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Electrical data identical with device 1N4150 Quadro Melf package
Top Searches for this datasheetLS4150 Electrical data identical with device 1N4150 Quadro Melf package Applications High speed switch general purpose computer industrial applications 12009 Absolute Maximum Ratings 25_C Parameter Repetitive peak reverse voltage Reverse voltage Peak forward surge current Forward current Average forward current Power dissipation Junction temperature Storage temperature range Test Conditions Type Symbol VRRM IFSM IFAV Tstg Value -65.+175 Unit tp=1ms VR=0 Maximum Thermal Resistance 25_C Parameter Junction ambient Test Conditions board 50mmx50mmx1.6mm Symbol RthJA Value Unit TELEFUNKEN Semiconductors Rev. 24-Jun-96 LS4150 Characteristics 25_C Parameter Forward voltage Test Conditions IF=1mA IF=10mA IF=50mA IF=100mA IF=200mA VR=50V VR=50V, Tj=150°C VR=0, f=1MHz, VHF=50mV IF=IR=10.100mA, iR=0.1xIR, RL=100W Type Symbol 0.54 0.66 0.76 0.82 0.87 0.62 0.74 0.86 0.92 Unit Reverse current Diode capacitance Reverse recovery time Typical Characteristics 25_C unless otherwise specified) Reverse Current Scattering Limit Forward Current 1000 Scattering Limit 25°C 0.01 9100 9162 Junction Temperature Forward Voltage Figure Reverse Current Junction Temperature Figure Forward Current Forward Voltage TELEFUNKEN Semiconductors Rev. 24-Jun-96 LS4150 Dimensions 12071 TELEFUNKEN Semiconductors Rev. 24-Jun-96 LS4150 Ozone Depleting Substances Policy Statement policy TEMIC TELEFUNKEN microelectronic GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances ODSs). Montreal Protocol 1987) London Amendments 1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency EPA) Council Decision 88/540/EEC 91/690/EEC Annex transitional substances respectively. TEMIC certify that semiconductors manufactured with ozone depleting substances contain such substances. reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer TEMIC products unintended unauthorized application, buyer shall indemnify TEMIC against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 7131 2831, number: 7131 2423 TELEFUNKEN Semiconductors Rev. 24-Jun-96 Other recent searchesSPS-93100RW-CXX0G - SPS-93100RW-CXX0G SPS-93100RW-CXX0G Datasheet SPS-93100BRW-CXX0G - SPS-93100BRW-CXX0G SPS-93100BRW-CXX0G Datasheet SP483 - SP483 SP483 Datasheet SP485 - SP485 SP485 Datasheet SN74ABT16843 - SN74ABT16843 SN74ABT16843 Datasheet SN54ABT16843 - SN54ABT16843 SN54ABT16843 Datasheet PIC16C56 - PIC16C56 PIC16C56 Datasheet MTP52N06VL - MTP52N06VL MTP52N06VL Datasheet MJ15020 - MJ15020 MJ15020 Datasheet MJ15021 - MJ15021 MJ15021 Datasheet FAN8082 - FAN8082 FAN8082 Datasheet ACTF433 - ACTF433 ACTF433 Datasheet
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