passion performance. Custom Mixed-Signal ASICs connect real

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passion performance. Custom Mixed-Signal ASICs connect real

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From Aeroflex Colorado Springs Over years experience Specializing acquisition conversion weak signals from noisy environments True Mixed-Signal System-on-Chip solutions with integrated analog functions Your full-service Mixed-Signal ASIC supplier
passion performance.
Custom Mixed-Signal ASICs
connect real world digital world
Aeroflex Colorado Springs earned reputation excellence, based design methodology, technical expertise, rigorous quality system, competitive prices, on-time delivery. Mixed-Signal design experts have delivered more than complex high-performance designs over customers. Aeroflex fab-independent semiconductor supplier with flexibility choose among several worldclass processes that offer highest performance lowest cost your design. exploit advantages third-party wafer fabrication have even installed process modules into commercial foundries. boast high rate first-pass design success.
AEROFLEX MIXED-SIGNAL SPECIALTIES
Sensitivity Capable processing very small signals <-100dBm High-resolution data conversion bits noise, high dynamic range converters >-103dbSNR power <2mW/channel Excellent isolation 10dB Density
Extreme integration: channels single chip System-on-Chip includes control, signal processing, programmability, power management, embedded processors, memory Security
processing encryption on-chip Sensitive data stays on-chip until encrypted
Reliability Extensive military space experience applicable industrial automotive markets Extended temperature range radiation tolerant options Flexibility Broad design expertise Fabless model Device programmability sales board-level solutions Creativity
offer innovative, value-added solutions
WHAT
One-stop shopping design layout performed in-house Flexible design interface Fabless model with world-class foundry partners Mixed-Signal CMOS, BiCMOS high-voltage, non-volatile CMOS 0.18µm QML-V/QML-Q, AS9000/ISO-9001 certified In-house test assembly fast prototyping Class assembly clean room Test floor with digital, memory Mixed-Signal automated test equipment Fully-equipped on-site failure analysis World-class production test assembly partners Leading-edge packaging technology High-volume pricing
SCREENING NT-O F-SALE
INTELLECTUAL PROPERTY CAPABILITIES
APPLICATION
Signal processing
MART SENSORS PROCESS OTATI DECODERS ETRY AUTO OTIVE CATI AUTO MATE
AEROFLEX SOLUTION
Switched capacitor filters, custom DSP, Opamps, instrumentation amplifiers, peak detectors, rectifiers Sigma-Delta, Flash, Pipeline, ADCs, Sigma-Delta, R2R, multiplying segmented DACs; speeds >100MHz; resolution >20bits; channels with 10dB isolation Switching regulators, LDOs, bandgap references, negative supply generation (e.g. ±5V), power-on reset, bias current generators crystal oscillators, phase-locked loops (PLL), delay-locked loops (DLL), clock trees RFID ARM9, ARM7, 8051, 68HC1 watchdog circuits Flash >40MHz, EEPROM, SRAM, mutli-port RAM, FIFO, USB2.0, USB1.1, IEEE 394, Serial (I2C, SPI, TWI), PCI, LVDS, RS-232 (±5V, 10V), RS-485, UARTs 1.8V circuits, power design techniques Most circuits available 100-300krads(Si)
Data conversion
Power management
Clock generation
Self-powered circuits Embedded control Memory Interface
Portable design RadHard circuits
COMPLETE RELIABILITY TEST CAPABILITY
Design Examples
HTOL/LTOL (JA108) (JA108) (JA101, M1004) Temperature cycling Burn-in (static dynamic) life test Latch-up JESD-78
EXTENSIVE FAILURE ANALYSIS FACILITY
Electrical fault isolation: Liquid crystal, photoemission, dynamic voltage contrast Structural analysis: Micro-sectioning 0.2µm; imaging angstroms; selective deprocessing (e.g. RIE, chemical, plasma) Package assembly analysis: X-radiography; X-ray fluorescence; X-ray elemental defect imaging Elemental composition: Energy dispersive X-ray analysis; imaging, elemental, alloy composition; dopant concentration Deprocess/reverse engineering: Die/component construction; metal step coverage; competitive analysis Process design verification: Critical design measurement ±0.2% (<1µm structures); alignment Destructive physical analysis: Meets EIA-469-C MIL-STD-883 Method 5009.
256-CHANNEL MEDICAL IMAGING DEVICE
Concurrent data conversion channels 20-bit output 7ENOB Data filtering regulation Custom package development
UNIVERSAL INTERFACE DEVICE
System-on-chip supporting RS-232, RS-485, USB1.1, OCIA keyboard wedge Embedded 8051 processor Voltage regulators FLASH memory blocks blocks Bandgap reference Clock multiplier oscillator over conditions)
Aeroflex Colorado Springs SITE www.aeroflex.com/mixedsignal info-ams@aeroflex.com TELEPHONE 800-645-8862
Part 2006 passion performance defined three attributes represented these three icons: solution-minded, performance-driven customer-focused.

passion performance. Custom Mixed-Signal ASICs connect real

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