FCI's CardBus Eject headers feature "modular design" either single-dec
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CardBus Eject Header Series
FCI's CardBus Eject headers feature "modular design" either single-deck double-deck configuration. This unique CardBus series innovative design that utilizes vertical transition board header that simply plugs into surface mount (SMT) board receptacle. This allows customers have full surface mount cardbus eject header solution with 5.0mm standoff capability either single double deck configuration. FCI's CardBus series excellent high-signal transmission applications requiring greater bandwidth (32-bit), higher clock rate MHz), enhanced grounding minimizing crosstalk.
Eject header module plugs into board-mounted receptacle Easy process only 0.8mm centerline BergStakconnector (P/N 73277-101000) soldered Board Conforms PCMCIA CardBus standard Suitable Type III; 3.3-volt standard; CardBus cards Single Double deck Above below board mounting configurations available 0.0, 2.2, 4.3, stand-off heights Multiple card guidance mechanism features available: eject, non-eject, right, left push Vertical Transition Headers easily separated from mechanisms custom applications
Provides modular add-on removal Stand-off options allow additional component real estate Provides excellent electrical performance High contact reliability Compact size small footprint consume minimal board space
Target Markets
Computing DataCom Commercial Industrial Instrumentation
Target Applications
Personal Mobile computers Peripherals Industrial medical instrumentation Set-top boxes 3.3-volt operating systems requiring extended battery life PCMCIA CardBus card interface applications
Benefits
"Plug-in" design board receptacle simplifies processing
Americas Tel.: (800) 237-2374; 717-938-7200
Internet: www.fciconnect.com Europe Tel.: 31-73-6206-911
Asia/Pacific Tel.: 65-549-6666
Technical Data
Materials
Eject Header Housing.Thermoplastic LCP, .FR4 Contact Shield .Phosphor-bronze Plating Underplating .0.5 min. Contact area .0.1 min. Gold over min. Pd-Ni Eject Mechanism Assembly Plastic Guide Button .PPA Metal mechanism components .Stainless Steel contact.Phosphor Bronze Receptacle (73277-101000) Housing.Thermoplastic LCP, Contact .BeCu
Part Numbers
Single Deck 71299-000CA 71299-020CA 71299-040CA 71299-050CA 71299-100CA 71299-120CA 71299-140CA 71299-150CA 71299-520CA 71299-540CA 71299-550CA 71299-620CA 71299-640CA 71299-650CA Double Deck 71240-000CA 71240-020CA 71240-040CA 71240-050CA 71240-100CA 71240-120CA 71240-140CA 71240-150CA 71240-200CA 71240-220CA 71299-240CA 71240-250CA 71240-300CA 71240-320CA 71299-340CA 71240-350CA 71240-520CA 71240-540CA Stand-off Stand-off Mounting Push Location Above Board Right eject Above Board Right eject Above Board Right eject Above Board Right eject Above Board Left eject Above Board Left eject Above Board Left eject Above Board Left eject Below Board Right eject Below Board Right eject Below Board Right eject Below Board Left eject Below Board Left eject Below Board Left eject Mounting Push Location Above Board Left (below deck) Right eject (top deck) Above Board Left (below deck) Right eject (top deck) Above Board Left (below deck) Right eject (top deck) Above Board Left (below deck) Right eject (top deck) Above Board Right (below deck) Left eject (top deck) Above Board Right (below deck) Left eject (top deck) Above Board Right (below deck) Left eject (top deck) Above Board Right (below deck) Left eject (top deck) Above Board Right Right eject Above Board Right Right eject Above Board Right Right eject Above Board Right Right eject Above Board Left Left eject Above Board Left Left eject Above Board Left Left eject Above Board Left Left eject Below Board Right (top deck) Left eject (below deck) Below Board Right (top deck) Left eject (below deck) Below Board Right (top deck) Left eject (below deck) Below Board Left (top deck) Right eject (below deck) Below Board Left (top deck) Right eject (below deck) Below Board Left (top deck) Right eject (below deck) Below Board Right Right eject Below Board Right Right eject Below Board Right Right eject Below Board Left Left eject Below Board Left Left eject Below Board Left Left eject
Mechanical Performance
Operating temperature Card Insertion Force.40 max. Card Unmating Force.6.8 min., max. Vertical Board Insertion Force max. Vertical Board Un-mating Force .6.8N min., max. Durability (mating cycles) Office Environment.10,000 cycles Harsh Environment .5,000 cycles
Electrical Performance
Insulation resistance .1,000M min. initial Withstanding voltage .1mA 125Vrms min. Current rating.0.5A Max. contact Contact Resistance.40 max. initial, max. after test
Specifications
Product Specification.GES-12-113
71240-550CA 71240-620CA 71240-640CA
Packaging
Eject Headers .Tray BergStak Receptacle .Tray Tape-and-Reel
71240-650CA 71240-720CA 71299-740CA 71240-750CA 71240-820CA 71299-840CA 71240-850CA
Mating BergStak receptacle, 0.8mm pitch, 100-position 73277-101000
options additional product information, call your local representative.
connects world
Americas Tel.: (800) 237-2374; 717-938-7200
Internet: www.fciconnect.com Europe Tel.: 31-73-6206-911
Asia/Pacific Tel.: 65-549-6666
950510-017 11/99
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