| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
VCXO Clock Generator Features Description On-chip tunab
Top Searches for this datasheetFS6207 VCXO Clock Generator Features Description On-chip tunable voltage-controlled crystal oscillator circuitry (VCXO) allows precise system frequency tuning (pull range typically 300ppm) Uses inexpensive fundamental-mode crystals Integrated phase-locked loops (PLL) multiply VCXO frequency higher system frequencies needed 3.3V supply voltage available (contact factory volt versions) Small circuit board footprint (8-pin 0.150 SOIC) Custom frequency selections available contact your local Sales Representative more information FS6207 monolithic CMOS clock generator designed minimize cost component count digital video/audio systems. on-chip voltage-controlled crystal oscillator (VCXO) permits reference frequency output frequency) tuned match other frequencies present system. Phase-locked loops used generate precise output reference frequency ratios. Table information frequency ratios programmed into each version FS6207. Table Version Information Figure Configuration XTUNE DEVICE (nom) FREF (MHz) CLKA (MHz) 27.000 (FREF 27.000 (FREF CLKB (MHz) 11.2896 (FREF 1568 1875) 12.2880 (FREF 1024 1125) XOUT CLKB CLKA FS620701 13.500 FS6207 NOTE: Contact custom versions 8-pin (0.150) SOIC Figure Block Diagram VCXO XOUT XTUNE CLKB CLKA FS6207 American Microsystems, Inc. reserves right change detail specifications required permit improvements design products. ISO9001 2.28.02 FS6207 VCXO Clock Generator Table Descriptions Key: Analog Input; Analog Output; Digital Input; Input with Internal Pull-Up; Input with Internal Pull-Down; Digital Input/Output; DI-3 Three-Level Digital Input, Digital Output; Power/Ground; Active TYPE NAME XTUNE CLKA CLKB XOUT VCXO Crystal Feedback Power Supply (+3.3V nominal) VCXO Tune Ground Clock Output Clock Output Select Input (see Version Information) VCXO Crystal Drive DESCRIPTION Functional Block Description Phase-Locked Loops (PLL) simple formula obtain pulling capability crystal oscillator ppm) on-chip PLLs standard frequency- phaselocked loop architecture. multiplies reference oscillator desired frequency ratio integers. frequency multiplication exactly that specified integer ratios. Voltage-Controlled Crystal Oscillator (VCXO) where extremes applied load capacitance. EXAMPLE: crystal with following parameters used. With 0.025pF, 6pF, 10pF, 20pF, tuning range between extreme settings XTUNE voltage VCXO provides tunable, low-jitter frequency reference rest FS6207 system components. Loading capacitance crystal internal FS6207. external components (other than crystal resonator itself) required operation VCXO. Continuous fine-tuning VCXO frequency accomplished varying voltage XTUNE pin. total change (from extreme other) effective loading capacitance 10pF nominal. That change from 10pF minimum loading) 20pF maximum loading). actual amount that changing load capacitance alters oscillator frequency will dependent characteristics crystal well oscillator circuit itself. Specifically, motional capacitance crystal (usually referred crystal manufacturers C1), static capacitance crystal (C0), load capacitance (CL) oscillator determine "warping" "pulling" capability crystal oscillator circuit. 0.025 Deviation -100 -150 -200 -250 V(XTUNE) volts Figure Typical VCXO Characteristic ISO9001 2.28.02 FS6207 VCXO Clock Generator Electrical Specifications Table Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. These conditions represent stress rating only, functional operation device these other conditions above operational limits noted this specification implied. Exposure maximum rating conditions extended conditions affect device performance, functionality, reliability. PARAMETER Supply Voltage (VSS ground) Input Voltage, Output Voltage, Input Clamp Current, VDD) Output Clamp Current, VDD) Storage Temperature Range (non-condensing) Ambient Temperature Range, Under Bias Junction Temperature Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) SYMBOL MIN. VSS-0.5 VSS-0.5 VSS-0.5 MAX. VDD+0.5 VDD+0.5 UNITS CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting loss functionality performance occur this device subjected high-energy electrostatic discharge. Table Operating Conditions PARAMETER Supply Voltage (3.3 volt system) Ambient Operating Temperature Range SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS ISO9001 2.28.02 FS6207 VCXO Clock Generator Table Electrical Specifications Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical. Negative currents indicate current flows device. PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs Clock Outputs (CLKx) High-Level Output Source Current Low-Level Output Sink Current Output Impedance Short Circuit Source Current Short Circuit Sink Current SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS fXTAL 13.5MHz; 10pF, 3.3V IOSH IOSL 2.0V 0.4V 0.5VDD; output driving high 0.5VDD; output driving shorted 30s, max. 3.3V; shorted 30s, max. ISO9001 2.28.02 FS6207 VCXO Clock Generator Table Timing Specifications Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical. PARAMETER Overall Synthesis Error Crystal Oscillator Crystal Loading Capacitance Crystal Drive Level Clock Output (CLK) Duty Cycle Jitter, Period (peak-peak) Jitter, Long Term (y()) Jitter, Long Term (y()) Rise Time Fall Time SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS (unless otherwise noted Frequency Table) CL(xtal) seen crystal connected XOUT (@VXTUNE=mid-scale) RXTAL=20; Ratio high pulse width measured from rising edge next falling edge VDD/2) clock period tj(P) tj(LT) tj(LT) From rising edge next rising edge VDD/2 From 0-500µs VDD/2 compared ideal clock source (CLK =27MHz 27.027MHz) From 0-500µs VDD/2 compared ideal clock source (CLK 74.175MHz 74.58MHz) 3.3V; 0.3V 3.0V; 10pF 3.3V; 3.0V 0.3V; 10pF ISO9001 2.28.02 FS6207 VCXO Clock Generator Package Information Table 8-pin SOIC (0.150") Package Dimensions DIMENSIONS INCHES MIN. 0.061 0.004 0.055 0.013 0.0075 0.189 0.150 0.230 0.010 0.016 MAX. 0.068 0.0098 0.061 0.019 0.0098 0.196 0.157 0.244 0.016 0.035 MILLIMETERS MIN. 1.55 0.102 1.40 0.33 0.191 4.80 3.81 5.84 0.25 0.41 MAX. 1.73 0.249 1.55 0.49 0.249 4.98 3.99 6.20 0.41 0.89 BASE PLANE RADII: 0.005" 0.01" AMERICAN MICROSYSTEMS, INC. SEATING PLANE typ. 0.050 1.27 Table 8-pin SOIC (0.150") Package Characteristics PARAMETER Thermal Impedance, Junction Free-Air 8-pin 0.150" SOIC Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk SYMBOL CONDITIONS/DESCRIPTION flow Corner lead Center lead lead adjacent lead lead TYP. 0.27 UNITS °C/W ISO9001 2.28.02 FS6207 VCXO Clock Generator Ordering Information DEVICE NUMBER PACKAGE TYPE 8-pin (0.150") SOIC (Small Outline Package) 8-pin (0.150") SOIC (Small Outline Package) OPERATING TEMPERATURE RANGE 70°C (Commercial) 70°C (Commercial) SHIPPING CONFIGURATION Tape Reel Tubes ORDERING CODE 1164011640- FS6207-01 FS6207-01 Copyright 1999, 2000 American Microsystems, Inc. Devices sold covered warranty patent indemnification provisions appearing Terms Sale only. makes warranty, express, statutory implied description, regarding information forth herein regarding freedom described devices from patent infringement. makes warranty merchantability fitness purposes. reserves right discontinue production change specifications prices time without notice. AMI's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, 83201, (208) 233-4690, (208) 234-6796, Address: http://www.amis.com E-mail: tgp@amis.com ISO9001 2.28.02 Other recent searchesTC55V400AFT-55 - TC55V400AFT-55 TC55V400AFT-55 Datasheet MMBT5550 - MMBT5550 MMBT5550 Datasheet MMBT5551 - MMBT5551 MMBT5551 Datasheet MAX3657 - MAX3657 MAX3657 Datasheet EE-247 - EE-247 EE-247 Datasheet AZ951 - AZ951 AZ951 Datasheet AZ952 - AZ952 AZ952 Datasheet at125 - at125 at125 Datasheet 1N821-1 - 1N821-1 1N821-1 Datasheet 1N823-1 - 1N823-1 1N823-1 Datasheet 1N825-1 - 1N825-1 1N825-1 Datasheet 1N827-1 - 1N827-1 1N827-1 Datasheet 1N829-1 - 1N829-1 1N829-1 Datasheet 1N821UR-1 - 1N821UR-1 1N821UR-1 Datasheet 1N823UR-1 - 1N823UR-1 1N823UR-1 Datasheet 1N825UR-1 - 1N825UR-1 1N825UR-1 Datasheet 1N827UR-1 - 1N827UR-1 1N827UR-1 Datasheet 1N829UR-1 - 1N829UR-1 1N829UR-1 Datasheet
Privacy Policy | Disclaimer |