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N-CHANNEL 0.0095 DPAK GATE CHARGE STripFETPOWER MOSFET PRELIMINAR


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STD40NF03L
N-CHANNEL 0.0095 DPAK GATE CHARGE STripFETPOWER MOSFET
PRELIMINARY DATA TYPE STD40NF03L
RDS(on) 0.012
TYPICAL RDS(on) 0.0095 TYPICAL OPTIMAL RDS(on) TRADE-OFF CONDUCTION LOSSES REDUCED SWITCHING LOSSES REDUCED
DESCRIPTION This application specific Power Mosfet third generation STMicroelectronics unique "Single Feature SizeTM" strip-based process. resulting transistor shows best trade-off between on-resistance gate charge. When used high side buck regulators, gives best performance terms both conduction switching losses. This extremely important motherboards where fast switching high efficiency paramount importance. APPLICATIONS SPECIFICALLY DESIGNED OPTIMISED HIGH EFFICIENCY CORE DC/DC CONVERTERS
DPAK TO-252 (Suffix "T4")
SUFFIX "T4" ORDERING TAPE REEL
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Tstg Parameter Drain-source Voltage Drain- gate Voltage Gate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) Total Dissipation Derating Factor Storage Temperature Max. Operating Junction Temperature
Value 0.37
Unit
Current Limited Package Pulse width limited safe operating area
September 2000
STD40NF03L
THERMAL DATA
thj-case thj-amb Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature Soldering Purpose 2.73 62.5
ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified)
Symbol (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test Conditions Min. Typ. Max. Unit
Zero Gate Voltage Rating Drain Current Rating Gate-body Leakage Current
=125
Symbol GS(th) DS(on) D(on) Parameter Gate Threshold Voltage Static Drain-source Resistance Test Conditions Min. 0.0095 0.019 0.012 0.022 Typ. Max. Unit
State Drain Current D(on) DS(on)max
DYNAMIC
Symbol Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions D(on) DS(on)max Min. Typ. 1470 Max. Unit
STD40NF03L
ELECTRICAL CHARACTERISTICS (continued) SWITCHING
Symbol d(on) Parameter Turn-on Delay Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions (Resistive Load, fig. Min. Typ. Max. Unit
SWITCHING
Symbol d(of Parameter Turn-off Delay Time Fall Time Test Conditions (Resistive Load, fig. Min. Typ. Max. Unit
SOURCE DRAIN DIODE
Symbol Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current di/dt A/µs (see test circuit, fig. Test Conditions Min. Typ. Max. Unit
Pulsed: Pulse duration duty cycle Pulse width limited safe operating area
STD40NF03L
Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform
Fig. Switching Times Test Circuits Resistive Load
Fig. Gate Charge test Circuit
Fig. Test Circuit Inductive Load Switching Diode Recovery Times
STD40NF03L
TO-252 (DPAK) MECHANICAL DATA
MIN. 0.03 0.64 0.45 0.48 9.35 0.023 TYP. MAX. 0.23 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397
DIM.
DETAIL
DETAIL
0068772-B
STD40NF03L
Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specification mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo trademark STMicroelectronics 2000 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil China Finland France Germany Hong Kong India Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom U.S.A. http://www.st.com

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