Fig.1 Construction dimensions NOTE Resistive element Electrode Pr
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2/16 Unit
Fig.1 Construction dimensions
NOTE Resistive element Electrode Protective coat Substrate
Nichrome alloy thin film Sn-Pb plating plating Polyimid resin coating Alumina ceramic
TITLE:
Code letter
Dimension(mm) 1.60±0.2 0.80±0.2 0.4±0.1 0.3±0.2 0.3±0.2
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
3/16
Rated dissipation 70deg Code Rated dissipation based continuous full load operation rated ambient temperature 70deg resistors operated ambient temperature excess 70deg maximum load shall derated accordance with following curve. Percentage rated dissipation
Area Recommended operation
Fig.3 Derating curve
Rated voltage d.c. a.c. r.m.s voltage shall calculated from following expression. When rated voltage exceeds limiting element voltage, limiting element voltage shall rated voltage. Where Rated voltage Rated resistance Rated dissipation
Ambient temperature
Limiting element voltage Maximum overload voltage Operating temperature range Storage temperature range
+125 +125
Marking Marking series rated resistance shall marked protect coating with three digit number. para.2. (Example) 3.9k39
Marking series manufacturing date code three digit number shall marked protect coating. manufacturing date code Refer 5201-1 Annex Table5 Three digit number next table. Three digit number shall marked protect coating. this case, three digit code number shall added type designation Marking Type designation RR0816P-4991-B-T5-68H
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
4/16
Three digit resistance code series
Code E96series Code E96series Code E96series Code E96series
Multipliers code Code
Multipliers 10-2 resistance value duplicated series series shall manufactured series only. Performance test method shall specified 60115-1. Standard atmospheric conditions Unless otherwise specified, standard range atmospheric conditions making measurements tests follows; Temperature 35deg Relative humidity 85%RH pressure 106kPa there doubt about results, measurements shall made within following limits; Temperature 20±2deg Relative humidity 70%RH pressure 106kPa
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
5/16 Electrical 6.1.1 Resistance tolerance Method; Refer 60115-1, Sub-clause 4.5. Specification: exceed specified tolerance rated resistance para.4.1.(2). 6.1.2 Temperature characteristic resistance Method; Resistance shall measured under standard atmospheric conditions. When temperature reaches maintained higher than temperature standard atmospheric conditions, resistance shall measured again. measurement shall made after period min, after each specified temperature reached. Specification: exceed specified temperature coefficient resistance para.4.1.(3). 6.1.3 Overload Method; d.c. a.c. r.m.s. voltage times rated voltage shall applied sec, check shall made arcing other damage happened. Then resistor shall maintained without electrical load after which resistance shall measured. However applied voltage shall exceed maximum overload voltage. other procedures, refer 60115-1, Sub-clause 4.13. Specification: Change resistance ±(0.5%+0.05) Without damage flash over (spark, arcing), burning breakdown etc. 6.1.4 Insulation resistance Method; Place specimen groove metal plate that edge metal block positions almost center both electrodes, with surface insulation enclosure located downward upward pressurize block force 1.0±0.2 test voltage shall 100±15d.c., maintain this voltage about min. insulation resistance shall then measured while applying voltage. other procedures, refer 60115-1, Sub-clause 4.6.
Measurement point metallic block
Insulating plate easurement point etallic plate
Base material
Specimen
Presurization spring
Insulating enclosure surface
Specification; (1)Between electrodes insulating enclosure. (2)Between electrodes base material.
100M more 1000M more
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
6/16 6.1.5 Voltage proof Method; resistor shall tested shown paragraph 6.1.4. test voltage shall voltage 100V (a.c. r.m.s.) between both electrode. voltage gradually increased rate about V/s. from almost specified voltage maintained 60s. +10/0s., then gradually decreased almost other procedures, refer 60115-1, Sub-clause 4.7. Specification; Change resistance ±(0.5%+0.05) Without damage flash over (spark, arcing), burning breakdown etc.
Mechanical 6.2.1 Substrate bending test Bond strength face plating Method; Apply pressure direction arrow rate about mm/s. until bent width reaches hold Mounted state
Testing printed circuit board Specimen
Test state
Pressurizing R230 Loading
Support Solder
±2mm less
nding Value
Unit
Resistance meter
other procedures, refer 60115-1, Sub-clause 4.33. Specification; Change resistance ±(0.5%+0.05) Without mechanical damage such breaks.
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
7/16 6.2.2 Body strength Method; load {1.02kgf} using R0.5 pressure shall applied center direction arrow held Specification; Change resistance ±(0.5%+0.05) Without mechanical damage such breaks.
R0.5
Pressurizing Specimen
6.2.3 Resistance soldering heat Method; Solder bath method Preheat 100110deg Temperature 270±5deg
10±1
Reflow soldering method Peak temperature 260±5deg sec. less Temperature 220deg over max. heating apparatus shall upper-heated oven temperature shall board surface temperature. Soldering iron method temperature 350±5deg Time resistor shall stored standard atmospheric conditions after which measurements shall made. other procedures, refer 60115-1, Sub-clause 4.18. Specification: Change resistance ±(0.5%+0.05) Without mechanical damage. Electrical characteristics shall satisfied.
6.2.4 Solderability Method; Temperature solder
235±5deg (Solder alloy: Sn-37Pb) 245±5deg (Solder alloy: Sn-3Ag-0.5Cu) Duration immersion 2±0.5 other procedures, refer 60115-1, Sub-clause 4.17.
Specification: uniform coating solder shall cover minimum surface being immersed.
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
8/16 6.2.5 Solvent resistance Method; Immersion cleaning normal temperature sec. Using Isopropyl alcohol. other procedures, refer 60115-1, Sub-clause 4.29. Specification: Marking shall legible. Without mechanical damage distinct damage appearance.
Endurance 6.3.1 Rapid change temperature Method; resistor shall subjected continuous cycles, each shown figure below. Minimum operating temperature±deg Standard atmospheric conditions Maximum operating temperature±deg Standard atmospheric conditions other procedures, refer 60115-1, Sub-clause 4.19. Specification; Change resistance ±(0.5%+0.05) Without mechanical damage such breaks distinct damage appearance. Marking shall legible. 6.3.2 Endurance (Damp heat with load) Method; specimen shall placed test chamber temperature 40±2deg relative humidity then subjected voltage cycle consisting rated d.c. voltage application rest repeatedly 1000 +48/0 hrs. However applied voltage shall exceed limited element voltage. other procedures, refer 60115-1, Sub-clause 4.24. Specification; Change resistance ±(0.5%+0.05) Without mechanical damage such breaks distinct damage appearance. Marking shall legible.
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
9/16 6.3.3 Endurance (rated load) Method; specimen shall placed test chamber 70±2deg then subjected voltage cycle consisting rated d.c. voltage application rest repeatedly 1000 +48/0 hrs. However applied voltage shall exceed limited element voltage. other procedures, refer 60115-1, Sub-clause 4.25. Specification; Change resistance ±(0.5%+0.05) Without mechanical damage such breaks distinct damage appearance. Marking shall legible.
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
11/16 Test board Test board substrate banding, adhesion test, Fig.4) Material: Glass fabric base epoxy resin 1.6mm Copper foil, thickness 0.035 Solder resist coating Test board another test, Fig.5) Material: Glass fabric base epoxy resin 1.6mm Copper foil, thickness 0.035 Solder resist coating
Mounting method Mounting method according solder bath method Epoxy based adhesive agent shall applied middle between lands test board resistor shall mounted such that resistor's electrodes will evenly placed land area then adhesive agent shall hardened. Then methanol medium colophony specific weight used flux non-deviant test results assurable over counter colophony based flux used) soldered dipping molten solder bath 260±5 immersed Mounting method according reflow soldering method About solder cream applied land portion test boards resistor shall mounted such that resistor's electrodes will evenly placed land. soldered under conditions board surface temperature 250deg C(peak temperature) upper-portion heated oven.
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
12/16 Packaging Resistors shall Taping. Dimensions 7.1.1 Tape packaging dimensions Fig.6. 7.1.2 Reel dimensions Fig.7 Fig.8 Materials Tape Paper Reel Plastic Specification taping Refer clause 60286-3. Pieces reel 1000 pieces reel 5000 pieces reel. When quantity 5000 pieces reel, code "-T5" shall added type designation. para.2. Marking label indicated following items shall marked single side reel. Type designation Quantity Manufacturing date code (Month year marked. Refer 5201-1 Annex Table5. Manufacturer's name Country origin Shipping inspection code Identification showing lead-free products.
Example label
Q.T.Y 1000pcs INSPECTED MADE JAPAN SUSUMU CO.,LTD. N012501-N: (BAR CODE) (BAR CODE) (BAR CODE)
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
13/16
0.60±0.05
Sprocket-hole
Rectangular-hole
±0.05
1.75±0.1
+0.1
2.0±0.05 0.65±0.1 4.0±0.1 4.0±0.1
Fig.6 Dimensions taping letter Dimension(mm) 1.1±0.1 1.9±0.1
Pre-emptied holes holes(or more. Code Unit
Label
13±0.2
21±0.8
9±0.3
13±1.4
Where Plastic sheet thickness shall 0.5mm. Fig.7. Dimensions reel
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
2±0.5
8.0±0.3
Rev.
RR00-1098
14/16
TITLE:
Fig.8
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
15/16 Precautions Storage Resistor shall stored room where temperature humidity must controlled. temperature humidity However, humidity keep low, possible. Resistor shall stored direct sunshine doesn't Resistor shall stored with moisture, dust, material that will make solderbility inferior, harmful (hydrogen chloride, sulfurous acid gas, hydrogen sulfide). Resistor shall stored with keeping minimum package unit with uncivilized sealed (Keep state taping). Time limit storage storage time limit product reckoned when product shipped company made within year. Confirm solderbility beforehand when that time limit passed. Chip mounting When chip mounted board, protection coat resistors must scratched. will scratched, will make performance moisture inferior. case that resistor will soldered soldering iron, heating shall done land, soldering iron must resistor itself. case that resin coating resin seal will made board after chip mounting, washing drying enough before coating sealing. bear moisture will sealed resin coating, will make performance moisture inferior sometimes. resinous use, necessary enough curing conditions. improper condition, change resistance value large case. According shape, material, pressure clamping chip mounting machine, there case that crack will appeared resistor. Control shock energy clamping resistor under With shock energy around clamping that says here, suited potential energy, case that iron block dropped naturally resistor placed iron plate height 2.8mm. glue resistor board around chip mounting, needed high insulation resistance great performance moisture. needed that these characteristics inferior using temperature range spot temperature acting. Using Handling necessary investigate performance reliability enough when using under harsh environment. Especially, performance product occasionally damaged when using with dewy state material adhered. necessary protect edge protection coat resistors from mechanical stress. Handle with care when board divided fixed support body, because bending board after chip mounting will make mechanical stress resistors.
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
16/16 Resistors shall used within rated range shown specification. Especially, voltage more than specified value will loaded resistor, there case will make damage machine because temperature rise depending generation heat, increase resistance value breaks. case that resistor loaded rated voltage, necessary confirms temperature resistor reduce load power according load reduction curve, because temperature rise resistor depends influence heat from mounting density neighboring element. Observe Limiting element voltage maximum overload voltage specified each specification. there possibility that large voltage (pulse voltage, shock voltage) charge resistor, necessary that operating condition shall before use, because performance thin film resistor affected large shock voltage. Using Handling Refer EIAJ RCR-2121 Electronic Industries Association Japan technological report "Fixed resistor directions guideline."
TITLE:
Specification Chip resistor RR0816 series
SUSUMU CO.,LTD
SPEC.NO:
Rev.
RR00-1098
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