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MC74HC138A identical pinout LS138. device inputs compatible with stand
Top Searches for this datasheetMC74HC138A 1-of-8 Decoder/ Demultiplexer MC74HC138A identical pinout LS138. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. HC138A decodes three-bit Address one-of-eight active-low outputs. This device features three Chip Select inputs, active-low active-high facilitate demultiplexing, cascading, chip-selecting functions. demultiplexing function accomplished using Address inputs select desired device output; Chip Selects used data input while other Chip Selects held their active states. Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs Equivalent Gates LOGIC DIAGRAM ADDRESS INPUTS ACTIVE-LOW OUTPUTS Assembly Location Wafer Year Work Week http://onsemi.com MARKING DIAGRAMS PDIP-16 SUFFIX CASE MC74HC138AN AWLYYWW SO-16 SUFFIX CASE 751B HC138A AWLYWW TSSOP-16 SUFFIX CASE 948F 138A ALYW ASSIGNMENT CHIP- SELECT INPUTS FUNCTION TABLE Inputs Outputs CS1CS2 ORDERING INFORMATION Device MC74HC138AN MC74HC138AD MC74HC138ADR2 MC74HC138ADT MC74HC138ADTR2 Package PDIP-16 SOIC-16 SOIC-16 TSSOP-16 TSSOP-16 Shipping 2000 Rail 2500 Reel Rail 2500 Reel high level (steady state); level (steady state); don't care Semiconductor Components Industries, LLC, 2000 March, 2000 Rev. Publication Order Number: MC74HC138A/D MC74HC138A MAXIMUM RATINGS* Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package) *Maximum Ratings those values beyond which damage device occur. Functional operation should restricted Recommended Operating Conditions. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: .W/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameter Unit Supply Voltage (Referenced GND) Vin, Vout Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Test Conditions -55_C 25_C 3.15 1.35 85_C 125_C 3.15 1.35 3.15 1.35 Unit Minimum High-Level Input Voltage Vout |Iout| Maximum Low-Level Input Voltage Vout |Iout| Minimum High-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 http://onsemi.com MC74HC138A ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Test Conditions -55_C 25_C 85_C 125_C 0.33 0.33 0.33 0.40 0.40 0.40 Unit Maximum Low-Level Output Voltage |Iout| |Iout| |Iout| |Iout| Iout 0.26 0.26 0.26 Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Guaranteed Limit Symbol tPLH, tPHL Parameter -55_C 25_C ELECTRICAL CHARACTERISTICS Input 85_C 125_C Unit Maximum Propagation Delay, Input Output (Figures tPLH, tPHL Maximum Propagation Delay, Output (Figures tPLH, tPHL Maximum Propagation Delay, Output (Figures tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTE: propagation delays with loads other than information typical parametric values, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Package)* Used determine no-load dynamic power consumption: load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). http://onsemi.com MC74HC138A SWITCHING WAVEFORMS VALID INPUT tPLH OUTPUT tPHL OUTPUT tTHL VALID INPUT tPHL tTLH tPLH Figure Figure TEST POINT INPUT CS2, tPHL OUTPUT tTHL tTLH *Includes probe capacitance tPLH DEVICE UNDER TEST OUTPUT Figure Figure Test Circuit DESCRIPTIONS ADDRESS INPUTS (Pins Address inputs. other combination CS1, CS2, CS3, outputs logic high. OUTPUTS (Pins Address inputs. These inputs, when chip selected, determine which eight outputs active-low. CONTROL INPUTS CS1, CS2, (Pins Chip select inputs. high level CS2, level, chip selected outputs follow Active-low Decoded outputs. These outputs assume level when addressed chip selected. These outputs remain high when addressed chip selected. http://onsemi.com MC74HC138A EXPANDED LOGIC DIAGRAM http://onsemi.com MC74HC138A PACKAGE DIMENSIONS PDIP-16 SUFFIX CASE 648-08 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES MILLIMETERS 0.740 0.770 18.80 19.55 0.250 0.270 6.85 6.35 0.145 0.175 4.44 3.69 0.015 0.021 0.53 0.39 0.040 0.070 1.77 1.02 0.100 2.54 0.050 1.27 0.008 0.015 0.38 0.21 0.110 0.130 3.30 2.80 0.295 0.305 7.74 7.50 0.020 0.040 1.01 0.51 0.25 (0.010) SEATING PLANE SOIC-16 SUFFIX CASE 751B-05 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 0.25 0.19 0.25 0.10 6.20 5.80 0.50 0.25 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019 0.25 (0.010) SEATING PLANE 0.25 (0.010) http://onsemi.com MC74HC138A PACKAGE DIMENSIONS TSSOP-16 SUFFIX CASE 948F-01 ISSUE 0.10 (0.004) 0.15 (0.006) IDENT. SECTION 0.25 (0.010) 0.15 (0.006) DETAIL NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 0.10 (0.004) SEATING PLANE DETAIL http://onsemi.com MC74HC138A Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. 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