HPND-4005 HPND-4018 HPND-4028 HPND-4038 applications requiring co

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HPND-4005 HPND-4018 HPND-4028 HPND-4038 applications requiring co

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Beam Lead Diodes Reliability Data
HPND-4005 HPND-4018 HPND-4028 HPND-4038
applications requiring component reliability estimation, Hewlett-Packard provides reliability data families devices. Data initially compiled from reliability tests prior market introduction demonstrate that product meets design criteria. Additional tests periodically. data this sheet represents latest review accumulated test results.
JUNCTION TEMPERATURE, (°C)
Applications
This information represents capabilities generic device. Failure rates MTTF values presented here achievable with normal MIL-S-19500 level screening. This reliability screening longer available from Hewlett-Packard. screening tests, references, conditions, sizes, LTPD provided references only.
MEAN TIME FAILURE, MTTF (HRS)
Mean Time Failure Junction Temperature
2-111
5965-8892E
Burn-In Storage
Test High Temperature Life Steady State Operating Life Test Conditions 1,000 hrs. min. storage time 200°C 1,000 hrs. min. operating time 150°C LTPD/ 1000 Hours
Environmental
Test Temperature Cycling Thermal Shock Moisture Resistance Constant Acceleration Mechanical Shock Vibration Variable Frequency Salt Atmosphere MIL-STD-750 Reference 1051 1056 1021 2006 2016 2056 1041 Test Conditions -65/+200°C, cycles, min. dwell, min. transfer 0/100°C, cycles, min. dwell, sec. transfer -10°C/+65°C, days KGs, min. each axis blows each axis 1500 msec pulse min., 2000 minute cycles each axis Salt 35°C hrs. LTPD
DOD-HDBK-1686 Classification: HPND-4005 Class HPND-4018 Class HPND-4028 Class HPND-4038 Class
2-112

HPND-4005 HPND-4018 HPND-4028 HPND-4038 applications requiring co

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