212L062002 (Tentative) Tentative Specification Passband frequency

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212L062002 (Tentative) Tentative Specification Passband frequency

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Multi-layer Pass Filter
212L062002 (Tentative)
Tentative Specification Passband frequency Insertion Loss Passband 0.9dBMax.(470-600MHz) deg-C) 1.1dBMax.(470-600MHz) (-30~+85 deg-C) 1.5dBMax.(600-710MHz) deg-C) 1.7dBMax.(600-710MHz) (-30~+85 deg-C) 3.4dBMax.(710-770MHz) deg-C) 3.7dBMax.(710-770MHz) (-30~+85 deg-C) 1.2dBMax. (470 MHz) 2.0Max. (470 MHz) 0.65dB 1.25dB 2.9dB
Attenuation(dB)
Confidential
Digital
Actual Data
Actual Data
Ripple Passband V.S.W.R. Passband Attenuation
0.85dB
1100 1600 Freq.(MHz) 2100 2600
5dBMin. (830 MHz) 25dBMin. (888 MHz) 25dBMin. (940 MHz) 27dBMin. (1429 1453 MHz) 26dBMin. 1920 1980 MHz) 26dBMin. (2400 2500 MHz)
9.5dB 32dB 34dB 33dB 29.5dB 29.5dB
Shapes Dimensions
+/-0.2
1.25 +/-0.2 +/-0.2 0.5Max.
Impedance
-0.1/+0.2 -0.1/+0.2
+/-0.2
unit
Note specifications subject change without notice technical improvements
TAIYOYUDENCO.,LTD.
Scope This specification covers high frequency multilayer chip filter electronic appliances electric communications equipment. Part Numbering System Part number indicated follows. (Example) Type Size Special code Special code pass 0620 Frequency code Individual Spec Frequency code 620MHz Packaging code Packaging code -Taping
Code
Size (mm)
Code
Code 0620
Code
Environmental conditions Standard test conditions shall temperature relative humidity pressure 106kPa. Test shall conducted temperature 20±2, relative humidity pressure 106kPa test result suspectable. Unless otherwise specified, tests shall conducted under standard conditions. Electrical specification Impedance (ZinZout) Nominal Frequency (fc) Pass band frequency Insertion Loss Insertion Loss Insertion Loss Ripple V.S.W.R. Nominal 620MHz Nominal 770MHz 0.9dB max. (+25) 1.1dB max. (-30 +85) 1.5dB max. (+25) 1.7dB max. (-30 +85) 3.4dB max. (+25) 3.7dB max. (-30 +85) 1.2dB max. (470 MHz) max. (470 710MHz) min. (830 MHz) 25dB min. (888 MHz) Attenuation 25dB min. (940 MHz) 27dB min. (1429 1453 MHz) 26dB min. (1920 1980 MHz) 26dB min. (2400 2500 MHz)
Measuring equipment Electrical characteristics shall measured condition that test sample specified measuring equipment. Measuring equipment NETWORK ANALYZER AGILENT 8753 NETWORK ANALYZER ADVANTEST R3767 equivalent N.W.A.
Measuring
Attenuation above measuring equipment, when input output shorted, output shall case calibrated reference level (0dB), when test sample inserted equipment, output shall loss shall prescribed attenuation. Attenuation (ATT.) (E2/E1) [dB]
External dimensions (Unit:
+/-0.2
1.25 +/-0.2
+/-0.2 0.5Max.
-0.1/+0.2 -0.1/+0.2
unit
+/-0.2
Material Body: Ca-Mg-Si type dielectric ceramics Internal conductors: Silver (Ag) Terminal electrodes: Silver (Ag) Surface: plating
Marking Abbreviation marked following which means input side. Dimension examples recommended land pattern (Thickness: 0.4mm, range, Both side hole board) Electrodes pattern
Resist pattern (aperture size)
1.65
0.75
Layout
5-dia0.5
0.75
LINE
Input Output
0.95
0.35
LINE
1.575
Reflow soldering condition Temp
Recommended reflow profile
About 5575s
Peak temperature: 250255
2030s
Timesec
Packaging Taping shall conducted follows. Unless otherwise specified, conform 0806. Taping shall right-sided wound (when pulled out, sprocket hole will right-hand side). Seal tape shall crossed over sprocket holes. seal tape shall carrier tape. packaging chips taping, blank spaces provided taping shown below. Leader part: Leader part): Trailer part): part (Blank part (Blank 400mm min. 100mm min. 160mm min.
160mm min. Trailer part 400mm min. Chip packaging area Leader part 180±3.0 100mm min. Blank part
Unit [mm] Leader part seal tape shall sealed with adhesive tape. Peeling strength seal tape tape) shall 0.11.0N (10.2102gf) when seal tape tape) peeled from carrier tape angle Label indicating Parts No., Quantity, Customer Parts shall attached reel.
Dimensions Reel Labe
Code Size Code Size
+1/-0 12.5
21.0
Unit [mm]
Chips shall packaged uniform direction; termination faced sprocket holes. Chips shall mounting part carrier tape.
Feeding direction
Taping reel shall packaged plastic reel. Standard number chips contained taping reel shall 3,000 pieces.
External dimensions carrier tape (Unit: Carrier tape material Cardboard Sprocket hole Chip cavity
Dimensions 1.55 ±0.2 ±0.2 ±0.3 ±0.05 1.75 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 0.65
[Unit
Package type
Label Reel 3,000 pcs/ Reel
with 34mm thickness used packaging reel reels. with 77mm thickness used packaging three five reels. Unit [mm]
Precautions careful using these products because characteristics deteriorated used following environment. Special atmosphere (Such CI2, NH3, Nox, etc.) atmosphere with volatility flammability Place where dust abundant Place where water splashes directly, condensation ease occur because high humidity, direct sunlight subjected freeze careful apply excessive pressure shock because these products made from ceramics element. careful apply excessive pressure shock these products during transporting handling print circuit board that these products soldered. careful handling (Don't drop hit) because characteristics changes when electrode damaged chipped out. careful touch these products with bare hands because causes solderability decline. Please storage under following condition. Temperature: Humidity: Please these products after delivery within months. after more than months have passed, please confirm solderability before them. Please arrange these products position mounting where stress isn't applied against bend deflection circuit board. careful apply stress deflection board during process after soldering these products (circuit board cut, break board checker, mounting other components, installation chassis wave soldering backside circuit board after reflow soldering) because electrode peeling chip break occur when circuit board bends during handling. When separating print circuit board after mounting, please avoid hand breaking special tools. careful apply excessive stress shock prevent break chip during mounting these products print circuit board. Please flux containing less than 0.1% conversion) halogen material soldering prevent corrosion electrodes decline insulation resistance. Please preheat soldering less than between solder temperature products temperate prevent break these products. When ultrasonic washing applied, please confirm cleaning condition advance, because crack occur these products soldering part vibration strength terminal electrode decline. Please confirm washing liquid when washing after soldering advance, because indication seal blurred disappear. When repairing soldering iron, temperature soldering iron should less than less than seconds prevent terminal electrode decline.
Operating conditions guarantee this product shown specification. Please note that Taiyo Yuden Co., Ltd. shall responsible failure and/or abnormality which caused under conditions other than aforesaid operating conditions.
This product developed, designed intended general electronics equipments. (for household, office supply, information service, telecommunications, etc.). Before incorporating components into equipments field such aerospace, aviation, nuclear control, submarine, transportation, (automotive driving control, passenger protection, train control, ship control), transportation signal, disaster prevention, medical, public information network etc. where higher safety reliability especially required, please contact Taiyo Yuden Co., Ltd. more detail advance. before incorporating components devices into equipments mentioned above, there possibility direct damage injury human body, please contact Taiyo Yuden Co., Ltd. more detail advance.
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212L062002 (Tentative) Tentative Specification Passband frequency

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