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CHANNEL 0.012 TO-252 STripFETPOWER MOSFET TYPE STD40NE03L VD
Top Searches for this datasheetSTD40NE03L CHANNEL 0.012 TO-252 STripFETPOWER MOSFET TYPE STD40NE03L VDSS DS(on) 0.016 TYPICAL RDS(on) 0.012 EXCEPTIONAL dv/dt CAPABILITY 100% AVALANCHE TESTED GATE CHARGE APPLICATION ORIENTED CHARACTERIZATION SUFFIX "T4" ORDERING TAPE REEL DESCRIPTION This Power MOSFET latest development STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows extremely high packing density on-resistance, rugged avalanche characteristics less critical alignment steps therefore remarkable manufacturing reproducibility. APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SOLENOID RELAY DRIVERS MOTOR CONTROL, AUDIO AMPLIFIERS DC-DC DC-AC CONVERTERS DPAK TO-252 (Suffix "T4") INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Drain-source Voltage Drain- gate Voltage Gate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) Total Dissipation Derating Factor dv/dt Peak Diode Recovery voltage slope Storage Temperature Max. Operating Junction Temperature Value 20** 20** 0.37 20A, di/dt A/µs, V(BR)DSS, TJMAX Unit V/ns Pulse width limited safe operating area (**) Value limited only package September 1999 STD40NE03L THERMAL DATA thj-pcb thj-amb thj-sink Thermal Resistance Junction-PC Board Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose AVALANCHE CHARACTERISTICS Symbol Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbol (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test Conditions Min. Typ. Max. Unit Zero Gate Voltage Rating Drain Current Rating Gate-body Leakage Current Symbol GS(th) DS(on) D(on) Parameter Gate Threshold Voltage Static Drain-source Resistance Test Conditions Min. Typ. 0.012 Max. 0.016 0.022 Unit State Drain Current D(on) DS(on)max DYNAMIC Symbol Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions D(on) DS(on)max Min. Typ. 2200 Max. Unit STD40NE03L ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbol d(on) Parameter Turn-on Delay Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions (Resistive Load, fig. Min. Typ. Max. Unit SWITCHING Symbol d(of tr(Voff) Parameter Turn-off Delay Time Fall Time Off-voltage Rise Time Fall Time Cross-over Time Test Conditions (Resistive Load, fig. (Inductive Load, fig. Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbol Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current di/dt A/µs (see test circuit, fig. Test Conditions Min. Typ. Max. Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area Safe Operating Area Thermal Impedance STD40NE03L Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance Gate Charge Gate-source Voltage Capacitance Variations STD40NE03L Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics STD40NE03L Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STD40NE03L TO-252 (DPAK) MECHANICAL DATA MIN. 0.03 0.64 0.45 0.48 9.35 0.023 TYP. MAX. 0.23 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 DIM. DETAIL DETAIL 0068772-B STD40NE03L Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specification mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo trademark STMicroelectronics 1999 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil China Finland France Germany Hong Kong India Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom U.S.A. http://www.st.com Other recent searchesTPS76815-EP - TPS76815-EP TPS76815-EP Datasheet TPS76818-EP - TPS76818-EP TPS76818-EP Datasheet TPS76825-EP - TPS76825-EP TPS76825-EP Datasheet TPS76827-EP - TPS76827-EP TPS76827-EP Datasheet TPS76828-EP - TPS76828-EP TPS76828-EP Datasheet TPS76830-EP - TPS76830-EP TPS76830-EP Datasheet TPS76833-EP - TPS76833-EP TPS76833-EP Datasheet TPS76850-EP - TPS76850-EP TPS76850-EP Datasheet TPS76801-EP - TPS76801-EP TPS76801-EP Datasheet TFM-5+ - TFM-5+ TFM-5+ Datasheet S75C6ZOV231RA460 - S75C6ZOV231RA460 S75C6ZOV231RA460 Datasheet MAX5487 - MAX5487 MAX5487 Datasheet MAX5488 - MAX5488 MAX5488 Datasheet MAX5489 - MAX5489 MAX5489 Datasheet KTA1807D - KTA1807D KTA1807D Datasheet KS8993 - KS8993 KS8993 Datasheet KS8995E - KS8995E KS8995E Datasheet KS8997 - KS8997 KS8997 Datasheet KS8999 - KS8999 KS8999 Datasheet FDC37C93X - FDC37C93X FDC37C93X Datasheet FDC37C93x - FDC37C93x FDC37C93x Datasheet DM74ALS5245 - DM74ALS5245 DM74ALS5245 Datasheet AP1701 - AP1701 AP1701 Datasheet AP1701 - AP1701 AP1701 Datasheet AP1702 - AP1702 AP1702 Datasheet AD9956 - AD9956 AD9956 Datasheet
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