Complete Power Supply Cellular Handsets Three Low-Dropout Regulators (

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TPS9111 CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY
Complete Power Supply Cellular Handsets Three Low-Dropout Regulators (LDOs) with 100-mV Dropout Less Than Supply Current Shutdown 250-ms Microprocessor Reset Output 10-mA Charge-Pump Driver Configurable Inverted Doubled Output Separate Enables LDOs Charge Pump 1.185-V Reference 28-Pin TSSOP Package
PACKAGE (TOP VIEW)
RESET GND_CP EN_CP EN_A
ON_REM EN_B
description
TPS9111 incorporates complete power supply system cellular subscriber terminal that uses battery packs with three four NiMH/NiCd cells single lithium-ion cell. device includes three low-dropout linear regulators rated each, charge-pump driver, logic that includes 250-ms reset, on/off control, processor interface. Regulators charge-pump driver have separate enables allowing circuitry powered down necessary conserve battery power. TPS9111 operates over free-air temperature range -40°C 85°C supplied 28-pin TSSOP package.
AVAILABLE OPTIONS 40°C 85°C PACKAGED DEVICE TSSOP (PW) TPS9111IPWLE CHIP FORM TPS9111Y
package only available left-end taped reeled.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
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functional block diagram
ChargePump Driver GND_CP EN_CP
Voltage Reference Regulator
UVLO EN_A
Regulator
EN_B
Regulator
Reset Generator RESET
ON_REM UVLO Undervoltage lockout Overtemperature protection
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TPS9111Y chip information
These chips, when properly assembled, display characteristics similar those TPS9111. Thermal compression ultrasonic bonding used doped aluminum bonding pads. chips mounted with conductive epoxy gold-silicon preform.
BONDING ASSIGNMENTS
CHIP THICKNESS: TYPICAL BONDING PADS: MINIMUM 150°C
TOLERANCES 10%. DIMENSIONS MILS.
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Terminal Functions
TERMINAL NAME EN_A EN_B EN_CP GND_CP ON_REM RESET Regulator filter capacitor connection Regulator enable input. logic EN_A turns regulator Program provides programming input regulator Regulator output voltage Regulator filter capacitor connection Regulator enable input. logic EN_B turns regulator Program provides programming input regulator Regulator output voltage Regulator filter capacitor connection Program provides voltage programming input regulator Regulator output voltage Ground. terminals should externally connected ground ensure proper functionality. 1.185-V reference output. Decouple with external 0.01-µF 0.1-µF capacitor ground. Supply voltage input. terminals connected internally must externally connected ensure proper functionality. Charge pump driver output Charge pump driver enable input. Logic EN_CP turns charge pump. Charge pump driver ground Charge pump driver supply voltage Enable signal input/output. logic enables TPS9111. Off-signal input. logic turns TPS9111. On-signal output. logical inversion signal. logic enables TPS9111. Remote logic high ON_REM enables TPS9111. Microprocessor reset output. RESET logic power-up. DESCRIPTION
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detailed description
voltage reference regulators reset generator utilize internal 1.185-V band-gap voltage reference. reference also buffered brought external use; source maximum 0.01-µF 0.1-µF capacitor must connected between ground. regulators 9111 includes three low-dropout regulators, implemented with PMOS series-pass transistors, with quiescent supply currents Each regulators supply continuous output current. PMOS series-pass transistor achieves dropout voltage maximum-rated output current. Each regulator output voltage independently programmed either using programming control input (Px). logic sets output voltage regulator logic high sets Each contains current limit circuit. When current demand regulator exceeds current limit, output voltage drops proportion excess current. When excess load current removed, output voltage returns regulation. Exceeding current limit disable TPS9111. enough current demand placed output voltage drops below reset threshold voltage causing RESET low, effectively unlatching enable. intended primary supply voltage microprocessor other system logic functions. power low-noise analog circuits and/or implement system power management. enable terminals EN_A EN_B utilized power down circuitry when required. EN_A EN_B TTL-compatible inputs with 10-µA active current-source pullups. logic enables respective regulator while logic high pulls regulator output voltage ground reduces regulator quiescent current leakage levels. Stability LDOs ensured addition compensation terminals which connect output regulator through internal resistor. This compensation scheme allows capacitors with equivalent series resistance (ESR) eliminating need expensive, low-ESR capacitors. reset generator RESET microprocessor reset signal that goes logic power-up, whenever drops below 2.93 (2.6 applications), remains that state after exceeds RESET threshold (see Figure open-drain output 30-µA pullup that eliminates need external pullup resistor still allows connected with other open-drain open-collector signals. RESET valid supply voltages OFF, ON_REM functions input intended main enable TPS9111 should connected ground through pushbutton switch. Once switch pressed, internal logic pulls low. designed sink used pulldown enable other functions TPS9111 other system circuitry. When pulled low, TPS9111 checks make sure supply voltage above undervoltage lockout (UVLO) threshold voltage temperature below 160°C. both these conditions met, reference circuitry, regulator reset generator, other support circuitry enabled. When RESET goes high, system respond with logic high OFF, which latches TPS9111 pushbutton then released. TPS9111 disabled similar manner. pushbutton pressed while TPS9111 enabled, responds with logic high. Once this logic high detected, system respond with logic OFF, disabling TPS9111 reducing supply currents (see Figure
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OFF, ON_REM functions (continued) ON_REM used same manner enabling disabling TPS9111. signal provided system interface increase flexibility system. also used input wired-OR open collector/drain enable TPS9111; however, does produce logic signal and, therefore, cannot used disable sequence described above. recommended that used primary enable signal TPS9111.
Enable Sequence Disable Sequence
must held until system responds with high OFF.
pressed turn system (phone).
Once goes low, status UVLO checked.
UVLO valid, other functions enabled. after rises above reset threshold voltage, RESET goes high. system respond with high OFF.
RESET
Once RESET high, enable latched System detects high signal responds with signal OFF.
Figure Recommended Enable Disable Sequence undervoltage lockout (UVLO) UVLO prevents operation functions TPS9111 until supply voltage exceeds threshold voltage, eliminating abnormal power-up conditions internally externally, providing orderly turn-on. overtemperature shutdown When temperature exceeds 160°C, thermal protection circuit shuts TPS9111. When temperature drops below 150°C, device restarted with input. charge pump driver unregulated inverting doubler charge pump implemented connecting network capacitors diodes inverting configuration, charge pump power liquid-crystal display (LCD) provide gate bias GaAs power amplifier. supply flash-memory programming powering subscriber identity module (SIM) European applications achieved using doubler configuration external LDO. logic-low input charge-pump enable, EN_CP, turns oscillator driver; logic high turns them off. EN_CP input disabled when RESET asserted. EN_CP 10-µA internal pullup.
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DISSIPATION RATING TABLE Free-Air Temperature PACKAGE 25°C POWER RATING DERATING FACTOR ABOVE 25°C mW/°C 70°C POWER RATING 85°C POWER RATING
DISSIPATION RATING TABLE Case Temperature PACKAGE 25°C POWER RATING 4025 DERATING FACTOR ABOVE 25°C 32.2 mW/°C 70°C POWER RATING 2576 85°C POWER RATING 2093
MAXIMUM CONTINUOUS POWER DISSIPATION FREE-AIR TEMPERATURE
Maximum Continuous Power Dissipation 1000 Maximum Continuous Power Dissipation
MAXIMUM CONTINUOUS POWER DISSIPATION CASE TEMPERATURE
5000
4000
178°C/W
3000 57°C/W 2000
1000
Free-Air Temperature
Case Temperature
Figure
Figure
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC, Input voltage range Input voltage range EN_A, EN_B, ON_REM, EN_CP Continuous total power dissipation dissipation rating tables Peak output current Internally limited Operating free-air temperature range, 40°C 85°C Storage temperature range, Tstg 65°C 150°C Lead Temperature 1,6mm (1/16 inch) from case seconds 260°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. voltages with respect GND.
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recommended operating conditions
Supply voltage, VCC, Input voltage, Input voltage EN_A, EN_B, ON_REM, EN_CP Reference output current Continuous regulator output current Operating free-air temperature UNIT
electrical characteristics over recommended operating free-air temperature range, IO(Vx) open, ON_REM (unless otherwise noted)
voltage reference (REF)
PARAMETER Output voltage TEST CONDITIONS 25°C, 1.161 1.185 1.209 UNIT
Pulse-testing techniques used maintain virtual junction temperature close possible ambient temperature; thermal effect must taken into account separately.
regulators
PARAMETER TEST CONDITIONS 25°C IO(Vx) Output voltage (Vx) VCC, VCC, Dropout voltage Load regulation Line regulation Ripple rejection 25°C IO(Vx) 3.25 2.95 3.35 3.05 3.10 UNIT
IO(Vx) IO(Vx) IO(Vx)
Quiescent current (each regulator) Pulse-testing techniques used maintain virtual junction temperature close possible ambient temperature; thermal effect must taken into account separately.
charge pump driver
PARAMETER Frequency Duty cycle Output resistance UNIT
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RESET
PARAMETER Input threshold voltage Input threshold voltage Timeout delay RESET High-level output voltage Low-level output voltage TEST CONDITIONS voltage decreasing voltage decreasing, Figure 2.871 2.548 2.93 2.989 2.652 UNIT
Hysteresis Pulse-testing techniques used maintain virtual junction temperature close possible ambient temperature; thermal effect must taken into account separately.
logic inputs EN_A, EN_B
PARAMETER High-level input voltage Low-level input voltage Input current UNIT
logic inputs OFF, ON_REM
PARAMETER High-level input voltage Low-level input voltage Input current UNIT
logic inputs
PARAMETER High-level input voltage Low-level input voltage Input current High level voltages dependent (see Figure 17). UNIT
logic inputs
PARAMETER High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage High low-level input voltages dependent (see Figure 18). TEST CONDITIONS UNIT
logic outputs
PARAMETER High-level output voltage Low-level output voltage TEST CONDITIONS 1-mA source current 1-mA sink current UNIT
overtemperature shutdown
PARAMETER Temperature threshold Temperature hysteresis UNIT
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undervoltage lockout (UVLO)
PARAMETER Threshold voltage Hysteresis TEST CONDITIONS increasing 1.80 2.52 UNIT
supply current
PARAMETER Shutdown Operating TEST CONDITIONS EN_CP UNIT
TPS9111Y electrical characteristics, 25°C, IO(Vx) open, ON_REM (unless otherwise noted)
voltage reference (REF)
PARAMETER TEST CONDITIONS UNIT Output voltage 1.185 Pulse-testing techniques used maintain virtual junction temperature close possible ambient temperature; thermal effect must taken into account separately.
regulators
PARAMETER Output voltage (Vx) Dropout voltage Load regulation Line regulation Ripple rejection Quiescent current (each regulator) TEST CONDITIONS IO(Vx) IO(Vx) IO(Vx) 2.95 3.05 UNIT
Pulse-testing techniques used maintain virtual junction temperature close possible ambient temperature; thermal effect must taken into account separately.
charge-pump driver
PARAMETER Frequency Duty cycle Output resistance UNIT
RESET
PARAMETER Threshold voltage Delay TEST CONDITIONS voltage decreasing voltage decreasing, Figure 2.93 UNIT
Hysteresis Pulse-testing techniques used maintain virtual junction temperature close possible ambient temperature; thermal effect must taken into account separately.
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PARAMETER MEASUREMENT INFORMATION
Voltage Reference
Charge-Pump Driver
Regulator Regulator Regulator
Reset Generator
RESET
ON_REM
Figure Test Circuit
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PARAMETER MEASUREMENT INFORMATION
VIT+
RESET
RESET Timeout Delay
Figure RESET Timing Diagram
Enable Input Voltage Enable Output Voltage 25°C
Time
Figure LDO-Regulator Output-Voltage Rise Time Fall Time
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PARAMETER MEASUREMENT INFORMATION
Regulator Output Current
Output Voltage Output Voltage Time 25°C
Figure LDO-Regulator Load Transient, Pulsed Load
Supply Voltage
25°C Time
Figure LDO-Regulator Line Transient
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TYPICAL CHARACTERISTICS Table Graphs
FIGURE Quiescent current Dropout voltage Change output voltage Output voltage, Change output voltage Change output voltage Shutdown current Input threshold voltage, Input threshold voltage, Input threshold voltage, ON_REM Ripple rejection Output spectral noise density Change frequency, Output resistance into Output resistance Supply voltage Output current Junction temperature Junction temperature Supply voltage Supply voltage Output current Supply voltage Supply voltage Supply voltage Supply voltage Frequency Frequency Junction temperature Supply voltage Supply voltage
TYPICAL CHARACTERISTICS
REGULATORS
QUIESENT CURRENT SUPPLY VOLTAGE
Quiesent Current Dropout Voltage 25°C
DROPOUT VOLTAGE OUTPUT CURRENT
85°C -40°C 25°C
Supply Voltage
Output Current
Figure
Figure
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TYPICAL CHARACTERISTICS
REGULATORS REGULATORS
DROPOUT VOLTAGE JUNCTION TEMPERATURE
Dropout Voltage Change Output Voltage
CHANGE OUTPUT VOLTAGE JUNCTION TEMPERATURE
Temperature
Temperature
Figure
REGULATOR
Figure
OUTPUT VOLTAGE SUPPLY VOLTAGE
Output Voltage, Change Output Voltage 25°C Supply Voltage 25°C
REGULATORS
LINE REGULATION
Supply Voltage
Figure
Figure
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TYPICAL CHARACTERISTICS
SHUTDOWN CURRENT SUPPLY VOLTAGE
25°C Shutdown Current Output Current 85°C 25°C 40°C Supply Voltage
REGULATORS
LOAD REGULATION
Change Output Voltage
Figure
INPUT THRESHOLD VOLTAGE, SUPPLY VOLTAGE
Open ON_REM -40°C
Figure
INPUT THRESHOLD VOLTAGE, SUPPLY VOLTAGE
Open ON_REM
Input Threshold Voltage,
25°C 85°C
Input Threshold Voltage,
Supply Voltage
Supply Voltage
Figure
Figure
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TYPICAL CHARACTERISTICS
REGULATORS
INPUT THRESHOLD VOLTAGE, ON_REM SUPPLY VOLTAGE
Input Threshold Voltage, ON_REM Open Open Ripple Rejection
RIPPLE REJECTION FREQUENCY
25°C
Supply Voltage
0.01
1000
Frequency
Figure
REGULATOR
Figure
OUTPUT SPECTRAL NOISE DENSITY FREQUENCY
Output Spectral Noise Density 25°C
CHANGE FREQUENCY, JUNCTION TEMPERATURE
Change Frequency,
Frequency
1000
10000
Temperature
Figure
Figure
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TYPICAL CHARACTERISTICS
OUTPUT RESISTANCE, SUPPLY VOLTAGE
Current Into Output Resistance, Output Resistance, Current
OUTPUT RESISTANCE, SUPPLY VOLTAGE
85°C 25°C
85°C 25°C -40°C
-40°C
VCC(VCP) Supply Voltage
VCC(VCP) Supply Voltage
Figure
Figure
THERMAL INFORMATION
Using thermal resistance, junction-to-ambient (RJA), maximum power dissipation calculated with equation: J(max) D(max)
Where TJ(max) maximum allowable junction temperature 125°C. This limit should then applied internal power dissipation TPS9111. equation calculating total internal power dissipation TPS9111 D(max)
Many system-dependent issues such thermal coupling, airflow, added heat sinks convection surfaces, presence other heat-generating components affect power dissipation limits given component. Three basic approaches enhancing thermal performance are:
Improving power dissipation capability design Improving thermal coupling component Introducing airflow system
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APPLICATION INFORMATION
BATTERY Regulator 7-13 Analog Section Voltage Reference Charge Pump Section
Regulator
7-13
Regulator Reset Generator
7-13 RESET Processor Logic Section
ON_REM
Figure Typical Application
LDOs (VL, output capacitors
10-µF capacitor must tied (CL, CB). terminal connected internally output through resistor. stability LDOs dependent output filter capacitor. Most LDOs designed stable over narrow range with lower limits upper limits, thus limiting type capacitor that used. With internal resistor, lower limit capacitor eliminated, permitting upper limit raised. Therefore, almost tantalum ceramic capacitor used, provided does exceed over operating temperature range.
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APPLICATION INFORMATION charge pump design
GND_CP GND_CP
Voltage Inverter
Voltage Doubler
Figure Charge-Pump Configurations charge-pump terminal drive either voltage inverter voltage doubler. either case only capacitors signal diodes needed. output voltage unregulated regulator added needed. charge transfer
(VCC
This occurs times second charge transfer unit time (current)
(VCC
Rewriting this equation form gives:
equivalent resistor.
where
equivalent circuit drawn taking diodes into account.
Rinternal -(VCC -Vdiode) Requiv 2VCC -Vdiode Rinternal Requiv
Voltage Inverter
Voltage Doubler
Figure Equivalent Circuit Charge Pump
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APPLICATION INFORMATION charge-pump design (continued)
output voltage doubler then:
Vdiode
Rtotal
output voltage inverter
(VCC
Vdiode)
Rtotal
determine size use:
where 100,000 ripple voltage. output current calculate: kHz0.010.1 Vripple
Because losses caused diode switching ESR, calculated capacitance should multiplied 2-µF capacitance should drive 10-mA voltage doubler inverter.
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MECHANICAL DATA
(R-PDSO-G**)
SHOWN 0,32 0,19
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,13
0,15 4,50 4,30 6,70 6,10 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,10 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60 4040064 10/95
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
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IMPORTANT NOTICE Texas Instruments (TI) reserves right make changes products discontinue semiconductor product service without notice, advises customers obtain latest version relevant information verify, before placing orders, that information being relied current. warrants performance semiconductor products related software specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques utilized extent deems necessary support this warranty. Specific testing parameters each device necessarily performed, except those mandated government requirements. Certain applications using semiconductor products involve potential risks death, personal injury, severe property environmental damage ("Critical Applications"). SEMICONDUCTOR PRODUCTS DESIGNED, INTENDED, AUTHORIZED, WARRANTED SUITABLE LIFE-SUPPORT APPLICATIONS, DEVICES SYSTEMS OTHER CRITICAL APPLICATIONS. Inclusion products such applications understood fully risk customer. products such applications requires written approval appropriate officer. Questions concerning potential risk applications should directed through local sales office. order minimize risks associated with customer's applications, adequate design operating safeguards should provided customer minimize inherent procedural hazards. assumes liability applications assistance, customer product design, software performance, infringement patents services described herein. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right covering relating combination, machine, process which such semiconductor products services might used.
Copyright 1996, Texas Instruments Incorporated

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