Leaded through-hole products Allegro leaded products designed thr

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Leaded through-hole products Allegro leaded products designed thr

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SOLDERING SURFACE-MOUNT DEVICES
Leaded through-hole products
Allegro leaded products designed through-hole soldered into printed wiring boards. They will withstand temperature excursions experienced during hand soldering, reflow soldering, wave soldering long normal, good soldering practices used. with leaded through-hole devices, adequate spacing between body device board should maintained. high given inexperienced operator, high temperature, large soldering iron. Note that surface-mount Hall-effect devices should limited +220°C. When reworking printed wiring board, solderability usually reduced. This increased copper content resulting higher eutectic temperature solder remaining solder pad. Many rework operations cored-wire solders with very aggressive fluxes. Aggressive fluxes leave more ionic residues much more attention cleaning required. When necessary construct engineering circuit-board prototypes, rework printed wiring boards, Allegro recommends that only trained, experienced operators used, that they provided with temperature-controlled soldering irons, preferably self-regulating type such Metcal SmartheatTM. Iron temperature should possible without extending soldering time. Halide-free flux strongly recommended.
Surface-mount products manual soldering
Manual soldering surface-mount products recommended! integrated circuits sensitive thermal shock. When soldering temperature high enough, transmission heat fast enough, possible delamination plastic package from surface occur. device react delamination exhibiting dramatic change parameters. This change usually reversed baking hours +150°C delamination remains longterm effect delamination reliability device unknown. Manual soldering operations basically uncontrolled, will typically apply more heat deposit more solder flux than paste-and-reflow operation. Flux residues containing halides, completely cleaned from printed wiring board, become activated moisture field application, provide source ionic contamination that attacks solder joint. package integrity ideal, activated flux residues also attack surface causing corrosion gold-aluminum connections. Soldering iron temperatures typically from +300°C +360°C much higher. Although these temperatures very high compared reflow system settings, experienced operator (using good soldering practices) will heat surface temperatures exceeding +240°C, likely damage device. potential heating device above +240°C (with substantial thermal shock) becomes very
Surface-mount products reflow soldering
Lead-formed, surface-mount versions
Chip carriers (PLCCs Allegro package codes EQ), small-outline packages (SOICs codes LW), quad flatpacks (PQFPs code soldered using low-temperature reflow techniques. temperature defined here method that does expose plastic body device temperatures excess +240°C. reflow chart next page.
SOT-89 type, surface-mount packages
Low-temperature reflow techniques must also used SOT-89 packaged devices (Allegro package code there special considerations. SOT-89 package three surface-mountable leads, outside pair angle sharply into plastic package center, ground lead, exposed full length.
SOLDERING SURFACE-MOUNT DEVICES
package integrity (moisture resistance) SOT-89 robust other surface-mount packages increased metal-to-plastic interface produced exposed ground lead. design SOT-89 attempts lock ground into plastic lengthen potential moisture infiltration path coining edge, precautions still need taken ensure that contaminants forced into package during soldering operation. Fluxes containing halides should used when soldering plastic-encapsulated semiconductor device, this especially true when working with SOT-89 package. also important SOT-89 package thoroughly clean after board-cleaning operation.
reflow soldering surface-mount Hall-effect devices described Allegro Application Note 27703.
Surface-mount products wave soldering
Because very small package-body dimensions, some Allegro surface-mount devices will especially sensitive standard wave-soldering techniques. Contact factory detailed information.
215°C, RECOMMENDED SOLDER MFG., 240°C MAX.
TEMPERATURE
183°C
PREHEAT 3°C/s
SOAK MINUTES MAX.
DWELL TIME ABOVE EUTECTIC TEMPERATURE MAX. COOL 4°C/s
TIME SECONDS
Allegro MicroSystems, Inc. reserves right make, from time time, such departures from detail specifications required permit improvements design products. information included herein believed accurate reliable. However, Allegro MicroSystems, Inc. assumes responsibility use; infringements patents other rights third parties which result from use.
Dwg. GH-062-1
Northeast Cutoff, 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 Copyright 1996, 1998 Allegro MicroSystems, Inc.

Leaded through-hole products Allegro leaded products designed thr

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