BPV21F high speed high sensitive photodiode plasic package with cylind

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BPV21F high speed high sensitive photodiode plasic package with cylind

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BPV21F
BPV21F high speed high sensitive photodiode plasic package with cylindrical side view lens. epoxy package itself filter, spectrally matched GaAs GaAs/GaAlAs emitters nm). Lens radius chip position perfectly matched chip size, giving high sensitivity without compromising viewing angle. comparison with flat packages cylindrical lens package achieves sensitivity improvement
Features
Large radiant sensitive area mm2) Wide viewing angle Fast response times junction capacitance TO-92 plastic package with filter Filter designed transmission
8387
Applications
Infrared remote control free transmission systems combination with emitter diodes (TSU.- TSI.-Series).
Absolute Maximum Ratings
Tamb 25_C Parameter Reverse Voltage Power Dissipation Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Thermal Resistance Junction/Ambient Test Conditions Tamb Symbol Tamb Tstg RthJA Value -55.+100 -55.+100 Unit
TELEFUNKEN Semiconductors Rev. 15-Jul-96
BPV21F
Basic Characteristics
Tamb 25_C Parameter Forward Voltage Breakdown Voltage Reverse Dark Current Diode Capacitance Serial Resistance Open Circuit Voltage Temp. Coefficient Short Circuit Current Reverse Light Current Temp. Coefficient Absolute Spectral Sensitivity Angle Half Sensitivity Wavelength Peak Sensitivity Range Spectral Bandwidth Quantum Efficiency Noise Equivalent Power Detectivity Rise Time Fall Time Cut-Off Frequency Test Conditions MHz, mW/cm2, mW/cm2, mW/cm2, mW/cm2, mW/cm2, Symbol V(BR) TKVo TKIra s(l) s(l) -2.6 0.35 870.1050 4x10-14 5x1012 Unit
mV/K cmHz/W
VR=10V, l=950nm VR=10V, l=950nm VR=10V, RL=1kW, l=820nm VR=10V, RL=1kW, l=820nm VR=12V, RL=1kW, l=870nm VR=12V, RL=1kW, l=950nm
l0.5
Typical Characteristics (Tamb 25_C unless otherwise specified)
Relative Reverse Light Current 1000 Reverse Dark Current
l=950nm
VR=5V
VR=10V
8409
8403
Tamb Ambient Temperature
Tamb Ambient Temperature
Figure Reverse Dark Current Ambient Temperature
Figure Relative Reverse Light Current Ambient Temperature
TELEFUNKEN Semiconductors Rev. 15-Jul-96
BPV21F
Relative Spectral Sensitivity
8408
1000 Reverse Light Current
VR=5V l=950nm
0.01
8421
Irradiance
1050
1150
Wavelength
Figure Reverse Light Current Irradiance
Reverse Light Current
Figure Relative Spectral Sensitivity Wavelength
l=950nm
mW/cm2 mW/cm2 mW/cm2 0.05 mW/cm2
Relative Sensitivity
mW/cm2
8422
Reverse Voltage
8406
Figure Reverse Light Current Reverse Voltage
Figure Relative Radiant Sensitivity Angular Displacement
Diode Capacitance
f=1MHz
8423
Reverse Voltage
Figure Diode Capacitance Reverse Voltage
TELEFUNKEN Semiconductors Rev. 15-Jul-96
BPV21F
Dimensions
9612202
TELEFUNKEN Semiconductors Rev. 15-Jul-96
BPV21F
Ozone Depleting Substances Policy Statement
policy TEMIC TELEFUNKEN microelectronic GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances ODSs). Montreal Protocol 1987) London Amendments 1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency EPA) Council Decision 88/540/EEC 91/690/EEC Annex transitional substances respectively. TEMIC certify that semiconductors manufactured with ozone depleting substances contain such substances.
reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer TEMIC products unintended unauthorized application, buyer shall indemnify TEMIC against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 7131 2831, number: 7131 2423
TELEFUNKEN Semiconductors Rev. 15-Jul-96

BPV21F high speed high sensitive photodiode plasic package with cylind

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