Dual Clock Generator Features Description Dual phase-lo

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Dual Clock Generator Features Description Dual phase-lo

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FS6244
Dual Clock Generator
Features
Description
Dual phase-locked loop (PLL) device with three output clock frequencies On-chip crystal oscillator reference frequency generation 3.3V supply voltage available Small circuit board footprint (16-pin 0.150 SOIC) Custom frequency selections available contact your local Sales Representative more information
FS6244 monolithic CMOS clock generator designed minimize cost component count digital video/audio systems. high-resolution phase-locked loops generate three output clocks through array post-dividers. frequencies ratiometrically derived from crystal oscillator frequency. locking output frequencies together eliminate unpredictable artifacts video systems reduce electromagnetic interference (EMI) frequency harmonic stacking.
Figure Configuration
XOUT CLKA
Table Version Information
CLKB CLKC
NOTE: Contact custom versions
DEVICE FS6244-03
(nom)
FXIN (MHz) 27.000
CLKA (MHz) 11.2896 (+1.1 ppm)
CLKB (MHz) 3.6864
CLKC (MHz) 27.000
FS6244
16-pin (0.150) SOIC
Figure Block Diagram
CRYSTAL OSC. XOUT DIVIDER ARRAY CLKB
CLKA
CLKC
FS6244
American Microsystems, Inc. reserves right change detail specifications required permit improvements design products. 2.28.02
ISO9001
FS6244
Dual Clock Generator
Table Descriptions
Key: Analog Input; Analog Output; Digital Input; Input with Internal Pull-Up; Input with Internal Pull-Down; Digital Input/Output; DI-3 Three-Level Digital Input, Digital Output; Power/Ground; Active
TYPE
NAME XOUT CLKA CLKC CLKB Connection Crystal Oscillator Drive Crystal Oscillator Feedback Power Supply (+3.3V +5V) Ground Clock Output Connection Connection Connection Clock Output Ground Connection Power Supply (+3.3V +5V) Clock Output Connection Connection
DESCRIPTION
Functional Block Description
Phase-Locked Loop (PLL)
Crystal Oscillator
on-chip PLLs standard frequency- phaselocked loop architecture. multiplies reference oscillator desired frequency ratio integers. frequency multiplication exact with zero synthesis error unless otherwise indicated frequency table.
Crystal Oscillator provides stable, low-jitter frequency reference rest FS6244 system components. Loading capacitance crystal internal FS6244. external components (other than resonator itself) required operation crystal oscillator.
ISO9001
2.28.02
FS6244
Dual VCXO Clock Generator
Electrical Specifications
Table Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. These conditions represent stress rating only, functional operation device these other conditions above operational limits noted this specification implied. Exposure maximum rating conditions extended conditions affect device performance, functionality, reliability.
PARAMETER Supply Voltage (VSS ground) Input Voltage, Output Voltage, Input Clamp Current, VDD) Output Clamp Current, VDD) Storage Temperature Range (non-condensing) Ambient Temperature Range, Under Bias Junction Temperature Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
SYMBOL
MIN. VSS-0.5 VSS-0.5 VSS-0.5
MAX. VDD+0.5 VDD+0.5
UNITS
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting loss functionality performance occur this device subjected high-energy electrostatic discharge.
Table Operating Conditions
PARAMETER Supply Voltage (3.3 volt system) Supply Voltage (5.0 volt system) Ambient Operating Temperature Range Crystal Resonator Frequency SYMBOL fXTAL CONDITIONS/DESCRIPTION NOTE NOTE NOTE Fundamental Mode MIN. TYP. MAX. UNITS
NOTE These specifications represent generic FS6244 device capability. Device specifications particular version (i.e. FS6244-xx) guaranteed only with operating voltage reference frequency specified Version Information.
ISO9001
2.28.02
FS6244
Dual Clock Generator
Table Electrical Specifications (VDD 3.3V nominal)
Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical. Negative currents indicate current flows device.
PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs Crystal Oscillator Crystal Loading Capacitance Crystal Drive Level Crystal Oscillator Feedback (XIN) Threshold Bias Voltage High-Level Input Current Low-Level Input Current Crystal Oscillator Drive (XOUT) High-Level Output Source Current Low-Level Output Sink Current Clock Outputs (CLKx) High-Level Output Source Current Low-Level Output Sink Current Short Circuit Source Current Short Circuit Sink Current
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
fXTAL 27MHz; 10pF, 3.3V (depends output frequencies)
CL(xtal)
seen crystal connected XOUT RXTAL=20;
V(XIN) V(XIN) 3.3V, 3.3V
-0.5
IOSH IOSL
2.0V 0.4V shorted 30s, max. 3.3V; shorted 30s, max.
ISO9001
2.28.02
FS6244
Dual VCXO Clock Generator
Table Electrical Specifications (VDD nominal)
Unless otherwise stated, 5.0V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical. Negative currents indicate current flows device.
PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs Crystal Oscillator Crystal Loading Capacitance Crystal Drive Level Crystal Oscillator Feedback (XIN) Threshold Bias Voltage High-Level Input Current Low-Level Input Current Crystal Oscillator Drive (XOUT) High-Level Output Source Current Low-Level Output Sink Current Clock Outputs (CLKx) High-Level Output Source Current Low-Level Output Sink Current Short Circuit Source Current Short Circuit Sink Current
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
fXTAL 27MHz; 10pF, 5.0V (-03 version)
CL(xtal)
seen crystal connected XOUT RXTAL=20;
V(XIN) V(XIN)
IOSH IOSL
-0.4V 0.4V shorted 30s, max. shorted 30s, max.
ISO9001
2.28.02
FS6244
Dual Clock Generator
Table Timing Specifications (VDD 3.3V nominal)
Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical.
PARAMETER Overall Synthesis Error Clock Output (CLKx) Duty Cycle Jitter, Period (peak-peak) Jitter, Long Term (y()) Rise Time Fall Time
SYMBOL
CONDITIONS/DESCRIPTION
CLOCK (MHz)
MIN.
TYP.
MAX.
UNITS
(unless otherwise noted Frequency Table)
Ratio high pulse width measured from rising edge next falling edge VDD/2) clock period
tj(P) tj(LT)
From rising edge next rising edge VDD/2, 10pF From 0-500µs VDD/2, 10pF compared ideal clock source 3.3V; 0.3V 3.0V; 10pF 3.3V; 3.0V 0.3V; 10pF
Table Timing Specifications (VDD nominal)
Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical.
PARAMETER Overall Synthesis Error Clock Output (CLKx) Duty Cycle Jitter, Period (peak-peak) Jitter, Long Term (y()) Rise Time Fall Time
SYMBOL
CONDITIONS/DESCRIPTION
CLOCK (MHz)
MIN.
TYP.
MAX.
UNITS
(unless otherwise noted Frequency Table)
Ratio high pulse width measured from rising edge next falling edge VDD/2) clock period
tj(P) tj(LT)
From rising edge next rising edge VDD/2, 10pF From 0-500µs VDD/2, 10pF compared ideal clock source 0.5V 4.5V; 10pF 4.5V 0.5V; 10pF
ISO9001
2.28.02
FS6244
Dual VCXO Clock Generator
Package Information
Table 16-pin SOIC (0.150") Package Dimensions
DIMENSIONS INCHES MIN. 0.061 0.004 0.055 0.013 0.0075 0.386 0.150 0.230 0.010 0.016 MAX. 0.068 0.0098 0.061 0.019 0.0098 0.393 0.157 0.244 0.016 0.035 MILLIMETERS MIN. 1.55 0.102 1.40 0.33 0.191 9.80 3.81 5.84 0.25 0.41 MAX. 1.73
0.249 1.55 0.49 0.249 9.98 3.99 6.20 0.41 0.89
AMERICAN MICROSYSTEMS, INC.
RADII: 0.005" 0.01"
typ.
SEATING PLANE
0.050
1.27
BASE PLANE
Table 16-pin SOIC (0.150") Package Characteristics
PARAMETER Thermal Impedance, Junction Free-Air 16-pin 0.150" SOIC Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk SYMBOL CONDITIONS/DESCRIPTION flow Corner lead Center lead lead adjacent lead lead TYP. UNITS °C/W
ISO9001
2.28.02
FS6244
Dual Clock Generator
Ordering Information
Table Device Ordering Codes
ORDERING CODE DEVICE NUMBER PACKAGE TYPE 16-pin (0.150") SOIC (Small Outline Package) 16-pin (0.150") SOIC (Small Outline Package) OPERATING TEMPERATURE RANGE 70°C (Commercial) 70°C (Commercial) SHIPPING CONFIGURATION Tape Reel Tubes
11640-821 11640-831
FS6244-03 FS6244-03
Revision Information
DATE 4/24/00 PAGE DESCRIPTION Fixed formatting errors
Copyright 1999, 2000 American Microsystems, Inc.
Devices sold covered warranty patent indemnification provisions appearing Terms Sale only. makes warranty, express, statutory implied description, regarding information forth herein regarding freedom described devices from patent infringement. makes warranty merchantability fitness purposes. reserves right discontinue production change specifications prices time without notice. AMI's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing such applications.
American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, 83201, (208) 233-4690, (208) 234-6796, Address: http://www.amis.com E-mail: tgp@amis.com
ISO9001
2.28.02

Dual Clock Generator Features Description Dual phase-lo

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