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Electrical data identical with device 1N4154 Quadro Melf package
Top Searches for this datasheetLS4154 Electrical data identical with device 1N4154 Quadro Melf package Applications Extreme fast switches 12009 Absolute Maximum Ratings 25_C Parameter Repetitive peak reverse voltage Reverse voltage Peak forward surge current Repetitive peak forward current Forward current Average forward current Power dissipation Junction temperature Storage temperature range Test Conditions Type Symbol VRRM IFSM IFRM IFAV Tstg Value -65.+175 Unit tp=1ms VR=0 Maximum Thermal Resistance 25_C Parameter Junction ambient Test Conditions board 50mmx50mmx1.6mm Symbol RthJA Value Unit TELEFUNKEN Semiconductors Rev. 24-Jun-96 LS4154 Characteristics 25_C Parameter Forward voltage Reverse current Breakdown voltage Diode capacitance Reverse recovery time Test Conditions IF=30mA VR=25V VR=25V, Tj=150°C IR=5mA, tp/T=0.01, tp=0.3ms VR=0, f=1MHz, VHF=50mV IF=IR=10mA, iR=1mA IF=10mA, VR=6V, iR=0.1xIR, RL=100W Type Symbol V(BR) Unit Typical Characteristics 25_C unless otherwise specified) Diode Capacitance Reverse Current Scattering Limit 9154 0.01 Junction Temperature 25°C 9156 Reverse Voltage Figure Reverse Current Junction Temperature 1000 Forward Current 100°C Figure Diode Capacitance Reverse Voltage 25°C 9152 Forward Voltage Figure Forward Current Forward Voltage TELEFUNKEN Semiconductors Rev. 24-Jun-96 LS4154 Dimensions 12071 TELEFUNKEN Semiconductors Rev. 24-Jun-96 LS4154 Ozone Depleting Substances Policy Statement policy TEMIC TELEFUNKEN microelectronic GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances ODSs). Montreal Protocol 1987) London Amendments 1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency EPA) Council Decision 88/540/EEC 91/690/EEC Annex transitional substances respectively. TEMIC certify that semiconductors manufactured with ozone depleting substances contain such substances. reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer TEMIC products unintended unauthorized application, buyer shall indemnify TEMIC against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 7131 2831, number: 7131 2423 TELEFUNKEN Semiconductors Rev. 24-Jun-96 Other recent searchesuPD754144 - uPD754144 uPD754144 Datasheet uPD754244 - uPD754244 uPD754244 Datasheet SLD1138VL - SLD1138VL SLD1138VL Datasheet MAC97 - MAC97 MAC97 Datasheet IRFR410B - IRFR410B IRFR410B Datasheet IRFU410B - IRFU410B IRFU410B Datasheet ICX642BKA - ICX642BKA ICX642BKA Datasheet ICX226AK - ICX226AK ICX226AK Datasheet ICX226AZ - ICX226AZ ICX226AZ Datasheet B4124 - B4124 B4124 Datasheet 2STC5949 - 2STC5949 2STC5949 Datasheet
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