Semiconductor ML9206-xx This version: ML9206-xx Jun. 1999 Ch

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Semiconductor ML9206-xx This version: ML9206-xx Jun. 1999 Ch

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E2C0042-19-62 Semiconductor
Semiconductor ML9206-xx
This version: ML9206-xx Jun. 1999
Character 16-Digit Display Controller/Driver with Character
ML9206-xx matrix vacuum fluorescent display tube controller driver which displays characters, numerics symbols. matrix vacuum fluorescent display tube drive signals generated serial data sent from micro-controller. display system easily realized internal character display. ML9206-xx power consumption since made CMOS process technology. available general-purpose code. Custom codes provided customer's request.
FEATURES
Logic power supply vacuum fluorescent display tube drive power supply (VDD) V±10% V±10% Fluorescent display tube drive power supply (VFL) driver output current (VFD driver output connected directly fluorescent display tube. pull-down resistor required.) Segment driver (SEG1 SEG35) (VFL=-60V) Segment driver (AD1 AD2) (VFL=-60V) Grid driver (COM1 COM16) (VFL=-60V) General output port output current Output driver (VDD=3.3V±10%) (VDD=5.0V±10%) Content display CGROM dots types (character data) CGRAM dots types (character data) ADRAM (display digit) bits (symbol data) DCRAM (display digit) bits (register character data display) General output port bits (static operation) Display control function Display digit digits Display duty (brightness adjustment) stages lights ON/OFF interfaces with microcontroller interfaces when RESET added) 1-byte instruction execution (excluding data write display duty mode RAM) Built-in oscillation circuit (external Package options: 64-pin plastic (QFP64-P-1414-0.80-BK) (Product name ML9206-xxGS-BK) 64-pin plastic SSOP (SSOP64-P-525-0.80-K) (Product name ML9206-xxGS-K) indicates code number.
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Semiconductor
ML9206-xx
BLOCK DIAGRAM
DCRAM CGROM Segment Driver RESET 8bit Shift Register CGRAM SEG35 Driver SEG1
ADRAM
Address Selector Command Decoder Control Circuit Write Address Counter Read Address Counter
Port Driver Digit Control Duty Control COM1 Grid Driver COM16
Timing Generator OSC0 OSC1 Oscillator
Timing Generator
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Semiconductor
ML9206-xx
INPUT OUTPUT CONFIGURATION
Schematic Diagrams Logic Portion Input Output Circuits Input
INPUT
Output
OUTPUT
Schematic Diagram Driver Output Circuit
OUTPUT
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Semiconductor
CONFIGURATION (TOP VIEW)
RESET
SEG10 SEG11 SEG12 SEG13
SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20
SEG4 SEG3 SEG2 SEG1
SEG5 SEG6 SEG7 SEG8 SEG9
ML9206-xx
OSC1
OSC0
COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2
SEG30
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG31
SEG32
SEG33
SEG34
SEG35
connection
64-Pin Plastic
COM1
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Semiconductor
SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 64-Pin Plastic SSOP
ML9206-xx
RESET OSC1 OSC0 COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29
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Semiconductor
ML9206-xx
DESCRIPTION
SSOP Symbol Type Connects Fluorescent tube anode electrode Fluorescent tube grid electrode Fluorescent tube anode electrode drive control pins Power supply Microcontroller Microcontroller Microcontroller Description Fluorescent display tube anode electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. IOH>-6 Fluorescent display tube grid electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. IOH>-30 Fluorescent display tube anode electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. IOH>-15 General port output. Output these pins static operation, these pins drive LED. VDD-GND power supplies internal logic. VDD-VFL power supplies driving fluorescent tubes. Apply after applied. Serial data input (positive logic). Input from LSB. Shift clock input. Serial data shifted rising edge Chip select input. Serial data transfer disabled when level. Reset input. "Low" initializes functions. Initial status follows. address "00"H Address each Content undefined Data each digits Display digit 0/256 brightness adjusment mode lights "Low" level outputs RESET (Circuit when connected externally) Application Circuit.
SEG1
COM1
AD1,
RESET
Microcontroller
OSC0
External oscillation. Connect externally. time constant depends voltage used. target oscillation frequency MHz. OSC0 OSC1 oscillation circuit) Application Circuit.
OSC1
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Semiconductor
ML9206-xx
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Supply Voltage Input Voltage Power Dissipation Storage Temperature Symbol TSTG Output Current Condition Ta25°C COM1 COM16 AD1, SEG1 SEG35 SSOP Rating -0.3 +6.5 VDD+0.3 -0.3 VDD+0.3 +150 -4.0 +4.0 Unit
RECOMMENDED OPERATING CONDITIONS-1
When power supply voltage (typ.)
Parameter Supply Voltage Supply Voltage High Level Input Voltage Level Input Voltage Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol fOSC Condition input pins excluding OSC0 R1=3.3kW, C1=47pF
DIGIT=1 R1=3.3kW, C1=47pF
Min.
Typ.
Max. 0.3VDD
Unit
input pins excluding OSC0 0.7VDD
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Semiconductor
ML9206-xx
RECOMMENDED OPERATING CONDITIONS-2
When power supply voltage 3.3V (typ.)
Parameter Supply Voltage Supply Voltage High Level Input Voltage Level Input Voltage Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol fOSC Condition input pins excluding OSC0 R1=3.3kW, C1=39pF
DIGIT=1 R1=3.3kW, C1=39pF
Min.
Typ.
Max. 0.2VDD
Unit
input pins excluding OSC0 0.8VDD
ELECTRICAL CHARACTERISTICS
Characteristics-1
(VDD=5.0V±10%, VFL=-60V, Ta=-40 +85°C, unless otherwise specified) Parameter High Level Input Voltage Level Input Voltage High Level Input Current Level Input Current Symbol VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Level Output Voltage VOL2 IDD1 Supply Current IDD2 VOL1 Applied RESET RESET RESET RESET COM1 AD1, SEG1 COM1 AD1, SEG1 IOL1=2mA Duty=240/256 fOSC= 2MHz, load Digit=1 output lights Duty=128/256 Digit=1 output lights VFL+1.0 Condition VIH=VDD VIL=0.0V IOH1=-30mA IOH2=-15mA IOH3=-6mA IOH4=-2mA Min. 0.7VDD -1.0 -1.0 VDD-1.5 VDD-1.5 VDD-1.5 VDD-1.0 Max. 0.3VDD +1.0 +1.0 Unit
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Semiconductor Characteristics-2
Parameter High Level Input Voltage Level Input Voltage High Level Input Current Level Input Current Symbol VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Level Output Voltage VOL2 IDD1 Supply Current IDD2 VOL1
ML9206-xx
(VDD=3.3V±10%, VFL=-60V, Ta=-40 +85°C, unless otherwise specified) Applied RESET RESET RESET RESET COM1 AD1, SEG1 COM1 AD1, SEG1 IOL1=1mA Duty=240/256 fOSC= 2MHz, load Digit=1 output lights Duty=128/256 Digit=1 output lights VFL+1.0 Condition VIH=VDD VIL=0.0V IOH1=-30mA IOH2=-15mA IOH3=-6mA IOH4=-1mA Min. 0.8VDD -1.0 -1.0 VDD-1.5 VDD-1.5 VDD-1.5 VDD-1.0 Max. 0.2VDD +1.0 +1.0 Unit
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Semiconductor Characteristics-1
ML9206-xx
(VDD=5.0V±10%, VFL=-60V, Ta=-40 +85°C, unless otherwise specified) Parameter Frequency Pulse Width Setup Time Hold Time Setup Time Hold Time Wait Time Data Processing Time RESET Pulse Width RESET Time Wait Time Output Slew Rate Rise Time Time Symbol tCSS tCSH tCSW tDOFF tWRES Condition R1=3.3kW, C1=47pF R1=3.3kW, C1=47pF When RESET signal input from microcontroller etc. externally When RESET signal input from microcontroller etc. externally R2=1.0kW, C2=0.1mF tRSOFF tPRZ tPOF Cl=100pF tR=20% tF=80% Min. Max. Unit
tRSON
When mounted unit When mounted unit, VDD=0.0V
Characteristics-2
(VDD=3.3V±10%, VFL=-60V, Ta=-40 +85°C, unless otherwise specified) Parameter Frequency Pulse Width Setup Time Hold Time Setup Time Hold Time Wait Time Data Processing Time RESET Pulse Width RESET Time Wait Time Output Slew Rate Rise Time Time Symbol tCSS tCSH tCSW tDOFF tWRES Condition R1=3.3kW, C1=39pF R1=3.3kW, C1=39pF When RESET signal input from microcontroller etc. externally When RESET signal input from microcontroller etc. externally R2=1.0kW, C2=0.1mF tRSOFF tPRZ tPOF Cl=100pF tR=20% tF=80% Min. Max. Unit
tRSON
When mounted unit When mounted unit, VDD=0.0V
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Semiconductor
ML9206-xx
TIMING DIAGRAM
Symbol VDD=3.3V±10% VDD=5.0V±10%
Data Timing
tCSS VALID VALID tDOFF VALID VALID tCSH
tCSW
Reset Timing
RESET
tPRZ tRSON tRSOFF tPOF
When input externally
tWRES
When external connected
tRSOFF
Output Timing
outputs
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Semiconductor
ML9206-xx
Digit Output Timing (for 16-digit display, duty 240/256)
T=2/ fOSC
Frame cycle t1=4096T (t1=4.096 when fosc=2.0 MHz) Display timing t2=240T (t2=240 when fosc=2.0 MHz) Blank timing t3=16T (t3=16 when fosc=2.0 MHz)
COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 AD1, SEG1-35
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Semiconductor
ML9206-xx
FUNCTIONAL DESCRIPTION
Commands List
Command DCRAM data write
byte
byte
CGRAM data write
byte byte byte byte byte
ADRAM data write Display duty Number digits lights ON/OFF Test mode
General output port
When data written (DCRAM, CGRAM, ADRAM) continuously, addresses internally incremented automatically. Therefore necessary specify byte write data later bytes. Note: test mode used inspection before shipment. user function.
Don't care Address specification each Character code specification each General output port status specification Display duty specification Number digits specification lights instruction lights instruction
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Semiconductor Positional Relationship Between SEGn (one digit)
ML9206-xx
SEG1
ADRAM written data. Corresponds byte
SEG4
SEG2
SEG3
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
CGRAM written data. Corresponds byte CGRAM written data. Corresponds byte CGRAM written data. Corresponds byte
CGRAM written data. Corresponds byte CGRAM written data. Corresponds byte
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Semiconductor Data Transfer Method Command Write Method Display control command data written 8-bit serial transfer. Write timing shown figure below.
ML9206-xx
Setting "Low" level enables data transfer. Data bits sequentially input into from (LSB first). shown figure below, data read shift register rising edge shift clock, which input into pin. 8-bit data input, internal load signals automatically generated data written each register RAM. Therefore necessary input load signals from outside. Setting "High" disables data transfer. Data input from point when changes from "High" "Low" recognized 8-bit units.
tDOFF tCSH
byte
byte
byte
When data written DCRAM* Command address data
Character code data
Character code data next address
When data written (DCRAM, ADRAM, CGRAM) continuously, addresses internally incremented automatically. Therefore necessary specify byte write data later bytes.
Reset Function Reset executed when RESET "L", (when turning power example) initializes functions. Initial status follows. Address each address "00"H Data each contents undefined General output port general output ports "Low" Display digit digits Brightness adjustment 0/256 display lights mode Segment output segment outputs "Low" output outputs "Low" Please again according "Setting Flowchart" after reset.
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Semiconductor Description Commands Functions
ML9206-xx
DCRAM data write (Specifies address DCRAM writes character code CGROM CGRAM.) DCRAM (Data Control RAM) 4-bit address store character code CGROM CGRAM. character code specified DCRAM converted matrix character pattern CGROM CGRAM. (The DCRAM store characters.) [Command format]
byte (1st)
selects DCRAM data write mode specifies DCRAM address (Ex: Specifies DCRAM address specifies character code CGROM CGRAM (written into DCRAM address
byte (2nd)
specify character code CGROM CGRAM continuously next address, specify only character code follows. addresses DCRAM automatically incremented. Specification byte unnecessary.
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Semiconductor
ML9206-xx
byte (3rd)
specifies character code CGROM CGRAM (written into DCRAM address
byte (4th) specifies character code CGROM CGRAM (written into DCRAM address
byte (17th)
specifies character code CGROM CGRAM (written into DCRAM address
byte (18th) specifies character code CGROM CGRAM (DCRAM address rewritten)
(LSB) (MSB): DCRAM addresses bits: characters) (LSB) (MSB): Character code CGROM CGRAM bits: characters) [COM positions DCRAM addresses]
position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
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Semiconductor CGRAM data write (Specifies addresses CGRAM writes character pattern data.)
ML9206-xx
CGRAM (Character Generator RAM) 3-bit address store matrix character patterns. character pattern stored CGRAM displayed specifying character code (address) DCRAM. address CGRAM assigned 07H. (All other addresses CGROM addresses.) (The CGRAM store types character patterns.) [Command format]
byte (1st)
selects CGRAM data write mode specifies CGRAM address. (Ex: specifies CGRAM address 00H) specifies column data (rewritten into CGRAM address 00H)
byte (2nd)
byte (3rd)
specifies column data (rewritten into CGRAM address 00H)
byte (4th)
specifies column data (rewritten into CGRAM address 00H)
byte (5th)
specifies column data (rewritten into CGRAM address 00H)
byte (6th)
specifies column data (rewritten into CGRAM address 00H)
specify character pattern data continuously next address, specify only character pattern data follows. addresses CGRAM automatically incremented. Specification byte therefore unnecessary. byte (character pattern data) regarded data item, sufficient tDOFF time between bytes.
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Semiconductor
ML9206-xx
byte (7th)
specifies column data (rewritten into CGRAM address 01H)
byte (11th)
specifies column data (rewritten into CGRAM address 01H)
(LSB) (MSB): CGRAM addresses bits: characters) (LSB) (MSB) Character pattern data bits: outputs digit) Don't care [CGROM addresses CGRAM addresses] Refer ROMCODE table
CGROM address RAM00(00000000B) RAM01(00000001B) RAM02(00000010B) RAM03(00000011B) RAM04(00000100B) RAM05(00000101B) RAM06(00000110B) RAM07(00000111B)
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Semiconductor Positional relationship between output area CGROM that CGRAM
area that corresponds byte (1st column) area that corresponds byte (2nd column)
ML9206-xx
area that corresponds byte (5th column) area that corresponds byte (4th column) area that corresponds byte (3rd column)
Note: CGROM (Character Generator ROM) 8-bit address generate matrix character patterns. CGRAM store types character patterns. General-purpose code available (see CODE list) custom codes provided customer's request.
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Semiconductor ADRAM data write (specifies address ADRAM writes symbol data)
ML9206-xx
ADRAM (Additional Data RAM) 2-bit address store symbol data. Symbol data specified ADRAM directly output without CGROM CGRAM. (The ADRAM store types symbol patterns each digit.) terminal which contents ADRAM output used cursor. [Command format]
byte (1st)
selects ADRAM data write mode specifies ADRAM address (Ex: specifies ADRAM address sets symbol data (written into ADRAM address
byte (2nd)
specify symbol data continuously next address, specify only symbol data follows. address ADRAM automatically incremented. Specification byte therefore unnecessary.
byte (3rd) byte (4th)
sets symbol data (written into ADRAM address sets symbol data (written into ADRAM address
byte (17th) byte (18th)
sets symbol data (written into ADRAM address sets symbol data (ADRAM address rewritten.)
(LSB) (MSB) ADRAM addresses bits: characters) (LSB) (MSB): Symbol data bits: 2-symbol data digit) Don't care
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Semiconductor [COM positions ADRAM addresses]
position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
ML9206-xx
General output port (specifies general output port status) general output port output 2-bit static operation. used control other devices turn LED. (static operation) When "High" level, this output becomes voltage, when "Low" level, becomes ground potential. Therefore, fluorescent display tube cannot driven. [Command format]
byte selects general output port specifies output status
general output port don't care [Set data state general output port]
Display state general output port Sets Sets high Sets high Sets high (The state when power applied when RESET input.)
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Semiconductor Display duty (writes display duty value duty cycle register)
ML9206-xx
Display duty adjusts brightness stages using 8-bit data. (maximum brightness=240/256) When power turned when RESET signal input, duty cycle register value "0". Always execute this instruction before turning display then desired duty value. [Command format]
byte
selects display duty mode sets duty value
byte Sets display duty value
(LSB) (MSB) display duty data bits: stages) don't care [Relation between setup data controlled duty]
duty 0/256 1/256 2/256 *The state when power turned when RESET signal input.
239/256 240/256 brightness change fixed blank time (16/256)
240/256
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Semiconductor Number digits (writes number display digits display digit register)
ML9206-xx
number digits display digits using 4-bit data. When power turned when RESET signal input, number digit register value "0". Always execute this instruction change number digits before turning dispaly [Command format]
byte selects number digit mode specifies number digit value
(LSB) (MSB) number digit data bits: digits) don't care [Relation between setup data controlled COM]
Number digits COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
Number digits COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
*The state when power turned when RESET signal input.
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Semiconductor display lights ON/OFF (turns dispaly lights OFF)
ML9206-xx
display lights used primarily display testing. display lights primarily used display blink prevent malfunction when power turned This command cannot control general output port. [Command format]
byte
selects display lights mode
sets lights sets lights Don't care
[Set data display state
Display state Normal display Sets outputs Sets outputs High Sets outputs High (All lights mode priority.) (The state when power applied when RESET input.)
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Semiconductor Setting Flowchart (Power applying included)
Apply
ML9206-xx
Apply
display lights
Status outputs RESET signal input
General output port setting
Number digits setting
Display duty setting Select used
DCRAM Data write mode (with address setting)
Address automatically incremented
CGRAM Data write mode (with address setting)
Address automatically incremented
ADRAM Data write mode (with address setting)
Address automatically incremented
DCRAM Character code DCRAM character code write ended?
CGRAM Character code CGRAM character code write ended?
ADRAM Character code ADRAM character code write ended?
Another set?
Releases display lights mode
Display operation mode
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Semiconductor Power-off Flowchart
Display operation mode
ML9206-xx
Turn
Turn
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Semiconductor
ML9206-xx
APPLICATION CIRCUIT
Heater Transformer matrix fluorescent display tube
ANODE ANODE GRID (SEGMENT) (SEGMENT) (DIGIT) Microcontroller Output Port ML9206-xx OSC0 OSC1 RESET AD1, SEG1-35 COM1-16
Notes: value depends power supply voltage microcontroller used. Adjust values constants power supply voltage used. value depends fluorescent display tube used. Adjust values constants power supply voltage used.
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Semiconductor Reference data
ML9206-xx
figure below shows relationship between voltage output current each driver. Take care that total power consumption used does exceed power dissipation.
Voltage-Output Current Each Driver (mA)
Output Current (mA)
COM1 COM16 (Condition: VOH=VDD-1.5
(Condition: VOH=VDD-1.5 SEG1 SEG35 (Condition: VOH=VDD-1.5
Voltage (VDD-n)
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Semiconductor
ML9206-xx
ML9206-01 Code
00000000B (00H) 00000111B (07H) CGRAM addresses.
0000 0000 RAM0 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
0001 RAM1
0010 RAM2
0011 RAM3
0100 RAM4
0101 RAM5
0110 RAM6
0111 RAM7
1000
1001
1010
1011
1100
1101
1110
1111
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Semiconductor
ML9206-xx
PACKAGE DIMENSIONS
(Unit
QFP64-P-1414-0.80-BK
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.87 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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Semiconductor
ML9206-xx
(Unit
SSOP64-P-525-0.80-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 1.34 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
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E2Y0002-29-62
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents contained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

Semiconductor ML9206-xx This version: ML9206-xx Jun. 1999 Ch

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