File Number 4804.1 22A, 100V, 0.064 Ohm, N-Channel, UltraFET
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HUF75623P3, HUF75623S3ST
File Number
4804.1
22A, 100V, 0.064 Ohm, N-Channel, UltraFET Power MOSFETs Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE
JEDEC TO-263AB
DRAIN (FLANGE)
Features
Ultra On-Resistance rDS(ON) 0.064, Simulation Models Temperature Compensated PSPICE® SABERElectrical Models Spice SABER© Thermal Impedance Models www.intersil.com Peak Current Pulse Width Curve Rating Curve
DRAIN (FLANGE)
GATE SOURCE
HUF75623P3
HUF75623S3ST
Symbol
Ordering Information
PART NUMBER PACKAGE TO-220AB TO-263AB BRAND 75623P 75623S HUF75623P3 HUF75623S3ST
NOTE: When ordering, entire part number i.e., HUF75623P3
Absolute Maximum Ratings
25oC, Unless Otherwise Specified HUF75623P3, HUF75623S3ST UNITS Figure Figures 0.57
Drain Source Voltage (Note VDSS Drain Gate Voltage (RGS 20k) (Note VDGR Gate Source Voltage Drain Current Continuous 25oC, 10V) (Figure Continuous 100oC, 10V) (Figure Pulsed Drain Current .IDM Pulsed Avalanche Rating .UIS Power Dissipation Derate Above 25oC Operating Storage Temperature TSTG Maximum Temperature Soldering Leads 0.063in (1.6mm) from Case 10s. Package Body 10s, Techbrief TB334 Tpkg NOTE: 25oC 150oC.
W/oC
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
CAUTION: These devices sensitive electrostatic discharge. Follow proper Handling Procedures. UltraFET® registered trademark Intersil Corporation. PSPICE® registered trademark MicroSim Corporation. SABERis trademark Analogy, Inc. 1-888-INTERSIL 321-724-7143 Intersil Design trademark Intersil Corporation. Copyright Intersil Corporation 2000
HUF75623P3, HUF75623S3ST
Electrical Specifications
PARAMETER STATE SPECIFICATIONS Drain Source Breakdown Voltage Zero Gate Voltage Drain Current BVDSS IDSS 250µA, (Figure 95V, 90V, 150oC Gate Source Leakage Current STATE SPECIFICATIONS Gate Source Threshold Voltage Drain Source Resistance THERMAL SPECIFICATIONS Thermal Resistance Junction Case Thermal Resistance Junction Ambient TO-220 1.76
oC/W oC/W
25oC, Unless Otherwise Specified SYMBOL TEST CONDITIONS UNITS
±100
IGSS
±20V
VGS(TH) rDS(ON)
VDS, 250µA (Figure 22A, (Figure
0.054
0.064
SWITCHING SPECIFICATIONS (VGS 10V) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time GATE CHARGE SPECIFICATIONS Total Gate Charge Gate Charge Threshold Gate Charge Gate Source Gate Charge Gate Drain "Miller" Charge CAPACITANCE SPECIFICATIONS Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS 25V, 1MHz (Figure Qg(TOT) Qg(10) Qg(TH) 50V, 22A, Ig(REF) 1.0mA (Figures td(ON) td(OFF) tOFF 50V, 10V, (Figures
Source Drain Diode Specifications
PARAMETER Source Drain Diode Voltage SYMBOL Reverse Recovery Time Reverse Recovered Charge 22A, dISD/dt 100A/µs 22A, dISD/dt 100A/µs TEST CONDITIONS 1.25 1.00 UNITS
HUF75623P3, HUF75623S3ST Typical Performance Curves
POWER DISSIPATION MULTIPLIER
DRAIN CURRENT
CASE TEMPERATURE (oC)
CASE TEMPERATURE (oC)
FIGURE NORMALIZED POWER DISSIPATION CASE TEMPERATURE
FIGURE MAXIMUM CONTINUOUS DRAIN CURRENT CASE TEMPERATURE
THERMAL IMPEDANCE ZJC, NORMALIZED DUTY CYCLE DESCENDING ORDER 0.05 0.02 0.01 NOTES: DUTY FACTOR: t1/t2 PEAK 10-3 10-2 RECTANGULAR PULSE DURATION 10-1
SINGLE PULSE 0.01 10-5 10-4
FIGURE NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
25oC PEAK CURRENT TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT FOLLOWS:
TRANSCONDUCTANCE LIMIT CURRENT THIS REGION 10-5 10-4 10-3 10-2 PULSE WIDTH 10-1
FIGURE PEAK CURRENT CAPABILITY
HUF75623P3, HUF75623S3ST Typical Performance Curves
IAS, AVALANCHE CURRENT SINGLE PULSE RATED 25oC
(Continued)
DRAIN CURRENT
(L)(IAS)/(1.3*RATED BVDSS VDD) (L/R)ln[(IAS*R)/(1.3*RATED BVDSS VDD)
100µs OPERATION THIS AREA LIMITED rDS(ON) DRAIN SOURCE VOLTAGE
STARTING 25oC STARTING 150oC
10ms
0.001
0.01
tAV, TIME AVALANCHE (ms)
NOTE: Refer Intersil Application Notes AN9321 AN9322. FIGURE FORWARD BIAS SAFE OPERATING AREA FIGURE UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
PULSE DURATION 80µs DUTY CYCLE 0.5%
DRAIN CURRENT
DRAIN CURRENT
175oC
-55oC 25oC
PULSE DURATION 80µs DUTY CYCLE 0.5% 25oC DRAIN SOURCE VOLTAGE
GATE SOURCE VOLTAGE
FIGURE TRANSFER CHARACTERISTICS
FIGURE SATURATION CHARACTERISTICS
NORMALIZED DRAIN SOURCE RESISTANCE PULSE DURATION 80µs DUTY CYCLE 0.5%
10V, NORMALIZED GATE THRESHOLD VOLTAGE
VDS, 250µA
JUNCTION TEMPERATURE (oC) JUNCTION TEMPERATURE (oC)
FIGURE NORMALIZED DRAIN SOURCE RESISTANCE JUNCTION TEMPERATURE
FIGURE NORMALIZED GATE THRESHOLD VOLTAGE JUNCTION TEMPERATURE
HUF75623P3, HUF75623S3ST Typical Performance Curves
NORMALIZED DRAIN SOURCE BREAKDOWN VOLTAGE 250µA 1000 CAPACITANCE (pF) CISS COSS
(Continued)
2000 1MHz
CRSS
JUNCTION TEMPERATURE (oC)
DRAIN SOURCE VOLTAGE
FIGURE NORMALIZED DRAIN SOURCE BREAKDOWN VOLTAGE JUNCTION TEMPERATURE
FIGURE CAPACITANCE DRAIN SOURCE VOLTAGE
GATE SOURCE VOLTAGE
WAVEFORMS DESCENDING ORDER:
GATE CHARGE (nC)
NOTE: Refer Intersil Application Notes AN7254 AN7260. FIGURE GATE CHARGE WAVEFORMS CONSTANT GATE CURRENT
Test Circuits Waveforms
BVDSS VARY OBTAIN REQUIRED PEAK
0.01
FIGURE UNCLAMPED ENERGY TEST CIRCUIT
FIGURE UNCLAMPED ENERGY WAVEFORMS
HUF75623P3, HUF75623S3ST Test Circuits Waveforms
(Continued)
Qg(TOT)
Qg(10) Qg(TH) Ig(REF)
Ig(REF)
FIGURE GATE CHARGE TEST CIRCUIT
FIGURE GATE CHARGE WAVEFORMS
td(ON)
tOFF td(OFF)
PULSE WIDTH
FIGURE SWITCHING TIME TEST CIRCUIT
FIGURE SWITCHING TIME WAVEFORM
HUF75623P3, HUF75623S3ST PSPICE Electrical Model
.SUBCKT HUF75623
1.27e-9 1.27e-9 7.20e-10 DBODY DBODYMOD DBREAK DBREAKMOD DPLCAP DPLCAPMOD
October 1999
LDRAIN DPLCAP RLDRAIN DBREAK EBREAK DRAIN RSLC1 ESLC
RSLC2
LGATE GATE RLGATE EVTEMP RGATE EVTHRES
LDRAIN 1.0e-9 LGATE 5.53e-9 LSOURCE 4.35e-9 MMED MMEDMOD MSTRO MSTROMOD MWEAK MWEAKMOD RBREAK RBREAKMOD RDRAIN RDRAINMOD 2.70e-2 RGATE 2.50 RLDRAIN RLGATE 55.3 RLSOURCE 43.5 RSLC1 RSLCMOD 1e-6 RSLC2 RSOURCE RSOURCEMOD 1.77e-2 RVTHRES RVTHRESMOD RVTEMP RVTEMPMOD S1AMOD S1BMOD S2AMOD S2BMOD
MSTRO LSOURCE RSOURCE RLSOURCE SOURCE
VBAT ESLC .MODEL DBODYMOD 6.0e-13 6.2e-3 TRS1 2.1e-3 TRS2 2.0e-6 8.50e-10 6.30e-8 0.54) .MODEL DBREAKMOD 5.6e-1 TRS1 8e-4 TRS2 3e-6) .MODEL DPLCAPMOD (CJO 9.29e-10 1e-30 0.79) .MODEL MMEDMOD NMOS (VTO 3.21 1e-30 2.50) .MODEL MSTROMOD NMOS (VTO 3.60 1e-30 .MODEL MWEAKMOD NMOS (VTO 2.77 0.09 1e-30 25.0 .MODEL RBREAKMOD (TC1 =1.05e-3 -5e-7) .MODEL RDRAINMOD (TC1 1.20e-2 3.00e-5) .MODEL RSLCMOD (TC1 3.20e-3 3.00e-6) .MODEL RSOURCEMOD (TC1 1e-3 1e-6) .MODEL RVTHRESMOD (TC1 -2.20e-3 -9.00e-6) .MODEL RVTEMPMOD (TC1 -2.40e-3 =1.80e-6) .MODEL S1AMOD VSWITCH (RON 1e-5 .MODEL S1BMOD VSWITCH (RON 1e-5 .MODEL S2AMOD VSWITCH (RON 1e-5 .MODEL S2BMOD VSWITCH (RON 1e-5 .ENDS ROFF ROFF ROFF ROFF -6.2 VOFF= -3.1) -3.1 VOFF= -6.2) -1.0 VOFF= 0.5) VOFF= -1.0)
NOTE: further discussion PSPICE model, consult PSPICE Sub-Circuit Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written William Hepp Frank Wheatley.
EBREAK 117.8 EVTHRES EVTEMP
RDRAIN
DBODY
MWEAK MMED
RBREAK RVTEMP
VBAT
RVTHRES
HUF75623P3, HUF75623S3ST SABER Electrical Model
October 1999 template huf75623 n2,n1,n3 electrical n2,n1,n3 iscl d.model dbodymod 6.00e-13, 8.50e-10, 6.30e-8, 5.5, 0.54) d.model dbreakmod d.model dplcapmod (cjo 9.29e-10, 1e-30, 0.79) m.model mmedmod (type=_n, 3.21, 1e-30, m.model mstrongmod (type=_n, 3.60, 1e-30, m.model mweakmod (type=_n, 2.77, 0.09, 1e-30, sw_vcsp.model s1amod (ron 1e-5, roff 0.1, -6.2, voff -3.1) DPLCAP sw_vcsp.model s1bmod (ron =1e-5, roff 0.1, -3.1, voff -6.2) sw_vcsp.model s2amod (ron 1e-5, roff 0.1, -1.0, voff 0.5) sw_vcsp.model s2bmod (ron 1e-5, roff 0.1, 0.5, voff -1.0) c.ca 1.27e-9 c.cb 1.27e-9 c.cin 7.20e-10 d.dbody model=dbodymod d.dbreak model=dbreakmod d.dplcap model=dplcapmod i.it l.ldrain 1e-9 l.lgate 5.53e-9 l.lsource 4.35e-9
GATE RLGATE LGATE RSLC2 ISCL
LDRAIN RLDRAIN RDBREAK DBREAK MWEAK MMED MSTRO EBREAK RDBODY DRAIN RSLC1
EVTEMP RGATE EVTHRES
RDRAIN
DBODY
m.mmed model=mmedmod, l=1u, w=1u m.mstrong model=mstrongmod, l=1u, w=1u m.mweak model=mweakmod, l=1u, w=1u res.rbreak 1.05e-3, -5.0e-7 res.rdbody 6.2e-3, 2.10e-3, 2.0e-6 res.rdbreak 5.6e-1, 8.0e-4, 3.0e-6 res.rdrain 2.70e-2, 1.20e-2, 3.00e-5 res.rgate 2.50 res.rldrain res.rlgate 55.3 res.rlsource 43.5 res.rslc1 1e-6, 3.2e-3, 3.0e-6 res.rslc2 res.rsource 1.77e-2, 1e-3, 1e-6 res.rvtemp -2.4e-3, 1.8e-6 res.rvthres -2.2e-3, -9.0e-6 spe.ebreak 117.8 spe.eds spe.egs spe.esg spe.evtemp spe.evthres sw_vcsp.s1a model=s1amod sw_vcsp.s1b model=s1bmod sw_vcsp.s2a model=s2amod sw_vcsp.s2b model=s2bmod v.vbat dc=1 equations (n51->n50) +=iscl iscl: v(n51,n50) 3.5))
LSOURCE RLSOURCE
SOURCE
RSOURCE RBREAK RVTEMP
VBAT
RVTHRES
HUF75623P3, HUF75623S3ST SPICE Thermal Model
October 1999 HUF75623T CTHERM1 1.40e-3 CTHERM2 5.55e-3 CTHERM3 5.65e-3 CTHERM4 6.10e-3 CTHERM5 9.80e-3 CTHERM6 7.70e-2 RTHERM1 1.10e-2 RTHERM2 5.80e-2 RTHERM3 1.35e-1 RTHERM4 3.60e-1 RTHERM5 4.13e-1 RTHERM6 4.30e-1
RTHERM1 CTHERM1 JUNCTION
RTHERM2
CTHERM2
RTHERM3
CTHERM3
SABER Thermal Model
SABER thermal model HUF75623T template thermal_model thermal_c ctherm.ctherm1 1.40e-3 ctherm.ctherm2 5.55e-3 ctherm.ctherm3 5.65e-3 ctherm.ctherm4 6.10e-3 ctherm.ctherm5 9.80e-3 ctherm.ctherm6 7.70e-2 rtherm.rtherm1 1.10e-2 rtherm.rtherm2 5.80e-2 rtherm.rtherm3 1.35e-1 rtherm.rtherm4 3.60e-1 rtherm.rtherm5 4.13e-1 rtherm.rtherm6 4.30e-1
RTHERM4
CTHERM4
RTHERM5
CTHERM5
RTHERM6
CTHERM6
CASE
HUF75623P3, HUF75623S3ST TO-263AB
TERM.
SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
TERM.
0.450 (11.43)
0.350 (8.89) 0.700 (17.78)
0.080 (2.03) 0.062 (1.58)
0.150 (3.81)
MINIMUM SIZE RECOMMENDED SURFACE-MOUNTED APPLICATIONS
INCHES MILLIMETERS SYMBOL NOTES 0.170 0.180 4.32 4.57 0.048 0.052 1.22 1.32 0.030 0.034 0.77 0.86 0.045 0.055 1.15 1.39 0.310 7.88 0.018 0.022 0.46 0.55 0.405 0.425 10.29 10.79 0.395 0.405 10.04 10.28 0.100 2.54 0.200 5.08 0.045 0.055 1.15 1.39 0.095 0.105 2.42 2.66 0.175 0.195 4.45 4.95 0.090 0.110 2.29 2.79 0.050 0.070 1.27 1.77 0.315 8.01 NOTES: These dimensions within allowable dimensions Rev. JEDEC TO-263AB outline dated 2-92. dimensions established minimum mounting surface terminal Solder finish uncontrolled this area. Dimension (without solder). typically 0.002 inches (0.05mm) solder plating. terminal length soldering. Position lead measured 0.120 inches (3.05mm) from bottom dimension Controlling dimension: Inch. Revision dated 5-99.
1.5mm DIA. HOLE
4.0mm USER DIRECTION FEED 2.0mm 1.75mm
TO-263AB
24mm TAPE REEL
24mm
16mm
COVER TAPE
40mm MIN. ACCESS HOLE 30.4mm
13mm 330mm 100mm
GENERAL INFORMATION PIECES REEL. ORDER MULTIPLES FULL REELS ONLY. MEETS EIA-481 REVISION SPECIFICATIONS. 24.4mm
HUF75623P3, HUF75623S3ST TO-220AB
LEAD JEDEC TO-220AB PLASTIC PACKAGE
TERM.
INCHES SYMBOL 0.170 0.048 0.030 0.045 0.014 0.590 0.395 0.180 0.052 0.034 0.055 0.019 0.610 0.160 0.410 0.030 0.100 0.200 0.235 0.100 0.530 0.130 0.149 0.102 0.255 0.110 0.550 0.150 0.153 0.112
MILLIMETERS 4.32 1.22 0.77 1.15 0.36 14.99 10.04 4.57 1.32 0.86 1.39 0.48 15.49 4.06 10.41 0.76 2.54 5.08 5.97 2.54 13.47 3.31 3.79 2.60 6.47 2.79 13.97 3.81 3.88 2.84 NOTES
NOTES: These dimensions within allowable dimensions Rev. JEDEC TO-220AB outline dated 3-24-87. Lead dimension finish uncontrolled Lead dimension (without solder). typically 0.002 inches (0.05mm) solder coating. Position lead measured 0.250 inches (6.35mm) from bottom dimension Position lead measured 0.100 inches (2.54mm) from bottom dimension Controlling dimension: Inch. Revision dated 7-97.
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