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Semiconductor MSM82C37B-5RS/GS/VJS Semiconductor PROGRAMMABLE CON
Top Searches for this datasheetE2O0016-39-81 Semiconductor MSM82C37B-5RS/GS/VJS Semiconductor PROGRAMMABLE CONTROLLER This version: Aug. 1999 MSM82C37B-5RS/GS/VJS Previous version: Jan. 1998 GENERAL DESCRIPTION MSM82C37B-5RS/GS/VJS, (Direct Memory Access) controller capable highspeed data transfer without intervention used peripheral device microcomputer systems. device features four independent programmable channels. silicon gate CMOS technology, standby current (max.), power consumption (max.) when clock generated. items characteristics compatible with intel 8237A-5. FEATURES Maximum operating frequency (Vcc ±10%) High-speed operation very power consumption silicon gate CMOS technology Wide operating temperature range from -40°C +85°C 4-channels independent control request masking programming request priority function DREQ DACK input/output logic inversion address increment/decrement selection Memory-to-Memory Transfers Channel extension cascade connection transfer termination input Intel 8237A-5 compatibility Compatible 40-pin Plastic (DIP40-P-600-2.54): (Product name: MSM82C37B-5RS) 44-pin Plastic (QFJ44-P-S650-1.27): (Product name: MSM82C37B-5VJS) 44-pin Plastic (QFP44-P-910-0.80-2K): (Product name: MSM82C37B-5GS-2K) 1/33 Semiconductor MSM82C37B-5RS/GS/VJS CONFIGURATION (TOP VIEW) Plastic MEMR MEMW READY HLDA ADSTB RESET DACK2 DACK3 DREQ3 DREQ2 DREQ1 DREQ0 DACK0 DACK1 Plastic MEMW MEMR READY HLDA ADSTB RESET DACK2 DACK3 Plastic MEMW MEMR DREQ3 DREQ2 DREQ1 DREQ0 DACK1 DACK0 READY HLDA ADSTB RESET DACK2 DACK3 DREQ3 DREQ0 DACK1 DREQ2 DREQ1 DACK0 2/33 Semiconductor MSM82C37B-5RS/GS/VJS BLOCK DIAGRAM MEMR MEMW READY ADSTB RESET Base Word Count Register Current Word Count Register Base Address Register Current Address Register (Terminal Count) Timing Control Circuit Decrementer Temporary Word Count Register (16) Incrementer/Decrementer Temporary Address Register (16) Output Buffer Input/Output Buffer Command Control Circuit HLDA DREQ0 DACK0 Priority Judgment Circuit Mode Register Command Register Mark Register Request Register Status Register Temporary Register Internal Data Input/Output Buffer 3/33 Semiconductor MSM82C37B-5RS/GS/VJS ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Output Voltage Storage Temperature Power Dissipation Symbol VOUT TSTG Conditions with respect 25°C Rating MSM82C37B-5RS MSM82C37B-5GS MSM82C37B-5VJS Unit -0.5 -0.5 +0.5 -0.5 +0.5 +150 RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Input Voltage Input Voltage Symbol Min. -0.5 Typ. Max. +0.8 Unit CHARACTERISTICS Parameter Output Voltage Output Voltage Input Leak Current Output Leak Current Average Power Supply Current during Operations Symbol Conditions -1.0 VOUT Input frequency MHz, when RESET V/VCC, HLDA -40°C +85°C Min. Typ. Max. Unit Power Supply Current Standby Mode ICCS 4/33 Semiconductor MSM82C37B-5RS/GS/VJS CHARACTERISTICS (Master) Mode Symbol tAEL tAET tAFAB tAFC tAFDB tAHR tAHS tAHW Item Delay Time from Falling Edge Leading Edge Delay Time from Rising Edge Trailing Edge Delay Time from Rising Edge Address Floating Status Delay Time from Rising Edge Read/Write Signal Floating Status Delay Time from Rising Edge Data Floating Status Address Valid Hold Time Read Signal Trailing Edge Data Valid Hold Time ADSTB Trailing Edge Address Valid Hold Time Write Signal Trailing Edge Delay Time from Falling Edge Active DACK Delay Time from Rising Edge Leading Edge Delay Time from Rising Edge Trailing Edge tASM tASS Time from Rising Edge Address Valid Data Set-up Time ADSTB Trailing Edge Clock High-level Time Clock Low-level Time Cycle Time Min. +85°C, Comments Max. Unit (Note (Note (Note (Note 5/33 Semiconductor (Master) Mode (continued) Symbol tDCL tDCTR tDCTW tEPS tEPW tFAAB tFAC tFADB tIDH tIDS tODH tODV tSTL tSTT Item Delay Time from Rising Edge Read/Write Signal Leading Edge Delay Time from Rising Edge Read Signal Trailing Edge Delay Time from Rising Edge Write Signal Trailing Edge Delay Time from Rising Edge Valid Leading Edge Set-up Time Falling Edge Pulse Width Delay Time from Rising Edge Address Valid Time from Rising Edge Active Read/Write Signal Delay Time from Rising Edge Data Valid HLDA Valid Set-up Time Rising Edge Input Data Hold Time MEMR Trailing Edge Input Data Set-up MEMR Trailing Edge Output Data Hold Time MEMW Trailing Edge Time from Output Data Valid MEMW Trailing Edge DREQ Set-up Time Falling Edge READY Hold Time Falling Edge READY Set-up Time Falling Edge Delay Time from Rising Edge ADSTB Leading Edge Delay Time from Rising Edge ADSTB Trailing Edge Min. Max. MSM82C37B-5RS/GS/VJS Unit Comments (Note (Note (Note (Note 6/33 Semiconductor Slave Mode Symbol tRDE tRDF tRSTD tRSTS tRSTW tWWS Item Time from Address Valid Leading Edge Leading Edge Address Valid Set-up Time Trailing Edge Leading Edge Set-up Time trailing edge Data Valid Set-up Time Trailing Edge Address Hold Time Trailing Edge Data Access Time Leading Edge Delay Time Data Floating Status from Trailing Edge Supply Power Leading Edge Set-up time RESET Trailing Edge Time First Active from RESET Trailing Edge RESET Pulse Width Pulse Width Address Hold Time Trailing Edge Trailing Edge Hold Time Trailing Edge Data Hold Time Trailing Edge Pulse Width Min. 2tCY MSM82C37B-5RS/GS/VJS +85°C, Comments Max. Unit Notes: Output load capacitance (pF). MEMW pulse widths (ns) normal writing, 2tCY (ns) extended writing. MEMR pulse widths 2tCY (ns) normal timing, (ns) compressed timing. DREQ DACK signal active level either high. timing chart, DREQ signal been active-high, DACK signal activelow. When executes continuous read write programming mode, interval during which read write pulse becomes active must least open drain output. value given obtained when pull-up resistance connected VCC. Rise time fall time less than Waveform measurement points both input output signals HIGH LOW, unless otherwise noted. 7/33 Semiconductor MSM82C37B-5RS/GS/VJS TIMING CHART Reset Timing tRSTD tRSTW RESET tRSTS IOR, Slave Mode Write Timing tWWS Input Valid Address Input Valid Data Slave Mode Read Timing Input Valid Address tRDE tRDF Output Valid Data 8/33 Semiconductor Transfer Timing MSM82C37B-5RS/GS/VJS DREQ HLDA tAEL tAET tSTL tSTT ADSTB tASS tFADB tAHS tFAAB tAFDB tAHW tASM tAFAB tAHR tDCL tDCTR DACK tFAC IOR, MEMR tDCL tDCTW tAFC IOW, MEMW Internal (Output) External (Input) (Extended Write) tEPS tEPW 9/33 Semiconductor Memory Memory Transfer Timing tSTL tSTT tSTL MSM82C37B-5RS/GS/VJS tSTT ADSTB tFAAB tAHS tASM tAHS tAFAB tFADB Valid Address tAFDB Valid Address tAFDB tFAC tDCL Data Input tDCTR tIDS tFADB tIDH Data Output tODV tODH tAFC tDCL tDCTW tAFC MEMR tFAC MEMW Internal (Output) External (Input) tEPS tEPW tEPS tEPW Ready Timing tDCL tDCTR IOR, MEMR tDCL tDCL tDCTW IOW, MEMW (Extended Write) READY 10/33 Semiconductor Compressed Transfer Timing MSM82C37B-5RS/GS/VJS tASM tASM tDCL Valid Address tDCTR tDCL tDCTR IOR, MEMR tDCTW tDCL tDCTW IOW, MEMW READY Internal (Output) External (Input) tEPS tEPW 11/33 Semiconductor MSM82C37B-5RS/GS/VJS FUNCTIONS Symbol RESET Name Power Ground Clock Chip Select Reset Input/Output Input Input Input power supply Ground connection. Control MSM82C37B-5 internal operations data transfer speed. active-low input signal used select MSM82C37B-5 device idle cycle. RESET active-high asynchrounous input signal used clear command, status, request, temporary registers, first/last F/F, mask register. MSM82C37B-5 enters idle cycle following RESET. read write pulse width extended accomodate slow access memories devices when this input switched level. Note this input must change within prescribed set-up/hold time. HLDA active-high input signal used indicate that system control been released when hold request recieved CPU. DREQ asynchronous transfer request input signals. Although these pins switched active-high reset, they programmed become active-low. requests received accordance with prescribed order priority. DREQ must held until DACK becomes active. bidirectional three-state signals connected system data bus, which used input/output MSM82C37B-5 internal registers during idle cycles, output eight higher order bits transfer addresses during active cycles. Also used input output transfer data during memorymemory transfers. active-low bidirectional three-state signal used input control signal reading MSM82C37B-5 internal registers during idle cycles, output control signal reading device transfer data writing transfers during active cycles. active-low bidirectional three-state signal used input control signal writing MSM82C37B-5 internal registers during idle cycles, output control signal writing device transfer data writing transfers during active cycles. Function READY Ready Input HLDA Hold Acknowledge Input DREQ0 DREQ3 Request Channels Input Data Input/Output Read Input/Output Write Input/Output 12/33 Semiconductor MSM82C37B-5RS/GS/VJS FUNCTIONS (continued) Symbol Name Process Input/Output Input/Output Function active-low bidirectional three-state signal. Unlike other pins, this N-channel open drain. During operations, low-level output pulse obtained from this channel word count changes from 0000H FFFFH. transfers terminated pulling input level. Both these actions called terminal count (TC). When internal external generated, MSM82C37B-5 terminates transfer resets request. When used, necessary hold high level pull-up resistor prevent input error. Also note that function cannot satisfied cascade mode. bidirectional three-state signals used input signals specifying MSM82C37B-5 internal register accessed during idle cycles, output four lower order bits transfer address during active cycles. three-state signals used output four higher order bits transfer address during active cycles. active-high signal used output hold request system data control purposes. After become active, least clock cycle required before HLDA becomes active. DACK output signals used indicate that transfer peripheral devices been permitted. (Available each channel.) Although these pins switched active-low when reset, they programmed become active-high. Note that there DACK output signal during memory-memory transfers. active-high ouput signal used indicate that output signals sent from MSM82C37B-5 system valid. addition enabling external latch hold eight higher order bits transfer address, this signal also used disable other system buffers. ADSTB active-high signal used strobe eight higher order bits transfer address external latch. MEMR active-low three-state output signal used control signal reading data from memory during read transfers memory-memory transfers. MEMW active-low three-state output signal used control signal writing data into memory during write transfers memory-memory transfers. Address Input/Output Address Hold Request Output Output DACK0 DACK3 Acknowledge Channels Output Address Enable Output ADSTB MEMR Address Strobe Memory Read Output Output MEMW Memory Write Output 13/33 Semiconductor MSM82C37B-5RS/GS/VJS RESET Internal/ external Request HLDA Memory-Memory Transfer Setting External Compressed Timing Verify READY Internal/ External Single Transfer HLDA External Request Demand Transfer Internal/ External HLDA External Setting READY External Setting READY Carry Borrow Note: (Active) (Inactive) Figure Operation State Transition Diagram 14/33 Semiconductor MSM82C37B-5RS/GS/VJS OUTLINE FUNCTIONS MSM82C37B-5 consists five blocks three logic sections, internal register section, counter section. logic sections include timing control block where internal timing external control signals generated, command control block where each instruction from decoded, priority decision block where order channel priority determined. purpose internal register section hold internal states instructions from CPU, while counter section computes addresses word counts. DESCRIPTION OPERATIONS MSM82C37B-5 operates cycles (called idle active cycles) which divided into independent states. Each state commenced clock falling edge continues single clock cycle. transition from state next operations outlined Figure Idle Cycle idle cycle entered from state when there valid request MSM82C37B-5 channel. During this cycle, DREQ inputs monitored during each cycle. When valid request then received, active cycle commenced. HLDA inputs level, programming state started with MSM82C37B-5 reading writing executed IOW. Programming details described later. Active Cycle request received unmasked channel while MSM82C37B-5 idle cycle, software DREQ generated, changed high level commence active cycle. initial state active cycle state which repeated until HLDA input from changed high level. (But because internal operational reasons, minimum clock cycle required HLDA changed high level after become high level. That state must repeated least twice.) After HLDA been changed high level, state proceeds operational states thru during I/O-memory transfers, operational states thru thru during memory-memory transfers. memory device cannot accessed within normal timing, state (wait state) inserted READY input extend timing. 15/33 Semiconductor MSM82C37B-5RS/GS/VJS DESCRIPTION TRANSFER TYPES MSM82C37B-5 transfers between memory devices, transfers between memory devices. three types transfers between memory devices read, write, verify. I/O-Memory Transfers operational states during I/O-memory transfer state, output changed high level indicate that control signal from MSM82C37B-5 valid. eight lower order bits transfer address obtained from thru eight higher order bits obtained from thru DB7. ADSTB output changed high level this time eight higher order bits external address latch, DACK output made active channel where request acknowledged. Where there change eight higher transfer address during demand block mode transfers, however, state omitted. state, MEMR output changed level. state, MEMW changed level. Where compressed timing used, however, state omitted. states memory input/output timing control states. state, IOR, IOW, MEMR, MEMW changed high level, word count register decremented while address register incremented decremented) This completes transfer word. Note that I/O-memory transfers, data transferred directly without being taken MSM82C37B-5. differences three types I/O-memory transfers indicated below. Read Transfer Data transferd from memory device changing MEMR level. MEMW kept high level during this time. Write Transfer Data transferred from device memory changing MEMW level. MEMR kept high level during this time. Note that writing reading these write read transfers with respect memory. Verify Transfer Although verify transfers involve same operations write read transfers (such transfer address generation input responses),they fact pseudo transfers where memory reading/writing control signals kept inactive. READY inputs disregarded verify transfers. 16/33 Semiconductor Memory-memory Transfer MSM82C37B-5RS/GS/VJS Memory-memory transfers used transfer data blocks from memory area another. Memory-memory transfers require total eight states complete single transfer four states (S11 thru S14) reading from memory, four states (S21 thru S24) writing into memory. These states similar I/O-memory transfer states, distinguished using two-digit numbers. memory-memory transfers, channel used reading data from source area, channel used writing data into destination area. During initial four states, data specified channel address read from memory when MEMR made active, taken MSM82C37B-5 temporary register. Then during latter four states, data temporary register written address specified channel This completes transfer byte data. With channel channel addresses subsequently incremented decremented) channel word count decremented this operation repeated. transfer terminated when word count reaches FFFF(H) from 0000(H), when input applied from external source. Note that there DACK output signal during this transfer. following preparations programming requiring enable memory-memory transfers started. Command Register Setting Memory-memory transfers enabled setting Channel address held transfers setting This setting used enable 1-word contents source area written into entire destination area. Mode Register Setting transfer type destination disregarded channels Memory-memory transfers always executed block transfer mode. Request Register Setting Memory-memory transfers started setting channel request bit. Mask Register Setting Mask bits channels prevent selection other channel apart from channel Word Count Register Setting channel word count validated, while channel word count disregarded. order autoinitialize both channels, necessary write same values into both word count registers. 17/33 Semiconductor MSM82C37B-5RS/GS/VJS DESCRIPTION OPERATION MODES Single Transfer Mode single transfer mode, only word transferred, addresses incremented decremented) while word count decremented then changed level return control CPU. DREQ remains active after completion transfer, changed level. After HLDA changed level CPU, then changes back high level commence fresh cycle. this reason, machine cycle inserted between cycles CPU. Block Transfer Mode Once transfer started block mode, transfer continued until terminal count (TC) status reached. DREQ remains active until DACK becomes active, transfer continued even DREQ becomes inactive. Demand Transfer Mode transfer continued demand transfer mode until DREQ longer active, until status reached. During transfer, intermediate address word count values held current address current word count registers. Consequently, transfer suspended result DREQ becoming inactive before status reached, DREQ that channel then made active again, suspended transfer resumed. 18/33 Semiconductor Cascade Transfer Mode MSM82C37B-5RS/GS/VJS When transfers involving more than four channels required, connecting multiple number MSM82C37A-5 devices cascade connection (see Figure enables simple system extension. This mode setting first stage MSM82C37B-5 channel cascade mode. DREQ DACK lines first stage MSM82C37B-5 channel cascade mode connected HLDA lines respective MSM82C37B-5 devices second stage. first stage MSM82C37B-5 DACK signal must active-high, DREQ signal active-low. Since first stage MSM82C37B-5 only used functionally determining order priority each channel when cascade mode set, only DREQ DACK used-all other inputs disregarded. since system hung transfer activated software DREQ, software DREQ channels where cascade mode been set. addition dual stage cascade connection shown Figure triple stage cascade connections possible with second stage also cascade mode. DREQ HLDA DREQ DACK Stage MSM82C37B-5 HLDA DREQ DREQ DACK HLDA DACK DACK Stage MSM82C37B-5 Figure MSM82C37B-5 Cascade Connection System Autoinitialize Mode Setting mode register enables autoinitialization that channel. Following generation, autoinitialize involves writing base address base word count register values respective current address current word count registers. same values current registers written base registers CPU, changed during transfers. When channel been autoinitialize, that channel used second transfer without involving without mask being reset after generation. Priority Modes MSM82C37B-5 makes priority decision modes, acknowledges channel highest priority among requesting channels. 19/33 Semiconductor Fixed Priority Mode MSM82C37B-5RS/GS/VJS fixed priority mode, channel highest priority, followed channels that order. Rotating Priority Mode rotating priority mode, order priority changed that channel where current transfer been completed given lowest priority. This prevent channel from monopolizing system. fixed priority regained immediately after resetting. Table MSM82C37B-5 Priority Decision Modes Priority Mode Service Terminated Channel Highest Order Priority Next Lowest Fixed Rotating Compressed Timing Setting MSM82C37B-5 compressed timing mode enables state used extension read pulse access time omitted permitted system structure) three clock cycle transfers. state omitted, read pulse width becomes same write pulse width with address updated read write operation executed This mode disregarded transfer memory-memory transfer, transfer. Extended Writing When this mode set, MEMW signal which normally appears during state obtained during state, thereby extending write pulse width. purpose this extended write pulse enable system accomodate memories devices where access time slower. Although pulse width also extended using READY, that involves insertion state increase number states. 20/33 Semiconductor MSM82C37B-5RS/GS/VJS DESCRIPTION INTERNAL REGISTERS Current Address Register Each channel equipped with 16-bit long current address register where transfer address held during transfers. register value incremented decremented) each cycle. Although this register bits long, accessed MSM82C37B-5 eight bits time, therefore necessitating successive 8-bit (lower higher order bits) reading writing operations using internal first/last flip-flops. When autoinitialize been set, register automatically initialized original value after Current Word Count Register Each channel also equipped with bit-long current word count register where transfer count held during transfers. register value decremented each cycle. When word count value reaches FFFF(H) from 0000(H), generated. Therefore, word count value which less than actual number transfers must set. Since this register also bits long, accessed first/last flip-flops control same address register. autoinitialize been set, register automatically initialized original value after Base Address Register Base Word Count Register Each channel equipped with 16-bit long base address register base word count register where initial value each current register held. same values written each base register current register CPU. contents current register made ready CPU, content base register cannot read. 21/33 Semiconductor Command Register MSM82C37B-5RS/GS/VJS This 8-bit write-only register prescribes operations MSM82C37B-5 channels. outline bits given Figure When controller disabled setting there output even request active. DREQ DACK signals active high active setting DB7. Memory-Memory Transfer Disabled Memory-Memory Transfer Enabled Channel Address Hold Disabled Channel Address Hold Enabled (Invalid when "0") Controller Enabled Controller Disabled Normal Timing Compressed Timing (Invalid when "1") Fixed Priority Rotating Priority Normal Write Pulse Width Extended Write Pulse Width DREQ Sense Active DREQ Sense Active DACK Sense Active DACK Sense Active Figure Command Register 22/33 Semiconductor Mode Register MSM82C37B-5RS/GS/VJS Each channel equipped with 6-bit write-only mode register, which decided setting DB0, which channel written when writing from programming status. description outlined Figure This register cleared Reset Master Clear instruction. Channel Selected Channle Selected Channel Selected Channle Selected Verify Transfer Write Transfer Read Transfer Disabled (Invalid When "11") Auto Initialize Disabled Auto Initialize Enabled Address Increment (+1) Selected Address Decrement (-1) Selected Demand Transfer Mode Selected Single Transfer Mode Selected Block Transfer Mode Selected Cascade Mode Selected Figure Mode Register Request Register addition using DREQ signal, MSM82C37B-5 request transfers software means. This involves setting request request register. Each channel corresponding request request register, order priority these bits determined priority decision circuit irrespective mask register. transfers acknowledged accordance with decided order priority. request bits reset when reached, when request certain channel been received, other request bits cleared. When memory-memory transfer commenced, channel request set. description outlined Figure Channel Selected Channel Selected Channel Selected Channel Selected Request Cleared Request Used Figure Request Register 23/33 Semiconductor Mask Register MSM82C37B-5RS/GS/VJS This register used disabling enabling transfers each channel. Each channel includes corresponding mask mask register, each when reached autoinitialize mode. This mask register different ways. method setting/resetting register each channel outlined Figure 6(a), while method setting/resetting register channels once outlined Figure 6(b). Channel Selected Channel Selected Channel Selected Channel Selected Mask Cleared Mask Used Single Mask Register (Setting/Resetting Each Channel) Channel Mask Cleared Channel Mask Channel Mask Cleared Channel Mask Channel Mask Cleared Channel Mask Channel Mask Cleared Channel Mask Used Mask Register (Setting/Resetting Channels Once) Figure Mask Register 24/33 Semiconductor Status Register MSM82C37B-5RS/GS/VJS This register read-only register used reading MSM82C37B-5 status. four higher order bits indicate transfer request status each channel, being when DREQ input signal active. four lower order bits indicate whether corresponding channel reached not, being when status reached. These four lower order bits reset status register reading, RESET input master clearing. description each outlined Figure Channel Reached Channel Reached Channel Reached Channel Reached Channel Reached Channel Reached Channel Reached Channel Reached Channel Requesting Channel Requesting Channel Requesting Channel Requesting Channel Requesting Channel Requesting Channel Requesting Channel Requesting Figure Status Register Temporary Register temporary register register where transfer data held temporarily during memorymemory transfers. Since last item data transferred held after completion transfer, this item read CPU. Software Command MSM82C37B-5 equipped with software commands executing special operations ensure proper programming. Software command irrespective data contents. 25/33 Semiconductor Clear First/Last Flip-Flop MSM82C37B-5RS/GS/VJS 16-bit address word count registers read written consecutive operations involving eight bits each (higher lower order bits) under data port control. fact that lower order bits accessed first MSM82C37B-5, followed accessing higher order bits, discerned internal first/last flip-flop. This command resets first/last flip-flop with eight lower order bits being accessed immediately after execution. Master Clear same operation when hardware RESET input applied. Thus command clears contents command, status (four lower order bits), request, temporary registers, also clears first/last flip-flop, sets mask register. This command followed idle cycle. Clear Mask Register When this command executed, mask bits channels cleared enable reception transfers. 26/33 Semiconductor MSM82C37B-5RS/GS/VJS PROGRAMMING MSM82C37B-5 switched programming status when HLDA input both level. this state, changed level with held high level enable reading CPU, else changed level while held high level enable writing CPU. list command codes reading from MSM82C37B-5 given Table list command codes writing MSM82C37B-5 given Table Note: transfer request received from device during MSM82C37B5 programming, that transfer commenced prevent proper programming. prevent this interference, channel must masked, controller disabled command register, system prevent DREQ becoming active during programming. Table List MSM82C37B-5 Read Commands Internal First/Last Flip/Flop Status Register Temporary Register Output Data Invalid Channel Current Word Count Register Channel Channel Current Word Count Register Current Address Register Current Word Count Register Current Address Register Channel Read Data Current Address Register Current Word Count Register Current Address Register Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Other Combinations 27/33 Semiconductor MSM82C37B-5RS/GS/VJS Table List MSM82C37B-5 Write Commands Internal First/Last Flip-Flop Channel Current Base Word Count Registers Command Register Request Register Single Mask Register Mode Register Clear First/Last Flip-Flop (Software Command) Master Clear (Software Command) Clear Mask Register (Software Command) Mask Register Channel Channel Current Base Word Count Registers Current Base Address Registers Current Base Word Count Registers Current Base Address Registers Channel Written Data Current Base Address Registers Current Base Word Count Registers Current Base Address Registers Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits Lower Order Bits Higher Order Bits 28/33 Semiconductor MSM82C37B-5RS/GS/VJS NOTICE REPLACING LOW-SPEED DEVICES WITH HIGH-SPEED DEVICES conventional speed devices replaced high-speed devices shown below. When want replace your speed devices with high-speed devices, read replacement notice given next pages. High-speed device (New) M80C85AH M80C86A-10 M80C88A-10 M82C84A-2 M81C55-5 M82C37B-5 M82C51A-2 M82C53-2 M82C55A-2 Low-speed device (Old) M80C85A/M80C85A-2 M80C86A/M80C86A-2 M80C88A/M80C88A-2 M82C84A/M82C84A-5 M81C55 M82C37A/M82C37A-5 M82C51A M82C53-5 M82C55A-5 Remarks 8-bit 16-bit 8-bit Clock generator RAM, I/O, timer controller USART Timer 29/33 Semiconductor Differences between MSM82C37A-5 MSM82C37B-5 MSM82C37B-5RS/GS/VJS Manufacturing Process These devices Si-CMOS process technology have same chip size. Function These devices have same logics except changes characteristics listed (3-2). Electrical Characteristics 3-1) Characteristics These devices have same characteristics. 3-2) Characteristics Parameter Clock Time automatic initialization) Clock Time (Other than above) Symbol MSM82C37A-5 minimum minimum MSM82C37B-5 minimum minimum shown above, MSM82C37A-5 cannot satisfy clock time automatic initialization). other hand, MSM82C37B-5 satisfy clock time operation status. other characteristics, both MSM82C37A-5 MSM82C37B-5 identical. Package MSM82C37A-5 employed PLCC package having OKI's original layout, which compatible AMD's PLCC products which been commercialized before OKI's products. meet overseas customers needs, developed AMD-compatible PLCC productsMSM82C37B-VJS. OKI's FLAT package identical those AMD. 30/33 Semiconductor MSM82C37B-5RS/GS/VJS PACKAGE DIMENSIONS (Unit DIP40-P-600-2.54 Package material Lead frame material treatment Solder plate thickness Package weight Epoxy resin alloy Solder plating more 6.10 TYP. 31/33 Semiconductor MSM82C37B-5RS/GS/VJS (Unit QFJ44-P-S650-1.27 Mirror finish Package material Lead frame material treatment Solder plate thickness Package weight Epoxy resin alloy Solder plating more 2.00 TYP. Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times). 32/33 Semiconductor MSM82C37B-5RS/GS/VJS (Unit QFP44-P-910-0.80-2K Mirror finish Package material Lead frame material treatment Solder plate thickness Package weight Epoxy resin alloy Solder plating more 0.41 TYP. Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times). 33/33 E2Y0002-29-62 NOTICE information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents contained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation. Copyright 1999 Electric Industry Co., Ltd. Printed Japan Other recent searchesSIGC158T170R3 - SIGC158T170R3 SIGC158T170R3 Datasheet RE233-LF - RE233-LF RE233-LF Datasheet PLL620-30 - PLL620-30 PLL620-30 Datasheet IDT49C466A - IDT49C466A IDT49C466A Datasheet E8500 - E8500 E8500 Datasheet DMP2215L - DMP2215L DMP2215L Datasheet
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