1N5719 5082-3001 5082-3039 5082-3077 Description applications req

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1N5719 5082-3001 5082-3039 5082-3077 Description applications req

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Diodes Reliability Data
1N5719 5082-3001 5082-3039 5082-3077
Description applications requiring component reliability estimation, Hewlett-Packard provides reliability data families devices. Data initially compiled from reliability tests prior market introduction demonstrate that product meets design criteria. Additional tests periodically. data this sheet represents latest review accumulated test results.
JUNCTION TEMPERATURE, (°C)
Applications
This information represents capabilities generic device. Failure rates MTTF values presented here achievable with normal MIL-S-19500 level screening. This reliability screening longer available from Hewlett-Packard. screening tests, references, conditions, sizes, LTPD provided references only.
MEAN TIME FAILURE, MTTF (HRS)
Mean Time Failure Junction Temperature
2-107
5966-0945E
Burn-In Storage
Test High Temperature Life Steady State Operating Life Test Conditions 1,000 hrs. min. storage time 150°C 1,000 hrs. min. operating time 25°C LTPD/ 1000 Hours
Environmental
Test Solderability Temperature Cycling Thermal Shock Moisture Resistance Shock Vibration Variable Frequency Constant Acceleration Terminal Strength Hermeticity MIL-STD-750 Reference 2026 1051 1056 1021 2016 2056 2006 2036 1014 Test Conditions solder 260°C cycles from -65°C +150°C, hrs. extremes, min. transfer cycles from +100°C, sec. transfer days, 90-98% +65°C, operating blows each 1500 msec pulse minute cycles each min. 2000 minute each 20,000 Miniature glass package, arcs, leads, oz., lead restriction Fine gross LTPD
DOD-HDBK-1686 Classification: diodes covered this Reliability Data Sheet Class
2-108

1N5719 5082-3001 5082-3039 5082-3077 Description applications req

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