-30V/-8A RDS(ON)=16m(typ.) VGS=-10V RDS(ON)=24m(typ.) VGS=-4.5V D
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APM4435K
-30V/-8A RDS(ON)=16m(typ.) VGS=-10V RDS(ON)=24m(typ.) VGS=-4.5V
Description
Super High Dense Cell Design Reliable Rugged SOP-8 Package Lead Free Available (RoHS Compliant)
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Applications
Power Management Notebook Computer, Portable Equipment Battery Powered Systems
P-Channel MOSFET
Ordering Marking Information
4435 Lead Free Code Handling Code Range Package Code Package Code SOP-8 Operating Junction Range 150°C Handling Code Tape Reel Lead Free Code Lead Free Device Blank Original Device XXXXX Date Code
4435
4435 XXXXX
Note: ANPEC lead-free products contain molding compounds/die attach materials 100% matte plate termination finish; which fully compliant with RoHS compatible with both SnPb lead-free soldiering operations. ANPEC lead-free products meet exceed lead-free requirements IPC/JEDEC STD-020C classification lead-free peak reflow temperature.
ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Mar., 2005 www.anpec.com.tw
APM4435K
Absolute Maximum Ratings
Symbol VDSS VGSS IDM* TSTG RJA*
Note: *Surface Mounted area, 10sec.
25°C unless otherwise noted)
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Diode Continuous Forward Current Maximum Junction Temperature Storage Temperature Range Maximum Power Dissipation Thermal Resistance-Junction Ambient TA=25°C TA=100°C VGS=-10V
Rating 62.5
Unit °C/W
Electrical Characteristics
Symbol Parameter
25°C unless otherwise noted)
Test Condition APM4435K Min. -1.5 -0.8 3200 VDD=-15V, RL=15, IDS=-1A, VGEN=-10V, RG=6,
Typ.
Max.
Unit
Static Characteristics BVDSS Drain-Source Breakdown Voltage IDSS VGS(th) IGSS RDS(ON)
VGS=0V, IDS=-250µA VDS=-24V, VGS=0V TA=25°C VDS=VGS, IDS=-250µA VGS=±25V, VDS=0V VGS=-10V, IDS=-8A VGS=-4.5V, IDS=-5A ISD=-3A, VGS=0V VGS=0V,VDS=0V,F=1MHz VGS=0V, VDS=-25V, Frequency=1.0MHz
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Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage
±100 -1.3
Dynamic Characteristics Gate Resistance Ciss Coss Crss td(ON) td(OFF)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
APM4435K
Electrical Characteristics (Cont.)
Symbol Parameter
25°C unless otherwise noted)
APM4435K Min. Typ. Max.
Test Condition
Unit
Gate Charge Characteristics Total Gate Charge
Notes:
Gate-Source Charge Gate-Drain Charge
VDS=-15V, VGS=-10V, IDS=-8A
Pulse test pulse width300µs, duty cycle2%. Guaranteed design, subject production testing.
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
APM4435K
Typical Characteristics
Power Dissipation
Drain Current
Drain Current
Ptot Power
TA=25
TA=25 C,VG=-10V
Junction Temperature (°C)
Junction Temperature (°C)
Safe Operation Area
Normalized Transient Thermal Resistance
Thermal Transient Impedance
Drain Current
Duty
0.05 0.02 0.01
10ms
100ms
0.01
Single Pulse Mounted 62.5
0.01 0.01
TA=25
1E-3 1E-4
1E-3
0.01
-VDS Drain Source Voltage
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
APM4435K
Typical Characteristics (Cont.)
Output Characteristics
VGS= -10V
Drain-Source Resistance
RDS(ON) Resistance
VGS= 4.5V VGS=
Drain Current
-VDS Drain Source Voltage
Drain Current
Transfer Characteristics
Gate Threshold Voltage
-250µA
Normalized Threshold Voltage
Drain Current
Tj=125 Tj=-55
Tj=25
-VGS Gate Source Voltage
Junction Temperature (°C)
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
APM4435K
Typical Characteristics (Cont.)
Drain-Source Resistance
2.00 -10V 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 RON@Tj=25
Source-Drain Diode Forward
Normalized Resistance
Tj=150
Source Current
Tj=25
Junction Temperature (°C)
-VSD Source Drain Voltage
Capacitance
5000 4500 Frequency=1MHz -15V
Gate Charge
-VGS Gate-source Voltage
4000
Capacitance (pF)
3500 3000 2500 2000 1500 1000 Crss Coss
Ciss
-VDS Drain Source Voltage
Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
APM4435K
Packaging Information
SOP-8 Reference JEDEC Registration MS-012)
0.004max.
Min. Min.
0.015X45
Inche
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
APM4435K
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material 90/10 63/37 SnPb), 100%Sn Meets Specification RSI86-91, ANSI/J-STD-002 Category
Reflow Condition
(IR/Convection Reflow)
ritical Zone
p-up
p-down Preheat
Peak
Classification Reflow Profiles
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Time maintained above: Temperature (TL) Time (tL) Peak/Classificatioon Temperature (Tp) Time within actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds table 10-30 seconds Pb-Free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds table 20-40 seconds
6°C/second max. 6°C/second max. minutes max. minutes max. Time 25°C Peak Temperature Notes: temperatures refer topside package .Measured body surface.
Copyright ANPEC Electronics Corp. Rev. Mar., 2005 www.anpec.com.tw
APM4435K
Classification Reflow Profiles(Cont.)
Table SnPb Entectic Process Package Peak Reflow peratures Package Thickness Volum Volum <350 <2.5 +0/-5°C +0/-5°C +0/-5°C +0/-5°C Table Pb-free Process Package Classification Reflow peratures Package Thickness Volum Volum Volum <350 350-2000 >2000 <1.6 +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* +0°C* *Tolerance: device anufacturer/supplier shall assure process patibility including stated classification perature (this eans Peak reflow perature +0°C. exam 260°C+0°C) rated level.
Reliability Test Program
Test item SOLDERABILITY HOLT Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 1000 Bias 125°C Hrs, 100% 121°C -65°C 150°C, Cycles
Carrier Tape Reel Dimensions
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
APM4435K
Carrier Tape Reel Dimensions(Cont.)
Application
330±1
12.75
12.4 +0.2
5.2±
1.75±
SOP-8
1.55±0.1 1.55+ 0.25
2.1± 0.3±0.013
(mm)
Cover Tape Dimensions
Application SOP- Carrier Width Cover Tape Width Devices Reel 2500
Customer Service
Anpec Electronics Corp. Head Office Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. Mar., 2005
www.anpec.com.tw
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