Silicon General Purpose High Voltage Transistor This Silicon Plan

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Silicon General Purpose High Voltage Transistor This Silicon Plan

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MSB92ASWT1
Silicon General Purpose High Voltage Transistor
This Silicon Planar Transistor designed general purpose amplifier applications. This device housed SC-70/SOT-323 package which designed power surface mount applications.
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COLLECTOR
MAXIMUM RATINGS 25°C)
Rating Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Continuous Electrostatic Discharge Symbol V(BR)CBO V(BR)CEO V(BR)EBO Value -300 -300 -5.0 MBMu16,000, MMu2,000 Unit mAdc SC-70/SOT-323 CASE STYLE BASE EMITTER
THERMAL CHARACTERISTICS
Rating Power Dissipation (Note Junction Temperature Storage Temperature Range Symbol Tstg Unit
MARKING DIAGRAM
Device mounted FR-4 glass epoxy printed circuit board using minimum recommended footprint.
Specific Device Code Date Code
ORDERING INFORMATION
Device MSB92ASWT1 Package SC-70/ SOT-323 Shipping Tape Reel (7-inch/3000 Unit)
Preferred devices recommended choices future best overall value.
Semiconductor Components Industries, LLC, 2003
May, 2003 Rev.
Publication Order Number: MSB92ASWT1/D
MSB92ASWT1
ELECTRICAL CHARACTERISTICS
Characteristic Collector-Emitter Breakdown Voltage -1.0 mAdc, Collector-Base Breakdown Voltage -100 mAdc, Emitter-Base Breakdown Voltage -100 mAdc, Collector-Base Cutoff Current (VCB Vdc, Emitter-Base Cutoff Current (VEB -3.0 Vdc, Current Gain (Note MSB92AWT1: (VCE Vdc, -1.0 mAdc) (VCE Vdc, mAdc) (VCE Vdc, mAdc) Collector-Emitter Saturation Voltage (Note mAdc, -2.0 mAdc) Base-Emitter Saturation Voltage mAdc, -2.0 mAdc) Symbol V(BR)CEO V(BR)CBO V(BR)EBO ICBO IEBO hFE1 hFE2 hFE3 VCE(sat) VBE(sat) -300 -300 -5.0 -0.25 -0.1 -0.5 -0.9 Unit
SMALL SIGNAL CHARACTERISTICS
Current Gain Bandwidth Product mAdc, Vdc, MHz) Collector-Base Capacitance (VCB Vdc, MHz) Pulse Test: Pulse Width D.C.
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MSB92ASWT1 INFORMATION USING SC-70/SOT-323 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS Surface mount board layout critical portion total design. footprint semiconductor packages must correct size insure proper solder connection
0.037 0.95
interface between board package. With correct geometry, packages will self align when subjected solder reflow process.
0.037 0.95
0.094 0.039 0.031 inches
SC-70/SOT-323 POWER DISSIPATION power dissipation SC-70/SOT-323 function size. This vary from minimum size soldering size given maximum power dissipation. Power dissipation surface mount device determined TJ(max), maximum rated junction temperature die, RqJA, thermal resistance from device junction ambient; operating temperature, Using values provided data sheet, calculated follows.
TJ(max) RqJA
equation ambient temperature 25°C, calculate power dissipation device which this case milliwatts.
150°C 25°C 0.625°C/W milliwatts
values equation found maximum ratings table data sheet. Substituting these values into
0.625°C/W assumes recommended footprint glass epoxy printed circuit board achieve power dissipation milliwatts. Another alternative would ceramic substrate aluminum core board such Thermal CladTM. Using board material such Thermal Clad, higher power dissipation milliwatts achieved using same footprint.
SOLDERING PRECAUTIONS melting temperature solder higher than rated temperature device. When entire device heated high temperature, failure complete soldering within short time could result device failure. Therefore, following items should always observed order minimize thermal stress which devices subjected. Always preheat device. delta temperature between preheat soldering should 100°C less.* When preheating soldering, temperature leads case must exceed maximum temperature ratings shown data sheet. When using infrared heating with reflow soldering method, difference should maximum 10°C.
soldering temperature time should exceed
260°C more than seconds. When shifting from preheating soldering, maximum temperature gradient should less. After soldering been completed, device should allowed cool naturally least three minutes. Gradual cooling should used forced cooling will increase temperature gradient result latent failure mechanical stress. Mechanical stress shock should applied during cooling.
Soldering device without preheating cause excessive thermal shock stress which result damage device.
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MSB92ASWT1
SOLDER STENCIL GUIDELINES Prior placing surface mount components onto printed circuit board, solder paste must applied pads. solder stencil required screen optimum amount solder paste onto footprint. stencil made brass stainless steel with typical thickness 0.008 inches. stencil opening size surface mounted package should same size printed circuit board, i.e., registration.
TYPICAL SOLDER HEATING PROFILE given circuit board, there will group control settings that will give desired heat pattern. operator must temperatures several heating zones, figure belt speed. Taken together, these control settings make heating "profile" that particular circuit board. machines controlled computer, computer remembers these profiles from operating session next. Figure shows typical heating profile when soldering surface mount device printed circuit board. This profile will vary among soldering systems good starting point. Factors that affect profile include type soldering system use, density types components board, type solder used, type board substrate material being used. This profile shows temperature versus time. line graph shows actual temperature that might experienced surface test board near central solder joint. profiles based high density density board. Vitronics SMD310 convection/infrared reflow soldering system used generate this profile. type solder used 62/36/2 Lead Silver with melting point between 177-189 When this type furnace used solder reflow work, circuit boards solder joints tend heat first. components board then heated conduction. circuit board, because large surface area, absorbs thermal energy more efficiently, then distributes this energy components. Because this effect, main body component degrees cooler than adjacent solder joints.
STEP PREHEAT ZONE RAMP" 200°C
STEP STEP VENT HEATING SOAK" ZONES RAMP"
STEP STEP HEATING HEATING ZONES ZONES SPIKE" SOAK" 170°C 160°C
STEP STEP VENT COOLING 205° 219°C PEAK SOLDER JOINT
DESIRED CURVE HIGH MASS ASSEMBLIES 150°C
150°C
100°C 100°C
140°C
SOLDER LIQUID SECONDS (DEPENDING MASS ASSEMBLY)
50°C
DESIRED CURVE MASS ASSEMBLIES
TIME MINUTES TOTAL)
TMAX
Figure Typical Solder Heating Profile
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MSB92ASWT1
PACKAGE DIMENSIONS
SC-70/SOT-323 CASE 419-02 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES 0.071 0.087 0.045 0.053 0.032 0.040 0.012 0.016 0.047 0.055 0.000 0.004 0.004 0.010 0.017 0.026 0.028 0.079 0.095 MILLIMETERS 1.80 2.20 1.15 1.35 0.80 1.00 0.30 0.40 1.20 1.40 0.00 0.10 0.10 0.25 0.425 0.650 0.700 2.00 2.40
0.05 (0.002)
STYLE BASE EMITTER COLLECTOR STYLE BASE EMITTER COLLECTOR
STYLE ANODE ANODE CATHODE
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MSB92ASWT1
SENSEFET trademark Semiconductor Components Industries, LLC.
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center Semiconductor P.O. 5163, Denver, Colorado 80217 Phone: 303-675-2175 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 Semiconductor Website: http://onsemi.com additional information, please contact your local Sales Representative.
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MSB92ASWT1/D

Silicon General Purpose High Voltage Transistor This Silicon Plan

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