Applications Data Device data made available computer discs evalu

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Applications Data Device data made available computer discs evalu

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application notes represented these abstracts available from your local Hewlett-Packard sales office nearest Hewlett-Packard authorized distributor representative. Technical information also available www.hp.com/go/rf US/Canada, technical literature available from Hewlett-Packard Components Group fax-back service 1-800-450-9455.
Applications Data
Device data made available computer discs evaluate device performance facilitate CAD. DesignPak DesignPak comprehensive data library S-parameter noise parameter data following products: Discrete Schottky diodes Discrete GaAs devices GaAs MMIC products Discrete Bipolar transistors Silicon MMIC gain blocks Silicon MMIC products S-parameters standard *.S2P ASCII file format most linear circuit simulators. Publication 5963-2301E Primer Thermal Properties Publication 300124 Primer Thermal Resistance Publication 300126
General Application Notes
A001 Notes Choke Network Design Stability; Bipolar Transistor GaAs choke networks Publication 5091-8824E A004R Electrostatic Discharge Damage Control Identifying preventing damage Publication 5091-8803E A006 Mounting Considerations Packaged Microwave Semiconductors Mechanical, thermal, soldering information Publication 5091-8696E Handling Bonding Beam Lead Devices Made Easy Beam Lead devices particularly attractive hybrid circuits because their parasitics small size. availability equipment techniques specifically designed their small size facilitated handling
bonding these devices. This application note describes some this equipment techniques, outlines suggestions proper handling bonding Beam Lead devices Publication 5953-4435 Beam Lead Attachment Methods This application bulletin gives general description various methods attaching beam lead components both hard soft substrates. table summarized most common attachment methods with advantages, disadvantages, equipment costs. Publication 5091-9074E Beam Lead Diodes Bonding Soft Substrate hard gold surface standard boards with soft substrate material makes almost impossible successfully bond beam lead diodes onto boards with normally recommended thermocompression bonding. Described this application note method resistive spot welding modified welding,
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which uses single electrode weld beam lead while conductor contacted separately. This method allows tight pressure used weld probe, resulting effective bond without damaging beam lead device. Publication 5954-2227
957-1 Broadbanding Shunt Diode SPDT Switch Covers impedance matching technique which improves bandwidth shunt diodes switches. Publication 5964-3902E
957-2 Reducing Insertion Loss Shunt Diode Examines simple filter design which includes shunt diode capacitance into pass filter, thereby extending upper frequency limit. Publication 5952-0491
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Applications Data Device data made available computer discs evalu

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