Dielectric PART NUMBER (see page complete information options)

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Dielectric PART NUMBER (see page complete information options)

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Profile Chips
Dielectric
PART NUMBER (see page complete information options)
1206
Size
Voltage
Dielectric
Capacitance Code
Capacitance Tolerance +80/-20%
Failure Rate Applicable
Terminations Plated Solder
Packaging Reel Reel
Thickness .026" Max. .022" Max. .018" Max.
PERFORMANCE CHARACTERISTICS
Capacitance Range Capacitance Tolerances Operating Temperature Range Temperature Characteristic Voltage Ratings Dissipation Factor 25°C, Vrms, 1kHz Insulation Resistance Dielectric Strength seconds mamp max. current Test Voltage Test Frequency Z5U: .33µF; Y5V: .47µF +80, -20% Z5U: +10°C +85°C; Y5V: -30°C +85°C Z5U: +22%, -56%; Y5V: +22%, -82% Z5U: Y5V: 10,000 megohms min. 1000 whichever less 250% rated Z5U: Vrms Y5V: Vrms Vrms
CAPACITANCE VALUES VARIOUS THICKNESSES
SIZE
Length Width Terminal (in.) (in.) (in.)
1206 1210
(.126 .008) (.098 .008) (.020 .010) (.026) (.018) (.022) (.026)
0805
2.01 (.079 .008) 1.25 (.049 .008) (.020 .010) (.018) (.022) (.026)
SIZE
Length Width Terminal Thickness Max. (µF) (in.) (in.) (in.) (in.) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082 (.018)
0805
2.01 (.079 .008) 1.25 (.049 .008) (.020 .010) (.022) (.026)
1206
(.126 .008) (.063 .008) (.020 .010) (.018) (.022) (.026)
1210
(.126 .008) (.098 .008) (.020 .010) (.018) (.022) (.026)
(.126 .008) (.063 .008) (.020 .010) (.018) (.022)
Thickness Max. (in.) (µF) .012 .015 .018 .022 .027 .033 .039 .047 .056 .068 .082
Paper Tape
Paper Tape
Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805
Size 0402 0504 0603 0805 1005 0907 1206 1210 1505 1805 1808 1812 1825 2225 3640
Dielectric (NP0)
Capacitance Tolerance ±.25 ±.50 ±10% ±20% +80%, -20% +100%,
Terminations
Special** Code Standard Product Non-Standard Embossed unmarked Embossed marked Standard packaging marked Profile Chips Only Max. Thickness .66mm (.026") .56mm (.022") .46mm (.018")
Standard:
Plated Others: Plated Gold Plated Pd/Ag
Voltage 100V 200V 250V 500V 600V 1000V 1500V 2000V 2500V 3000V 4000V 5000V
Capacitance Code significant digits zeros) Examples: 1,000 22,000 220,000 values below place decimal point, e.g., 9R1.
Failure Rate Applicable
Packaging**
Recommended:
Reel =13" Reel Others: Bulk Cassette Bulk
tolerances values. Standard Tape Reel material depends upon chip size thickness. individual part tables tape material type each capacitance value. Note: Unmarked product standard. Marked product available special request, please contact AVX. Standard packaging shown individual tables. Non-standard packaging available special request, please contact AVX.
Surface Mounting Guide
Chip Capacitors
Component Design
Component pads should designed achieve good solder filets minimize component movement during reflow soldering. designs given below most common sizes multilayer ceramic capacitors both wave reflow soldering. basis these designs width equal component width. permissible decrease this component width advisable below this. overlap 0.5mm beneath component. extension 0.5mm beyond components reflow 1.0mm wave soldering.
REFLOW SOLDERING
Case Size 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225
1.70 (0.07) 2.30 (0.09) 3.00 (0.12) 4.00 (0.16) 4.00 (0.16) 5.60 (0.22) 5.60 (0.22) 5.60 (0.22) 6.60 (0.26) 6.60 (0.26)
0.60 (0.02) 0.80 (0.03) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)
0.50 (0.02) 0.70 (0.03) 1.00 (0.04) 2.00 (0.09) 2.00 (0.09) 3.60 (0.14) 3.60 (0.14) 3.60 (0.14) 4.60 (0.18) 4.60 (0.18)
0.60 (0.02) 0.80 (0.03) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04)
0.50 (0.02) 0.75 (0.03) 1.25 (0.05) 1.60 (0.06) 2.50 (0.10) 2.00 (0.08) 3.00 (0.12) 6.35 (0.25) 5.00 (0.20) 6.35 (0.25)
Dimensions millimeters (inches)
Surface Mounting Guide
Chip Capacitors
WAVE SOLDERING
Case Size 0603 0805 1206 1210
3.10 (0.12) 4.00 (0.15) 5.00 (0.19) 5.00 (0.19)
1.20 (0.05) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06)
0.70 (0.03) 1.00 (0.04) 2.00 (0.09) 2.00 (0.09)
1.20 (0.05) 1.50 (0.06) 1.50 (0.06) 1.50 (0.06)
0.75 (0.03) 1.25 (0.05) 1.60 (0.06) 2.50 (0.10)
Dimensions millimeters (inches)
Component Spacing
wave soldering components, must spaced sufficiently apart avoid bridging shadowing (inability solder penetrate properly into small spaces). This less important reflow soldering sufficient space must allowed enable rework should required.
Preheat Soldering
rate preheat should exceed 4°C/second prevent thermal shock. better maximum figure about 2°C/second. capacitors size 1206 below, with maximum thickness 1.25mm, generally permissible allow temperature differential from preheat soldering 150°C. other cases this differential should exceed 100°C. further specific application process advice, please consult AVX.
1.5mm (0.06) (0.04)
Cleaning
Care should taken ensure that capacitors thoroughly cleaned flux residues especially space beneath capacitor. Such residues otherwise become conductive effectively offer resistance bypass capacitor. Ultrasonic cleaning permissible, recommended conditions being Watts/litre 20-45 kHz, with process cycle minutes vapor rinse, minutes immersion ultrasonic solvent bath finally minutes vapor rinse.
(0.04)
Surface Mounting Guide
Chip Capacitors
APPLICATION NOTES
Storage
Good solderability maintained least twelve months, provided components stored their received" packaging less than 40°C
General
Surface mounting chip multilayer ceramic capacitors designed soldering printed circuit boards other substrates. construction components such that they will withstand time/temperature profiles used both wave reflow soldering methods.
Solderability
Terminations well soldered after immersion 60/40 tin/lead solder bath ±5°C seconds.
Handling
Chip multilayer ceramic capacitors should handled with care avoid damage contamination from perspiration skin oils. tweezers vacuum pick strongly recommended individual components. Bulk handling should ensure that abrasion mechanical shock minimized. Taped reeled components provides ideal medium direct presentation placement machine. mechanical shock should minimized during handling chip multilayer ceramic capacitors.
Leaching
Terminations will resist leaching least immersion times conditions shown below. Termination Type Nickel Barrier Solder Solder Tin/Lead/Silver Temp. 60/40/0 260±5 Immersion Time Seconds 30±1
Preheat Recommended Soldering Profiles
Reflow
220°C 250°C Preheat Natural Cooling
Solder Temp.
important avoid possibility thermal shock during soldering carefully controlled preheat therefore required. rate preheat should exceed 4°C/second target figure 2°C/second recommended. Although 80°C 120°C temperature differential preferred, recent developments allow temperature differential between component surface soldering temperature 150°C (Maximum) capacitors 1210 size below with maximum thickness 1.25mm. user cautioned that risk thermal shock increases chip size temperature differential increases.
Soldering
Mildly activated rosin fluxes preferred. minimum amount solder give good joint should used. Excessive solder lead damage from stresses caused difference coefficients expansion between solder, chip substrate. terminations suitable wave reflow soldering systems. hand soldering cannot avoided, preferred technique utilization soldering tools.
1min
1min
sec.
(Minimize soldering time)
Wave
Preheat Natural Cooling
Cooling
Natural cooling preferred, this minimizes stresses within soldered joint. When forced cooling used, cooling rate should exceed 4°C/second. Quenching recommended used, maximum temperature differentials should observed according preheat conditions above.
Solder Temp.
230°C 250°C
Cleaning
Flux residues hygroscopic acidic must removed. capacitors acceptable with solvents described specifications MIL-STD202 EIA-RS-198. Alcohol based solvents acceptable properly controlled water cleaning systems also acceptable. Many other solvents have been proven successful, most solvents that acceptable other components circuit assemblies equally acceptable with ceramic capacitors.
sec.
(Preheat chips before soldering) T/maximum 150°C
Packaging Chip Components
Automatic Insertion Packaging
TAPE REEL QUANTITIES
tape reel specifications compliance with RS481.
Paper Embossed Carrier Embossed Only Paper Only Qty. Reel/7" Reel Qty. Reel/13" Reel
12mm
0805, 1005, 1206, 1210 0504, 0907 0402, 0603 2,000 4,000 10,000 3,000 10,000 1,000 4,000 1505, 1805, 1808 1812, 1825 2220, 2225
Dependent chip thickness. profile chips shown page 5,000 reel reel. 0402 size chips 10,000 reels available reels. 3640 size chip contact factory quantity reel.
REEL DIMENSIONS
Tape Size(1)
Max.
Min.
Min.
Min.
+1.0 -0.0 (.331 +.060 -0.0
Max. 14.4 (.567)
Min. (.311) 10.9 Max. (.429) 11.9 Min. (.469) 15.4 Max. (.607)
(12.992) 12mm
(.059)
13.0±0.20 (.512±.008)
20.2 (.795)
(1.969) 12.4 +2.0 -0.0 +.076 (.488 -0.0 18.4 (.724)
Metric dimensions will govern. English measurements rounded reference only. tape sizes 16mm 24mm (used with chip size 3640) consult RS-481 latest revision.
Embossed Carrier Configuration
12mm Tape Only
12mm Embossed Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 12mm (.059
+0.10 -0.0 +.004 -0.0
Max. 0.600 (.024)
0.10 (.004) Max.
0.75 (.030) Min. Note
0.75 (.030) Min. Note
1.75 0.10 0.10 0.05 (.069 .004) (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size Max. Min. Note Note 4.55 (.179) (.323) 4.55 (.179) (.323) (.039) (.059) (.039) (.059) Min. Note (.984) (1.181) (.984) (1.181)
0.05 0.10 (.138 .002) (.157 .004) 0.05 0.10 (.217 .002) (.157 .004) 0.05 0.10 (.138 .002) 0.79 .004 0.05 0.10 (.217 .002) (.315 .004)
(.098) Max. (.256) Max. (.098) Max. (.256)
+0.3 -0.1 (.315 +.012 -.004 12.0 (.472 .012) +0.3 -0.1 (.315 +.012 -.004 12.0 (.472 .012)
Note
12mm Pitch 12mm Double Pitch
Note
Note
Note
NOTES: determined max. dimensions ends terminals extending from component body and/or body dimensions component. clearance between terminals body component sides depth cavity (A0, must within 0.05 (.002) min. 0.50 (.020) max. clearance allowed must also prevent rotation component within cavity more than degrees (see sketches Tape with components shall pass around radius without damage. minimum trailer length (Note Fig. require additional length provide min. embossed tape reels with diameters approaching min. (Table dimension flat area from edge sprocket hole either outward deformation carrier tape between embossed cavities edge cavity whichever less. dimension flat area from edge carrier tape opposite sprocket holes either outward deformation carrier tape between embossed cavity edge cavity whichever less. embossment hole location shall measured from sprocket hole controlling location embossment. Dimensions embossment location hole location shall applied independent each other. dimension reference dimension tape feeder clearance only.
Paper Carrier Configuration
12mm Tape Only
12mm Paper Tape Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size 12mm (.059
+0.1 -0.0 +.004 -.000
1.75 0.10 (.069 .004)
0.10 (.004) Max.
0.75 (.030) Min.
0.75 (.030) Min.
MIN. (.984) Note
0.10 0.05 (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size 0.10 (.157 .004) .010 (.157 .004) 0.10 (.079 .004) 0.05 (.138 .002) 0.05 (.217 .002) 0.05 (.138 .002) +0.3 -0.1 (.315 +.012 -.004 12.0 (.472 .012) +0.3 -0.1 (.315 +.012 -.004 Note Note
12mm Pitch 12mm Double Pitch
0.10 (.315 .004)
0.05 (.217 .002)
12.0 (.472 .012)
NOTES: determined max. dimensions ends terminals extending from component body and/or body dimensions component. clearance between ends terminals body component sides depth cavity (A0, must within 0.05 (.002) min. 0.50 (.020) max. clearance allowed must also prevent rotation component within cavity more than degrees (see sketches Tape with components shall pass around radius without damage. (.043) Base Tape (.063) Max. Non-Paper Base Compositions.
Code Labeling Standard
code labeling available follows latest version EIA-556-A.
Bulk Case Packaging
BENEFITS
Easier handling Smaller packaging volume
(1/20 packaging)
BULK FEEDER
Easier inventory control Flexibility Recyclable
Case
Cassette Gate
CASE DIMENSIONS
Shutter Slider 12mm 36mm Expanded Drawing 110mm Attachment Base
Shooter
Mounter Head Chips
CASE QUANTITIES
Part Size Qty. (pcs cassette) 0402 80,000 0603 15,000 0805 10,000 (T=0.6mm) 5,000

Dielectric PART NUMBER (see page complete information options)

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