Product Specification Sep. 2003 Supersedes Date Jan. 2003 Chip Re

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Product Specification Sep. 2003 Supersedes Date Jan. 2003 Chip Re

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Product Specification Sep. 2003 Supersedes Date Jan. 2003
Chip Resistor Surface Mount
SERIES
SCOPE This specification describes series chip resistors made thick film process. ORDERING INFORMATION Part number identified series, size, tolerance, packing style, temperature coefficient, special type resistance value.
XXXX XXXX
MARKING
RL0805 RL1206 RL1210 RL2010 RL2512
SIZE
ynsc005
Fig. Value=20m
Either tolerance digits Uses Standard resistance marking signifies decimal place
RL0603- R100mR E-24 SERIES
TOLERANCE
ynsc006
Fig. Value=220m
10mX, 20mX, 30mX, 40mX, 50mX, 60mX digits Uses Standard resistance marking signifies decimal place
PACKAGING TYPE
Paper taping reel Embossed Plastic Tape Reel Bulk case
RL0402 STYLE E-24 SERIES R<100mR RL0603
ynsc007
marking
Fig.
TEMPERATURE CHARACTERISTIC RESISTANCE
Base spec
CONSTRUCTION resistors constructed high-grade ceramic body. Internal metal electrodes added each connected resistive paste. composition paste adjusted give approximate required resistance laser cutting this resistive layer that achieves tolerance trims value. resistive layer covered with protective coat printed with resistance value. Finally, external terminations added. fig.
protective coat
handbook, columns
SPECIAL TYPE
inch dia. Reel inch dia. Reel inch dia. Reel
RESISTANCE VALUE:
R056, Remark: (E48/96 request)
resistor layer inner electrode termination ceramic substrate
MBE940_a
Fig. Chip resistor construction
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Chip Resistor Surface Mount
SERIES
DIMENSION
dimension Table
protective coat
Table TYPE (mm) (mm) (mm) (mm) (mm) RL0402 1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10 RL0603 1.60±0.10 0.80±0.10 0.45±0.10 0.25±0.15 0.25±0.15 RL0805 2.00±0.10 1.25±0.10 0.50±0.10 0.35±0.20 0.35±0.20 RL1206 3.10±0.10 1.60±0.10 0.55±0.10 0.45±0.20 0.40±0.20 RL1210 3.10±0.10 2.60±0.15 0.55±0.10 0.50±0.20 0.50±0.20 RL2010 5.00±0.10 2.50±0.15 0.55±0.10 0.60±0.20 0.50±0.20 RL2512 6.35±0.10 3.20±0.15 0.55±0.10 0.60±0.20 0.50±0.20
MBE940_a
Fig. Chip resistor dimension
POWER RATING RATED POWER 70°C: RL0402=1/16W, RL0603=1/10W, RL0805=1/8W, RL1206=1/4W, RL1210=1/2W, RL2010=3/4W, RL2512=1W RATED VOLTAGE:
ndbook, halfpage
MLB206
(%Prated
(rms) continuous working voltage corresponding rated power determined following formula: V=(P Where V=Continuous rated (rms) working voltage P=Rated power R=Resistance value
Tamb
Fig. Maximum dissipation (Pmax) percentage rated power function operating ambient temperature (Tamb)
ELECTRICAL CHARACTERISTICS
Table CHARACTERISTICS RL0402 RL0603 RL0805 RL1206 RL1210 RL2010 RL2512 OPERATING TEMPERATURE RANGE
-55°C +125°C -55°C +125°C -55°C +125°C -55°C +125°C -55°C +125°C -55°C +125°C -55°C +125°C
DERATED LOAD
+125°C +125°C +125°C +125°C +125°C +125°C +125°C
RESISTANCE RANGE
100mRn<1 10mRn<1 10mRn<1 10mRn<1 10mRn<1 10mRn<1 10mRn<1
TEMPERATURE COEFFICIENT
10mXRn<100mX -±1,500ppm/°C ±1,500ppm/°C ±1,500ppm/°C ±1,500ppm/°C ±1,500ppm/°C ±1,500ppm/°C 100mXRn<1X ±800ppm/°C ±600ppm/°C ±600ppm/°C ±600ppm/°C ±600ppm/°C ±600ppm/°C ±600ppm/°C
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Chip Resistor Surface Mount
SERIES
TAPING REEL
Table
DIMENSION PACKAGIN TAPE (mm) (mm) (mm) (mm) (mm)
RL0402
Paper
RL0603
Paper
RL0805
Paper
RL1206
Paper
RL1210
RL2010
12mm
RL2512
12mm
dimension Table
Paper Embossed Embossed
180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 180+0/-3 60+1/-0 60+1/-0 60+1/-0 60+1/-0 60+1/-0 60+1/-0 60+1/-0 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2
MSA284_a
9.0±0.3 11.4±1
9.0±0.3 11.4±1
9.0±0.3 11.4±1
9.0±0.3 11.4±1
9.0±0.3 13.0±0.3 13.0±0.3 11.4±1 15.4±1 15.4±1
Fig. Reel dimension
PAPER TAPE SPECIFICATION
Table
DIMENSION (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm)
RL0402
0.65±0.1 1.15±0.1 8.0±0.2 1.75±0.1 3.5±0.05 4.0±0.1 2.0±0.05
RL0603
1.1±0.1 1.90±0.1 8.0±0.2 1.75±0.1 3.5±0.05 4.0±0.1 4.0±0.05
RL0805
1.65±0.1 2.40±0.1 8.0±0.2 1.75±0.1 3.5±0.05 4.0±0.1 4.0±0.05
RL1206
1.90±0.1 3.50±0.1 8.0±0.2 1.75±0.1 3.5±0.05 4.0±0.1 4.0±0.05
RL1210
2.80±0.1 3.50±0.1 8.0±0.2 1.75±0.1 3.5±0.05 4.0±0.1 4.0±0.05
dimension Table
cover tape
MBD123_a
2.0±0.05 2.0±0.05 2.0±0.05 2.0±0.05 2.0±0.05 (mm) 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 1.5+0.1/-0 (mm) 0.53±0.10 0.70±0.10 0.85±0.10 0.85±0.10 0.85±0.10
Fig. Paper tape dimension
EMBOSSED TAPE SPECIFICATION
Table
DIMENSION (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm)
RL2010
2.80±0.2 5.4±0.2 12.0±0.3 1.75±0.1 5.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 1.5+0.1/-0 1.0±0.1
RL2512
3.5±0.2 6.7±0.2 12±0.3 1.75±0.1 5.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 1.5+0.1/-0 1.0±0.1
cover tape
MBG516_a
direction unreeling
1.5+0.25/-0 1.5+0.25/-0
Fig. Embossed tape dimension
dimension Table
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Chip Resistor Surface Mount
SERIES
PACKING METHOD LEADER/TRAILER TAPE SPECIFICATION
leader trailer
empty compartments with cover tape (min. cover tape only
BULK CASSETTE
handbook, columns
slider
shutter coupled portion
trailer (max.
leader
CCB325
MGB377
Fig. Leader trailer tape dimension
Fig.11
Bulk case outline
Table Packing style packaging quantity PACKING STYLE Paper Taping Reel REEL DIMENSION
(178 (254 (330 (178
RL0402
10,000 20,000 50,000 -50,000
RL0603
5,000 10,000 20,000 -25,000
RL0805
5,000 10,000 20,000 -10,000
RL1206
5,000 10,000 20,000
RL1210
5,000 10,000 20,000
RL2010
-4,000
RL2512
-4,000
Embossed Taping Reel Bulk Cassette
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Chip Resistor Surface Mount
SERIES
TYPE Temperature Coefficient Resistance (T.C.R.)
TEST METHOD
Measure resistance +25°C specified room temperature then measure -55°C +125°C respectively Determine temperature coefficient resistance from following formula:
ACCEPTANCE STANDARD Formula
R2-R1 T.C.R.= (ppm/°C) R1(t2-t1) Where t1=+25°C specified room temperature t2=-55°C +125°C test temperature R1=resistance reference temperature ohms R2=resistance test temperature ohms Refer table
Thermal Shock
-55±3°C minutes +125±2°C minutes cycle. After cycles, specimen shall stabilized room temperature. Measure resistance determine R/R(%) after more hour.
±1.0%
Temperature Operation
Place specimen test chamber maintained (+0/-5)°C. After hour stabilization this temperature, full rated working voltage shall applied (+5/-0) minutes. Have15 (+5/-0 minutes after remove voltage, specimen shall removed from chamber stabilized room temperature hrs. Measure resistance determine R/R(%).
±1.0% mechanical damage
Short Time Overload
Apply times rated voltage exceeding maximum overload voltage seconds. Have specimen stabilized room temperature minutes minimum. Measure resistance determine R/R(%).
±1.0% tolerance ±2.0% tolerance evidence mechanical damage
Insulation Resistance
Place specimen apply rated continues overload voltage (R.C.O.V) minute. Measure insulation resistance.
10,000M
Dielectric Withstand Voltage Resistance Soldering Heat
Place specimen apply specified value continuous overload voltage minute.
Breakdown voltage> specification without open/short ±1.0% visible damage
Immerse specimen solder 260±5°C. 10±1 seconds. Have specimen stabilized room temperature minutes minimum. Measure resistance determine R/R(%).
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Chip Resistor Surface Mount
SERIES
TYPE Moisture Resistance
TEST METHOD
Place specimen test chamber subject damp heat cycles. Each which consists steps figure total length test 1,000 hours. Have specimen stabilized room temperature hours after testing. Measure resistance determine R/R(%).
ACCEPTANCE STANDARD
±2.0% visible damage
Life
Place specimen oven 70±2°C. Apply rated voltage specimen hours hour cycle. total length test 1,000 hours. Have specimen stabilized room temperature hour minimum after testing. Measure R/R(%).
±2.0% tolerance ±3.0% tolerance
Solderability
Immerse specimen solder 235±5°C sec.
least solder coverage termination
temperature [°C] initial drying hours
rate change temperature unspecified, however, specimens shall subjected radiant heating from chamber conditioning processes (+18 (-3.6 initial measurements specified circulation conditioning shall minimum cubic rate minute equivalent times volume chamber
final cycle; measurements specified
temperature tolerance (±3.6 unless otherwise specified STEP1 prior first cycle only
HBK073
optional sub-cycle specified (2.3); sub-cycle performed during first cycles; humidity uncontrolled during sub-cycle
voltage applied specified
STEP2
STEP3
STEP4
STEP5
STEP6
STEP7
cycle hours; repeat specified time
Fig. Conditions change temperature
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Product Specification Sep. 2003 Supersedes Date Jan. 2003 Chip Re

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