300mA CMOS with Shutdown VREF Bypass Extremely Supply Current (50
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TC1107
300mA CMOS with Shutdown VREF Bypass
Extremely Supply Current (50µA, Typ.) Very Dropout Voltage Guaranteed 300mA Output High Output Voltage Accuracy Standard Custom Output Voltages Power-Saving Shutdown Mode Bypass Input Ultra-Quiet Operation Over-Current Over-Temperature Protection Space-Saving MSOP Package Option
GENERAL DESCRIPTION
TC1107 fixed output, high accuracy (typically ±0.5%) CMOS upgrade older (bipolar) dropout regulators. Total supply current typically 50µA full load times lower than bipolar regulators!). TC1107 features include ultra noise operation (plus optional Bypass input); very dropout voltage (typically 240mV full load), fast response step changes load. Supply current reduced 0.05µA (typical) VOUT falls zero when shutdown input low. TC1107 incorporates both over-temperature over-current protection. TC1107 stable with output capacitor only maximum output current 300mA.
APPLICATIONS
Battery-Operated Systems Portable Computers Medical Instruments Instrumentation Cellular Phones Linear Post-Regulator SMPS Pagers
ORDERING INFORMATION
Part Number Package Junction Temp. Range
TYPICAL APPLICATION
TC1107-xxVOA 8-Pin SOIC 40°C +125°C TC1107-xxVUA 8-Pin MSOP 40°C +125°C TC1015EV Evaluation CMOS Family Available Output Voltages: 2.5, 2.8, 3.0, 3.3, indicates output voltages
Other output voltages available. Please contact Microchip Technology details.
VOUT
VOUT
CONFIGURATIONS
TC1107
VOUT
8-Pin SOIC
VOUT Bypass
8-Pin MSOP
Bypass
SHDN
Bypass
TC1107VOA
SHDN
TC1107VUA
SHDN
CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic)
2001 Microchip Technology Inc.
DS21356A
TC1107-2 1/4/00
300mA CMOS with Shutdown VREF Bypass TC1107
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .6.5V Output Voltage (VSS 0.3) (VIN 0.3) Power Dissipation Internally Limited (Note Operating Temperature 40°C 125°C Storage Temperature 65°C +150°C Maximum Voltage 0.3V 0.3V Lead Temperature (Soldering, Sec.) +300°C
*Absolute Maximum Ratings indicate device operation limits beyond damage occur. Device operation beyond limits listed Electrical Characteristics recommended.
ELECTRICAL CHARACTERISTICS:
VOUT 0.1µA, 3.3µF, SHDN VIH, 25°C, Unless Otherwise Noted. Boldface type specifications apply junction temperatures
40°C +125°C. Symbol
IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VOUT
Parameter
Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage
Test Conditions
Units
ppm/°C
Note Note 0.1mA IOUTMAX 0.1mA 100mA 300mA (Note SHDN SHDN 1KHz VOUT Note 1KHz, COUT 1µF, RLOAD
0.5% 2.5% 2.5% 0.05 0.35 0.05 0.04
ISS1 ISS2 PSRR IOUTSC VOUT/PD SHDN Input
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise
nV/Hz
SHDN Input High Threshold SHDN Input Threshold
%VIN %VIN
NOTES: regulator output voltage setting. VOUT (VOUTMAX VOUTMIN) VOUT Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX 10msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature, thermal resistance from junction-to-air (i.e. JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Thermal Considerations section this data sheet more details.
TC1107-2 1/4/00
2001 Microchip Technology Inc.
DS21356A
300mA CMOS with Shutdown VREF Bypass TC1107
DETAILED DESCRIPTION
TC1107 precision regulator available fixed voltages. Unlike bipolar regulators, TC1107 supply current does increase with load current. addition, VOUT remains stable within regulation very load currents important consideration CMOS battery backup applications). TC1107 functions detailed below:
Bypass Input
470pF capacitor connected from Bypass input ground reduces noise present internal reference, which turn significantly reduces output noise. output noise concern, this input left unconnected. Larger capacitor values used, results longer time period rated output voltage when power initially applied.
DESCRIPTION
Output Capacitor
(min) capacitor from VOUT ground required. output capacitor should have effective series resistance less. capacitor should connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic tantalum capacitor types used. (Since many aluminum electrolytic capacitors freeze approximately 30°C, solid tantalums recommended applications operating below 25°C.) When operating from sources other than batteries, supply-noise rejection transient response improved increasing value input output capacitors employing passive filtering techniques.
Symbol
VOUT Bypass
Description
Regulated voltage output Ground terminal connect Reference bypass input. Connecting 470pF this input further reduces output noise. Shutdown control input. regulator fully enabled when logic high applied this input. regulator enters shutdown when logic applied this input. During shutdown, output voltage falls zero supply current reduced 0.05µA (typical). connect connect Unregulated supply input
SHDN
Thermal Considerations
Thermal Shutdown Integrated thermal protection circuitry shuts regulator when temperature exceeds 150°C. regulator remains until temperature drops approximately 140°C. Power Dissipation amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation: (VINMAX VOUTMIN)ILOADMAX Where: worst case actual power dissipation VINMAX maximum voltage VOUTMIN minimum regulator output voltage ILOADMAX maximum output (load) current
Equation
Figure shows typical application circuit. regulator enabled time shutdown input (SHDN) above VIH, shutdown (disabled) when SHDN below VIL. SHDN controlled CMOS logic gate, port microcontroller. SHDN input required, should connected directly input supply. While shutdown, supply current decreases 0.05µA (typical), VOUT falls zero.
VOUT VOUT Battery
TC1107
CBYPASS 470pF (Optional)
Bypass
SHDN
Shutdown Control (from Power Control Logic)
Figure Typical Application Circuit
2001 Microchip Technology Inc. DS21356A
maximum allowable power dissipation (Equation function maximum ambient temperature (TAMAX), maximum allowable temperature (125°C), thermal resistance from junction-to-air JA). 8-Pin
TC1107-2 1/4/00
300mA CMOS with Shutdown VREF Bypass TC1107
SOIC package approximately 160°C/Watt, while 8-Pin MSOP package approximately 200°C/Watt; both when mounted single layer dielectric copper clad board. PDMAX (TJMAX TAMAX)
this example, TC1107 dissipates maximum only 167mW; below allowable limit 350mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits. Layout Considerations primary path heat conduction package package leads. Therefore, layouts having ground plane, wide traces pads, wide power supply lines combine lower and, therefore, increase maximum allowable power dissipation limit.
Where terms previously defined.
Equation
Equation used conjunction with Equation ensure regulator thermal operation within limits. example: GIVEN: VINMAX 3.0V VOUTMIN 2.7V -2.5% ILOADMAX 250mA TJMAX 125°C TAMAX 55°C 8-Pin MSOP Package FIND: Actual power dissipation Maximum allowable dissipation. Actual power dissipation: (VINMAX VOUTMIN)ILOADMAX [(3.0 1.1) (2.7 .975)]250 10-3 167mW Maximum allowable power dissipation: PDMAX (TJMAX TAMAX)
(125 350mW
TC1107-2 1/4/00
2001 Microchip Technology Inc.
DS21356A
300mA CMOS with Shutdown VREF Bypass TC1107
TYPICAL CHARACTERISTICS
Line Regulation 0.012 0.010
LINE REGULATION Noise (µV//
Output Noise 10.0 2.00 RLOAD COUT
LOAD REGULATION
Load Regulation 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 100mA 50mA 300mA
0.008 0.006 0.004 0.002 0.000 -0.002 -0.004
0.01
0.01
1000
0.00
TEMPERATURE (°C) Supply Current 100.0
DROPOUT VOLTAGE SUPPLY CURRENT (µA)
FREQUENCY (KHz)
TEMPERATURE (°C) VOUT Temperature 3.075 ILOAD 100µA CLOAD 3.3µF
Dropout Voltage Load Current 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -40°C 125°C 85°C 70°C 25°C
VOUT
90.0 80.0 70.0 60.0 50.0 40.0
3.025
2.975
2.925
TEMPERATURE (°C)
LOAD CURRENT (mA)
TEMPERATURE (°C)
Power Supply Rejection Ratio VOUT -35dB LOAD -40dB VINAC 50mV
PSRR (dB)
-30dB
-45dB -50dB -55dB -60dB -65dB -70dB -75dB -80dB 100K
FREQUENCY (Hz)
COUT
2001 Microchip Technology Inc.
DS21356A
TC1107-2 1/4/00
300mA CMOS with Shutdown VREF Bypass TC1107
TAPE REEL DIAGRAMS
Component Taping Orientation 8-Pin MSOP Devices
User Direction Feed
User Direction Feed
Standard Reel Component Orientation Suffix Device
Reverse Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin MSOP
2500
Component Taping Orientation 8-Pin SOIC (Narrow) Devices
User Direction Feed
User Direction Feed
Standard Reel Component Orientation Suffix Device
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin SOIC
2500
TC1107-2 1/4/00
2001 Microchip Technology Inc.
DS21356A
300mA CMOS with Shutdown VREF Bypass TC1107
PACKAGE DIMENSIONS
8-Pin MSOP
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
8-Pin SOIC (Narrow)
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40)
MAX.
Dimensions: inches (mm)
2001 Microchip Technology Inc.
DS21356A
TC1107-2 1/4/00
300mA CMOS with Shutdown VREF Bypass TC1107
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rights reserved. 2001 Microchip Technology Incorporated. Printed USA. 1/01
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, except maybe explicitly expressed herein, under intellectual property rights. Microchip logo name registered trademarks Microchip Technology Inc. U.S.A. other countries. rights reserved. other trademarks mentioned herein property their respective companies.
TC1107-2 1/4/00
2001 Microchip Technology Inc.
DS21356A
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