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CHANNEL 250V 0.95 DPAK/IPAK PowerMESHMOSFET TYPE STD4NB25 VD
Top Searches for this datasheetSTD4NB25 CHANNEL 250V 0.95 DPAK/IPAK PowerMESHMOSFET TYPE STD4NB25 VDSS DS(on) TYPICAL RDS(on) 0.95 EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED VERY INTRINSIC CAPACITANCES GATE CHARGE MINIMIZED TROUGH-HOLE VERSION CONTACT SALES OFFICE IPAK TO-251 (Suffix "-1") DPAK TO-252 (Suffix "T4") DESCRIPTION Using latest high voltage MESH OVERLAYprocess, STMicroelectronics designed advanced family power MOSFETs with outstanding performances. patent pending strip layout coupled with Company's proprietary edge termination structure, gives lowest RDS(on) area, exceptional avalanche dv/dt capabilities unrivalled gate charge switching characteristics. APPLICATIONS SWITCH MODE POWER SUPPLIES (SMPS) DC-AC CONVERTERS WELDING EQUIPMENT UNINTERRUPTIBLE POWER SUPPLIES MOTOR DRIVE INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol VDGR dv/dt(1 Parameter Drain-source Voltage Drain- gate Voltage Gate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) Total Dissipation Derating Factor Peak Diode Recovery voltage slope Storage Temperature Max. Operating Junction Temperature Value 0.32 di/dt A/µs, V(BR)DSS, TJMAX Unit V/ns Pulse width limited safe operating area February 2000 STD4NB25 THERMAL DATA thj-case Rthj-amb thc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose 3.12 oC/W AVALANCHE CHARACTERISTICS Symbol Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbol V(BR)DSS Parameter Drain-source Breakdown Voltage Test Conditions Min. Typ. Max. Unit Zero Gate Voltage Rating Drain Current Rating Gate-body Leakage Current Symbol VGS(th) DS(on) D(on) Parameter Gate Threshold Voltage Static Drain-source Resistance Test Conditions Min. Typ. 0.95 Max. Unit State Drain Current ID(on) DS(on)max DYNAMIC Symbol Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions ID(on) DS(on)max Min. Typ. Max. Unit STD4NB25 ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbol d(on) Parameter Turn-on Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions Min. Typ. Max. Unit SWITCHING Symbol r(Vof Parameter Off-voltage Rise Time Fall Time Cross-over Time Test Conditions Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbol IRRM Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current di/dt A/µs Test Conditions Min. Typ. Max. Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area STD4NB25 TO-251 (IPAK) MECHANICAL DATA DIM. MIN. 0.45 0.48 15.9 0.95 16.3 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 0.64 TYP. MAX. 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033 0068771-E STD4NB25 TO-252 (DPAK) MECHANICAL DATA MIN. 0.03 0.64 0.45 0.48 9.35 0.023 TYP. MAX. 0.23 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 DIM. DETAIL DETAIL 0068772-B STD4NB25 Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specification mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo trademark STMicroelectronics 1999 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil China Finland France Germany Hong Kong India Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom U.S.A. http://www.st.com Other recent searchesX28C010 - X28C010 X28C010 Datasheet STS-48 - STS-48 STS-48 Datasheet STM-16 - STM-16 STM-16 Datasheet STS-192 - STS-192 STS-192 Datasheet STM-64 - STM-64 STM-64 Datasheet STS-12 - STS-12 STS-12 Datasheet STM-4 - STM-4 STM-4 Datasheet STS-48 - STS-48 STS-48 Datasheet STM-16 - STM-16 STM-16 Datasheet STS-192 - STS-192 STS-192 Datasheet STM64 - STM64 STM64 Datasheet P83CL883 - P83CL883 P83CL883 Datasheet P87CL883 - P87CL883 P87CL883 Datasheet P83CL884 - P83CL884 P83CL884 Datasheet P87CL884 - P87CL884 P87CL884 Datasheet DDR333 - DDR333 DDR333 Datasheet PC2700-Compliant - PC2700-Compliant PC2700-Compliant Datasheet CDC857-2 - CDC857-2 CDC857-2 Datasheet ARM7TDMI - ARM7TDMI ARM7TDMI Datasheet AOZ1016 - AOZ1016 AOZ1016 Datasheet 1N6140A - 1N6140A 1N6140A Datasheet
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