDET VDET (Optional) VOUT VOUT Battery Bypass SHDN
TC1300
DESCRIPTIONS
Symbol
RESET
CBYPASS 470pF (Optional)
Shutdown Control (from Power Control Logic)
Description
RESET output remains while VDET below reset voltage threshold, 300msec after VDET rises above reset theshold. Regulated Voltage Output Ground Terminal Reference Bypass Input. Connecting 470pF this input further reduces output noise. Shutdown Control Input. regulator fully enabled when logic high applied this input. regulator enters shutdown when logic applied this input. During shutdown, regulator output voltage falls zero, RESET output remains valid supply current reduced 30µA (typ.). connect Power Supply Input Detected Input Voltage. VDET connected together.
Figure Typical Application Circuit
VOUT Bypass SHDN
Output Capacitor (min) capacitor from VOUT ground required. capacitor should also connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic, ceramic tantalum capacitor types used (since many aluminum electrolytic capacitors freeze approximately 30°C, solid tantalums recommended applications operating below 25°C). When operating from sources other than batteries, supplynoise rejection transient response improved increasing value input output capacitors employing passive filtering techniques. Bypass Input (optional) 470pF capacitor connected from Bypass input ground reduces noise present internal reference, which turn significantly reduces output noise. This input left unconnected. Larger capacitor values used, results longer time period rated output voltage when power initially applied.
VDET
Figure shows typical application circuit. regulator enabled time shutdown input (SHDN) above VIH, shutdown (disabled) when SHDN below VIL. SHDN controlled CMOS logic gate, port microcontroller. SHDN input required, should connected directly input supply. While shutdown, supply current decreases 30µA (typical), VOUT falls zero RESET remains valid. RESET Output RESET output driven active within µsec VDET falling through reset voltage threshold. RESET maintained active minimum 140msec after VDET rises above reset threshold. TC1300 activelow RESET output. output TC1300 guaranteed valid down VDET optimized reject fast transient glitches VDET line.
Article: "TelCom's CMOS LDOs Exhibit Excellent Stability While Offering Advantage Low-Value Ceramic Capacitors"
TC1300-1 3/22/00
2001 Microchip Technology Inc.
DS21385A
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
Turn Response turn response defined separate response categories, Wake Time (tWK) Settling Time (tS). TC1300 fast Wake Time (10µsec typical) when released from shutdown. Figure Wake Time designated tWK. Wake Time defined time takes output rise VOUT value after being released from shutdown. total turn response defined Settling Time (tS), Figure Settling Time (inclusive with tWK) defined condition when output within fully enabled value (50µsec typical) when released from shutdown. settling time output voltage dependent load conditions output capacitance VOUT response).
SHDN VOUT
SOIC-8 package approximately 160°C/Watt, while MSOP-8 package approximately 200°C/Watt; both when mounted single layer dielectric copper clad board. PDMAX (TJMAX TAMAX)
Where terms previously defined.
Equation
Equation used conjunction with Equation ensure regulator thermal operation within limits. example: VINMAX 4.0V VOUTMIN 3.3V 2.5% ILOADMAX 200mA TJMAX 125°C TAMAX 55°C 200°C/W MSOP-8 Package FIND: Actual power dissipation Actual power dissipation: GIVEN: (VINMAX VOUTMIN)ILOADMAX [(4.0 1.1) (3.03 .975)]200 10-3 236.5mW
Figure Wake Response Time
Thermal Considerations
Thermal Shutdown Integrated thermal protection circuitry shuts regulator when temperature exceeds 150°C. regulator remains until temperature drops approximately 140°C. Power Dissipation amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation: (VINMAX VOUTMIN)ILOADMAX Where: VINMAX VOUTMIN ILOADMAX worst case actual power dissipation maximum voltage minimum regulator output voltage maximum output (load) current
Equation
Maximum allowable power dissipation: (TJMAX- TAMAX)
(125 350mW this example, TC1300 dissipates maximum only 236.5mW; below allowable limit 350mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits. example, maximum allowable found substituting maximum allowable power dissipation 350mW into Equation from which VINMAX 4.1V. Layout Considerations primary path heat conduction package package leads. Therefore, layouts having ground plane, wide traces pads, wide power supply lines combine lower and, therefore, increase maximum allowable power dissipation limit.
maximum allowable power dissipation (Equation function maximum ambient temperature (TAMAX), maximum allowable temperature (125°C), thermal resistance from junction-to-air JA).
2001 Microchip Technology Inc. DS21385A
TC1300-1 3/22/00
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
TYPICAL CHARACTERISTICS
LOAD REGULATION 1mA-300mA(%)
Line Regulation Temperature 0.14
LINE REGULATION
Output Noise Frequency 10.0 RLOAD COUT
Load Regulation Temperature VOUT 5.0V VOUT 2.5V VOUT 3.0V
0.12 0.10 0.08 0.06 0.04 0.02 0.00 0.01 0.01
Noise (µV/HZ)
1000
TEMPERATURE (°C) Supply Current Temperature 0.16
SUPPLY CURRENT (mA) DROPOUT VOLTAGE
FREQUENCY (KHz)
TEMPERATURE (°C) Dropout Voltage Load Current (5.0V) 0.30
DROPOUT VOLTAGE
Dropout Voltage Load Current (2.5V) 0.30 0.25 0.20 -40°C 0.15 25°C 0.10 0.05 0.00 125°C
0.14 0.12 0.10 0.08 0.06 VOUT 2.5V 0.04 0.02 0.00 VOUT 3.0V
0.25 0.20 0.15
125°C 25°C
-40°C 0.10 0.05 0.00
TEMPERATURE (°C)
LOAD CURRENT (mA)
LOAD CURRENT (mA)
1.0010
-30dB -35dB -40dB -45dB
PSRR (dB)
NORMALIZED VOUT
1.0008 1.0006 1.0004 1.0002 1.0000 0.9998 0.9996 0.9994 0.9992 0.9990
VOUT RLOAD VINAC 50mV
OUTPUT, SHUTDOWN VOLTAGE
Normalized VOUT Temperature
Power Supply Rejection Ratio
Wake Response Time
SHDN
2.8V
-50dB -55dB -60dB -65dB -70dB -75dB -80dB 100K COUT
ILOAD 30mA CLOAD 4.7µF
VOUT
TEMPERATURE (°C)
FREQUENCY (Hz)
TIME (50µs/Div)
TC1300-1
3/22/00
2001 Microchip Technology Inc.
DS21385A
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
TYPICAL CHARACTERISTICS
POWER-UP RESET TIMEOUT (mSec)
Power-Up Reset Timeout Temperature
1.003
NORMALIZED THRESHHOLD
Normalized Reset Threshold Temperature
350µs
VDET RESET DELAY
VDET Reset Delay Temperature
1.002 1.001 1.000 0.999 0.998 0.997
300µs 250µs
10mV Overdrive 100mV Overdrive
200µs 150µs 100µs 50µs
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
TAPE REEL DIAGRAMS
Component Taping Orientation 8-Pin SOIC (Narrow) Devices
User Direction Feed
User Direction Feed
Standard Reel Component Orientation Suffix Device
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin SOIC
2500
2001 Microchip Technology Inc.
DS21385A
TC1300-1 3/22/00
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
PACKAGE DIMENSIONS
8-Pin MSOP
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
TC1300-1
3/22/00
2001 Microchip Technology Inc.
DS21385A
300mA CMOS with Shutdown, Bypass Independent Delayed Reset Function TC1300
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01/09/01
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rights reserved. 2001 Microchip Technology Incorporated. Printed USA. 1/01
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, except maybe explicitly expressed herein, under intellectual property rights. Microchip logo name registered trademarks Microchip Technology Inc. U.S.A. other countries. rights reserved. other trademarks mentioned herein property their respective companies.
2001 Microchip Technology Inc.
DS21385A
TC1300-1 3/22/00

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