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Kbit (32Kb Voltage EPROM EPROM 2.7V 3.6V SUPPLY VOLTAGE READ OPER
Top Searches for this datasheetM27W256 Kbit (32Kb Voltage EPROM EPROM 2.7V 3.6V SUPPLY VOLTAGE READ OPERATION ACCESS TIME: 70ns 3.0V 3.6V 80ns 2.7V 3.6V COMPATIBLE with M27C256B POWER CONSUMPTION: 15µA Standby Current 15mA Active Current 5MHz FDIP28W PDIP28 PROGRAMMING TIME 100µs/byte HIGH RELIABILITY CMOS TECHNOLOGY 2,000V Protection 200mA Latchup Protection Immunity PLCC32 ELECTRONIC SIGNATURE Manufacturer Code: Device Code: Figure Logic Diagram TSOP28 13.4mm DESCRIPTION M27W256 voltage Kbit EPROM offered ranges (ultra violet erase) (one time programmable). ideally suited microprocessor systems organized 32,768 bits. M27W256 operates read mode with supply voltage decrease operating power allows either reduction size battery increase time between battery recharges. FDIP28W (window ceramic frit-seal package) transparent which allows user expose chip ultraviolet light erase pattern. pattern then written device following programming procedure. applications where content programmed only time erasure required, M27W256 offered PDIP28, PLCC32 TSOP28 13.4 packages. A0-A14 Q0-Q7 M27W256 AI03629 August 2002 1/15 M27W256 Figure Connections Figure Connection AI03627 AI03626 M27W256 M27W256 A0-A14 Q0-Q7 Figure TSOP Connection Table Signal NameAddress Inputs Data Outputs Chip Enable Output Enable Program Supply Supply Voltage Ground Connected Internally Don't M27W256 AI03628 2/15 M27W256 Table Absolute Maximum Ratings Symbol TBIAS TSTG Parameter Ambient Operating Temperature Temperature Under Bias Storage Temperature Input Output Voltage (except Supply Voltage Voltage Program Supply Voltage Value 13.5 Unit Note: Except rating "Operating Temperature Range", stresses above those listed Table "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only operation device these other conditions above those indicated Operating sections this specification implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability. Refer also STMicroelectronics SURE Program other relevant quality documents. Minimum voltage Input Output -0.5V with possible undershoot -2.0V period less than 20ns. Maximum voltage Output +0.5V with possible overshoot period less than 20ns. Depends range. Table Operating ModeMode Read Output Disable Program Verify Program Inhibit Standby Electronic Signature Note: VIL, 0.5V. Pulse Q7-Q0 Data Hi-Z Data Data Hi-Z Hi-Z Code Table Electronic Signature Identifier Manufacturer's Code Device Code Data 3/15 M27W256 Table Measurement ConditionHigh Speed Input Rise Fall Times Input Pulse Voltages Input Output Timing Ref. Voltages 10ns 1.5V Standard 20ns 0.4V 2.4V 0.8V Figure Testing Input Output Waveform Figure Testing Load Circuit 1.3V High Speed 1.5V DEVICE UNDER TEST 2.0V 0.8V AI01822 1N914 3.3k Standard 2.4V 0.4V 30pF High Speed 100pF Standard includes capacitance AI01823B Table Capacitance MHz) Symbol COUT Parameter Input Capacitance Output Capacitance Test Condition VOUT Unit Note: Sampled only, 100% tested. DEVICE OPERATION modes operation M27W256 listed Operating Modes. single power supply required read mode. inputs levels except Electronic Signature. Read Mode M27W256 control functions, both which must logically active order obtain data outputs. Chip Enable power control should used device selection. Output Enable output control should used gate data output pins, indepen- dent device selection. Assuming that addresses stable, address access time (tAVQV) equal delay from output (tELQV). Data available output after delay tGLQV from falling edge assuming that been addresses have been stable least tAVQV-tGLQV. Standby Mode M27W256 standby mode which reduces supply current from 10mA 10µA with voltage operation 3.6V, Read Mode Characteristics table details. M27W256 placed standby mode applying CMOS high signal input. When standby mode, outputs high impedance state, independent input. 4/15 M27W256 Table Read Mode Characteristics 85°C; 2.7V 3.6V; VCC) Symbol ICC1 ICC2 Parameter Input Leakage Current Output Leakage Current Supply Current Supply Current (Standby) Supply Current (Standby) CMOS Program Current Input Voltage Input High Voltage Output Voltage Output High Voltage 2.1mA -400µA Test Condition VOUT VIL, VIL, IOUT 0mA, 5MHz, 3.6V 0.2V, 3.6V -0.6 Unit Note: must applied simultaneously with before removed simultaneously after VPP. Maximum voltage Output +0.5V. Table Read Mode Characteristics 85°C; 2.7V 3.6V; VCC) M27W256 Test Condition tAVQV tELQV tGLQV tEHQZ tGHQZ tAXQX tACC Address Valid Output Valid Chip Enable Output Valid Output Enable Output Valid Chip Enable High Output Hi-Z Output Enable High Output Hi-Z Address Transition Output Transition VIL, VIL, -100 (-120/-150/-200) Symbol Parameter Unit 3.0V 3.6V 2.7V 3.6V 2.7V 3.6V Note: must applied simultaneously with before removed simultaneously after VPP. Sampled only, 100% tested. Speed obtained with High Speed measurement conditions. 5/15 M27W256 Figure Read Mode Waveform A0-A14 VALID tAVQV tAXQX VALID tGLQV tELQV Q0-Q7 tGHQZ Hi-Z tEHQZ AI00758B Line Output Control Because EPROMs usually used larger memory arrays, this product features line control function which accommodates multiple memory connection. line control function allows: lowest possible memory power dissipation, complete assurance that output contention will occur. most efficient these control lines, should decoded used primary device selecting function, while should made common connection devices array connected READ line from system control bus. This ensures that deselected memory devices their power standby mode output pins only active when data desired from particular memory device. System Considerations power switching characteristics Advance CMOS EPROMs require careful decoupling devices. supply current, ICC, three segments that interest system designer: standby current level, active current level, transient current peaks that produced falling rising edges magnitude this transient current peaks dependent capacitive inductive loading device output. associated transient voltage peaks suppressed complying with line output control properly selected decoupling capacitors. recommended that 0.1µF ceramic capacitor used every device between VSS. This should high frequency capacitor inherent inductance should placed close device possible. addition, 4.7µF bulk electrolytic capacitor should used between every eight devices. bulk capacitor should located near power supply connection point. purpose bulk capacitor overcome voltage drop caused inductive effects traces. 6/15 M27W256 Table Programming Mode Characteristics 6.25V 0.25V; 12.75V 0.25V) Symbol Parameter Input Leakage Current Supply Current Program Current Input Voltage Input High Voltage Output Voltage Output High Voltage Voltage 2.1mA -1mA 11.5 12.5 -0.3 Test Condition Unit Note: must applied simultaneously with before removed simultaneously after VPP. Table Programming Mode Characteristics 6.25V 0.25V; 12.75V 0.25V Symbol tAVEL tQVEL tVPHEL tVCHEL tELEH tEHQX tQXGL tGLQV tGHQZ tGHAX tVPS tVCS tOES tDFP Parameter Address Valid Chip Enable Input Valid Chip Enable High Chip Enable High Chip Enable Chip Enable Program Pulse Width Chip Enable High Input Transition Input Transition Output Enable Output Enable Output Valid Output Enable High Output Hi-Z Output Enable High Address Transition Unit Note: must applied simultaneously with before removed simultaneously after VPP. Programming M27W256 been designed fully compatible with M27C256B same electronic signature. result M27W256 programmed M27C256B same programming equipments applying 12.75V 6.25V same PRESTO algorithm. When delivered (and after each erasure EPROM), bits M27W256 state. Data introduced selectively programming '0's into desired locations. Although only '0's will programmed, both '1's '0's present data word. only change exposure ultraviolet light EPROM). M27W256 programming mode when input 12.75V, pulsed VIL. data programmed applied bits parallel data output pins. levels required address data inputs TTL. specified 6.25 0.25 7/15 M27W256 Figure Programming Verify Modes Waveform A0-A14 tAVEL Q0-Q7 DATA tQVEL tVPHEL tVCHEL tELEH VALID DATA tEHQX tGLQV tGHQZ tGHAX tQXGL PROGRAM VERIFY AI00759 Figure Programming Flowchart 6.25V, 12.75V 100µs Pulse VERIFY Last Addr Addr FAIL CHECK WORDS 1st: 2nd: 2.7V AI00707D PRESTO Programming Algorithm PRESTO Programming Algorithm allows program whole array with guaranteed margin, typical time seconds. Programming with PRESTO involves application sequence 100µs program pulses each byte until correct verify occurs (see Figure During programming verify operation, MARGIN MODE circuit automatically activated order guarantee that each cell programmed with enough margin. overprogram pulse applied since verify MARGIN MODE much higher than 3.6V provides necessary margin each programmed cell. Program Inhibit Programming multiple M27W256s parallel with different data also easily accomplished. Except like inputs including parallel M27W256 common. level pulse applied M27W256's input, with 12.75 will program that M27W256. high level input inhibits other M27W256s from being programmed. Program Verify verify (read) should performed programmed bits determine that they were correctly programmed. verify accomplished with VIL, VIH, 12.75V 6.25V. 8/15 M27W256 Electronic Signature Electronic Signature (ES) mode allows reading binary code from EPROM that will identify manufacturer type. This mode intended programming equipment automatically match device programmed with corresponding programming algorithm. mode functional 25°C ambient temperature range that required when programming M27W256. activate mode, programming equipment must force 11.5V 12.5V address line M27W256, with identifier bytes then sequenced from device outputs toggling address line from VIH. other address lines must held during Electronic Signature mode. Byte VIL) represents manufacturer code byte VIH) device identifier code. STMicroelectronics M27W256, these identifier bytes given Table read-out outputs Note that M27W256 M27C256B have same identifier bytes. ERASURE OPERATION (applies EPROM) erasure characteristics M27W256 such that erasure begins when cells exposed light with wavelengths shorter than approximately 4000 should noted that sunlight some type fluorescent lamps have wavelengths 3000-4000 range. Research shows that constant exposure room level fluorescent lighting could erase typical M27W256 about years, while would take approximately week cause erasure when exposed direct sunlight. M27W256 exposed these types lighting conditions extended periods time, suggested that opaque labels over M27W256 window prevent unintentional erasure. recommended erasure procedure M27W256 exposure short wave ultraviolet light which wavelength integrated dose (i.e. intensity exposure time) erasure should minimum W-sec/cm2. erasure time with this dosage approximately minutes using ultraviolet lamp with 12000 µW/cm2 power rating. M27W256 should placed within inch) lamp tubes during erasure. Some lamps have filter their tubes which should removed before erasure. 9/15 M27W256 Table Ordering Information Scheme Example: Device Type Supply Voltage 2.7V 3.6V Device Function Kbit (32Kb Speed (1,2) -100 Design -120 -150 -200 Package FDIP28W PDIP28 PLCC32 TSOP28: 13.4 Temperature Range Options Tape Reel Packing Note: High Speed, Characteristics section further information. This speed also guarantees 70ns access time 3.0V 3.6V. These speeds replaced 100ns. Packages option available request. Please contact STMicroelectronics local Sales Office. M27W256 list available options (Speed, Package, etc.) further information aspect this device, please contact STMicroelectronics Sales Office nearest you. Table Revision History Date 1998 July 1999 March 2000 30-Aug-2002 Version STMicroelectronics Logo Programming Flowchart clarified (Figure Document Template changed Package mechanical data clarified PDIP28 (Table 14), PLCC32 (Table Figure TSOP28 (Table Figure Revision Detail 10/15 M27W256 Table FDIP28W Ceramic Frit-seal DIP, with window, Package Mechanical Data Symbol 7.11 2.54 14.99 33.02 15.24 1.45 0.51 3.91 3.89 0.41 0.23 36.50 13.06 16.18 3.18 1.52 millimeters 5.72 1.40 4.57 4.50 0.56 0.30 37.34 13.36 18.03 4.10 2.49 0.280 0.100 0.590 1.300 0.600 0.057 0.020 0.154 0.153 0.016 0.009 1.437 0.514 0.637 0.125 0.060 inches 0.225 0.055 0.180 0.177 0.022 0.012 1.470 0.526 0.710 0.161 0.098 Figure FDIP28W Ceramic Frit-seal DIP, with window, Package Outline FDIPW-a Drawing scale. 11/15 M27W256 Table PDIP28 Plastic DIP, mils width, Package Mechanical Data millimeters Symbol 3.300 1.78 2.08 36.830 33.020 15.240 13.720 2.540 15.000 12.700 14.800 15.200 14.480 15.200 16.680 0.1299 0.070 0.082 4.445 0.630 3.810 0.450 1.270 0.230 36.580 0.310 37.080 1.4500 1.3000 0.6000 0.5402 0.1000 0.5906 0.5000 0.5827 0.5984 0.5701 0.5984 0.6567 3.050 4.570 0.1750 0.0248 0.1500 0.0177 0.0500 0.0091 1.4402 0.0122 1.4598 0.1201 0.1799 inche Figure PDIP28 Plastic DIP, mils width, Package Outline PDIP Drawing scale. 12/15 M27W256 Table PLCC32 lead Plastic Leaded Chip Carrier, Package Mechanical Data Symbol 0.89 10.16 1.27 7.62 12.32 11.35 4.78 14.86 13.89 6.05 0.00 millimeters 3.18 1.53 0.38 0.33 0.66 3.56 2.41 0.53 0.81 0.10 12.57 11.51 5.66 15.11 14.05 6.93 0.13 0.035 0.400 0.050 0.300 0.485 0.447 0.188 0.585 0.547 0.238 0.000 inches 0.125 0.060 0.015 0.013 0.026 0.140 0.095 0.021 0.032 0.004 0.495 0.453 0.223 0.595 0.553 0.273 0.005 Figure PLCC32 lead Plastic Leaded Chip Carrier, Package Outline 0.51 (.020) 1.14 (.045) PLCC-A Drawing scale. 13/15 M27W256 Table TSOP28 lead Plastic Thin Small Outline, 13.4 Package Mechanical Data millimeters Symbol 0.550 13.200 11.700 7.900 0.500 0.950 0.170 0.100 1.250 0.200 1.150 0.270 0.210 0.100 13.600 11.900 8.100 0.700 0.0217 0.5197 0.4606 0.3110 0.0197 0.0374 0.0067 0.0039 inches 0.0492 0.0079 0.0453 0.0106 0.0083 0.0039 0.5354 0.4685 0.3189 0.0276 Figure TSOP28 lead Plastic Thin Small Outline, 13.4 Package Outline TSOP-a Drawing scale 14/15 M27W256 Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. 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