August 1997 Revised September 2003 High-Speed CMOS Logic Dual 4-I

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August 1997 Revised September 2003 High-Speed CMOS Logic Dual 4-I

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CD54HC21, CD74HC21, CD74HCT21
August 1997 Revised September 2003
High-Speed CMOS Logic Dual 4-Input Gate
Description
'HC21 CD74HCT21 logic gates utilize silicon gate CMOS technology achieve operating speeds similar LSTTL gates with power consumption standard CMOS integrated circuits. devices have ability drive LSTTL loads. logic family functionally compatible with standard logic family.
Features
Buffered Inputs
/Title (CD74H C21, CD74H CT21) /Subject (High Speed CMOS Logic Dual 4Input
Typical Propagation Delay: 15pF, 25oC Fanout (Over Temperature Range) Standard Outputs LSTTL Loads Driver Outputs LSTTL Loads Wide Operating Temperature Range -55oC 125oC Balanced Propagation Delay Transition Times Significant Power Reduction Compared LSTTL Logic Types Operation High Noise Immunity: 30%, Types 4.5V 5.5V Operation Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), (Min) CMOS Input Compatibility, VOL,
Ordering Information
PART NUMBER CD54HC21F3A CD74HC21E CD74HC21M CD74HC21MT CD74HC21M96 CD74HCT21E CD74HCT21M CD74HCT21MT CD74HCT21M96 TEMP. RANGE (oC) PACKAGE CERDIP PDIP SOIC SOIC SOIC PDIP SOIC SOIC SOIC
NOTE: When ordering, entire part number. suffix denotes tape reel. suffix denotes small-quantity reel 250.
Pinout
CD54HC21 (CERDIP) CD74HC21, CD74HCT21 (PDIP, SOIC) VIEW
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper Handling Procedures. Copyright
2003, Texas Instruments Incorporated
CD54HC21, CD74HC21, CD74HCT21 Functional Diagram
TRUTH TABLE INPUTS OUTPUT
High Voltage Level, Voltage Level, Irrelevant
Logic Symbol
CD54HC21, CD74HC21, CD74HCT21
Absolute Maximum Ratings
Supply Voltage, -0.5V Input Diode Current, -0.5V 0.5V .±20mA Output Diode Current, -0.5V 0.5V .±20mA Output Source Sink Current Output Pin, -0.5V 0.5V .±25mA Ground Current, IGND .±50mA
Thermal Information
Thermal Resistance (Typical, Note (oC/W) (PDIP) Package (SOIC) Package. Maximum Junction Temperature 150oC Maximum Storage Temperature Range .-65oC 150oC Maximum Lead Temperature (Soldering 10s) 300oC (SOIC Lead Tips Only)
Operating Conditions
Temperature Range (TA) -55oC 125oC Supply Voltage Range, Types Types .4.5V 5.5V Input Output Voltage, Input Rise Fall Time 1000ns (Max) 4.5V. 500ns (Max) 400ns (Max)
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
NOTE: package thermal impedance calculated accordance with JESD 51-7.
Electrical Specifications
TEST CONDITIONS PARAMETER TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage Loads Level Output Voltage CMOS Loads Level Output Voltage Loads Input Leakage Current -0.02 -0.02 -0.02 -5.2 0.02 0.02 0.02 3.15 3.98 5.48 1.35 0.26 0.26 ±0.1 3.15 3.84 5.34 1.35 0.33 0.33 3.15 1.35 SYMBOL (mA) 25oC -40oC 85oC -55oC 125oC UNITS
CD54HC21, CD74HC21, CD74HCT21
Electrical Specifications
(Continued) TEST CONDITIONS PARAMETER Quiescent Device Current TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage Loads Level Output Voltage CMOS Loads Level Output Voltage Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Input Pin: Unit Load NOTE: dual-supply systems theoretical worst case 2.4V, 5.5V) specification 1.8mA. -2.1 -0.02 SYMBOL (mA) 25oC -40oC 85oC -55oC 125oC UNITS
3.98
3.84
0.02
0.26
0.33
±0.1
(Note
Input Loading Table
INPUT UNIT LOADS
NOTE: Unit Load limit specified Electrical Specifications table, e.g. 360µA 25oC.
Switching Specifications Input
PARAMETER TYPES Propagation Delay, Input Output (Figure tPLH, tPHL 50pF Propagation Delay, Data Input Output tPLH, tPHL 15pF SYMBOL TEST CONDITIONS 25oC -40oC 85oC -55oC 125oC UNITS
CD54HC21, CD74HC21, CD74HCT21
Switching Specifications Input
PARAMETER Transition Times (Figure SYMBOL tTLH, tTHL (Continued) Input Capacitance Power Dissipation Capacitance (Notes TYPES Propagation Delay, Input Output (Figure Propagation Delay, Data Input Output Transition Times (Figure Input Capacitance Power Dissipation Capacitance (Notes NOTES: used determine dynamic power consumption, gate. VCC2 (CPD where input frequency, output load capacitance, supply voltage. tRHL, tPHL tPLH, tPHL tTLH, tTHL 50pF 15pF 50pF 25oC -40oC 85oC -55oC 125oC UNITS
TEST CONDITIONS 50pF
Test Circuits Waveforms
INPUT
INPUT 2.7V 1.3V 0.3V
tTLH
tTHL
tTLH tPHL tPLH
tTHL
INVERTING OUTPUT
INVERTING OUTPUT tPHL tPLH
1.3V
FIGURE TRANSITION TIMES PROPAGATION DELAY TIMES, COMBINATION LOGIC
FIGURE TRANSITION TIMES PROPAGATION DELAY TIMES, COMBINATION LOGIC
MECHANICAL
MPDI002C JANUARY 1995 REVISED DECEMBER 20002
(R-PDIP-T**)
PINS SHOWN
PLASTIC DUAL-IN-LINE PACKAGE
PINS
0.775 (19,69) 0.745 (18,92)
0.775 (19,69) 0.745 (18,92)
0.920 (23,37) 0.850 (21,59)
1.060 (26,92) 0.940 (23,88)
0.260 (6,60) 0.240 (6,10)
MS-100 VARIATION
0.070 (1,78) 0.045 (1,14)
0.045 (1,14) 0.030 (0,76)
0.020 (0,51)
0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) Seating Plane 0.125 (3,18) 0.010 (0,25) Gauge Plane
0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25)
0.430 (10,92)
14/18 ONLY vendor option
4040049/E 12/2002
NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. Falls within JEDEC MS-001, except minimum body lrngth (Dim lead shoulder width vendor option, either half full width.
POST OFFICE 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
MSOI002B JANUARY 1995 REVISED SEPTEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 0.010 (0,25)
PLASTIC SMALL-OUTLINE PACKAGE
0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81)
0.008 (0,20)
Gage Plane 0.044 (1,12) 0.016 (0,40)
0.010 (0,25)
Seating Plane 0.069 (1,75) 0.010 (0,25) 0.004 (0,10) 0.004 (0,10)
PINS
0.197 (5,00) 0.189 (4,80)
0.344 (8,75) 0.337 (8,55)
0.394 (10,00) 0.386 (9,80)
4040047/E 09/01 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. Body dimensions include mold flash protrusion, exceed 0.006 (0,15). Falls within JEDEC MS-012
POST OFFICE 655303
DALLAS, TEXAS 75265
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August 1997 Revised September 2003 High-Speed CMOS Logic Dual 4-I

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