SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering

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SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering

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SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES
Manual soldering
Manual soldering surface-mount products recommended! Hall sensors sensitive thermal shock. When soldering temperature high enough, transmission heat fast enough, possible delamination plastic package from surface occur. Hall sensor reacts delamination exhibiting dramatic change magnetic parameters. This magnetic change usually reversed baking hours +150°C delamination remains long-term effect delamination reliability device unknown. Manual soldering operations basically uncontrolled, will typically apply more heat deposit more solder flux than paste-and-reflow operation. Flux residues containing halides, completely cleaned from printed wiring board, become activated moisture field application, provide source ionic contamination that attacks solder joint. package integrity ideal, activated flux residues also attack surface causing corrosion gold-aluminum connections. Soldering iron temperatures typically from +300°C +360°C much higher. Although these temperatures very high compared reflow system settings, experienced operator (using good soldering practices) will heat surface temperatures exceeding +240°C, likely damage Hall sensor. potential heating device above +240°C (with substantial thermal shock) becomes very high given inexperienced operator, high temperature, large soldering iron. When reworking printed wiring board, solderability usually reduced. This increased copper content resulting higher melting temperature solder remaining solder pad. Many rework operations cored-wire solders with very aggressive fluxes. Aggressive fluxes leave more ionic residues much more attention cleaning required. When necessary construct engineering circuit-board prototypes, rework printed wiring boards, Allegro recommends that only trained, experienced operators used, that they provided with temperature-controlled soldering irons, preferably self-regulating type such Metcal SmartheatTM. Iron temperature should possible without extending soldering time. Halide-free flux strongly recommended.
Reflow soldering
Lead-formed, surface-mount versions
Sensors that have been lead formed surface mounting (package codes `KA-TL' `UA-TL') soldered using low-temperature reflow techniques. temperature defined here method that does directly expose plastic body device temperatures excess +240°C. This temperature effectively precludes wave solder soldering technique. reflow chart next page.
SOT-89 type, surface-mount packages
Low-temperature reflow techniques (see preceding paragraph) must also used SOT-89 packaged devices (code `LT') there special considerations. SOT-89 package three surface-mountable leads, outside pair angle sharply into plastic package center, ground lead, exposed full length. package integrity (moisture resistance) SOT-89 robust other surface-mount packages increased metal-to-plastic interface produced exposed ground lead. design SOT-89 attempts lock ground into plastic lengthen potential moisture infiltration path coining edge, precautions still need taken ensure that contaminants forced into package during soldering operation. Fluxes containing halides should used when soldering plastic-encapsulated semiconductor device, this especially true when working with SOT-89 package. also important SOT-89 package thoroughly clean after board-cleaning operation.
SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES
Low-profile type, surface-mount packages
Allegro low-profile package (code `LH') been specifically designed withstand wave-solder conditions. This product been tested using extreme versions these conditions found robust.
Leaded, through-hole packages
Leaded products, designed used through-hole applications, have different requirements considerations. Please refer Allegro Application Note 27703 soldering through-hole Hall-sensor devices.
SOLDERING ABOVE 240°C LIKELY PRODUCE FAILURES MAX. 240°C
TEMPERATURE
MIN. 215°C
183°C
MAX. DWELL TIME ABOVE EUTECTIC TEMP.
Typical solder-reflow profile surface-mount Hall-sensor devices (package codes KA-TL, UA-TL).
COOL 4°C/s
PREHEAT 3°C/s
SOAK -160°C MAX.
TIME SECONDS
Dwg. GH-062-2
Northeast Cutoff, 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 Copyright 1996, 1999 Allegro MicroSystems, Inc.
SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES
260°C MAX.
MAX. 250°C
TEMPERATURE
MIN. 215°C
183°C
MAX. DWELL TIME ABOVE EUTECTIC TEMP.
Typical solder-reflow profile low-profile surface-mount Hall-sensor devices (package code LH).
COOL 4°C/s
PREHEAT 3°C/s
SOAK -160°C MAX.
TIME SECONDS
Dwg. GH-062-3
MAX. 260°C MAX.
TEMPERATURE
COOL 4°C/s
183°C
Typical wave-solder profile low-profile surface-mount Hall-sensor devices (package code LH).
SOAK
PREHEAT 3°C/s
TIME SECONDS
Dwg. GH-062-4
SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES
Allegro MicroSystems, Inc. reserves right make, from time time, such departures from detail specifications required permit improvements design products. information included herein believed accurate reliable. However, Allegro MicroSystems, Inc. assumes responsibility use; infringements patents other rights third parties which result from use.
Northeast Cutoff, 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000

SOLDERING SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering

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